DE102012110858A1 - Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems - Google Patents

Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems Download PDF

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Publication number
DE102012110858A1
DE102012110858A1 DE102012110858.7A DE102012110858A DE102012110858A1 DE 102012110858 A1 DE102012110858 A1 DE 102012110858A1 DE 102012110858 A DE102012110858 A DE 102012110858A DE 102012110858 A1 DE102012110858 A1 DE 102012110858A1
Authority
DE
Germany
Prior art keywords
temperature sensor
housing part
ceramic housing
sensor system
sensor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102012110858.7A
Other languages
German (de)
English (en)
Inventor
Jan Ihle
Oliver Bard
Steffen Mehlig
Wolfgang Grundmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102012110858.7A priority Critical patent/DE102012110858A1/de
Priority to PCT/EP2013/070256 priority patent/WO2014072126A2/de
Priority to EP13773211.1A priority patent/EP2917710B1/de
Priority to CN201380059149.0A priority patent/CN104769402B/zh
Priority to KR1020157015321A priority patent/KR102049631B1/ko
Priority to JP2015541057A priority patent/JP6250690B2/ja
Priority to US14/442,333 priority patent/US10132689B2/en
Publication of DE102012110858A1 publication Critical patent/DE102012110858A1/de
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
DE102012110858.7A 2012-11-12 2012-11-12 Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems Ceased DE102012110858A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102012110858.7A DE102012110858A1 (de) 2012-11-12 2012-11-12 Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems
PCT/EP2013/070256 WO2014072126A2 (de) 2012-11-12 2013-09-27 Temperatursensorsystem und verfahren zur herstellung eines temperatursensorsystems
EP13773211.1A EP2917710B1 (de) 2012-11-12 2013-09-27 Temperatursensorsystem und verfahren zur herstellung eines temperatursensorsystems
CN201380059149.0A CN104769402B (zh) 2012-11-12 2013-09-27 温度传感器系统和用于加工温度传感器系统的方法
KR1020157015321A KR102049631B1 (ko) 2012-11-12 2013-09-27 온도 센서 시스템 및 그 제조 방법
JP2015541057A JP6250690B2 (ja) 2012-11-12 2013-09-27 温度センサシステムおよび温度センサシステムの製造方法
US14/442,333 US10132689B2 (en) 2012-11-12 2013-09-27 Temperature sensor system and method for producing a temperature sensor system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012110858.7A DE102012110858A1 (de) 2012-11-12 2012-11-12 Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems

Publications (1)

Publication Number Publication Date
DE102012110858A1 true DE102012110858A1 (de) 2014-05-15

Family

ID=49303962

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012110858.7A Ceased DE102012110858A1 (de) 2012-11-12 2012-11-12 Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems

Country Status (7)

Country Link
US (1) US10132689B2 (ko)
EP (1) EP2917710B1 (ko)
JP (1) JP6250690B2 (ko)
KR (1) KR102049631B1 (ko)
CN (1) CN104769402B (ko)
DE (1) DE102012110858A1 (ko)
WO (1) WO2014072126A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6484462B2 (ja) * 2015-03-02 2019-03-13 日立Ｇｅニュークリア・エナジー株式会社 温度計測システム
DE102016125403A1 (de) * 2016-12-22 2018-06-28 Endress + Hauser Wetzer Gmbh + Co Kg Temperatursensor
CN107219009A (zh) * 2017-08-02 2017-09-29 武汉优斯特汽车传感器科技有限公司 一种温度传感器
DE202019104670U1 (de) * 2019-08-26 2019-12-10 Tdk Electronics Ag Sensor
WO2022240644A1 (en) * 2021-05-08 2022-11-17 Therm-O-Disc Incorporated Temperature sensor probe

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708844C2 (ko) * 1986-03-18 1990-07-12 Hitachi Metals, Ltd., Tokio/Tokyo, Jp
DE10238628A1 (de) * 2002-08-19 2004-03-11 Temperaturmeßtechnik Geraberg GmbH Keramisch isolierter Hochtemperatursensor
DE102007032694A1 (de) * 2007-07-13 2009-01-22 Kutzner, Dieter, Dipl.-Ing. Schutzhülle für ein Temperaturmesselement
JP2010032237A (ja) 2008-07-25 2010-02-12 Worldwing Co Ltd 温度センサ
EP2420807A2 (en) 2010-08-19 2012-02-22 NGK Spark Plug Co., Ltd. Temperature sensor

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
CA1289268C (en) 1988-11-21 1991-09-17 Harald H. Schmidt Thermocouple with bent sheath
US5209571A (en) * 1992-07-09 1993-05-11 Heraeus Electro-Nite International N.V. Device for measuring the temperature of a molten metal
US5697706A (en) * 1995-12-26 1997-12-16 Chrysler Corporation Multi-point temperature probe
JP3325207B2 (ja) * 1997-06-30 2002-09-17 アイシン・エィ・ダブリュ株式会社 温度センサ
JP2002048655A (ja) * 2000-05-24 2002-02-15 Ngk Spark Plug Co Ltd 温度センサ及びその製造管理方法
DE10062041C2 (de) * 2000-12-13 2003-03-13 Beru Ag Temperatursensor
JP4041018B2 (ja) 2003-06-25 2008-01-30 Ｔｄｋ株式会社 温度センサ
CN2658730Y (zh) 2003-07-01 2004-11-24 湘潭钢铁集团有限公司 快速测温电偶
DE10340636B3 (de) 2003-09-03 2005-01-13 Epcos Ag Verfahren zur Herstellung eines feuchtedichten Fühlers
EP1714122B1 (de) * 2004-02-09 2013-11-13 Temperaturmesstechnik Geraberg GmbH Hochtemperatursensor
DE102004018354B4 (de) * 2004-04-15 2007-01-11 Epcos Ag Messfühler
DE102004035628B4 (de) 2004-07-22 2007-03-29 Sensotherm Temperatursensorik Gmbh Temperaturerfassungseinheit und Verfahren zu deren Herstellung
US20060222050A1 (en) * 2005-03-31 2006-10-05 Robertshaw Controls Company Ceramic receptacle for temperature probes and the like
US7458718B2 (en) * 2006-02-22 2008-12-02 Honeywell International Inc. Temperature sensor that achieves a fast response in an exhaust gas environment
US8366316B2 (en) * 2006-04-14 2013-02-05 Deka Products Limited Partnership Sensor apparatus systems, devices and methods
US7719401B2 (en) * 2006-04-26 2010-05-18 Northrop Grumman Corporation Temperature probe and method of making the same
CN201075039Y (zh) 2007-08-08 2008-06-18 张品莹 一种浇封型温度传感器
US20090148657A1 (en) * 2007-12-05 2009-06-11 Jan Ihle Injection Molded PTC-Ceramics
DE102009008457A1 (de) 2009-02-11 2010-08-12 Continental Automotive Gmbh Verfahren zur Herstellung eines Sensors mit nahtloser Umspritzung eines Sensorelementes
US9823133B2 (en) * 2009-07-20 2017-11-21 Applied Materials, Inc. EMI/RF shielding of thermocouples
JP5304822B2 (ja) * 2010-04-28 2013-10-02 株式会社デンソー 温度センサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708844C2 (ko) * 1986-03-18 1990-07-12 Hitachi Metals, Ltd., Tokio/Tokyo, Jp
DE10238628A1 (de) * 2002-08-19 2004-03-11 Temperaturmeßtechnik Geraberg GmbH Keramisch isolierter Hochtemperatursensor
DE102007032694A1 (de) * 2007-07-13 2009-01-22 Kutzner, Dieter, Dipl.-Ing. Schutzhülle für ein Temperaturmesselement
JP2010032237A (ja) 2008-07-25 2010-02-12 Worldwing Co Ltd 温度センサ
EP2420807A2 (en) 2010-08-19 2012-02-22 NGK Spark Plug Co., Ltd. Temperature sensor

Also Published As

Publication number Publication date
WO2014072126A2 (de) 2014-05-15
JP6250690B2 (ja) 2017-12-20
EP2917710B1 (de) 2018-08-01
JP2015534085A (ja) 2015-11-26
CN104769402B (zh) 2018-12-28
US20160258818A1 (en) 2016-09-08
EP2917710A2 (de) 2015-09-16
KR102049631B1 (ko) 2019-11-27
US10132689B2 (en) 2018-11-20
WO2014072126A3 (de) 2014-08-07
CN104769402A (zh) 2015-07-08
KR20150081361A (ko) 2015-07-13

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R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: G01K0007220000

Ipc: G01K0001100000

R081 Change of applicant/patentee

Owner name: TDK ELECTRONICS AG, DE

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final