DE102009022901A1 - Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls - Google Patents

Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls Download PDF

Info

Publication number
DE102009022901A1
DE102009022901A1 DE102009022901A DE102009022901A DE102009022901A1 DE 102009022901 A1 DE102009022901 A1 DE 102009022901A1 DE 102009022901 A DE102009022901 A DE 102009022901A DE 102009022901 A DE102009022901 A DE 102009022901A DE 102009022901 A1 DE102009022901 A1 DE 102009022901A1
Authority
DE
Germany
Prior art keywords
radiation
carrier substrate
component
electrical
emitting semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009022901A
Other languages
German (de)
English (en)
Inventor
Georg Bogner
Stefan Gruber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102009022901A priority Critical patent/DE102009022901A1/de
Priority to CN201080023025.3A priority patent/CN102450109B/zh
Priority to US13/318,504 priority patent/US8916900B2/en
Priority to JP2012512198A priority patent/JP2012528470A/ja
Priority to EP10721292A priority patent/EP2436242B1/de
Priority to PCT/DE2010/000492 priority patent/WO2010136006A1/de
Priority to KR1020117031189A priority patent/KR101675008B1/ko
Publication of DE102009022901A1 publication Critical patent/DE102009022901A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE102009022901A 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls Withdrawn DE102009022901A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102009022901A DE102009022901A1 (de) 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
CN201080023025.3A CN102450109B (zh) 2009-05-27 2010-04-28 光电子模块和用于制造光电子模块的方法
US13/318,504 US8916900B2 (en) 2009-05-27 2010-04-28 Optoelectronic module and method of producing an optoelectronic module
JP2012512198A JP2012528470A (ja) 2009-05-27 2010-04-28 オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法
EP10721292A EP2436242B1 (de) 2009-05-27 2010-04-28 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls
PCT/DE2010/000492 WO2010136006A1 (de) 2009-05-27 2010-04-28 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls
KR1020117031189A KR101675008B1 (ko) 2009-05-27 2010-04-28 광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009022901A DE102009022901A1 (de) 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls

Publications (1)

Publication Number Publication Date
DE102009022901A1 true DE102009022901A1 (de) 2010-12-02

Family

ID=42558477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009022901A Withdrawn DE102009022901A1 (de) 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls

Country Status (7)

Country Link
US (1) US8916900B2 (enExample)
EP (1) EP2436242B1 (enExample)
JP (1) JP2012528470A (enExample)
KR (1) KR101675008B1 (enExample)
CN (1) CN102450109B (enExample)
DE (1) DE102009022901A1 (enExample)
WO (1) WO2010136006A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024115867A1 (de) * 2024-06-06 2025-12-11 Ams-Osram International Gmbh Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827295B2 (ja) * 2015-12-22 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
KR102801218B1 (ko) * 2019-08-30 2025-04-29 삼성전자주식회사 디스플레이 모듈 패키지

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203427A (ja) * 2000-01-20 2001-07-27 Canon Inc 波長多重面型発光素子装置、その製造方法およびこれを用いた波長多重伝送システム
DE102004031391A1 (de) * 2004-06-29 2006-01-26 Osram Opto Semiconductors Gmbh Gehäuse für ein elektronisches Bauteil
US20070295975A1 (en) * 2004-06-25 2007-12-27 Sanyo Electric Co., Ltd. Light-Emitting Device
US20090115049A1 (en) * 2007-11-06 2009-05-07 Shinko Electric Industries Co., Ltd. Semiconductor package

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281976A (ja) 1989-04-24 1990-11-19 Sharp Corp Ｌｅｄプリンタヘッド
JPH04276649A (ja) 1991-03-04 1992-10-01 Hitachi Ltd 複合形半導体装置およびその実装構造体並びにその実装方法
JP2002231885A (ja) 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
WO2005104248A1 (ja) * 2004-04-19 2005-11-03 Matsushita Electric Industrial Co., Ltd. 発光素子駆動用半導体チップ、発光装置及び照明装置
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
WO2006114745A2 (en) * 2005-04-28 2006-11-02 Koninklijke Philips Electronics N.V. Light source comprising led arranged in recess
DE102006004397A1 (de) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP2007312107A (ja) 2006-05-18 2007-11-29 Alps Electric Co Ltd 表面弾性波装置
DE102006025162B3 (de) * 2006-05-30 2008-01-31 Epcos Ag Flip-Chip-Bauelement und Verfahren zur Herstellung
US20080106251A1 (en) * 2006-11-03 2008-05-08 Cabral Roy Manuel Daylight-readable digital panel meter with auto-brightness adjusting led display
DE102007020475A1 (de) * 2007-04-27 2008-11-06 Häusermann GmbH Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
US20100059783A1 (en) * 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203427A (ja) * 2000-01-20 2001-07-27 Canon Inc 波長多重面型発光素子装置、その製造方法およびこれを用いた波長多重伝送システム
US20070295975A1 (en) * 2004-06-25 2007-12-27 Sanyo Electric Co., Ltd. Light-Emitting Device
DE102004031391A1 (de) * 2004-06-29 2006-01-26 Osram Opto Semiconductors Gmbh Gehäuse für ein elektronisches Bauteil
US20090115049A1 (en) * 2007-11-06 2009-05-07 Shinko Electric Industries Co., Ltd. Semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024115867A1 (de) * 2024-06-06 2025-12-11 Ams-Osram International Gmbh Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip

Also Published As

Publication number Publication date
JP2012528470A (ja) 2012-11-12
WO2010136006A1 (de) 2010-12-02
EP2436242B1 (de) 2013-01-09
KR20120036892A (ko) 2012-04-18
CN102450109A (zh) 2012-05-09
US8916900B2 (en) 2014-12-23
CN102450109B (zh) 2015-07-29
US20120056235A1 (en) 2012-03-08
EP2436242A1 (de) 2012-04-04
KR101675008B1 (ko) 2016-11-10

Similar Documents

Publication Publication Date Title
DE102016119002B4 (de) Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements
DE19709295B4 (de) Halbleiterbaugruppe
DE10316355B3 (de) Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung
DE102011115314B4 (de) LED-Modul
DE102013201931B4 (de) Laserbauelement und Verfahren zu seiner Herstellung
DE102019119371B4 (de) Bauteil und verfahren zur herstellung eines bauteils
WO2017060280A1 (de) Optoelektronisches bauelement mit einem leiterrahmen mit einer versteifungsstruktur
DE102013219780A1 (de) Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
DE102006015447B4 (de) Leistungshalbleiterbauelement mit einem Leistungshalbleiterchip und Verfahren zur Herstellung desselben
DE10142119A1 (de) Elektronisches Bauteil und Verfahren zu seiner Herstellung
WO2019002098A1 (de) Optoelektronisches halbleiterbauteil und anordnung mit einem optoelektronischen halbleiterbauteil
EP2436242B1 (de) Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls
DE10142117A1 (de) Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung
WO2015078865A1 (de) Bauelementanordnung und verfahren zum herstellen einer bauelementanordnung
EP1278243A2 (de) Multichipmodul in COB Bauweise, insbesondere Compact Flash Card mit hoher Speicherkapazität und Verfahren zur Herstellung desselben
DE102013207111B4 (de) Optoelektronisches Bauelement
DE102010049961A1 (de) Optoelektronisches Halbleiterbauelement mit einem Halbleiterchip, einem Trägersubstrat und einer Folie und ein Verfahren zu dessen Herstellung
WO2025202477A1 (de) Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements
WO2021185598A1 (de) Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement
WO2024236040A2 (de) Integriertes bauelementpackage mit einem auf einem halbleiterchip angeordneten laserpackage
DE102024115867A1 (de) Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip
WO2022248247A1 (de) Optoelektronisches halbleiterbauteil und paneel
EP2345076B1 (de) Oberflächenmontierbare vorrichtung
DE10142118B4 (de) Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung
DE112018007215T5 (de) Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer Vielzahl von lichtemittierenden Vorrichtungen

Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20141202