KR20140133606A - 전기적 분할성 폴리아미드 접착제 - Google Patents

전기적 분할성 폴리아미드 접착제 Download PDF

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Publication number
KR20140133606A
KR20140133606A KR1020147028297A KR20147028297A KR20140133606A KR 20140133606 A KR20140133606 A KR 20140133606A KR 1020147028297 A KR1020147028297 A KR 1020147028297A KR 20147028297 A KR20147028297 A KR 20147028297A KR 20140133606 A KR20140133606 A KR 20140133606A
Authority
KR
South Korea
Prior art keywords
mol
melt adhesive
hot melt
weight
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147028297A
Other languages
English (en)
Korean (ko)
Inventor
라이마르 호이허
지그프리트 코파니아
시어런 맥카들
마누엘라 슈투페
야나 콜베
Original Assignee
헨켈 아게 운트 코. 카게아아
프라운호퍼-게젤샤프트 추르 푀르데룽 데어 안제반텐 포르슝 에 파우
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 헨켈 아게 운트 코. 카게아아, 프라운호퍼-게젤샤프트 추르 푀르데룽 데어 안제반텐 포르슝 에 파우 filed Critical 헨켈 아게 운트 코. 카게아아
Publication of KR20140133606A publication Critical patent/KR20140133606A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/021—Treatment by energy or chemical effects using electrical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020147028297A 2012-03-12 2013-03-12 전기적 분할성 폴리아미드 접착제 Withdrawn KR20140133606A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012203794.2 2012-03-12
DE201210203794 DE102012203794A1 (de) 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff
PCT/EP2013/054972 WO2013135677A1 (de) 2012-03-12 2013-03-12 Elektrisch lösbarer polyamid-klebstoff

Publications (1)

Publication Number Publication Date
KR20140133606A true KR20140133606A (ko) 2014-11-19

Family

ID=47844378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147028297A Withdrawn KR20140133606A (ko) 2012-03-12 2013-03-12 전기적 분할성 폴리아미드 접착제

Country Status (7)

Country Link
US (1) US20140374032A1 (https=)
EP (1) EP2825608A1 (https=)
JP (1) JP2015514826A (https=)
KR (1) KR20140133606A (https=)
CN (1) CN104204129A (https=)
DE (1) DE102012203794A1 (https=)
WO (1) WO2013135677A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170122218A (ko) * 2015-02-27 2017-11-03 헨켈 아게 운트 코. 카게아아 탈결합 가능한 반응성 핫 멜트 접착제
KR20180111869A (ko) * 2016-02-01 2018-10-11 헨켈 아게 운트 코. 카게아아 전도성 잉크의 사용에 의한 pu 핫 멜트 접착제의 전기적 탈결합
KR20230140810A (ko) * 2022-03-30 2023-10-10 실버스타케미칼(주) 바이오매스를 포함하는 생분해성 폴리아마이드 핫멜트 접착제
KR20240128467A (ko) * 2023-02-17 2024-08-26 실버스타케미칼(주) 바이오매스를 포함하는 바이오플라스틱 복합 조성물

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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ES2625552T3 (es) * 2014-06-17 2017-07-19 3M Innovative Properties Company Composición de adhesivo epoxídico de curado rápido
EP2990437B1 (en) * 2014-08-26 2017-10-04 Henkel AG & Co. KGaA Polyamide Hot Melt Coating
JP6407825B2 (ja) * 2015-09-02 2018-10-17 信越化学工業株式会社 永久磁石磁気回路の製造方法
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
CN109749695A (zh) * 2017-11-06 2019-05-14 山东凯恩新材料科技有限公司 一种新型聚酰胺热熔胶及其制备方法
DE102018201470A1 (de) * 2018-01-31 2019-01-10 Carl Zeiss Smt Gmbh Lithographieanlage und verfahren
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
CN115443320A (zh) 2020-04-24 2022-12-06 汉高股份有限及两合公司 可热分离的双层胶黏剂体系和使用该体系的胶黏剂脱胶方法
JP7804594B2 (ja) 2020-06-22 2026-01-22 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電気化学的に剥離可能な接着剤組成物
EP4050040A1 (en) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
KR20230169152A (ko) 2021-04-14 2023-12-15 헨켈 아게 운트 코. 카게아아 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체
EP4444785A1 (en) * 2021-12-07 2024-10-16 3M Innovative Properties Company Ionomer polyamides, primers, articles, and methods of making same
DE102022104817A1 (de) 2022-03-01 2023-09-07 Tesa Se Haftklebstoffzusammensetzung
DE102022110643A1 (de) 2022-05-02 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement

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FR2497518A1 (fr) * 1981-01-05 1982-07-09 Ato Chimie Compositions adhesives thermofusibles a base de copolyetheramides sequences
US4548996A (en) * 1984-01-09 1985-10-22 Monsanto Company Hot melt adhesive compositions
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
GB0023706D0 (en) 2000-09-27 2000-11-08 Scionix Ltd Ionic liquids
US7537840B2 (en) * 2004-08-05 2009-05-26 H.B. Licensing & Financing, Inc. Polyamide adhesive and articles including the same
BRPI0617034A2 (pt) * 2005-09-08 2011-07-19 Dow Global Technologies Inc uso de um polìmero termoplástico de poliéster/amida numa formulação de adesivo hot melt, método para aplicar um adesivo hot melt, método para ligar um primeiro substrato a um segundo substrato, artigo tecido ou não tecido, caixa, caixa de papelão ou bandeja, livro, e melhoramento em artigo
DE102005050632A1 (de) * 2005-10-20 2007-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoffzusammensetzung für Klebeverbindungen, die mittels Anlegen von elektrischer Spannung gelöst werden können
WO2008150227A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170122218A (ko) * 2015-02-27 2017-11-03 헨켈 아게 운트 코. 카게아아 탈결합 가능한 반응성 핫 멜트 접착제
KR20180111869A (ko) * 2016-02-01 2018-10-11 헨켈 아게 운트 코. 카게아아 전도성 잉크의 사용에 의한 pu 핫 멜트 접착제의 전기적 탈결합
KR20230140810A (ko) * 2022-03-30 2023-10-10 실버스타케미칼(주) 바이오매스를 포함하는 생분해성 폴리아마이드 핫멜트 접착제
KR20240128467A (ko) * 2023-02-17 2024-08-26 실버스타케미칼(주) 바이오매스를 포함하는 바이오플라스틱 복합 조성물

Also Published As

Publication number Publication date
WO2013135677A1 (de) 2013-09-19
US20140374032A1 (en) 2014-12-25
EP2825608A1 (de) 2015-01-21
DE102012203794A1 (de) 2013-09-12
CN104204129A (zh) 2014-12-10
JP2015514826A (ja) 2015-05-21

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20141008

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid