DE102014013023A1 - Polyurethan-Polierkissen - Google Patents

Polyurethan-Polierkissen Download PDF

Info

Publication number
DE102014013023A1
DE102014013023A1 DE201410013023 DE102014013023A DE102014013023A1 DE 102014013023 A1 DE102014013023 A1 DE 102014013023A1 DE 201410013023 DE201410013023 DE 201410013023 DE 102014013023 A DE102014013023 A DE 102014013023A DE 102014013023 A1 DE102014013023 A1 DE 102014013023A1
Authority
DE
Germany
Prior art keywords
polishing pad
isocyanate
reaction product
polishing
astm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE201410013023
Other languages
German (de)
English (en)
Inventor
Fengji Yeh
Marty DeGroot
James Murnane
David B. James
Mary Jo Kulp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=52470551&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102014013023(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102014013023A1 publication Critical patent/DE102014013023A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polyurethanes Or Polyureas (AREA)
DE201410013023 2013-09-04 2014-09-02 Polyurethan-Polierkissen Withdrawn DE102014013023A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/017,998 US20150059254A1 (en) 2013-09-04 2013-09-04 Polyurethane polishing pad
US14/017,998 2013-09-04

Publications (1)

Publication Number Publication Date
DE102014013023A1 true DE102014013023A1 (de) 2015-03-05

Family

ID=52470551

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201410013023 Withdrawn DE102014013023A1 (de) 2013-09-04 2014-09-02 Polyurethan-Polierkissen

Country Status (7)

Country Link
US (1) US20150059254A1 (enExample)
JP (1) JP6423205B2 (enExample)
KR (1) KR102160987B1 (enExample)
CN (1) CN104416454B (enExample)
DE (1) DE102014013023A1 (enExample)
FR (1) FR3009990A1 (enExample)
TW (1) TW201522404A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
US10391606B2 (en) 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
JP7072429B2 (ja) * 2018-03-30 2022-05-20 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法
KR102058877B1 (ko) * 2018-04-20 2019-12-24 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
WO2023104041A1 (zh) * 2021-12-06 2023-06-15 华为技术有限公司 材料及其制备方法、材料的应用、研磨材料
US20230390888A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp pad having ultra expanded polymer microspheres

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7414080B2 (en) 2004-02-03 2008-08-19 Materials Cmp Holdings, Inc. Polyurethane polishing pad

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP2009090397A (ja) * 2007-10-05 2009-04-30 Nitta Haas Inc 研磨パッド
JP4897082B2 (ja) * 2008-04-25 2012-03-14 トーヨーポリマー株式会社 ポリウレタン発泡体及び研磨パッド
WO2010038724A1 (ja) * 2008-09-30 2010-04-08 Dic株式会社 研磨パッド用２液型ウレタン樹脂組成物、それを用いてなるポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法
KR20120088536A (ko) * 2009-03-24 2012-08-08 피피지 인더스트리즈 오하이오 인코포레이티드 폴리우레탄 및 이로부터 제조되는 물품 및 코팅, 및 이의 제조 방법
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7414080B2 (en) 2004-02-03 2008-08-19 Materials Cmp Holdings, Inc. Polyurethane polishing pad

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
ASTM 5279
ASTM-D2240
ASTM-D412

Also Published As

Publication number Publication date
JP6423205B2 (ja) 2018-11-14
KR102160987B1 (ko) 2020-09-29
US20150059254A1 (en) 2015-03-05
FR3009990A1 (fr) 2015-03-06
JP2015051498A (ja) 2015-03-19
KR20150027722A (ko) 2015-03-12
CN104416454A (zh) 2015-03-18
CN104416454B (zh) 2017-03-08
TW201522404A (zh) 2015-06-16

Similar Documents

Publication Publication Date Title
DE102015009512A1 (de) Polyurethan-Polierkissen
DE102014013023A1 (de) Polyurethan-Polierkissen
DE102007024460B4 (de) Chemisch-mechanisches Polierkissen
DE102017008616A1 (de) Chemisch-mechanische Polierkissen mit hoher Planarisierungseffizienz und Verfahren zu deren Herstellung
DE102015007033A1 (de) Chemisch-mechanische Polierschichtformulierung mit Konditionierungstoleranz
DE60114183T2 (de) Polierkissen zum chemisch-mechanischen planarisieren
DE102015006980A1 (de) Chemisch-Mechanisches Polierverfahren
TWI480123B (zh) 多功能研磨墊
DE102015016424A1 (de) CMP-Gießverfahren mit eingestellter Viskosität
DE102015016427A1 (de) Gießverfahren für ein CMP-Kissen mit eingestellter Expansion
DE102013018258A1 (de) Weiches und konditionierbares chemisch-mechanisches Polierkissen
KR101526010B1 (ko) 화학 기계적 연마 패드
DE102014015664A1 (de) Verfahren zum chemisch-mechanischen Polieren von Siliziumwafern
DE602004010871T2 (de) Polierscheibe
DE102007024459A1 (de) Chemisch-mechanisches Polierkissen
DE102018004452A1 (de) Chemisch-mechanische Polierkissen für eine verbesserte Entfernungsgeschwindigkeit und Planarisierung
DE102015003240A1 (de) Chemisch-mechanisches polierkissen mit polierschicht und fenster
DE102015016425A1 (de) Polyurethan-Polierkissen mit hoher Stabilität
DE102019007230A1 (de) Chemisch-mechanisches polierkissen und polierverfahren
DE102015004786A1 (de) Chemisch-mechanisches Polierkissen
DE102016012533A1 (de) Chemisch-mechanisches Polierverfahren
DE102014012353A1 (de) Chemisch-mechanisches polierkissen
DE102015003200A1 (de) Weiches und konditionierbares chemisch-mechanisches polierkissen mit fenster
DE102016007777A1 (de) Verfahren mit Porositätseinstellung zur Bildung eines Polierkissens
DE102016007771A1 (de) Verfahren zur Herstellung einer Polierschicht für ein chemisch-mechanisches Polierkissen

Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: MUELLER-BORE & PARTNER PATENTANWAELTE PARTG MB, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee