JP2013065838A - 基板上に導電体を形成するためのシステムおよび方法 - Google Patents
基板上に導電体を形成するためのシステムおよび方法 Download PDFInfo
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- JP2013065838A JP2013065838A JP2012187559A JP2012187559A JP2013065838A JP 2013065838 A JP2013065838 A JP 2013065838A JP 2012187559 A JP2012187559 A JP 2012187559A JP 2012187559 A JP2012187559 A JP 2012187559A JP 2013065838 A JP2013065838 A JP 2013065838A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
【解決手段】基板の表面領域の一部分を露出する第2のパターンを形成するために、非導電性材料を用いて基板上に導電体パターンの反転画像を印刷する。その後、導電性材料を用いて基板の全表面領域を覆う。反転画像の非導電性材料は、反転画像を覆う導電性材料を、第2のパターンを覆う導電性材料から電気的に絶縁する。
【選択図】なし
Description
Claims (10)
- 非導電性材料を実質的に含まない基板上に第2のパターンを形成するために前記非導電性材料を用いて前記基板上に第1のパターンを印刷することであって、前記基板が、前記第1のパターンと前記第2のパターンとを本質的に含む表面領域を有する、印刷することと、
前記第2のパターンを覆う前記導電性材料が、前記第1のパターン内に塗布された前記非導電性材料を覆う前記導電性材料から電気的に絶縁された導電体として機能できるようにするために、前記第1のパターンの前記非導電性材料と、前記非導電性材料を本質的に含まない前記基板と、を覆うように前記基板の前記表面領域に導電性材料を塗布することと、を含む、
基板上に導電体を形成する方法。 - 前記基板の前記表面領域の粗さが、前記非導電性材料で形成された前記第1のパターンの表面の粗さよりも小さい、請求項1に記載の方法。
- 基板と、
前記基板上の第1のパターン内に形成された非導電性材料であって、前記第1のパターンは、前記基板の表面領域の第2の部分を露出する第2のパターンを形成するために前記基板の前記表面領域の第1の部分だけを覆う、非導電性材料と、
前記第1のパターン内に形成された前記非導電性材料と、前記基板の前記表面領域の前記露出した第2の部分と、を覆う導電性材料であって、前記第2のパターンにより露出された前記基板の前記表面領域の前記第2の部分を覆う前記導電性材料は前記基板上の前記第1のパターン内に形成された前記非導電性材料を覆う前記導電性材料から電気的に絶縁されている、導電性材料と、を含む、
電気回路。 - 前記基板の前記表面領域上の前記第1のパターンが、前記導電性材料と、前記非導電性材料とで覆われており、前記導電性材料だけで覆われた前記第2のパターンの電気抵抗よりも大きい電気抵抗を有する、請求項3に記載の電気回路。
- 前記第1のパターンが、前記非導電性材料で覆われており、前記第2のパターンにより露出された前記基板の表面粗さよりも大きい表面粗さを有する請求項4に記載の電気回路。
- 前記非導電性材料が、前記非導電性材料の前記表面上に形成された前記導電性材料を、前記第2のパターンにより露出された前記基板の前記表面領域上に形成された前記導電性材料から電気的に絶縁するように構成されている、請求項3に記載の電気回路。
- 前記基板が多孔質材料を本質的に含む、請求項3に記載の電気回路。
- 前記多孔質材料が紙を本質的に含む、請求項7に記載の電気回路。
- 前記非導電性材料が乳化凝集トナーまたは相転移インクを本質的に含む、請求項3に記載の電気回路。
- 前記第2のパターンが、電磁信号の送信および受信のうちの少なくとも一方を可能にするアンテナとして構成されている、請求項3に記載の電気回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/236,265 US8635761B2 (en) | 2011-09-19 | 2011-09-19 | System and method for formation of electrical conductors on a substrate |
US13/236,265 | 2011-09-19 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013065838A true JP2013065838A (ja) | 2013-04-11 |
JP2013065838A5 JP2013065838A5 (ja) | 2015-10-08 |
JP5838136B2 JP5838136B2 (ja) | 2015-12-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012187559A Expired - Fee Related JP5838136B2 (ja) | 2011-09-19 | 2012-08-28 | 基板上に導電体を形成するためのシステムおよび方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8635761B2 (ja) |
JP (1) | JP5838136B2 (ja) |
CN (1) | CN103025071B (ja) |
DE (1) | DE102012215593B4 (ja) |
Cited By (4)
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KR20160001709A (ko) * | 2014-06-27 | 2016-01-06 | 펄스 핀랜드 오와이 | 도전성 요소 피착 및 형성을 위한 방법들 및 장치 |
US9325060B2 (en) | 2014-02-12 | 2016-04-26 | Pulse Finland Oy | Methods and apparatus for conductive element deposition and formation |
US9780438B2 (en) | 2012-03-02 | 2017-10-03 | Pulse Electronics, Inc. | Deposition antenna apparatus and methods |
US10020561B2 (en) | 2013-09-19 | 2018-07-10 | Pulse Finland Oy | Deposited three-dimensional antenna apparatus and methods |
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US9595754B2 (en) * | 2014-12-26 | 2017-03-14 | Wistron Neweb Corp. | Patterned conductive structure and method for forming the same |
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US10539376B2 (en) | 2016-03-18 | 2020-01-21 | Hewlett-Packard Development Company, L.P. | Fuser assemblies |
US11047630B2 (en) | 2018-05-14 | 2021-06-29 | Hewlett-Packard Development Company, L.P. | Fuser assemblies |
US11799183B2 (en) * | 2019-07-17 | 2023-10-24 | Xerox Corporation | System, apparatus, and method for producing printed electrically conductive lines |
CN110677932B (zh) * | 2019-09-10 | 2021-06-25 | 博宇(天津)半导体材料有限公司 | 一种陶瓷加热器支撑基体及陶瓷加热器 |
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KR101701620B1 (ko) * | 2014-06-27 | 2017-02-01 | 펄스 핀랜드 오와이 | 도전성 요소 피착 및 형성을 위한 방법들 및 장치 |
US9833802B2 (en) | 2014-06-27 | 2017-12-05 | Pulse Finland Oy | Methods and apparatus for conductive element deposition and formation |
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DE102012215593B4 (de) | 2022-04-21 |
US20130068511A1 (en) | 2013-03-21 |
DE102012215593A1 (de) | 2013-03-21 |
CN103025071B (zh) | 2016-06-08 |
CN103025071A (zh) | 2013-04-03 |
US8635761B2 (en) | 2014-01-28 |
JP5838136B2 (ja) | 2015-12-24 |
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