DE102012215593B4 - Elektrischer Schaltkreis und Verfahren zum Bilden von elektrischen Leitern auf einem Substrat - Google Patents

Elektrischer Schaltkreis und Verfahren zum Bilden von elektrischen Leitern auf einem Substrat Download PDF

Info

Publication number
DE102012215593B4
DE102012215593B4 DE102012215593.7A DE102012215593A DE102012215593B4 DE 102012215593 B4 DE102012215593 B4 DE 102012215593B4 DE 102012215593 A DE102012215593 A DE 102012215593A DE 102012215593 B4 DE102012215593 B4 DE 102012215593B4
Authority
DE
Germany
Prior art keywords
conductive material
substrate
electrically
pattern
electrically non
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102012215593.7A
Other languages
German (de)
English (en)
Other versions
DE102012215593A1 (de
Inventor
Yiliang Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of DE102012215593A1 publication Critical patent/DE102012215593A1/de
Application granted granted Critical
Publication of DE102012215593B4 publication Critical patent/DE102012215593B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE102012215593.7A 2011-09-19 2012-09-03 Elektrischer Schaltkreis und Verfahren zum Bilden von elektrischen Leitern auf einem Substrat Expired - Fee Related DE102012215593B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/236,265 2011-09-19
US13/236,265 US8635761B2 (en) 2011-09-19 2011-09-19 System and method for formation of electrical conductors on a substrate

Publications (2)

Publication Number Publication Date
DE102012215593A1 DE102012215593A1 (de) 2013-03-21
DE102012215593B4 true DE102012215593B4 (de) 2022-04-21

Family

ID=47751512

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012215593.7A Expired - Fee Related DE102012215593B4 (de) 2011-09-19 2012-09-03 Elektrischer Schaltkreis und Verfahren zum Bilden von elektrischen Leitern auf einem Substrat

Country Status (4)

Country Link
US (1) US8635761B2 (enExample)
JP (1) JP5838136B2 (enExample)
CN (1) CN103025071B (enExample)
DE (1) DE102012215593B4 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013130842A1 (en) 2012-03-02 2013-09-06 Pulse Electronics, Inc. Deposition antenna apparatus and methods
US10020561B2 (en) 2013-09-19 2018-07-10 Pulse Finland Oy Deposited three-dimensional antenna apparatus and methods
CN106463828B (zh) 2014-02-12 2021-04-06 脉冲芬兰有限公司 用于导电元件沉积和形成的方法和设备
US9833802B2 (en) * 2014-06-27 2017-12-05 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
US9147875B1 (en) * 2014-09-10 2015-09-29 Cellink Corporation Interconnect for battery packs
US10211443B2 (en) 2014-09-10 2019-02-19 Cellink Corporation Battery interconnects
US9595754B2 (en) * 2014-12-26 2017-03-14 Wistron Neweb Corp. Patterned conductive structure and method for forming the same
CN107408544B (zh) 2015-02-03 2019-09-13 塞林克公司 用于组合式热能与电能传递的系统及方法
WO2017160320A1 (en) 2016-03-18 2017-09-21 Hewlett-Packard Development Company, L.P. Fuser assemblies
WO2019023193A1 (en) * 2017-07-24 2019-01-31 The Johns Hopkins University MONITOR OF VITAL SIGNS OF NEW-BORN
US11047630B2 (en) 2018-05-14 2021-06-29 Hewlett-Packard Development Company, L.P. Fuser assemblies
US11799183B2 (en) * 2019-07-17 2023-10-24 Xerox Corporation System, apparatus, and method for producing printed electrically conductive lines
CN110677932B (zh) * 2019-09-10 2021-06-25 博宇（天津）半导体材料有限公司 一种陶瓷加热器支撑基体及陶瓷加热器
KR20230160239A (ko) 2021-03-24 2023-11-23 셀링크 코포레이션 다층 가요성 배터리 인터커넥트 및 이의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3877412T2 (de) 1987-05-05 1993-08-12 Digital Equipment Corp Bei einer mehrere halbleiterbausteine beinhaltenden verpackung fuer hohe ansprueche verwendbares mehrschichtenverbindungssystem.
DE102009033510A1 (de) 2008-11-13 2010-05-20 Sefar Ag Gewebe, Vorrichtung mit Gewebe sowie Herstellungsverfahren für Gewebe
US20100323102A1 (en) 2009-06-23 2010-12-23 Xerox Corporation System and Method for Preparing Conductive Structures Using Radiation Curable Phase Change Gel Inks

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821440B2 (ja) * 1975-07-21 1983-04-30 住友ベークライト株式会社 プリントカイロバンノセイゾウホウホウ
JPS5745992A (en) * 1980-09-03 1982-03-16 Citizen Watch Co Ltd Method of forming transparent electrode pattern
US4778552A (en) * 1986-09-29 1988-10-18 Monarch Marking Systems, Inc. Alarm tag and method of making and deactivating it
JPH01173041A (ja) * 1987-12-28 1989-07-07 Matsushita Electric Ind Co Ltd パターン形成方法
JPH01205495A (ja) * 1988-02-10 1989-08-17 Furukawa Electric Co Ltd:The フレキシブルプリント回路基板の製造方法
US5197185A (en) * 1991-11-18 1993-03-30 Ag Communication Systems Corporation Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques
US5758575A (en) * 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
DE69806388T2 (de) * 1997-08-08 2002-11-21 Sca Coordination Center Nv, Zaventem Polymere funkfrequenzetiketten und herstellungsverfahren dazu
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
JP2002200833A (ja) * 2000-12-28 2002-07-16 Tobi Co Ltd 金属酸化物膜のパターン化方法
JP2002374053A (ja) * 2001-06-15 2002-12-26 Matsushita Electric Ind Co Ltd パネル基材へのパターン形成方法及び装置
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US7141185B2 (en) 2003-01-29 2006-11-28 Parelec, Inc. High conductivity inks with low minimum curing temperatures
US7211205B2 (en) 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US20060158478A1 (en) 2005-01-14 2006-07-20 Howarth James J Circuit modeling and selective deposition
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
KR100634327B1 (ko) 2005-04-13 2006-10-13 한국기계연구원 롤-투-롤 윤전인쇄방식을 이용한 전자소자의 제조방법 및그 제조장치
US20070188327A1 (en) 2006-02-16 2007-08-16 Ncr Corporation Radio frequency device
IL182371A0 (en) 2006-04-04 2007-07-24 Hanita Coatings R C A Ltd Patterns of conductive objects on a substrate and method of producing thereof
US7653982B2 (en) 2007-11-16 2010-02-02 Xerox Corporation Individually unique hybrid printed antennae for chipless RFID applications
US9439293B2 (en) 2007-11-21 2016-09-06 Xerox Corporation Galvanic process for making printed conductive metal markings for chipless RFID applications
US7976733B2 (en) 2007-11-30 2011-07-12 Xerox Corporation Air stable copper nanoparticle ink and applications therefor
US7888169B2 (en) 2007-12-26 2011-02-15 Organicid, Inc. Organic semiconductor device and method of manufacturing the same
FR2926653B1 (fr) 2008-01-23 2010-02-26 Tageos Procede de realisation d'elements d'identification radiofrequence et elements d'identification radiofrequence susceptibles d'etre obtenus par un tel procede
US8062698B2 (en) 2008-03-10 2011-11-22 Xerox Corporation Synthesis of conductive metal markings for chipless RFID applications

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3877412T2 (de) 1987-05-05 1993-08-12 Digital Equipment Corp Bei einer mehrere halbleiterbausteine beinhaltenden verpackung fuer hohe ansprueche verwendbares mehrschichtenverbindungssystem.
DE102009033510A1 (de) 2008-11-13 2010-05-20 Sefar Ag Gewebe, Vorrichtung mit Gewebe sowie Herstellungsverfahren für Gewebe
US20100323102A1 (en) 2009-06-23 2010-12-23 Xerox Corporation System and Method for Preparing Conductive Structures Using Radiation Curable Phase Change Gel Inks

Also Published As

Publication number Publication date
US8635761B2 (en) 2014-01-28
US20130068511A1 (en) 2013-03-21
CN103025071B (zh) 2016-06-08
CN103025071A (zh) 2013-04-03
JP2013065838A (ja) 2013-04-11
JP5838136B2 (ja) 2015-12-24
DE102012215593A1 (de) 2013-03-21

Similar Documents

Publication Publication Date Title
DE102012215593A1 (de) System und Verfahren zum Bilden von elektrischen Leitern auf einem Substrat
DE102013109636B4 (de) Integriertes beschichtungssystem
DE69607277T2 (de) Thermischer Übertragungsfarbdrucker
DE69906212T2 (de) Endlosdruckverfahren für einen Plastikfilm, Gerät hierfür, sowie damit hergestellter bedruckter Plastikfilm
DE69404376T2 (de) Farbstrahlkopf
DE2921120C2 (de) Farbträgerband für eine Thermodruckvorrichtung
DE69209388T2 (de) Direktdruck-Abbildungssystem für den Lithographiedruck
DE69631782T2 (de) Vorrichtung und druckverfahren
DE112010003566T5 (de) Vorrichtung und Verfahren zum Bedrucken einer Folie mittels einer geprägten Musterfolie
DE102011087685A1 (de) System und Verfahren für das Tintenstrahldrucken einer Schutzschicht in unterschiedlichen Halbtönen mit Glanzkompensation
EP2308682B1 (de) Verfahren zum Erzeugen eines drucktechnischen Merkmals auf einem Substrat eines Druckprodukts
DE102012105854A1 (de) Verfahren und Vorrichtung zum Versehen eines Substrats mit einem Aufdruck, sowie mit Aufdruck versehenes Substrat
DE69120336T2 (de) Bildübertragungsverfahren für einen elektrografischen Drucker
EP0766908B1 (de) Verfahren und vorrichtung zum beschichten von leiterplatten, insbesondere zur herstellung von multi-chip-modulen
EP1052115A2 (de) Verfahren und Vorrichtung zum Aufbringen von Dekors und/oder Zeichen auf Glas-, Glaskeramik- und Keramikerzeugnisse
DE3874879T2 (de) Drucker.
EP1743510B1 (de) Verfahren zum drucken elektrischer und/oder elektronischer strukturen und folie zur verwendung in einem solchen verfahren
DE60015668T2 (de) Verfahren und Vorrichtung zum Laminieren
EP3571052A1 (de) Vorrichtung und verfahren zum bedrucken von unter thermischer belastung sich verformenden folien
DE102012218022B4 (de) Betrieb eines Kaltfolienaggregates mit einem Druckwerk
DE102016202432A1 (de) System und Verfahren zum Aufbringen elektromagnetischer Druckfarbe auf ein Bild aus nicht-elektromagnetischer Druckfarbe
DE102020103995A1 (de) Etikett zur radiofrequenz-identifikation (rfid) oder leiterbahn-thermotransferdruckverfahren
DE69210896T2 (de) Wärmekopf und elektronische Geräte
DE19629269A1 (de) Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauteils, insbesondere zur Herstellung einer Induktionsspule für Chipkarten
DE102004041497A1 (de) Organisches Elektronik-Bauteil sowie Verfahren zur Herstellung eines solchen

Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUS, DE

R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee