DE102011078077A1 - Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors - Google Patents

Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors Download PDF

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Publication number
DE102011078077A1
DE102011078077A1 DE102011078077A DE102011078077A DE102011078077A1 DE 102011078077 A1 DE102011078077 A1 DE 102011078077A1 DE 102011078077 A DE102011078077 A DE 102011078077A DE 102011078077 A DE102011078077 A DE 102011078077A DE 102011078077 A1 DE102011078077 A1 DE 102011078077A1
Authority
DE
Germany
Prior art keywords
electrode
circuit board
printed circuit
electrodes
configuration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102011078077A
Other languages
German (de)
English (en)
Inventor
Stefan Burger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microchip Technology Germany GmbH
Original Assignee
Ident Technology AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ident Technology AG filed Critical Ident Technology AG
Priority to DE102011078077A priority Critical patent/DE102011078077A1/de
Priority to US14/128,998 priority patent/US9702902B2/en
Priority to CN201280039513.2A priority patent/CN103733518B/zh
Priority to KR1020147001022A priority patent/KR101911842B1/ko
Priority to PCT/EP2012/061900 priority patent/WO2012175580A2/en
Priority to EP12730884.9A priority patent/EP2724464B1/en
Priority to JP2014516332A priority patent/JP6081996B2/ja
Priority to TW101122553A priority patent/TWI556693B/zh
Publication of DE102011078077A1 publication Critical patent/DE102011078077A1/de
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960765—Details of shielding arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960775—Emitter-receiver or "fringe" type detection, i.e. one or more field emitting electrodes and corresponding one or more receiving electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE102011078077A 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors Ceased DE102011078077A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102011078077A DE102011078077A1 (de) 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
US14/128,998 US9702902B2 (en) 2011-06-24 2012-06-20 Printed circuit board comprising an electrode configuration of a capacitive sensor
CN201280039513.2A CN103733518B (zh) 2011-06-24 2012-06-20 包括电容性传感器的电极配置的印刷电路板
KR1020147001022A KR101911842B1 (ko) 2011-06-24 2012-06-20 용량성 센서의 전극 구성을 포함하는 인쇄 회로 기판
PCT/EP2012/061900 WO2012175580A2 (en) 2011-06-24 2012-06-20 Printed circuit board comprising an electrode configuration of an capacitive sensor
EP12730884.9A EP2724464B1 (en) 2011-06-24 2012-06-20 Printed circuit board comprising an electrode configuration of an capacitive sensor
JP2014516332A JP6081996B2 (ja) 2011-06-24 2012-06-20 容量性センサの電極構成を備えている印刷回路基板
TW101122553A TWI556693B (zh) 2011-06-24 2012-06-22 包含一電容感測器之一電極組態之印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011078077A DE102011078077A1 (de) 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors

Publications (1)

Publication Number Publication Date
DE102011078077A1 true DE102011078077A1 (de) 2012-12-27

Family

ID=46420125

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011078077A Ceased DE102011078077A1 (de) 2011-06-24 2011-06-24 Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors

Country Status (8)

Country Link
US (1) US9702902B2 (https=)
EP (1) EP2724464B1 (https=)
JP (1) JP6081996B2 (https=)
KR (1) KR101911842B1 (https=)
CN (1) CN103733518B (https=)
DE (1) DE102011078077A1 (https=)
TW (1) TWI556693B (https=)
WO (1) WO2012175580A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015006607A1 (de) 2015-05-21 2016-11-24 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug
DE102014014050B4 (de) * 2014-09-29 2017-08-03 gomtec GmbH Näherungssensoranordnung
EP3629478A1 (de) * 2018-09-26 2020-04-01 Huf Hülsbeck & Fürst GmbH & Co. KG Sensorvorrichtung zur detektion einer aktivierungshandlung bei einem fahrzeug
EP3758230A1 (de) * 2019-06-28 2020-12-30 Robert Bosch GmbH Sensoreinrichtung mit kapazitivem sensor
DE102015017199B4 (de) 2015-05-21 2025-05-22 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug und Kraftfahrzeug

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DE102009057935B4 (de) * 2009-12-11 2015-07-09 Ident Technology Ag Einrichtung und Verfahren zur Detektion eines Umgreifens eines Handgeräts durch eine Hand
DE102009057933B3 (de) * 2009-12-11 2011-02-24 Ident Technology Ag Sensoreinrichtung sowie Verfahren zur Annäherungs- und Berührungsdetektion
DE102011078077A1 (de) 2011-06-24 2012-12-27 Ident Technology Ag Leiterplatte mit Elektrodenkonfiguration eines kapazitiven Sensors
DE102012109034A1 (de) * 2012-09-25 2014-03-27 Huf Hülsbeck & Fürst Gmbh & Co. Kg Kraftfahrzeugtürgriff mit Sensorelektronik
WO2016017298A1 (ja) * 2014-07-30 2016-02-04 日立オートモティブシステムズ株式会社 物理量検出装置
US9810314B2 (en) 2015-02-25 2017-11-07 Kongsberg Driveline Systems I, Inc. Rotary shifter assembly
US10108292B2 (en) * 2015-04-22 2018-10-23 Microchip Technology Incorporated Capacitive sensor system with multiple transmit electrodes
JP6511963B2 (ja) * 2015-05-28 2019-05-15 アイシン精機株式会社 静電センサ
CN108352102B (zh) 2015-11-19 2020-02-14 法国圣戈班玻璃厂 警报玻璃板装置
WO2017085302A1 (de) * 2015-11-19 2017-05-26 Saint-Gobain Glass France Alarmscheibenanordnung
CN105649604B (zh) * 2015-12-30 2019-12-06 中国石油天然气集团公司 一种电极电路内置结构
US10089513B2 (en) * 2016-05-30 2018-10-02 Kyocera Corporation Wiring board for fingerprint sensor
BR112018072278A2 (pt) 2016-08-02 2019-02-12 Saint-Gobain Glass France montagem de painel de alarme
BR112018072275A2 (pt) 2016-08-02 2019-02-12 Saint-Gobain Glass France montagem de painel de alarme
US10285275B2 (en) * 2017-05-25 2019-05-07 Tt Electronics Plc Sensor device having printed circuit board substrate with built-in media channel
JP2026048150A (ja) * 2024-09-05 2026-03-17 Smk株式会社 入力装置

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DE19823190A1 (de) * 1998-04-09 1999-10-14 Mannesmann Vdo Ag Füllstandssensor mit Schwimmer
DE102007058088A1 (de) * 2007-12-03 2009-06-04 Robert Bosch Gmbh Sensor zur tiefenselektiven Ortung dielektrischer Werkstoffe und Verfahren zum Betrieb eines derartigen Sensor
DE102008019178A1 (de) * 2008-04-17 2009-11-05 Preh Gmbh Sensoranordnung mit einem kapazitiven Regensensor und einem Lichtsensor
DE102010019841A1 (de) * 2010-05-07 2011-11-10 Ident Technology Ag Leiterplatte für Display und Anzeigemodul mit Display und Leiterplatte

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19823190A1 (de) * 1998-04-09 1999-10-14 Mannesmann Vdo Ag Füllstandssensor mit Schwimmer
DE102007058088A1 (de) * 2007-12-03 2009-06-04 Robert Bosch Gmbh Sensor zur tiefenselektiven Ortung dielektrischer Werkstoffe und Verfahren zum Betrieb eines derartigen Sensor
DE102008019178A1 (de) * 2008-04-17 2009-11-05 Preh Gmbh Sensoranordnung mit einem kapazitiven Regensensor und einem Lichtsensor
DE102010019841A1 (de) * 2010-05-07 2011-11-10 Ident Technology Ag Leiterplatte für Display und Anzeigemodul mit Display und Leiterplatte

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014014050B4 (de) * 2014-09-29 2017-08-03 gomtec GmbH Näherungssensoranordnung
DE102015006607A1 (de) 2015-05-21 2016-11-24 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug
WO2016184969A1 (de) 2015-05-21 2016-11-24 Audi Ag Bedienvorrichtung für ein kraftfahrzeug
DE102015006607B4 (de) * 2015-05-21 2017-05-18 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug
DE102015017199B4 (de) 2015-05-21 2025-05-22 Audi Ag Bedienvorrichtung für ein Kraftfahrzeug und Kraftfahrzeug
EP3629478A1 (de) * 2018-09-26 2020-04-01 Huf Hülsbeck & Fürst GmbH & Co. KG Sensorvorrichtung zur detektion einer aktivierungshandlung bei einem fahrzeug
EP3758230A1 (de) * 2019-06-28 2020-12-30 Robert Bosch GmbH Sensoreinrichtung mit kapazitivem sensor
US11525704B2 (en) 2019-06-28 2022-12-13 Robert Bosch Gmbh Sensor device with capacitive sensor

Also Published As

Publication number Publication date
US9702902B2 (en) 2017-07-11
KR101911842B1 (ko) 2018-10-25
TWI556693B (zh) 2016-11-01
CN103733518A (zh) 2014-04-16
EP2724464A2 (en) 2014-04-30
TW201316855A (zh) 2013-04-16
EP2724464B1 (en) 2016-09-14
WO2012175580A3 (en) 2013-02-21
CN103733518B (zh) 2017-11-17
KR20140040815A (ko) 2014-04-03
WO2012175580A2 (en) 2012-12-27
JP2014520401A (ja) 2014-08-21
US20140139240A1 (en) 2014-05-22
JP6081996B2 (ja) 2017-02-15

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