DE102012203794A1 - Elektrisch lösbarer Polyamid-Klebstoff - Google Patents

Elektrisch lösbarer Polyamid-Klebstoff Download PDF

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Publication number
DE102012203794A1
DE102012203794A1 DE201210203794 DE102012203794A DE102012203794A1 DE 102012203794 A1 DE102012203794 A1 DE 102012203794A1 DE 201210203794 DE201210203794 DE 201210203794 DE 102012203794 A DE102012203794 A DE 102012203794A DE 102012203794 A1 DE102012203794 A1 DE 102012203794A1
Authority
DE
Germany
Prior art keywords
mol
hot melt
melt adhesive
adhesive according
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE201210203794
Other languages
German (de)
English (en)
Inventor
Reimar Heucher
Siegfried Kopannia
Ciaran McArdle
Manuela Stuve
Jana Kolbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Henkel AG and Co KGaA
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Henkel AG and Co KGaA
Priority to DE201210203794 priority Critical patent/DE102012203794A1/de
Priority to PCT/EP2013/054972 priority patent/WO2013135677A1/de
Priority to JP2014561411A priority patent/JP2015514826A/ja
Priority to EP13708485.1A priority patent/EP2825608A1/de
Priority to KR1020147028297A priority patent/KR20140133606A/ko
Priority to CN201380013098.8A priority patent/CN104204129A/zh
Publication of DE102012203794A1 publication Critical patent/DE102012203794A1/de
Priority to US14/484,451 priority patent/US20140374032A1/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/021—Treatment by energy or chemical effects using electrical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE201210203794 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff Ceased DE102012203794A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE201210203794 DE102012203794A1 (de) 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff
PCT/EP2013/054972 WO2013135677A1 (de) 2012-03-12 2013-03-12 Elektrisch lösbarer polyamid-klebstoff
JP2014561411A JP2015514826A (ja) 2012-03-12 2013-03-12 電気的可分性ポリアミド接着剤
EP13708485.1A EP2825608A1 (de) 2012-03-12 2013-03-12 Elektrisch lösbarer polyamid-klebstoff
KR1020147028297A KR20140133606A (ko) 2012-03-12 2013-03-12 전기적 분할성 폴리아미드 접착제
CN201380013098.8A CN104204129A (zh) 2012-03-12 2013-03-12 可电分割的聚酰胺粘合剂
US14/484,451 US20140374032A1 (en) 2012-03-12 2014-09-12 Electrically divisible polyamide adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201210203794 DE102012203794A1 (de) 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff

Publications (1)

Publication Number Publication Date
DE102012203794A1 true DE102012203794A1 (de) 2013-09-12

Family

ID=47844378

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201210203794 Ceased DE102012203794A1 (de) 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff

Country Status (7)

Country Link
US (1) US20140374032A1 (https=)
EP (1) EP2825608A1 (https=)
JP (1) JP2015514826A (https=)
KR (1) KR20140133606A (https=)
CN (1) CN104204129A (https=)
DE (1) DE102012203794A1 (https=)
WO (1) WO2013135677A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016135341A1 (en) 2015-02-27 2016-09-01 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
EP3139390A1 (en) * 2015-09-02 2017-03-08 Shin-Etsu Chemical Co., Ltd. Method for producing permanent magnet magnetic circuit
EP3199344A1 (en) 2016-02-01 2017-08-02 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
DE102018201470A1 (de) * 2018-01-31 2019-01-10 Carl Zeiss Smt Gmbh Lithographieanlage und verfahren
WO2021213815A1 (en) 2020-04-24 2021-10-28 Henkel Ag & Co. Kgaa Heat separable two-layer adhesive system and process of adhesive debonding using the same
DE102022110643A1 (de) 2022-05-02 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2625552T3 (es) * 2014-06-17 2017-07-19 3M Innovative Properties Company Composición de adhesivo epoxídico de curado rápido
EP2990437B1 (en) * 2014-08-26 2017-10-04 Henkel AG & Co. KGaA Polyamide Hot Melt Coating
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
CN109749695A (zh) * 2017-11-06 2019-05-14 山东凯恩新材料科技有限公司 一种新型聚酰胺热熔胶及其制备方法
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
JP7804594B2 (ja) 2020-06-22 2026-01-22 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電気化学的に剥離可能な接着剤組成物
EP4050040A1 (en) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
KR20230169152A (ko) 2021-04-14 2023-12-15 헨켈 아게 운트 코. 카게아아 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체
EP4444785A1 (en) * 2021-12-07 2024-10-16 3M Innovative Properties Company Ionomer polyamides, primers, articles, and methods of making same
DE102022104817A1 (de) 2022-03-01 2023-09-07 Tesa Se Haftklebstoffzusammensetzung
KR102730909B1 (ko) * 2022-03-30 2024-11-15 실버스타케미칼(주) 바이오매스를 포함하는 생분해성 폴리아마이드 핫멜트 접착제
KR102842845B1 (ko) * 2023-02-17 2025-08-06 실버스타케미칼(주) 바이오매스를 포함하는 바이오플라스틱 복합 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005584A1 (en) 1999-07-14 2001-01-25 Eic Laboratories, Inc. Electrically disbonding materials
US20040097755A1 (en) 2000-09-27 2004-05-20 Abbott Andrew P. Ionic liquids and their use as solvents
WO2008150227A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2497518A1 (fr) * 1981-01-05 1982-07-09 Ato Chimie Compositions adhesives thermofusibles a base de copolyetheramides sequences
US4548996A (en) * 1984-01-09 1985-10-22 Monsanto Company Hot melt adhesive compositions
US7537840B2 (en) * 2004-08-05 2009-05-26 H.B. Licensing & Financing, Inc. Polyamide adhesive and articles including the same
BRPI0617034A2 (pt) * 2005-09-08 2011-07-19 Dow Global Technologies Inc uso de um polìmero termoplástico de poliéster/amida numa formulação de adesivo hot melt, método para aplicar um adesivo hot melt, método para ligar um primeiro substrato a um segundo substrato, artigo tecido ou não tecido, caixa, caixa de papelão ou bandeja, livro, e melhoramento em artigo
DE102005050632A1 (de) * 2005-10-20 2007-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoffzusammensetzung für Klebeverbindungen, die mittels Anlegen von elektrischer Spannung gelöst werden können

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005584A1 (en) 1999-07-14 2001-01-25 Eic Laboratories, Inc. Electrically disbonding materials
US20080283415A1 (en) * 1999-07-14 2008-11-20 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
US20040097755A1 (en) 2000-09-27 2004-05-20 Abbott Andrew P. Ionic liquids and their use as solvents
US7183433B2 (en) 2000-09-27 2007-02-27 Scionix Limited Ionic liquids and their use as solvents
WO2008150227A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure

Non-Patent Citations (3)

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Title
DIN 53176
EN ISO 2555
ISO 4625-1

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016135341A1 (en) 2015-02-27 2016-09-01 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
US10800956B2 (en) 2015-02-27 2020-10-13 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
EP3139390A1 (en) * 2015-09-02 2017-03-08 Shin-Etsu Chemical Co., Ltd. Method for producing permanent magnet magnetic circuit
EP3199344A1 (en) 2016-02-01 2017-08-02 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
WO2017133864A1 (en) 2016-02-01 2017-08-10 Henkel Ag & Co. Kgaa Electrical debonding of pu hot melt adhesives by use of conductive inks
US10590310B2 (en) 2016-02-01 2020-03-17 Henkel Ag & Co. Kgaa Electrical debonding of PU hot melt adhesives by use of conductive inks
DE102018201470A1 (de) * 2018-01-31 2019-01-10 Carl Zeiss Smt Gmbh Lithographieanlage und verfahren
WO2021213815A1 (en) 2020-04-24 2021-10-28 Henkel Ag & Co. Kgaa Heat separable two-layer adhesive system and process of adhesive debonding using the same
US12448547B2 (en) 2020-04-24 2025-10-21 Henkel Ag & Co. Kgaa Heat separable two-layer adhesive system and process of adhesive debonding using the same
DE102022110643A1 (de) 2022-05-02 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement
EP4273201A2 (de) 2022-05-02 2023-11-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermisch aktivierbares expansionselement, verwendung desselben sowie fügeteil und verbundbauteil umfassend das thermisch aktivierbare expansionselement

Also Published As

Publication number Publication date
KR20140133606A (ko) 2014-11-19
WO2013135677A1 (de) 2013-09-19
US20140374032A1 (en) 2014-12-25
EP2825608A1 (de) 2015-01-21
CN104204129A (zh) 2014-12-10
JP2015514826A (ja) 2015-05-21

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