CN104204129A - 可电分割的聚酰胺粘合剂 - Google Patents

可电分割的聚酰胺粘合剂 Download PDF

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Publication number
CN104204129A
CN104204129A CN201380013098.8A CN201380013098A CN104204129A CN 104204129 A CN104204129 A CN 104204129A CN 201380013098 A CN201380013098 A CN 201380013098A CN 104204129 A CN104204129 A CN 104204129A
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CN
China
Prior art keywords
mol
hotmelt
weight
acid
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380013098.8A
Other languages
English (en)
Chinese (zh)
Inventor
R·霍谢尔
S·科潘尼亚
C·麦卡德尔
M·施图韦
J·科尔贝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Henkel AG and Co KGaA
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Henkel AG and Co KGaA
Publication of CN104204129A publication Critical patent/CN104204129A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/021—Treatment by energy or chemical effects using electrical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201380013098.8A 2012-03-12 2013-03-12 可电分割的聚酰胺粘合剂 Pending CN104204129A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012203794.2 2012-03-12
DE201210203794 DE102012203794A1 (de) 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff
PCT/EP2013/054972 WO2013135677A1 (de) 2012-03-12 2013-03-12 Elektrisch lösbarer polyamid-klebstoff

Publications (1)

Publication Number Publication Date
CN104204129A true CN104204129A (zh) 2014-12-10

Family

ID=47844378

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380013098.8A Pending CN104204129A (zh) 2012-03-12 2013-03-12 可电分割的聚酰胺粘合剂

Country Status (7)

Country Link
US (1) US20140374032A1 (https=)
EP (1) EP2825608A1 (https=)
JP (1) JP2015514826A (https=)
KR (1) KR20140133606A (https=)
CN (1) CN104204129A (https=)
DE (1) DE102012203794A1 (https=)
WO (1) WO2013135677A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486279A (zh) * 2015-09-02 2017-03-08 信越化学工业株式会社 生产永磁磁路的方法
CN108602313A (zh) * 2016-02-01 2018-09-28 汉高股份有限及两合公司 通过采用导电油墨来使聚氨酯热熔粘合剂电脱粘
CN109749695A (zh) * 2017-11-06 2019-05-14 山东凯恩新材料科技有限公司 一种新型聚酰胺热熔胶及其制备方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2625552T3 (es) * 2014-06-17 2017-07-19 3M Innovative Properties Company Composición de adhesivo epoxídico de curado rápido
EP2990437B1 (en) * 2014-08-26 2017-10-04 Henkel AG & Co. KGaA Polyamide Hot Melt Coating
EP3262132A1 (en) 2015-02-27 2018-01-03 Henkel AG & Co. KGaA Debondable reactive hot melt adhesives
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
DE102018201470A1 (de) * 2018-01-31 2019-01-10 Carl Zeiss Smt Gmbh Lithographieanlage und verfahren
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
CN115443320A (zh) 2020-04-24 2022-12-06 汉高股份有限及两合公司 可热分离的双层胶黏剂体系和使用该体系的胶黏剂脱胶方法
JP7804594B2 (ja) 2020-06-22 2026-01-22 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電気化学的に剥離可能な接着剤組成物
EP4050040A1 (en) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
KR20230169152A (ko) 2021-04-14 2023-12-15 헨켈 아게 운트 코. 카게아아 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체
EP4444785A1 (en) * 2021-12-07 2024-10-16 3M Innovative Properties Company Ionomer polyamides, primers, articles, and methods of making same
DE102022104817A1 (de) 2022-03-01 2023-09-07 Tesa Se Haftklebstoffzusammensetzung
KR102730909B1 (ko) * 2022-03-30 2024-11-15 실버스타케미칼(주) 바이오매스를 포함하는 생분해성 폴리아마이드 핫멜트 접착제
DE102022110643A1 (de) 2022-05-02 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement
KR102842845B1 (ko) * 2023-02-17 2025-08-06 실버스타케미칼(주) 바이오매스를 포함하는 바이오플라스틱 복합 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005584A1 (en) * 1999-07-14 2001-01-25 Eic Laboratories, Inc. Electrically disbonding materials
DE102005050632A1 (de) * 2005-10-20 2007-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoffzusammensetzung für Klebeverbindungen, die mittels Anlegen von elektrischer Spannung gelöst werden können

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
FR2497518A1 (fr) * 1981-01-05 1982-07-09 Ato Chimie Compositions adhesives thermofusibles a base de copolyetheramides sequences
US4548996A (en) * 1984-01-09 1985-10-22 Monsanto Company Hot melt adhesive compositions
GB0023706D0 (en) 2000-09-27 2000-11-08 Scionix Ltd Ionic liquids
US7537840B2 (en) * 2004-08-05 2009-05-26 H.B. Licensing & Financing, Inc. Polyamide adhesive and articles including the same
BRPI0617034A2 (pt) * 2005-09-08 2011-07-19 Dow Global Technologies Inc uso de um polìmero termoplástico de poliéster/amida numa formulação de adesivo hot melt, método para aplicar um adesivo hot melt, método para ligar um primeiro substrato a um segundo substrato, artigo tecido ou não tecido, caixa, caixa de papelão ou bandeja, livro, e melhoramento em artigo
WO2008150227A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005584A1 (en) * 1999-07-14 2001-01-25 Eic Laboratories, Inc. Electrically disbonding materials
DE102005050632A1 (de) * 2005-10-20 2007-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoffzusammensetzung für Klebeverbindungen, die mittels Anlegen von elektrischer Spannung gelöst werden können

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486279A (zh) * 2015-09-02 2017-03-08 信越化学工业株式会社 生产永磁磁路的方法
CN106486279B (zh) * 2015-09-02 2020-05-15 信越化学工业株式会社 生产永磁磁路的方法
CN108602313A (zh) * 2016-02-01 2018-09-28 汉高股份有限及两合公司 通过采用导电油墨来使聚氨酯热熔粘合剂电脱粘
TWI722104B (zh) * 2016-02-01 2021-03-21 德商漢高股份有限及兩合公司 利用導電墨水電脫黏pu熱熔黏著劑
CN118849536A (zh) * 2016-02-01 2024-10-29 汉高股份有限及两合公司 通过采用导电油墨来使聚氨酯热熔粘合剂电脱粘
CN109749695A (zh) * 2017-11-06 2019-05-14 山东凯恩新材料科技有限公司 一种新型聚酰胺热熔胶及其制备方法

Also Published As

Publication number Publication date
KR20140133606A (ko) 2014-11-19
WO2013135677A1 (de) 2013-09-19
US20140374032A1 (en) 2014-12-25
EP2825608A1 (de) 2015-01-21
DE102012203794A1 (de) 2013-09-12
JP2015514826A (ja) 2015-05-21

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141210