DE102012007811A1 - Chemisch-mechanische Polierzusammensetzung und Verfahren zum Polieren von Germanium-Antimon-Tellur-Legierungen - Google Patents

Chemisch-mechanische Polierzusammensetzung und Verfahren zum Polieren von Germanium-Antimon-Tellur-Legierungen Download PDF

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Publication number
DE102012007811A1
DE102012007811A1 DE102012007811A DE102012007811A DE102012007811A1 DE 102012007811 A1 DE102012007811 A1 DE 102012007811A1 DE 102012007811 A DE102012007811 A DE 102012007811A DE 102012007811 A DE102012007811 A DE 102012007811A DE 102012007811 A1 DE102012007811 A1 DE 102012007811A1
Authority
DE
Germany
Prior art keywords
mechanical polishing
chemical mechanical
substrate
polishing composition
phase change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012007811A
Other languages
German (de)
English (en)
Inventor
Jaeseok Lee
Yi Guo
Kancharla-Arun Kumar Reddy
Guangyun Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102012007811A1 publication Critical patent/DE102012007811A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/061—Shaping switching materials
    • H10N70/066—Shaping switching materials by filling of openings, e.g. damascene method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE102012007811A 2011-04-28 2012-04-18 Chemisch-mechanische Polierzusammensetzung und Verfahren zum Polieren von Germanium-Antimon-Tellur-Legierungen Withdrawn DE102012007811A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/096,740 US8309468B1 (en) 2011-04-28 2011-04-28 Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys
US13/096,740 2011-04-28

Publications (1)

Publication Number Publication Date
DE102012007811A1 true DE102012007811A1 (de) 2012-10-31

Family

ID=47007821

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012007811A Withdrawn DE102012007811A1 (de) 2011-04-28 2012-04-18 Chemisch-mechanische Polierzusammensetzung und Verfahren zum Polieren von Germanium-Antimon-Tellur-Legierungen

Country Status (6)

Country Link
US (1) US8309468B1 (https=)
JP (1) JP5947611B2 (https=)
CN (1) CN102756326B (https=)
DE (1) DE102012007811A1 (https=)
FR (1) FR2974530B1 (https=)
TW (1) TWI532830B (https=)

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* Cited by examiner, † Cited by third party
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US8790160B2 (en) * 2011-04-28 2014-07-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing phase change alloys
JP2013084876A (ja) * 2011-09-30 2013-05-09 Fujimi Inc 研磨用組成物
US9238755B2 (en) * 2011-11-25 2016-01-19 Fujima Incorporated Polishing composition
US8920667B2 (en) * 2013-01-30 2014-12-30 Cabot Microelectronics Corporation Chemical-mechanical polishing composition containing zirconia and metal oxidizer
JP6094541B2 (ja) * 2014-07-28 2017-03-15 信越半導体株式会社 ゲルマニウムウェーハの研磨方法
JP7545106B2 (ja) * 2019-08-29 2024-09-04 日産化学株式会社 過酸化水素を含む酸化物系基板の研磨用組成物
CN114605922B (zh) * 2022-03-18 2023-05-09 北京通美晶体技术股份有限公司 一种快速抛光的化学抛光液及其制备方法
CN116399667A (zh) * 2023-04-13 2023-07-07 宁波江丰电子材料股份有限公司 一种锗碲锑合金的溶解方法

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US7064070B2 (en) * 1998-09-28 2006-06-20 Tokyo Electron Limited Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process
US6176895B1 (en) * 1998-11-04 2001-01-23 Desimone Joseph M. Polymers for metal extractions in carbon dioxide
US6884144B2 (en) 2002-08-16 2005-04-26 Micron Technology, Inc. Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers
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CN1300271C (zh) * 2004-09-24 2007-02-14 中国科学院上海微系统与信息技术研究所 硫系化合物相变材料化学机械抛光的纳米抛光液及其应用
JP2008533442A (ja) * 2005-01-18 2008-08-21 アイダホ リサーチ ファウンデーション インコーポレイテッド 金属含有物質から金属を回収する方法およびシステム
KR101332302B1 (ko) * 2005-06-06 2013-11-25 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 단일 플래튼 처리를 위한 방법 및 일체형 화학적 기계적연마 조성물
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CN101372606B (zh) * 2008-10-14 2013-04-17 中国科学院上海微系统与信息技术研究所 用氧化铈化学机械抛光液抛光硫系化合物相变材料的方法
US8735293B2 (en) * 2008-11-05 2014-05-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
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KR20100101379A (ko) * 2009-03-09 2010-09-17 삼성전자주식회사 상변화 물질의 화학 기계적 연마 방법, 및 이를 이용한 상변화 메모리 소자 제조 방법
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Also Published As

Publication number Publication date
CN102756326A (zh) 2012-10-31
FR2974530B1 (fr) 2016-03-04
JP2012235110A (ja) 2012-11-29
US8309468B1 (en) 2012-11-13
TWI532830B (zh) 2016-05-11
JP5947611B2 (ja) 2016-07-06
CN102756326B (zh) 2015-08-12
FR2974530A1 (fr) 2012-11-02
TW201247855A (en) 2012-12-01
US20120276742A1 (en) 2012-11-01

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