DE102007041752A1 - Chipmodul für ein RFID-System - Google Patents
Chipmodul für ein RFID-System Download PDFInfo
- Publication number
- DE102007041752A1 DE102007041752A1 DE102007041752A DE102007041752A DE102007041752A1 DE 102007041752 A1 DE102007041752 A1 DE 102007041752A1 DE 102007041752 A DE102007041752 A DE 102007041752A DE 102007041752 A DE102007041752 A DE 102007041752A DE 102007041752 A1 DE102007041752 A1 DE 102007041752A1
- Authority
- DE
- Germany
- Prior art keywords
- antenna
- rfid
- adhesive layer
- microns
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007041752A DE102007041752A1 (de) | 2007-09-04 | 2007-09-04 | Chipmodul für ein RFID-System |
| US12/602,415 US8371509B2 (en) | 2007-09-04 | 2008-09-03 | Chip module for an RFID system |
| CA2696119A CA2696119A1 (en) | 2007-09-04 | 2008-09-03 | Chip module for an rfid system |
| PCT/EP2008/007171 WO2009030463A1 (de) | 2007-09-04 | 2008-09-03 | Chipmodul für ein rfid-system |
| JP2010523318A JP5377493B2 (ja) | 2007-09-04 | 2008-09-03 | Rfidシステム用のチップモジュール |
| KR1020097019846A KR20100051039A (ko) | 2007-09-04 | 2008-09-03 | Rfid 시스템용 칩 모듈 |
| EP08801804.9A EP2183705B1 (de) | 2007-09-04 | 2008-09-03 | Verfahren zur herstellung eines chipmoduls |
| CN2008800124990A CN101663678B (zh) | 2007-09-04 | 2008-09-03 | 用于rfid系统的芯片模块 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007041752A DE102007041752A1 (de) | 2007-09-04 | 2007-09-04 | Chipmodul für ein RFID-System |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102007041752A1 true DE102007041752A1 (de) | 2009-03-05 |
Family
ID=40158664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102007041752A Withdrawn DE102007041752A1 (de) | 2007-09-04 | 2007-09-04 | Chipmodul für ein RFID-System |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8371509B2 (https=) |
| EP (1) | EP2183705B1 (https=) |
| JP (1) | JP5377493B2 (https=) |
| KR (1) | KR20100051039A (https=) |
| CN (1) | CN101663678B (https=) |
| CA (1) | CA2696119A1 (https=) |
| DE (1) | DE102007041752A1 (https=) |
| WO (1) | WO2009030463A1 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2432074A1 (de) * | 2010-09-21 | 2012-03-21 | Printechnologics GmbH | Baugruppe mit wenigstens einer UHF-Dipol-Antenne |
| DE102010056055A1 (de) * | 2010-12-23 | 2012-06-28 | Schreiner Group Gmbh & Co. Kg | Etikett mit einem elektronischen Funktionselement |
| WO2013128299A1 (en) * | 2012-03-02 | 2013-09-06 | Usta Kutluhan | Enhanced antenna structure for rfid tags |
| DE102013215706A1 (de) * | 2013-08-08 | 2015-02-12 | Bielomatik Leuze Gmbh + Co. Kg | Transfer-Stanzen |
| US9723726B2 (en) | 2014-02-26 | 2017-08-01 | Schreiner Group Gmbh & Co. Kg | Film composite having electrical functionality for applying to a substrate |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006052517A1 (de) * | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
| DE102007026720A1 (de) * | 2007-06-06 | 2008-12-11 | Bielomatik Leuze Gmbh + Co.Kg | Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung |
| US20140103116A1 (en) * | 2011-03-24 | 2014-04-17 | Tagsys Sas | Rfid tag assembly and label process |
| KR101531383B1 (ko) * | 2014-07-07 | 2015-06-24 | 주식회사 에이티앤씨 | 스티커형 안테나 제조방법 |
| WO2016072301A1 (ja) * | 2014-11-07 | 2016-05-12 | 株式会社村田製作所 | キャリアテープ及びその製造方法、並びにrfidタグの製造方法 |
| KR101632205B1 (ko) * | 2014-11-26 | 2016-06-22 | 김우중 | 갈바닉 내부식특성을 향상시킨 이동통신 단말기용 안테나의 제작방법, 이에 의해 제조된 이동통신 단말기용 케이스 및 이를 갖는 이동통신 단말기 |
| JP7377490B2 (ja) * | 2019-11-19 | 2023-11-10 | 大王製紙株式会社 | Rfidタグ |
| JP7457519B2 (ja) * | 2020-02-18 | 2024-03-28 | 株式会社ブリヂストン | 航空機用タイヤ |
| WO2022224002A1 (en) * | 2021-04-22 | 2022-10-27 | Sml Brand Identification Solutionslimited | Extensible and modular rfid device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60305295T2 (de) * | 2002-01-18 | 2007-01-18 | Avery Dennison Corp., Pasadena | Methode zur herstellung von rfid etiketten |
| DE202005021190U1 (de) * | 2005-08-31 | 2007-04-26 | Krones Ag | Herstellung von Etiketten und Etikettierung |
| DE102006052517A1 (de) | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
| DE102007026720A1 (de) | 2007-06-06 | 2008-12-11 | Bielomatik Leuze Gmbh + Co.Kg | Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10293828A (ja) * | 1997-04-18 | 1998-11-04 | Omron Corp | データキャリア、コイルモジュール、リーダライタ及び衣服データ取得方法 |
| US6297727B1 (en) * | 1997-05-05 | 2001-10-02 | George N. Nelson, Jr. | Transponder identification and record assembly |
| DE19837689A1 (de) * | 1998-08-19 | 2000-02-24 | Baumer Ident Gmbh | Anordnung zur Kennzeichnung von Objekten |
| DE10016037B4 (de) * | 2000-03-31 | 2005-01-05 | Interlock Ag | Verfahren zur Herstellung eines Etiketts oder einer Chipkarte |
| WO2002089338A2 (en) * | 2001-04-30 | 2002-11-07 | Bnc Ip Switzerland Gmbh | Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| JP2002352206A (ja) * | 2001-05-30 | 2002-12-06 | Toppan Forms Co Ltd | データ送受信体の製造方法 |
| JP2003030612A (ja) * | 2001-07-19 | 2003-01-31 | Oji Paper Co Ltd | Icチップ実装体 |
| JP2003037427A (ja) * | 2001-07-24 | 2003-02-07 | Dainippon Printing Co Ltd | アンテナパターンの製造方法 |
| CN1589457B (zh) * | 2001-12-21 | 2010-05-12 | 德国捷德有限公司 | 片材及用于制造和处理该片材的设备与方法 |
| DE10229168A1 (de) * | 2002-06-28 | 2004-01-29 | Infineon Technologies Ag | Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht |
| JP4236974B2 (ja) * | 2003-03-28 | 2009-03-11 | トッパン・フォームズ株式会社 | 非接触型情報記録媒体 |
| NL1025869C2 (nl) * | 2004-04-02 | 2005-10-05 | Capturetech Benelux B V | Samenstel van kluis en daarbij te gebruiken verzegelbare flexibele waardehouders. |
| JP2005311179A (ja) * | 2004-04-23 | 2005-11-04 | Dainippon Printing Co Ltd | 非接触データキャリア用導電部材製造方法および非接触データキャリア用導電部材製造装置 |
| US20060044769A1 (en) * | 2004-09-01 | 2006-03-02 | Forster Ian J | RFID device with magnetic coupling |
| JP2006157705A (ja) * | 2004-11-30 | 2006-06-15 | Oubiken:Kk | 電磁波吸収部材および携帯電話機用アンテナ |
| JP4541246B2 (ja) * | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | 非接触icモジュール |
| CA2619997C (en) * | 2005-08-24 | 2013-08-13 | A.M. Ramp & Co. Gmbh | Process for producing articles having an electrically conductive coating |
| DE102005042444B4 (de) * | 2005-09-06 | 2007-10-11 | Ksw Microtec Ag | Anordnung für eine RFID - Transponder - Antenne |
| JP2007080766A (ja) * | 2005-09-16 | 2007-03-29 | Dainippon Printing Co Ltd | 導電性パターン形成用金属箔シート |
| US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
| JP2009075687A (ja) * | 2007-09-19 | 2009-04-09 | Hitachi Ltd | Rfidタグ |
| US20100001862A1 (en) * | 2008-07-03 | 2010-01-07 | James Charles Wilson | Method for authenticating radio frequency identification |
-
2007
- 2007-09-04 DE DE102007041752A patent/DE102007041752A1/de not_active Withdrawn
-
2008
- 2008-09-03 CA CA2696119A patent/CA2696119A1/en not_active Abandoned
- 2008-09-03 WO PCT/EP2008/007171 patent/WO2009030463A1/de not_active Ceased
- 2008-09-03 EP EP08801804.9A patent/EP2183705B1/de not_active Not-in-force
- 2008-09-03 KR KR1020097019846A patent/KR20100051039A/ko not_active Ceased
- 2008-09-03 JP JP2010523318A patent/JP5377493B2/ja not_active Expired - Fee Related
- 2008-09-03 US US12/602,415 patent/US8371509B2/en not_active Expired - Fee Related
- 2008-09-03 CN CN2008800124990A patent/CN101663678B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60305295T2 (de) * | 2002-01-18 | 2007-01-18 | Avery Dennison Corp., Pasadena | Methode zur herstellung von rfid etiketten |
| DE202005021190U1 (de) * | 2005-08-31 | 2007-04-26 | Krones Ag | Herstellung von Etiketten und Etikettierung |
| DE102006052517A1 (de) | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
| DE102007026720A1 (de) | 2007-06-06 | 2008-12-11 | Bielomatik Leuze Gmbh + Co.Kg | Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2432074A1 (de) * | 2010-09-21 | 2012-03-21 | Printechnologics GmbH | Baugruppe mit wenigstens einer UHF-Dipol-Antenne |
| DE102010056055A1 (de) * | 2010-12-23 | 2012-06-28 | Schreiner Group Gmbh & Co. Kg | Etikett mit einem elektronischen Funktionselement |
| WO2013128299A1 (en) * | 2012-03-02 | 2013-09-06 | Usta Kutluhan | Enhanced antenna structure for rfid tags |
| DE102013215706A1 (de) * | 2013-08-08 | 2015-02-12 | Bielomatik Leuze Gmbh + Co. Kg | Transfer-Stanzen |
| WO2015018587A1 (de) * | 2013-08-08 | 2015-02-12 | Bielomatik Leuze Gmbh + Co. Kg | Transfer-stanzen |
| US9723726B2 (en) | 2014-02-26 | 2017-08-01 | Schreiner Group Gmbh & Co. Kg | Film composite having electrical functionality for applying to a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5377493B2 (ja) | 2013-12-25 |
| US20100187316A1 (en) | 2010-07-29 |
| WO2009030463A1 (de) | 2009-03-12 |
| KR20100051039A (ko) | 2010-05-14 |
| CN101663678B (zh) | 2013-05-22 |
| JP2010538556A (ja) | 2010-12-09 |
| CA2696119A1 (en) | 2009-03-12 |
| CN101663678A (zh) | 2010-03-03 |
| EP2183705A1 (de) | 2010-05-12 |
| EP2183705B1 (de) | 2016-11-23 |
| US8371509B2 (en) | 2013-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| R082 | Change of representative |
Representative=s name: VON ROHR PATENTANWAELTE PARTNERSCHAFT MBB, DE |
|
| R120 | Application withdrawn or ip right abandoned |