DE102010060855A1 - Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil - Google Patents

Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil Download PDF

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Publication number
DE102010060855A1
DE102010060855A1 DE102010060855A DE102010060855A DE102010060855A1 DE 102010060855 A1 DE102010060855 A1 DE 102010060855A1 DE 102010060855 A DE102010060855 A DE 102010060855A DE 102010060855 A DE102010060855 A DE 102010060855A DE 102010060855 A1 DE102010060855 A1 DE 102010060855A1
Authority
DE
Germany
Prior art keywords
layer
electronic component
conductive material
circuit board
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102010060855A
Other languages
German (de)
English (en)
Inventor
Thomas Gottwald
Christian Rössle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schweizer Electronic AG
Original Assignee
Schweizer Electronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schweizer Electronic AG filed Critical Schweizer Electronic AG
Priority to DE102010060855A priority Critical patent/DE102010060855A1/de
Priority to BR112013015289-3A priority patent/BR112013015289B1/pt
Priority to US13/885,437 priority patent/US8811019B2/en
Priority to JP2013540265A priority patent/JP5767338B2/ja
Priority to RU2013128431/28A priority patent/RU2556274C2/ru
Priority to CN201180065944.1A priority patent/CN103339726B/zh
Priority to DE202011110023U priority patent/DE202011110023U1/de
Priority to EP11799363.4A priority patent/EP2524394B1/de
Priority to PCT/EP2011/005912 priority patent/WO2012072212A2/de
Publication of DE102010060855A1 publication Critical patent/DE102010060855A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102010060855A 2010-11-29 2010-11-29 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil Withdrawn DE102010060855A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102010060855A DE102010060855A1 (de) 2010-11-29 2010-11-29 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil
BR112013015289-3A BR112013015289B1 (pt) 2010-11-29 2011-11-24 Dispositivo eletrônico, método para a produção do último e placa de circuito integrado compreendendo o dispositivo eletrônico
US13/885,437 US8811019B2 (en) 2010-11-29 2011-11-24 Electronic device, method for producing the same, and printed circuit board comprising electronic device
JP2013540265A JP5767338B2 (ja) 2010-11-29 2011-11-24 電子デバイス、その製作方法、及び電子デバイスを備えているプリント基板
RU2013128431/28A RU2556274C2 (ru) 2010-11-29 2011-11-24 Электронное устройство, способ его изготовления и печатная плата, содержащая электронное устройство
CN201180065944.1A CN103339726B (zh) 2010-11-29 2011-11-24 电子部件及其制造方法和带有电子部件的电路板
DE202011110023U DE202011110023U1 (de) 2010-11-29 2011-11-24 Elektronisches Bauteil und Leiterplatte mit elektronischem Bauteil
EP11799363.4A EP2524394B1 (de) 2010-11-29 2011-11-24 Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil
PCT/EP2011/005912 WO2012072212A2 (de) 2010-11-29 2011-11-24 Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010060855A DE102010060855A1 (de) 2010-11-29 2010-11-29 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil

Publications (1)

Publication Number Publication Date
DE102010060855A1 true DE102010060855A1 (de) 2012-05-31

Family

ID=45390054

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102010060855A Withdrawn DE102010060855A1 (de) 2010-11-29 2010-11-29 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil
DE202011110023U Expired - Lifetime DE202011110023U1 (de) 2010-11-29 2011-11-24 Elektronisches Bauteil und Leiterplatte mit elektronischem Bauteil

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE202011110023U Expired - Lifetime DE202011110023U1 (de) 2010-11-29 2011-11-24 Elektronisches Bauteil und Leiterplatte mit elektronischem Bauteil

Country Status (8)

Country Link
US (1) US8811019B2 (https=)
EP (1) EP2524394B1 (https=)
JP (1) JP5767338B2 (https=)
CN (1) CN103339726B (https=)
BR (1) BR112013015289B1 (https=)
DE (2) DE102010060855A1 (https=)
RU (1) RU2556274C2 (https=)
WO (1) WO2012072212A2 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011105346A1 (de) 2011-06-21 2012-12-27 Schweizer Electronic Ag Elektronische Baugruppe und Verfahren zu deren Herstellung
WO2014139666A1 (de) 2013-03-13 2014-09-18 Schweizer Electronic Ag Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil
EP2988328A1 (en) * 2014-08-19 2016-02-24 ABB Technology Oy Power semiconductor module and method of manufacturing there same
WO2016116194A1 (de) * 2015-01-22 2016-07-28 Robert Bosch Gmbh Verbindungsanordnung zwischen einem trägerelement und einem elektronischen schaltungsbauteil und schaltungsträger
WO2020239221A1 (en) * 2019-05-29 2020-12-03 Huawei Technologies Co., Ltd. Integrated component and porwer switching device
US10897812B2 (en) 2018-12-25 2021-01-19 AT&S (Chongqing) Company Limited Component carrier having a component shielding and method of manufacturing the same

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CN203013703U (zh) * 2012-12-17 2013-06-19 中怡(苏州)科技有限公司 散热元件及应用该散热元件的通讯装置
DE102013102542A1 (de) * 2013-03-13 2014-09-18 Schweizer Electronic Ag Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils
AT515069B1 (de) * 2013-11-07 2019-10-15 At & S Austria Tech & Systemtechnik Ag Leiterplattenstruktur
RU2579434C2 (ru) * 2014-03-19 2016-04-10 Михаил Юрьевич Гончаров Планарный индуктивный элемент и способ отвода тепла от его обмоток
DE102014008148B4 (de) * 2014-05-23 2020-06-04 Continental Automotive Gmbh Verfahren zur Herstellung einer Leiterplatte und Leiterplatte
RU2602835C9 (ru) * 2015-05-13 2017-02-02 Акционерное общество "Концерн радиостроения "Вега" Способ экранирования в электронном модуле
JP6501638B2 (ja) * 2015-06-11 2019-04-17 オムロンオートモーティブエレクトロニクス株式会社 電子装置
US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
WO2018001983A1 (en) 2016-06-28 2018-01-04 Abb Schweiz Ag Cooled electronics package with stacked power electronics components
DE102017208147B4 (de) 2017-05-15 2021-12-30 Schweizer Electronic Ag Elektronisches Bauteil und Leiterplatte mit diesem elektronischen Bauteil
RU2677633C1 (ru) * 2017-12-12 2019-01-18 Федеральное государственное унитарное предприятие "Научно-производственный центр автоматики и приборостроения имени академика Н.А. Пилюгина" (ФГУП "НПЦАП") Конструкция многослойных печатных плат со встроенным теплоотводом
CN111200899B (zh) * 2018-11-20 2023-09-15 奥特斯科技(重庆)有限公司 部件承载件及制造该部件承载件的方法
EP3809805B1 (en) * 2019-10-14 2026-03-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier and method of manufacturing the same
US11632860B2 (en) 2019-10-25 2023-04-18 Infineon Technologies Ag Power electronic assembly and method of producing thereof
DE102020132808B4 (de) 2020-12-09 2023-03-09 Schweizer Electronic Aktiengesellschaft Leiterplattenmodul, Leiterplatte, Kühlkörper und Wärmeleitelement
WO2022190316A1 (ja) 2021-03-11 2022-09-15 株式会社メイコー 記憶装置及び記憶装置モジュール
WO2022215381A1 (ja) * 2021-04-09 2022-10-13 株式会社村田製作所 接続構造およびアンテナモジュール
CN115707169A (zh) * 2021-08-06 2023-02-17 奥特斯(中国)有限公司 部件承载件及其制造方法和用途以及布置结构
DE102022135026B3 (de) 2022-12-30 2024-01-25 Schweizer Electronic Ag Leistungselektronisches Modul, leistungselektronischer Modulblock, Leiterplatte mit leistungselektronischem Modul bzw. Leiterplattenbauelement und Verfahren zur Herstellung eines leistungselektronischen Moduls
EP4622399A1 (en) * 2024-03-21 2025-09-24 ZF CV Systems Global GmbH Printed circuit board, electrical circuit assembly and methods of producing a printed circuit board and an electrical circuit assembly

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US20030133274A1 (en) * 2002-01-16 2003-07-17 Kuo-Tso Chen Integrated circuit package and method of manufacture
DE102009013818A1 (de) 2008-03-18 2009-11-19 Infineon Technologies Ag Elektronische Vorrichtung und ihre Herstellung

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Publication number Priority date Publication date Assignee Title
US4200900A (en) * 1978-06-30 1980-04-29 Robertshaw Controls Company Circuit board arrangement
DE4305399A1 (de) * 1992-03-25 1993-09-30 Dyconex Ag Zuerich Leiterplattenverstärkung
US20030133274A1 (en) * 2002-01-16 2003-07-17 Kuo-Tso Chen Integrated circuit package and method of manufacture
DE102009013818A1 (de) 2008-03-18 2009-11-19 Infineon Technologies Ag Elektronische Vorrichtung und ihre Herstellung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011105346A1 (de) 2011-06-21 2012-12-27 Schweizer Electronic Ag Elektronische Baugruppe und Verfahren zu deren Herstellung
WO2012175207A2 (de) 2011-06-21 2012-12-27 Schweizer Electronic Ag Elektronische baugruppe und verfahren zu deren herstellung
WO2014139666A1 (de) 2013-03-13 2014-09-18 Schweizer Electronic Ag Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil
DE102013102541A1 (de) 2013-03-13 2014-09-18 Schweizer Electronic Ag Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil
US9913378B2 (en) 2013-03-13 2018-03-06 Schweizer Electronic Ag Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assembly
EP2988328A1 (en) * 2014-08-19 2016-02-24 ABB Technology Oy Power semiconductor module and method of manufacturing there same
WO2016116194A1 (de) * 2015-01-22 2016-07-28 Robert Bosch Gmbh Verbindungsanordnung zwischen einem trägerelement und einem elektronischen schaltungsbauteil und schaltungsträger
US10897812B2 (en) 2018-12-25 2021-01-19 AT&S (Chongqing) Company Limited Component carrier having a component shielding and method of manufacturing the same
WO2020239221A1 (en) * 2019-05-29 2020-12-03 Huawei Technologies Co., Ltd. Integrated component and porwer switching device

Also Published As

Publication number Publication date
DE202011110023U1 (de) 2012-11-12
WO2012072212A2 (de) 2012-06-07
US8811019B2 (en) 2014-08-19
CN103339726A (zh) 2013-10-02
RU2013128431A (ru) 2015-01-10
US20130329370A1 (en) 2013-12-12
BR112013015289A2 (pt) 2018-05-15
CN103339726B (zh) 2014-12-31
JP5767338B2 (ja) 2015-08-19
EP2524394B1 (de) 2013-07-31
BR112013015289B1 (pt) 2020-10-06
JP2014503997A (ja) 2014-02-13
EP2524394A2 (de) 2012-11-21
RU2556274C2 (ru) 2015-07-10
WO2012072212A3 (de) 2012-09-07

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