DE102009058006B4 - Optoelektronisches Halbleiterbauteil - Google Patents
Optoelektronisches Halbleiterbauteil Download PDFInfo
- Publication number
- DE102009058006B4 DE102009058006B4 DE102009058006.9A DE102009058006A DE102009058006B4 DE 102009058006 B4 DE102009058006 B4 DE 102009058006B4 DE 102009058006 A DE102009058006 A DE 102009058006A DE 102009058006 B4 DE102009058006 B4 DE 102009058006B4
- Authority
- DE
- Germany
- Prior art keywords
- converter element
- semiconductor chip
- radiation
- reflective
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 138
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 27
- 230000005855 radiation Effects 0.000 claims abstract description 61
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000012790 adhesive layer Substances 0.000 claims description 27
- 238000005538 encapsulation Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- -1 BaSO 4 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Led Device Packages (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058006.9A DE102009058006B4 (de) | 2009-12-11 | 2009-12-11 | Optoelektronisches Halbleiterbauteil |
| US13/515,256 US9029907B2 (en) | 2009-12-11 | 2010-11-17 | Optoelectronic semiconductor component |
| CN201510315781.8A CN105023999B (zh) | 2009-12-11 | 2010-11-17 | 光电子半导体构件 |
| CN201080056260.0A CN102652369B (zh) | 2009-12-11 | 2010-11-17 | 光电子半导体构件 |
| JP2012542430A JP5863665B2 (ja) | 2009-12-11 | 2010-11-17 | オプトエレクトロニクス半導体部品 |
| PCT/EP2010/067707 WO2011069791A1 (de) | 2009-12-11 | 2010-11-17 | Optoelektronisches halbleiterbauteil |
| KR1020127018022A KR20120117817A (ko) | 2009-12-11 | 2010-11-17 | 광전자 반도체 소자 |
| EP10788035.3A EP2510558B1 (de) | 2009-12-11 | 2010-11-17 | Optoelektronisches halbleiterbauteil |
| TW099142775A TWI419377B (zh) | 2009-12-11 | 2010-12-08 | 光電半導體組件 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058006.9A DE102009058006B4 (de) | 2009-12-11 | 2009-12-11 | Optoelektronisches Halbleiterbauteil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102009058006A1 DE102009058006A1 (de) | 2011-06-16 |
| DE102009058006B4 true DE102009058006B4 (de) | 2022-03-31 |
Family
ID=43536571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009058006.9A Active DE102009058006B4 (de) | 2009-12-11 | 2009-12-11 | Optoelektronisches Halbleiterbauteil |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9029907B2 (https=) |
| EP (1) | EP2510558B1 (https=) |
| JP (1) | JP5863665B2 (https=) |
| KR (1) | KR20120117817A (https=) |
| CN (2) | CN105023999B (https=) |
| DE (1) | DE102009058006B4 (https=) |
| TW (1) | TWI419377B (https=) |
| WO (1) | WO2011069791A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010048162A1 (de) | 2010-10-11 | 2012-04-12 | Osram Opto Semiconductors Gmbh | Konversionsbauteil |
| DE102012101102A1 (de) | 2012-02-10 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Anordnung mit einer Mehrzahl von derartigen Bauelementen |
| DE102012113003A1 (de) | 2012-12-21 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| DE202013101400U1 (de) * | 2013-04-02 | 2014-07-03 | Zumtobel Lighting Gmbh | Anordnung zum Konvertieren des von einer LED-Lichtquelle emittierten Lichts |
| DE102013220790A1 (de) * | 2013-10-15 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements |
| JP2015109337A (ja) * | 2013-12-04 | 2015-06-11 | 日東電工株式会社 | 光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
| US10211374B2 (en) * | 2014-01-09 | 2019-02-19 | Lumileds Llc | Light emitting device with reflective sidewall |
| DE102014114914A1 (de) * | 2014-10-14 | 2016-04-14 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements |
| DE102016105988A1 (de) * | 2016-04-01 | 2017-10-05 | Osram Opto Semiconductors Gmbh | Konverter zur teilweisen Konversion einer Primärstrahlung und lichtemittierendes Bauelement |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009069671A1 (ja) | 2007-11-29 | 2009-06-04 | Nichia Corporation | 発光装置及びその製造方法 |
| WO2009115998A2 (en) | 2008-03-21 | 2009-09-24 | Koninklijke Philips Electronics N.V. | A luminous device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3789747B2 (ja) * | 2000-11-15 | 2006-06-28 | 三洋電機株式会社 | 発光装置の製造方法 |
| JP2006173271A (ja) * | 2004-12-14 | 2006-06-29 | Matsushita Electric Ind Co Ltd | 半導体発光装置、照明装置、携帯通信機器、及びカメラ |
| US7341878B2 (en) | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
| JP2006294925A (ja) | 2005-04-12 | 2006-10-26 | Seiko Epson Corp | 発光素子、発光素子の製造方法および発光装置 |
| JP2007019096A (ja) * | 2005-07-05 | 2007-01-25 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
| EP2206164A2 (en) * | 2007-10-08 | 2010-07-14 | 3M Innovative Properties Company | Light emitting diode with bonded semiconductor wavelength converter |
| US8049237B2 (en) * | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
| JP5224173B2 (ja) * | 2008-03-07 | 2013-07-03 | スタンレー電気株式会社 | 半導体発光装置 |
| DE102008025159A1 (de) * | 2008-05-26 | 2009-12-10 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Reflexlichtschranke und Verfahren zur Herstellung eines Gehäuses |
| DE102008025923B4 (de) * | 2008-05-30 | 2020-06-18 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
| DE102008050538B4 (de) | 2008-06-06 | 2022-10-06 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| KR101639793B1 (ko) * | 2008-09-25 | 2016-07-15 | 코닌클리케 필립스 엔.브이. | 코팅된 발광 장치 및 그 코팅 방법 |
| TWM357028U (en) | 2009-01-08 | 2009-05-11 | Jmk Optoelectronic Co Ltd | Packaging structure for light emitting diode |
-
2009
- 2009-12-11 DE DE102009058006.9A patent/DE102009058006B4/de active Active
-
2010
- 2010-11-17 CN CN201510315781.8A patent/CN105023999B/zh active Active
- 2010-11-17 WO PCT/EP2010/067707 patent/WO2011069791A1/de not_active Ceased
- 2010-11-17 CN CN201080056260.0A patent/CN102652369B/zh active Active
- 2010-11-17 EP EP10788035.3A patent/EP2510558B1/de active Active
- 2010-11-17 US US13/515,256 patent/US9029907B2/en active Active
- 2010-11-17 KR KR1020127018022A patent/KR20120117817A/ko not_active Ceased
- 2010-11-17 JP JP2012542430A patent/JP5863665B2/ja active Active
- 2010-12-08 TW TW099142775A patent/TWI419377B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009069671A1 (ja) | 2007-11-29 | 2009-06-04 | Nichia Corporation | 発光装置及びその製造方法 |
| EP2216834A1 (en) | 2007-11-29 | 2010-08-11 | Nichia Corporation | Light-emitting device and its manufacturing method |
| WO2009115998A2 (en) | 2008-03-21 | 2009-09-24 | Koninklijke Philips Electronics N.V. | A luminous device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013513934A (ja) | 2013-04-22 |
| TW201131822A (en) | 2011-09-16 |
| WO2011069791A1 (de) | 2011-06-16 |
| EP2510558A1 (de) | 2012-10-17 |
| US20120299041A1 (en) | 2012-11-29 |
| CN102652369B (zh) | 2015-07-01 |
| KR20120117817A (ko) | 2012-10-24 |
| CN105023999A (zh) | 2015-11-04 |
| CN102652369A (zh) | 2012-08-29 |
| CN105023999B (zh) | 2018-07-17 |
| EP2510558B1 (de) | 2019-06-26 |
| US9029907B2 (en) | 2015-05-12 |
| JP5863665B2 (ja) | 2016-02-16 |
| DE102009058006A1 (de) | 2011-06-16 |
| TWI419377B (zh) | 2013-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| R012 | Request for examination validly filed | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033500000 Ipc: H10H0020851000 |