DE102010023550B4 - Beleuchtungselement - Google Patents

Beleuchtungselement Download PDF

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Publication number
DE102010023550B4
DE102010023550B4 DE102010023550.4A DE102010023550A DE102010023550B4 DE 102010023550 B4 DE102010023550 B4 DE 102010023550B4 DE 102010023550 A DE102010023550 A DE 102010023550A DE 102010023550 B4 DE102010023550 B4 DE 102010023550B4
Authority
DE
Germany
Prior art keywords
organic light
circuit board
emitting diode
lighting element
element according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102010023550.4A
Other languages
German (de)
English (en)
Other versions
DE102010023550A1 (de
Inventor
Jan Hesse
Christian Kirchhof
Dr. Bechtloff Udo
Dr. Schmieder Kai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ksg De GmbH
Original Assignee
KSG LEITERPLATTEN GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KSG LEITERPLATTEN GmbH, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical KSG LEITERPLATTEN GmbH
Priority to DE102010023550.4A priority Critical patent/DE102010023550B4/de
Priority to JP2011117192A priority patent/JP5779406B2/ja
Priority to US13/067,343 priority patent/US9054333B2/en
Publication of DE102010023550A1 publication Critical patent/DE102010023550A1/de
Application granted granted Critical
Publication of DE102010023550B4 publication Critical patent/DE102010023550B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
DE102010023550.4A 2010-06-03 2010-06-03 Beleuchtungselement Active DE102010023550B4 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102010023550.4A DE102010023550B4 (de) 2010-06-03 2010-06-03 Beleuchtungselement
JP2011117192A JP5779406B2 (ja) 2010-06-03 2011-05-25 照明装置
US13/067,343 US9054333B2 (en) 2010-06-03 2011-05-25 Organic light emitting diode and circuit board for control thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010023550.4A DE102010023550B4 (de) 2010-06-03 2010-06-03 Beleuchtungselement

Publications (2)

Publication Number Publication Date
DE102010023550A1 DE102010023550A1 (de) 2011-12-08
DE102010023550B4 true DE102010023550B4 (de) 2015-02-26

Family

ID=44973846

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102010023550.4A Active DE102010023550B4 (de) 2010-06-03 2010-06-03 Beleuchtungselement

Country Status (3)

Country Link
US (1) US9054333B2 (enExample)
JP (1) JP5779406B2 (enExample)
DE (1) DE102010023550B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019124349A1 (de) * 2019-09-11 2021-03-11 Rehau Ag + Co Verfahren zur Herstellung eines elektrifizierten Kunststoffprofils sowie elektrifiziertes Kunststoffprofil

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011056570A1 (de) * 2011-12-16 2013-06-20 Osram Opto Semiconductors Gmbh Lichtemittierende Bauelement-Anordnung
JP6271414B2 (ja) * 2012-02-20 2018-01-31 株式会社カネカ 発光システム及び有機ｅｌ装置
WO2021048240A1 (de) 2019-09-10 2021-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Organisches leuchtdiodenmodul

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013001A2 (en) * 2005-07-27 2007-02-01 Philips Intellectual Property & Standards Gmbh Light-emitting device with a sealing integrated driver circuit
JP2009199777A (ja) * 2008-02-19 2009-09-03 Fujifilm Corp 回路基板の製造方法及び回路基板並びに有機ｅｌ発光装置
EP2411290A1 (en) * 2009-03-26 2012-02-01 Nestec S.A. A jaw support for a pouch filler

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62299890A (ja) * 1986-06-19 1987-12-26 沖電気工業株式会社 Ｅｌデイスプレイ装置
JPH06325868A (ja) * 1993-03-15 1994-11-25 Fuji Electric Co Ltd 薄膜エレクトロルミネセンスパネル
US5703394A (en) * 1996-06-10 1997-12-30 Motorola Integrated electro-optical package
JP4345153B2 (ja) 1999-09-27 2009-10-14 ソニー株式会社 映像表示装置の製造方法
KR100477101B1 (ko) 2000-10-06 2005-03-17 삼성에스디아이 주식회사 유기 발광 소자
JP2002373779A (ja) * 2001-06-13 2002-12-26 Sony Corp 電気的接続装置および電気的接続装置を有する電子機器
JP3849680B2 (ja) * 2003-10-06 2006-11-22 セイコーエプソン株式会社 基板接合体の製造方法、基板接合体、電気光学装置の製造方法、及び電気光学装置
JP2005338419A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd 面発光装置用封止体及び面発光装置
WO2006087653A2 (en) * 2005-02-16 2006-08-24 Koninklijke Philips Electronics N.V. An oled device
KR100593937B1 (ko) * 2005-03-30 2006-06-30 삼성전기주식회사 Ｓｉ기판을 이용한 ＬＥＤ 패키지 및 그 제조방법
EP1893912B1 (en) * 2005-05-23 2020-12-16 Signify North America Corporation Modular led-based lighting apparatus for socket engagement, lighting fixtures incorporating same, and methods of assembling, installing and removing same
JP2008037848A (ja) * 2006-08-10 2008-02-21 Takasago Internatl Corp 白金錯体及び発光素子
US7738257B2 (en) * 2006-12-13 2010-06-15 Intel Corporation Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
EP2144290A1 (en) 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
US8350470B2 (en) * 2008-12-17 2013-01-08 General Electric Company Encapsulation structures of organic electroluminescence devices
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013001A2 (en) * 2005-07-27 2007-02-01 Philips Intellectual Property & Standards Gmbh Light-emitting device with a sealing integrated driver circuit
JP2009199777A (ja) * 2008-02-19 2009-09-03 Fujifilm Corp 回路基板の製造方法及び回路基板並びに有機ｅｌ発光装置
EP2411290A1 (en) * 2009-03-26 2012-02-01 Nestec S.A. A jaw support for a pouch filler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019124349A1 (de) * 2019-09-11 2021-03-11 Rehau Ag + Co Verfahren zur Herstellung eines elektrifizierten Kunststoffprofils sowie elektrifiziertes Kunststoffprofil

Also Published As

Publication number Publication date
US20110298359A1 (en) 2011-12-08
US9054333B2 (en) 2015-06-09
JP2011258551A (ja) 2011-12-22
JP5779406B2 (ja) 2015-09-16
DE102010023550A1 (de) 2011-12-08

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Legal Events

Date Code Title Description
R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0051520000

Ipc: H10K0050800000

R081 Change of applicant/patentee

Owner name: KSG GMBH, DE

Free format text: FORMER OWNERS: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., 80686 MUENCHEN, DE; KSG LEITERPLATTEN GMBH, 09390 GORNSDORF, DE

R082 Change of representative

Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE