Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
  • G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements

Definitions

• the invention relates to a projection objective for microlithography for imaging an object arranged in an object plane on a photosensitive wafer in an image plane, with a plurality of optical elements having at least one reflective element and at least one refractive element and in the light propagation direction of the Nutzlichts behind the at least a reflective element lie on a common straight optical axis, wherein the at least one reflective element comprises a substrate having at least one aperture through which light rays can pass.
• the invention further relates to a projection exposure apparatus for microlithography with such a projection lens.
• Such a projection lens is known from US 6,600,608 Bl.
• a projection objective of the aforementioned type is used, for example, in semiconductor microlithography for producing finely structured components in order to image a patterned object (reticle) onto a wafer.
• the object or the wafer is arranged in an object plane or image plane of the projection objective.
• the wafer is provided with a photosensitive layer which, upon exposure to light passing through the projection lens, transmits the pattern of the object to the photosensitive layer of the wafer. After possible multiple exposure and subsequent development of the photosensitive layer, the desired structure is formed on the wafer.
• Projection lenses can be distinguished according to their design.
• a catadioptric projection lens has both reflective and refractive elements in the form of mirrors and lenses, for example. If, on the other hand, a projection objective has only refractive elements or only reflective elements, then it is called dioptric or catoptric.
• the catadotropic projection objective known from the aforementioned US Pat. No. 6,600,608 B1 has a plurality of lenses and mirrors which lie on a common straight optical axis.
• the optical elements are arranged in three subassemblies which are dioptric, catadioptric and dioptric in the light propagation direction of the useful light of the projection objective.
• the mirrors of the catadioptric assembly each have an opening through which the light rays incident on the mirror can pass.
• the mirror surfaces are designed to be light-reflecting, so that the light rays incident on the mirror surfaces are reflected in accordance with their angle of incidence with respect to the surfaces.
• the imaging quality of the known projection objective is determined by its imaging properties, so that it should be largely free from aberrations and image quality impairing interference effects.
• a catadioptric projection objective for example, light rays which are unintentionally reflected on the surfaces of an optical element are directed backwards onto one of the mirrors The reflected light beams mingle with the traveling light beams seen in the "ordinary" light propagation direction of the useful light and interfere with the imaging of the pattern on the photosensitive wafer.
• stray light caused by unwanted light transitions between the optical elements omitting the mirrors can be suppressed by light-absorbing shielding screens or shielding plates which are arranged in the area of the mirrors.
• the shields are made of a light-absorbing material or provided with a light-absorbing layer, and they can be made adjustable in position and tiltable to improve the absorption effect with respect to the optical axis.
• the absorption properties of the shields may also be tuned to the wavelength of the light rays passing through the projection lens.
• a disadvantage of the use of light-absorbing shields for Streulich tincture suppression is that the projection lens has an additional element whose arrangement or geometry must be adapted to the respective requirements of the scattered light occurring.
• the arrangement of this additional element in the projection lens requires sufficient space, which is often not available, whereby this type of scattered light suppression is only partially operational.
• the presence of a shield in the projection lens requires higher production costs for the projection lens, which are caused due to the often structurally complicated geometry and positioning of the shield. Since it often turns out only in the operation of the known projection lens on which areas the scattered light increasingly occurs, the implementation of a shield is often only later possible, which can also lead to downtime of the known projection lens.
• a further disadvantage of shielding screens is that the maximum beam cross section of the light beams passing through the projection lens can also be unintentionally reduced, so that the wafer is not completely exposed. This requires a structurally complex measure for adjusting the position of the wafer in the image plane in order to achieve an exposure of all wafer regions.
• the optimum absorption effect of the shield is often achieved only by its positional adjustment or tilting.
• Such a change in position of the shield in the known projection lens requires sufficient space and is also structurally very complex to implement.
• the shielding must have, for example, actuators which bring about their positional adjustment or tilt, which additionally increases the production costs of the projection objective.
• the object with respect to the projection objective mentioned above is achieved in that the at least one reflective element is at least partially made of a material which suppresses rearward incident on the reflective element scattered light.
• the projection objective according to the invention of the projection exposure apparatus according to the invention is catadioptric and has a plurality of optical elements which lie in the light propagation direction of the useful light behind the at least one reflecting element on a common straight optical axis.
• the reflective element of the projection objective according to the invention has a substrate which is provided with at least one aperture through which the light beams can pass. Further, the reflective element is at least partially made of such a material that suppresses or at least reduces the stray light incident on the rear of the reflective element.
• the term "backward" to the reflecting element is to be understood to mean those light rays which come from the direction of the image plane towards the object plane, ie propagate counter to the light propagation direction of the useful light, and hit the reflecting element at any angle
• the light beams contributing to the scattered light can impinge on the substrate rear side or at least partially pass through the aperture of the substrate and obliquely penetrate into the substrate of the reflective element with respect to the optical axis
• the choice of material of the reflecting element thus advantageously makes it possible to produce a scattered light reducing device that is particularly easy to implement ng, since no additional element such as the shield known from the prior art must be provided in the projection lens, which fulfills this function.
• this type of scattered light suppression is applicable to all catadioptric projection lenses regardless of the distances between their optical elements.
• the production costs of the projection objective according to the invention are advantageously reduced significantly, since the scattered light suppression is effected by the reflecting element already accommodated in the projection objective and not by an additional absorption shielding.
• no additional costs are caused, which, as in the known projection lens, caused by a positional adjustment or tilting of the absorption shield with respect to the optical axis.
• the use of the reflective element for scattered-light suppression does not cause any unwanted beam limitation of the light beams passing through the projection lens, as a result of which the wafer is always completely exposed.
• the substrate of the reflective element is at least partially made of the stray light suppressing material.
• the substrate of the reflective element may be wholly or partially, i. only in some areas, be made of the stray light suppressing material.
• the substrate of the reflective element at least partially on a layer which is made of the stray light suppressing material.
• the layer may be made so thin that the substrate extent of the reflective element does not increase significantly and the reflective element does not take up unnecessary space.
• the reflective element is particularly easy and inexpensive to produce, since the stray light-suppressing layer during the Manufacturing process along the desired substrate extent can be applied.
• the layer is arranged below a reflective surface of the substrate.
• This measure has the effect that the scattered light, which is incident on the rear side of the substrate of the reflective element, no longer reaches the light-reflecting surface of the substrate, since it is already destroyed by the layer.
• an optimal scattered light suppression is advantageously achieved, at the same time a possible radiation damage to the substrate by the passing stray light is largely avoided.
• the light propagation in the projection lens from the object plane to the image plane is not impaired, since the stray light-suppressing layer is arranged below the reflecting surface in the light propagation direction of the useful light.
• the layer is arranged directly below the reflective surface of the substrate.
• This measure has the effect of suppressing not only stray light, which reaches the reflecting surface from any direction across the rear side of the substrate of the reflective element, but also such stray light which penetrates into the reflective element through the side walls of the reflective element which are adjacent to the aperture is, whereby advantageously an even more effective scattered light suppression is achieved.
• the layer is arranged along an entire extent of the reflective surface of the substrate.
• This measure advantageously provides even more effective stray light suppression, since the stray-light-suppressing layer is arranged along the entire mirror surface, as a result of which no stray light which hits backwards can reach the reflective surface of the reflective element.
• the production of the reflective element is particularly simple and inexpensive, since the stray light-suppressing layer can be applied during the manufacturing process along the entire substrate extension, without having to cover the non-coating intermediate areas of the substrate.
• the layer is arranged at least partially along the opening of the substrate.
• the layer may be arranged on the side walls of the substrate along the entire extent of the opening or only in partial areas of the substrate side walls.
• the reflective element has a mount which is arranged at least partially on a substrate rear side, wherein the mount is made at least partially from the stray-light-suppressing material.
• This measure has the advantage that the scattered light which hangs back on the reflective element is effectively suppressed already on the mount of the reflective element, whereby the substrate of the reflective element is even better protected against undesired radiation absorption.
• the material and the geometry of the socket can be adapted to the respective requirements of optimum straylight suppression.
• the version can be fully be constantly made of the stray light suppressing material, or only partial areas, which are made of the stray light suppressing material.
• the socket has at least partially a coating which is made of the stray light suppressing material.
• the coating can be applied to a standard mount of the reflective element.
• the coating may be applied on the front of the frame facing the substrate or on the back of the frame.
• the stray-light-suppressing material is light-absorbing.
• This measure advantageously provides a particularly effective possibility for stray light suppression, since the scattered light incident on the rear side of the reflecting element is absorbed and no scattered light is reflected in the direction of the image plane.
• the absorption effect of the stray-light-suppressing material may, for example, be adapted to the respective wavelength of the light rays which pass through the projection objective.
• the light-absorbing material is Zerodur.
• a use of Zerodur as the light-absorbing material for the substrate of the reflective element is particularly advantageous because of its material properties, since it has only a small expansion coefficient. Furthermore, this material is particularly homogeneous, so that the production of the reflective element can be accomplished particularly easily.
• the stray-light-suppressing material is non-directionally light-scattering.
• This measure causes the scattered light suppression is achieved by an undirected light scattering of the incident light beams in all directions, so that advantageously no significant backscattering of the scattered light to the image plane occurs.
• the stray-light-suppressing material is metal.
• metal as a frame material or as a coating material for the socket advantageously represents a particularly cost-effective measure for reduced light scattering.
• the metal prevents the light reflected back in the light propagation direction of the useful light behind the reflective element from reaching the reflective surface of the element.
• the at least one reflective element is a mirror.
• the present invention in an embodiment of the projection lens whose optical elements form a non-obscured imaging system.
• a projection objective preferably has two perforated mirrors whose reflective surfaces face each other. In such a case, only one mirror sector of the mirrors on one side of the opening is used by the useful light.
• this projection objective is preferably one whose optical elements image an off-axis object field that does not contain the optical axis onto an off-axis image field.
• aperture of the reflective element comprises, in particular in the case of the abovementioned projection objective, its optical elements Projecting off-axis object field on an off-axis image field, even the case that the non-useful light hit sector of the reflective element is simply omitted.
• a projection lens seen in light propagation of the useful light behind the geometrically last reflective element and in front of the image plane has a plurality of refractive elements, and in which the scattered light by at least one reflex on at least one of the surfaces of at least one of the refractive elements, in particular at least A surface of the last refractive element in front of the image plane, in particular on the front surface of the last refractive element viewed in the direction of light propagation, can be detected by means of scattered light suppression at the first mirror, ie in the propagation direction of the useful light the mirror, which is geometrically closest to the image plane, achieve a particularly effective improvement of the imaging properties of the projection lens by reducing the scattered light component.
• a projection exposure apparatus which has a lighting system and a projection objective according to one or more of the aforementioned embodiments.
• FIG. 2 shows an exemplary embodiment of the projection objective in FIG. 1;
• FIG. 4a and b) show a further exemplary embodiment of a projection objective for use in a projection exposure apparatus according to FIG. 1, wherein FIG. 4a) shows the projection objective with the useful light beam path and FIG. 4b) shows the projection objective with a scattered light beam.
• FIG. 1 schematically shows a projection exposure apparatus provided with the general reference numeral 10, which is used, for example, in semiconductor microlithography in order to produce finely structured components.
• the projection exposure apparatus 10 has an illumination system 11 with a light source 12 and an illumination optics 14 and a projection objective 16.
• the projection lens 16 serves to image an object 18 arranged in an object plane O and provided with a pattern onto a photosensitive wafer 20, which is arranged in an image plane B of the projection objective 16.
• the object 18 and the wafer 20 are inserted into a holder 22 or a holder 24 during operation of the projection exposure apparatus 10.
• Light beams 26 generated by the light source 12 and guided by the illumination optical system 14 pass through the pattern of the object 18, extend from the object plane O through the projection lens 16 to the image plane B in the light propagation direction of the useful light and thus transmit the pattern of the object 18 the wafer 20 arranged in the image plane B.
• the projection objective 16 is of catadioptric design, ie it has reflective elements 30, here two reflecting elements 30a, b, and refractive elements 32.
• the reflecting elements 30a, b are formed as arched mirrors 34a, b, and the refractive elements 32 are formed as lenses 36 of various shapes and aspherization.
• the optical elements 28 are arranged rotationally symmetrical with respect to a common straight optical axis X and thus lie on the common straight optical axis X, in particular in the light propagation direction of the useful light behind the mirror 34b.
• the optical elements 28 of the projection lens 16 are subdivided into three subassemblies Gi, G2 and G3.
• the first and in the light propagation direction third assembly Gi and G3 are dioptric and have only the lenses 36.
• the central catadioptric assembly G2 has the two mirrors 34a, b and the two lenses 36a, b between the mirrors 34a, b.
• the two mirrors 34a, b of the middle subassembly G2 each have in their substrate 37a, b an approximately central and approximately equal opening 38a, b whose, for example, circular shape is adapted to a course of the light beams 26 of the projection lens 16.
• the apertures 38a, b are arranged approximately rotationally symmetrical with respect to the optical axis X.
• the mirrors 34a, b may each have a plurality of apertures 38a, b, through which the light beams 26 can pass.
• the apertures 38a, b can not be disposed rotationally symmetrically with respect to the optical axis X and away from the optical axis X.
• the substrates 37a, b of the mirrors 34a, b are further provided with light-reflecting surfaces 40a, b facing each other.
• the reflective surfaces 40a, b may be formed as a reflection coating.
• the light beams 26 generated by the light source 12 ideally pass through in the light propagation direction of the useful light of the projection lens 16 first assembly Gi and are each deflected on the belonging to this assembly lenses 36. Thereafter, the light beams 26 enter the second subassembly G2 of the projection lens 16 through the aperture 38a of the mirror 34a and are refracted at the lenses 36a, b of the second subassembly G2. As shown in Fig. 2, such light beams 26, which pass approximately parallel to the optical axis X through the aperture 38a of the mirror 34a, are not deflected from their propagation direction and pass through the aperture 38b of the mirror 34b.
• the light beams 26 which obliquely pass through the opening 38a of the mirror 34a with respect to the optical axis X are refracted on the lenses 36a, b so as to meet, for example, in an edge portion of the light reflecting surface 40b of the mirror 34b and reflect to the mirror 34a become.
• These light beams 26 again pass through the lenses 36a, b in reverse order and strike an edge area of the mirror 34a on the light-reflecting surface 40a thereof.
• the light beams 26 pass through the two lenses 36a, b, pass through the aperture 38b of the mirror 34b, and pass through the lenses 36 of the third assembly G3 to face on the image plane B of the projection lens 16 Wafer 20 to apply.
• the imaging quality of the projection objective 16 is determined by its imaging properties, which are impaired in particular by scattered light 42 or so-called "ghost images.”
• the scattered light 42 can be incident on a rear side of the mirror 34b by such light rays 43a, b, which impinge at arbitrary angles of incidence.
• the light beam 43a may not be transmitted to surfaces of the lenses 36 of the third assembly G3, but may be reflected back to the second assembly G 2 and impinge backward on the mirror substrate 37b.
• the scattered light 42 can be produced by back reflection of the light beam 43b on the wafer 20 into the projection objective 16, wherein the light beam 43b then traverses the optical elements 28 of the assembly G3 adjacent to the image plane B in reverse order against the light propagation direction of the useful light and faces the mirror 34b rearward incident.
• the scattered light may be caused by back reflection of the light beam 43c on the surfaces of the lenses 36 of the third assembly G3, the light beam 43c partially passing through the aperture 38b of the mirror 34b and into the substrate 37b of the substrate 37b via the sidewalls of the substrate 37b adjacent to the aperture 38b Mirror 34b penetrates.
• the light beams 43a-c can also run with the omission of optical elements 28, which is exemplified by the beam path of the light beam 43b.
• An effective suppression or at least a reduction of the scattered light 42 is effected by a choice of material of the mirror 34 b of the catadioptric projection objective 16.
• the material of the mirror 34b may be light-absorbing, so that the scattered light 42 striking the mirror 34b at the rear is absorbed.
• the absorption property of the material is in this case matched to the wavelength of the incident light beams 26, ie to the wavelength of the light source 12.
• the material of the mirror 34b may also be non-directional light scattering, whereby a diffuse scattered light line leads in all spatial directions to a distribution of the light rays 43a-c contributing to the scattered light 42.
• FIGS. 3A-3E show various embodiments of the mirror 34b, which has a main body, the substrate 37b, and a socket 44.
• the substrate 37b and / or the socket 44 of the mirror 34b may be made at least partially of the stray light suppressing material.
• the various configurations of the substrate 37b and the frame 44 can be combined for scattered light suppression in any manner or even used alone.
• the substrate 37b of the mirror 37b is at least partially made of the stray light suppressing or at least stray light reducing material.
• the mirror substrate 37b has seven substrate regions 46a-g, which are located approximately centrally in a substrate extension of the mirror 34b.
• the substrate regions 46a-g are formed differently in their dimensions, so that they are optimally adapted to the extent of the preferred impact areas of the light beams 43a-c and to the intensity of the incident stray light 42.
• the substrate 37b of the mirror 34b may also include a stray light suppressing layer 48 (see Fig. 3B).
• the layers 48a, b applied in a first and second mirror half 50a, b, which are separated from each other by the opening 38b, are arranged below the reflecting surface 40b of the substrate 37b in the light propagation direction of the useful light.
• the layer 48a extends along an opposite side of the reflective surface 40b, i. a substrate backside 52, and its diameter decreases to a substrate edge 53.
• the provided in the mirror half 50b layer 48b is located approximately in the center of the mirror substrate 37b directly adjacent to the opening 38b and widens radially outward.
• the layers 48a, b may be disposed directly below the reflective surface 40b of the substrate 37b in the light propagation direction of the useful light. Further, the layers 48a, b extend along the entire extent of the reflective surface 40b, so that optimum straylight suppression of the rear incident on the mirror substrate 37b Light beams 43a-c is reached. The light beams 43a-c are also suppressed by the layers 48a, b arranged directly beneath the reflective surface 40b, which pass through the aperture 38b at least partially and penetrate into the mirror substrate 37b via side walls 54a, b of the substrate 37b. This prevents in particular that these light beams 43a-c can reach the reflecting surface 40b of the mirror 34b. It is understood that the substrate 37b may have one or more side walls 54 depending on the geometry of the opening 38b.
• the stray light suppressing layer 48c is disposed which annihilates the light beams 43a-c passing through the aperture 38b (see Fig. 3D).
• the layer 48c is disposed along the entire extent of the side walls 54a, b of the substrate 37b of the mirror 34b.
• the stray light suppressing layer 48c may also be arranged only in partial areas along the side walls 54a, b or only along a side wall 54a, b.
• the entire mirror substrate 37b is made of the stray light suppressing material (see Fig. 3E).
• homogeneously distributed particles can be introduced from the stray light suppressing material in the mirror substrate 37b.
• the stray light suppressing material may be formed of Zerodur having a low coefficient of expansion. This is particularly advantageous in the case of intense illumination of the projection objective 16 by the light source 12. Furthermore, this material is particularly homogeneous so that it can be easily processed during mirror fabrication.
• the socket 44 of the mirror 34b can additionally or exclusively be used for stray light suppression.
• the sockets 44 of the mirror 34b shown in FIGS. 3A-3B, 3D-3E are at least partially disposed on the substrate back 52.
• the Socket 44 extends, for example, along the entire substrate rear side 52 (compare FIGS. 3A, 3B, 3D) or only in an outer annular section 56 of substrate 37b (see FIG. 3E).
• the socket 44 further includes a radially outer protrusion 58 which faces the reflective surface 40b of the substrate 37b and receives the substrate edge 53 (see Fig. 3A) or surrounds (see Fig. 3B, 3D, 3E).
• 3E is particularly advantageous in comparison to the sockets 44 shown in Figs. 3A, 3B, 3D when the stray light 42 is incident in the annular portion 56 of the mirror 34b.
• This embodiment of the socket 44 is also particularly space-saving, and it is at the same time the weight, which acts on a socket attachment (not shown) in the projection lens 16, reduced.
• the socket 44 may be formed entirely of metal, for example, so that the scattered light 42 is destroyed by the socket 44, as a result of which the scattered light 42 does not penetrate into the substrate 37b and further no stray light 42 is conducted to the image plane B (see FIG. 3D, 3E).
• the socket 44 can also have partial areas 60, shown in FIG. 3B, two partial areas 60a, b, which are made of the stray-light-suppressing metal. These subareas 60a, b may be enclosed in the socket 44 at those regions of an otherwise, for example, light-transparent frame material, on which the scattered light 42 preferably impinges. In Fig. 3B, the portions 60a, b are in the mirror half 50a, while the mirror half 50b is formed only of the transparent material.
• the mount 44 may be coated with a stray-light-suppressing coating 62 of, for example, metal, which is applied to a surface 64 of the mount 44 facing the mirror substrate 37b (see FIG. 3E).
• the coating 62 may likewise be provided on a surface 66 of the socket 44 facing away from the mirror substrate 37b.
• the rest of the frame material may be designed to be light-transparent.
• the mirror 37b of the mirror 34b when the substrate 37b of the mirror 34b is made entirely of the stray light suppressing material, or the layer 48a, b is formed along the entire extent of the reflective surface 40b of the mirror 37b, the mirror 37b may be formed without the socket 44 and may be mounted only on a bracket (not shown) ) may be received in the projection lens 16 (see Fig. 3C). The stray light suppression is then effected solely by the substrate material.
• a further embodiment of a projection lens 16 ' is shown.
• the projection objective 16 ' can be used instead of the projection objective 16 in the projection exposure apparatus 10 in FIG. 1.
• the components which are comparable or identical to the components of the projection objective 16 in FIG. 2 are given the same reference numerals as in FIG. 2, supplemented by a'.
• the projection objective 16 ' is a catadioptric projection objective whose optical elements 28' have two reflective elements 30'a and 30'b in the form of mirrors 34'a and 34'b and, moreover, sixteen refractive elements 32 'in the form of lenses 36' ,
• the optical elements 28 ' are arranged between an object plane O and an image plane B.
• optical elements 28 of the projection objective 16 in FIG. 2 result in an obscured imaging system
• optical elements 28 'of the projection objective 16' according to FIG. 4 a) form a non-obscured imaging system.
• the reflective elements 30'a and 30'b of the projection lens 16 ' like the corresponding reflective elements 30a and 30b of the projection objective 16, each have an aperture 38'a and 38'b, however, the mirror 34a and the mirror 34' b only one mirror sector on one side of the aperture 38'a and 38'b hit by the useful light, the beam path in Fig. 4a) is located.
• the mirrors 34a and 34b are hit by the useful light on both sides of the apertures 38a and 38b.
• the non-useful light sectors of the reflective elements 30'a and 30'b shown in Figs. 4a) and b) may also be omitted.
• the projection objective 16 ' is capable of imaging an off-axis object field OF in the object plane O, that is to say an object field OF which does not contain the optical axis X, into the image plane B, namely onto an off-axis image field.
• the space between the mirrors 34'a and 34'b is free of refractive elements, i. free of lenses.
• the mirror 34'b is the first mirror and the mirror 34'a the second mirror, wherein the first mirror 34'b faces the image plane B and the image plane B is geometrically closer than the mirror 34'a.
• FIG. 4b shows the projection lens 16 ', where there is only one light beam L starting from the object plane O is shown.
• the light beam L starting from the image plane O, first passes through the first five lenses 36 'and through the aperture 38'a in the second reflective element 30'a and strikes the first mirror 34'b. From there, the light beam L is reflected to the second mirror 34'a and from there passes through the aperture 38'b in the first reflective element 30'b and passes through the ten nearest lenses 36 '.
• a reflection Ri of the light beam L at the front surface of the last lens 36'1 in the light propagation direction is considered here.
• the reflection Ri of the light beam L travels as a reflected light beam Lm from the last lens 36'1 through the ten lenses 36 'arranged in front of it and then penetrates into the substrate 37'b of the reflective element 30'b up to the reflecting surface of the mirror 34'. b and meets these.
• the resulting reflection R2 is reflected as the light beam L R 2 again in the direction of the image plane B and passes through the ten lenses 36 'and the last lens 36 1 I.
• the light beam LR2 enters the image plane B and superimposed there the Nutzlichtstrahlen (see FIG 4a)), but does not contribute to the proper mapping, but produces a ghost image.

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• Physics & Mathematics (AREA)
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• Life Sciences & Earth Sciences (AREA)
• Atmospheric Sciences (AREA)
• Engineering & Computer Science (AREA)
• Environmental & Geological Engineering (AREA)
• Lenses (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

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• 2008
  • 2008-05-09 WO PCT/EP2008/003760 patent/WO2008138560A1/de not_active Ceased
  • 2008-05-09 JP JP2010507832A patent/JP2010527160A/ja active Pending
  • 2008-05-13 DE DE102008001719A patent/DE102008001719A1/de not_active Withdrawn
• 2009
  • 2009-10-30 US US12/609,437 patent/US20100085644A1/en not_active Abandoned

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