DE102008001719A1 - Projektionsobjektiv und Projektionsbelichtungsanlage für die Mikrolithographie - Google Patents
Projektionsobjektiv und Projektionsbelichtungsanlage für die Mikrolithographie Download PDFInfo
- Publication number
- DE102008001719A1 DE102008001719A1 DE102008001719A DE102008001719A DE102008001719A1 DE 102008001719 A1 DE102008001719 A1 DE 102008001719A1 DE 102008001719 A DE102008001719 A DE 102008001719A DE 102008001719 A DE102008001719 A DE 102008001719A DE 102008001719 A1 DE102008001719 A1 DE 102008001719A1
- Authority
- DE
- Germany
- Prior art keywords
- light
- projection objective
- substrate
- objective according
- reflective element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001393 microlithography Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 230000003287 optical effect Effects 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000003384 imaging method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000006094 Zerodur Substances 0.000 claims description 4
- 239000011358 absorbing material Substances 0.000 claims description 4
- 238000000149 argon plasma sintering Methods 0.000 claims description 4
- 230000011514 reflex Effects 0.000 claims description 2
- 230000001629 suppression Effects 0.000 description 24
- 235000012431 wafers Nutrition 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008001719A DE102008001719A1 (de) | 2007-05-14 | 2008-05-13 | Projektionsobjektiv und Projektionsbelichtungsanlage für die Mikrolithographie |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007024214.1 | 2007-05-14 | ||
| DE102007024214 | 2007-05-14 | ||
| DE102008001719A DE102008001719A1 (de) | 2007-05-14 | 2008-05-13 | Projektionsobjektiv und Projektionsbelichtungsanlage für die Mikrolithographie |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102008001719A1 true DE102008001719A1 (de) | 2008-11-20 |
Family
ID=39689310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102008001719A Withdrawn DE102008001719A1 (de) | 2007-05-14 | 2008-05-13 | Projektionsobjektiv und Projektionsbelichtungsanlage für die Mikrolithographie |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100085644A1 (https=) |
| JP (1) | JP2010527160A (https=) |
| DE (1) | DE102008001719A1 (https=) |
| WO (1) | WO2008138560A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6600608B1 (en) | 1999-11-05 | 2003-07-29 | Carl-Zeiss-Stiftung | Catadioptric objective comprising two intermediate images |
| WO2006128613A1 (en) | 2005-06-02 | 2006-12-07 | Carl Zeiss Smt Ag | Microlithography projection objective |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5107526A (en) * | 1990-10-31 | 1992-04-21 | The United State Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Water window imaging x-ray microscope |
| US5274420A (en) * | 1992-04-20 | 1993-12-28 | International Business Machines Corporation | Beamsplitter type lens elements with pupil-plane stops for lithographic systems |
| JPH11345761A (ja) * | 1998-05-29 | 1999-12-14 | Nikon Corp | 走査型露光装置 |
| TWI282909B (en) * | 1999-12-23 | 2007-06-21 | Asml Netherlands Bv | Lithographic apparatus and a method for manufacturing a device |
| DE10040998A1 (de) * | 2000-08-22 | 2002-03-14 | Zeiss Carl | Projektionsbelichtungsanlage |
| US6912049B2 (en) * | 2001-12-19 | 2005-06-28 | Nir Diagnostics, Inc. | Electromagnetic radiation attenuating and scattering member with improved thermal stability |
| DE10210899A1 (de) * | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refraktives Projektionsobjektiv für Immersions-Lithographie |
| JP2003322710A (ja) * | 2002-05-01 | 2003-11-14 | Canon Inc | 光吸収膜、光吸収膜形成方法、露光装置、デバイス製造方法及びデバイス |
-
2008
- 2008-05-09 WO PCT/EP2008/003760 patent/WO2008138560A1/de not_active Ceased
- 2008-05-09 JP JP2010507832A patent/JP2010527160A/ja active Pending
- 2008-05-13 DE DE102008001719A patent/DE102008001719A1/de not_active Withdrawn
-
2009
- 2009-10-30 US US12/609,437 patent/US20100085644A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6600608B1 (en) | 1999-11-05 | 2003-07-29 | Carl-Zeiss-Stiftung | Catadioptric objective comprising two intermediate images |
| WO2006128613A1 (en) | 2005-06-02 | 2006-12-07 | Carl Zeiss Smt Ag | Microlithography projection objective |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008138560A1 (de) | 2008-11-20 |
| JP2010527160A (ja) | 2010-08-05 |
| US20100085644A1 (en) | 2010-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8127 | New person/name/address of the applicant |
Owner name: CARL ZEISS SMT GMBH, 73447 OBERKOCHEN, DE |
|
| 8130 | Withdrawal | ||
| R120 | Application withdrawn or ip right abandoned |
Effective date: 20110322 |