WO2022224002A1 - Extensible and modular rfid device - Google Patents
Extensible and modular rfid device Download PDFInfo
- Publication number
- WO2022224002A1 WO2022224002A1 PCT/IB2021/000262 IB2021000262W WO2022224002A1 WO 2022224002 A1 WO2022224002 A1 WO 2022224002A1 IB 2021000262 W IB2021000262 W IB 2021000262W WO 2022224002 A1 WO2022224002 A1 WO 2022224002A1
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- WO
- WIPO (PCT)
- Prior art keywords
- antenna
- antenna structure
- auxiliary
- rfid
- inlay member
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 103
- 230000008878 coupling Effects 0.000 claims description 70
- 238000010168 coupling process Methods 0.000 claims description 70
- 238000005859 coupling reaction Methods 0.000 claims description 70
- 230000000007 visual effect Effects 0.000 claims description 5
- 239000011888 foil Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
- G06K19/0724—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit for communicating at a plurality of frequencies, e.g. for managing time multiplexed communication over at least two antennas of different types
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07767—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
Definitions
- RFID substrates are inexpensive and they can be read quickly and with radio frequencies that can penetrate through many non-metallic materials. When products leave production in a shipping box, tracking labeling on the shipping box is required. Using RFID, each shipping box can be tracked using an RFID substrate, even if the label is not visible.
- Fig. 4C shows an alternative embodiment of an RFID inlay member and auxiliary antenna modules in accordance with the present invention
- Fig. 5B shows a configuration of the RFID inlay member of Fig. 5 A in combination with auxiliary antenna modules in accordance with an embodiment of the present invention
- Fig. 2A shows a top view of a substrate 202 and auxiliary antenna modules 204 and 206 in accordance with an embodiment of the present invention.
- Substrate 202 which may be in the form of a rectangular (or any other desired shape) piece of cardboard (or other non-metallic material) for use in a hangtag for a retail product, is shown to include first auxiliary antenna module 204 and second auxiliary antenna module 206.
- the antenna modules may be of different patterns/shapes/configurations for different desired performance levels or characteristics.
- the first and second auxiliary antenna modules 204 and 206 include antenna structures that are made of metallic foil printed on the substrate 202.
- the metallic foils may be formed of copper, aluminum, or other desired metal or alloy.
- an RFID inlay member 200 is disposed on the substrate 202.
- the inlay member 200 includes, for example, an RFID transponder 210 and an antenna structure 212.
- the RFID transponder 210 is electrically interconnected to the antenna structure 212 at base antenna portion 214, which is in turn interconnected to antenna extension portions 216 and 218.
- the antenna structure 212 may be made, for example, from aluminum and is designed to offer a basic performance characteristic in this initial state, i.e., the RFID inlay member 200 may function on its on as an RFID substrate without any additional structures, as is the case with RFID inlay 104 of Figs. 1A and IB.
- base antenna portion 214 and antenna extension portions 216 and 218 may be designed in various configurations to meet a desired performance characteristic (i.e. a first performance characteristic).
- the inlay member when used in a multi-substrate RFID label, the inlay member may occupy the top-most substrate and the auxiliary antenna module may occupy the next substrate down, adjacent to and overlapping with the top-most substrate.
- the exact relative positioning of the respective antenna structures of the inlay member and the auxiliary antenna module results in a high (read range) performance RFID label.
- Configuration (b) in Fig. 4D is an alternative configuration of RFID inlay 200A and auxiliary antenna module 412 disposed on an exemplary hangtag substrate 418 for a product to be sold in Europe.
- the antenna structure of inlay member 200A is electrically coupled to connection points 414A and 414B of auxiliary antenna module 412. This coupling configures the inlay member 200A to have a performance characteristic that conforms to ETSI requirements or optimizes performance in the ETSI frequency band.
- the antenna structure of inlay member 200A is electrically decoupled from connection points 416A and 416B of auxiliary antenna module 412.
- auxiliary antenna module 424 is disposed on an exemplary hangtag substrate 422.
- the auxiliary antenna module 424 includes connection points 426 A and 426B and connection points 428 A and 428B. These connection points provide different performance characteristics of auxiliary antenna module 424 adapted to different RFID inlay chip types. This allows RFID chips or RFID inlays from various vendors to be used with a single auxiliary antenna module.
- Configuration (c) in Fig. 4E depicts the antenna structure of inlay member 432 electrically coupled to connection points 428A and 428B of auxiliary antenna module 424. This coupling configures auxiliary antenna module 424 to be optimized for the inlay member 432.
- the antenna structure of inlay member 432 is electrically decoupled from connection points 426A and 426B of auxiliary antenna module 424.
- the auxiliary antenna module may be manufactured from any metal, alloy or other conductive material or composite. Further, the auxiliary antenna module may be disposed on the substrate by printing or by being applied as a label with adhesive. There may be more than one auxiliary antenna module and, for a particular design/performance characteristic only one of the two antenna structures 502A or 502B may be electrically coupled to the antenna module(s).
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
Abstract
An RFID device, comprising an inlay member including an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic. There is a first auxiliary antenna module including a second antenna structure. The second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic.
Description
Extensible and Modular RFID Device
Technical Field
[0001] The present invention relates to an RFID device and more particularly such an RFID including an RFID inlay and an auxiliary antenna structure to make the device extensible and modular.
Background Art
[0002] Products need to be tracked throughout the supply chain from production to point-of-sale. This can be done using labels, tags, or cards, for example, including a barcode, or other printed information describing/identifying the labeled product. Radio Frequency Identification (RFID) is a technology that is also used in these applications. RFID uses radio waves for communication between an RFID substrate and an RFID reader (or interrogator). The RFID substrate includes a microchip attached to an antenna, which is commonly referred to as an RFID inlay. The reader is capable of reading data from and writing data to the RFID substrate. The RFID substrate may be affixed directly on a surface of the product or its packaging as in the case of a label, or it may be affixed to the product as in the case of a hangtag or card.
[0003] One advantage of RFID substrates is that they can be read quickly and with radio frequencies that can penetrate through many non-metallic materials. When products leave production in a shipping box, tracking labeling on the shipping box is required. Using RFID, each shipping box can be tracked using an RFID substrate, even if the label is not visible.
[0004] Different applications or desired performance characteristics for RFID substrates may require different antenna configurations. Even though the RFID microchip remains the same throughout all these applications or characteristics, the antenna configuration changes. The change in antenna configuration requires that the RFID label be redesigned for each application or desired performance characteristic.
Summary of the Embodiments
[0005] It is an object of the invention to provide a cost-effective way to meet different applications or desired performance characteristics for RFID substrates. More specifically various embodiments utilize a combination of RFID inlays and one or more auxiliary antenna modules to allow the same inlay to meet a variety of performance requirements by adapting the one or more auxiliary antenna modules. In addition, different inlay types may be used with a single auxiliary antenna module.
[0006] In one aspect of the disclosure there is included an RFID device, comprising an inlay member with an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic. There is a first auxiliary antenna module including a second antenna structure. The second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic.
[0007] In other aspects, one or more of the following features may be included.
There may be a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna may be electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with the second performance characteristic, different from the first performance characteristic.
In a second configuration, the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module may be electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a third performance characteristic, different from the first and second performance characteristics. The second performance characteristic and the third performance characteristic may differ by one of read range, read frequency band, or read angles in three- dimensional space. In the first configuration the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing second antenna structure adjacent to the first antenna structure
and in a second configuration the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing third antenna structure adjacent to the first antenna structure.
[0008] In further embodiments, one or more of the following features may be included. The first antenna structure may include a first antenna portion and a second antenna portion, the second antenna structure may include a first coupling portion spaced from a second coupling portion, and the third antenna structure may include a third coupling portion spaced from a fourth coupling portion. In the first configuration, the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure respectively over the first coupling portion and second coupling portion of the second antenna structure. In the second configuration the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the third antenna structure. There may further be included a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna may be electrically de-coupled from the first antenna structure of the inlay member; and wherein the RFID transponder of the inlay member includes an RFID chip of a first chip type. In a second configuration, the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member and wherein the RFID transponder of the inlay member includes an RFID chip of a second chip type.
[0009] In yet further embodiments the following features may be included. The second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing second antenna structure adjacent to the first antenna structure. The first antenna structure may include a first antenna
portion and a second antenna portion and the second antenna structure may include a first coupling portion spaced from a second coupling portion. The second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure. The first antenna structure may include a first antenna portion and a second antenna portion and the second antenna structure may include a first coupling portion spaced from a second coupling portion and a third coupling portion spaced from a fourth coupling portion. In a first configuration the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure. In a second configuration the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the second antenna structure.
[0010] In additional embodiments the following features may be included. In the first configuration the second performance characteristic may be provided and in the second configuration the third performance characteristic may be provided. The first performance characteristics may differ by one of read range, read frequency band, or read angles in three- dimensional space. The first configuration the RFID transponder of the inlay member may include an RFID chip of a first chip type and in the second configuration the RFID transponder of the inlay member may include an RFID chip of a second chip type. The inlay member and the first auxiliary antenna module may be disposed on a first substrate. The inlay member may be disposed on a first substrate and the first auxiliary antenna module may be disposed on a second substrate. The first substrate may overlay the second substrate. The inlay member, the first auxiliary antenna module, and the second auxiliary antenna module may be disposed on a first substrate. The inlay member may be disposed on a first substrate and the first auxiliary antenna module and the second auxiliary antenna module may be disposed on a second substrate. The first substrate may overlay the second substrate.
wherein at least a portion of the second antenna structure of the first auxiliary antenna module form a visual design pattern or logo.
[0011] In another aspect of the disclosure there is included an RFID device, comprising an inlay member having an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic. There is a first auxiliary antenna module including a second antenna structure and a second auxiliary antenna module including a third antenna structure. In a first configuration, the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic. In a second configuration, the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a third performance characteristic, different than the first and second performance characteristics.
[0012] In yet another aspect of the disclosure there is included an RFID device including an inlay member including an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic. There is a first auxiliary antenna module including a second antenna structure. The second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the first antenna structure includes a first antenna portion and a second antenna portion. The second antenna structure includes a first coupling portion spaced from a second coupling portion and a third coupling portion spaced from a fourth coupling portion. In a first configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure. In a second configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by
disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the second antenna structure.
Brief Description of the Drawings
[0013] The foregoing features of embodiments will be more readily understood by reference to the following detailed description, taken with reference to the accompanying drawings, in which:
[0014] Fig. 1 A shows an exploded perspective view of a portion of a prior art RFID hangtag with a bottom cardboard substrate on which is disposed and RFID inlay;
[0015] Fig. IB shows an exploded perspective view of the prior art hang tag of Fig.
1 A, including a top cardboard substrate disposed over the bottom cardboard substrate forming the RFID hangtag;
[0016] Fig. 2A shows a top view of a substrate and auxiliary antenna modules in accordance with an embodiment of the present invention;
[0017] Fig. 2B shows a top view of a substrate, auxiliary antenna modules, and an RFID inlay member in accordance with an embodiment of the present invention;
[0018] Fig. 2C shows a top view of an RFID inlay member encapsulated between two substrates in accordance with an embodiment of the present invention;
[0019] Fig. 3 shows an RFID inlay member and auxiliary antenna modules in accordance with an embodiment of the present invention;
[0020] Fig. 4A shows a first configuration of an RFID inlay member and auxiliary antenna modules in accordance with an embodiment of the present invention;
[0021] Fig. 4B shows a second configuration of an RFID inlay member and auxiliary antenna modules in accordance with an embodiment of the present invention;
[0022] Fig. 4C shows an alternative embodiment of an RFID inlay member and auxiliary antenna modules in accordance with the present invention;
[0023] Fig. 4D shows another embodiment of an RFID inlay member and auxiliary antenna module in accordance with the present invention;
[0024] Fig. 4E shows yet another embodiment of an RFID inlay member and auxiliary antenna module in accordance with the present invention;
[0025] Fig. 5 A shows an RFID inlay member in accordance with another embodiment of the present invention;
[0026] Fig. 5B shows a configuration of the RFID inlay member of Fig. 5 A in combination with auxiliary antenna modules in accordance with an embodiment of the present invention;
[0027] Fig. 5C shows an alternative configuration of RFID inlay member and auxiliary antenna module in accordance with an embodiment of the present invention ; and
[0028] Fig. 5D shows cross-sectional views of RFID inlay member, substrates, and auxiliary antenna module in accordance with embodiments of the present invention.
Detailed Description of Specific Embodiments
[0029] Definitions. As used in this description and the accompanying claims, the following terms shall have the meanings indicated, unless the context otherwise requires:
[0030] The term “electrically coupled” includes direct electric coupling via a direct physical connection and indirect electric coupling, such as capacitive and inductive coupling.
[0031] The term “RFID substrate” includes labels, tags (including hang tags), cards, and any other type of substrate containing an RFID inlay and any or all of these terms may be used interchangeably herein.
[0032] The term “substrate” includes labels, tags, cards, and any other type of substrate which may be applied, affixed or attached to a product or other object, and any or all of these terms may be used interchangeably herein.
[0033] Fig. 1 A shows an exploded perspective view of a portion of a prior art RFID hangtag 100 with a bottom cardboard substrate 102 on which is disposed an RFID inlay 104. The RFID inlay 104 may be in the form of a label including an adhesive to adhere the inlay to the bottom cardboard structure 102. The RFID inlay 104, may include an RFID transponder 106 electrically interconnected to an antenna structure 108, which may be formed of aluminum. The antenna structure 108 may comprise a central or base antenna portion 110 having a desired pattern/shape/configuration, which may be interconnected to one or more antenna extension portions 112/114 also having a desired
pattern/shape/configuration. The base antenna portion 110 and the one or more antenna extension portions 112/114 of RFD inlay 100 may be configured to meet certain performance requirements; however, once the RFID inlay 100 is manufactured, its performance characteristics cannot be changed or extended. Therefore, RFID inlays are typically manufactured in various configurations to meet different performance requirements.
[0034] Fig. IB shows an exploded perspective view of the full prior art RFID hangtag 100, including the bottom cardboard substrate 102 on which is disposed an RFID inlay 104 and a top cardboard substrate 120 which is disposed over the bottom cardboard substrate 102 to encapsulate the RFID inlayl04. The combination of bottom substrate 102, RFID inlay 104, and top substrate 120 together form RFID hangtag 100 which may, for example, be used as a hangtag that is attached to a product in a retail store. A perforation 122 in top substrate 120 and a perforation 124 in bottom substrate 102 may be provided so that a fastener may be fed there through to affix RFID hangtag 100 to a retail product.
[0035] Fig. 2A shows a top view of a substrate 202 and auxiliary antenna modules 204 and 206 in accordance with an embodiment of the present invention. Substrate 202, which may be in the form of a rectangular (or any other desired shape) piece of cardboard (or other non-metallic material) for use in a hangtag for a retail product, is shown to include first auxiliary antenna module 204 and second auxiliary antenna module 206. The antenna modules may be of different patterns/shapes/configurations for different desired performance levels or characteristics. Illustratively, the first and second auxiliary antenna modules 204 and 206 include antenna structures that are made of metallic foil printed on the substrate 202. The metallic foils may be formed of copper, aluminum, or other desired metal or alloy. The antenna structures of the auxiliary antenna modules may be manufactured from other conductive materials or composites. Further, the auxiliary antenna modules may be disposed on the substrate in a manner different than printing, such as by being applied as a label with adhesive. In addition, while two auxiliary antenna modules are depicted, it is expressly contemplated that the substrate may include only one auxiliary antenna module or more than two auxiliary antenna modules.
[0036] Referring now to Fig. 2B, an RFID inlay member 200 is disposed on the substrate 202. The inlay member 200 includes, for example, an RFID transponder 210 and an antenna structure 212. The RFID transponder 210 is electrically interconnected to the
antenna structure 212 at base antenna portion 214, which is in turn interconnected to antenna extension portions 216 and 218. The antenna structure 212 may be made, for example, from aluminum and is designed to offer a basic performance characteristic in this initial state, i.e., the RFID inlay member 200 may function on its on as an RFID substrate without any additional structures, as is the case with RFID inlay 104 of Figs. 1A and IB. Thus, base antenna portion 214 and antenna extension portions 216 and 218 may be designed in various configurations to meet a desired performance characteristic (i.e. a first performance characteristic).
[0037] However, according to an aspect of this disclosure, RFID inlay member 200 advantageously allows its performance characteristics to be extended to, for example, maximize its (read-range) performance at one or more particular RFID bands and/or to increase its RF performance at other angles in three-dimensional space by electrically coupling its antenna structure 212 with one of the first or second auxiliary antenna modules 204 and 206.
[0038] The extensibility of the RFID inlay member 200 is accomplished by the exact placement (position and orientation) relative to one or more auxiliary antenna structures, such as the antenna structures of first and second auxiliary antenna modules 204 and 206. As described above with regard to Fig. 2A, the auxiliary antenna structures may be realized with a printed metallic foil pattern. By electrically coupling the antenna structure 212 of RFID inlay member 200 to one of the auxiliary antenna structures, e.g. 206, the performance characteristic of the RFID inlay member 200 can be extended to have a second performance characteristic which is different from the first performance characteristic. Alternatively, the antenna structure 212 of RFID inlay member 200 may be electrically coupled to the other auxiliary antenna structure, i.e. 204, and the performance characteristic of the RFID inlay member 200 can be altered to have a third performance characteristic which is different from the first and second performance characteristics.
[0039] Fig. 2C shows a top view of the RFID inlay member 200 encapsulated between two substrates, a top substrate 220 and a bottom substrate 202. The RFID inlay member 200 and auxiliary antenna modules 204 and 206 are therefore integrated inside the cardboard and not visible, thereby forming an RFID hangtag 222. Illustratively, cardboard substrates 202 and 220 have half the thickness of a conventional hangtag without RFID
technology. For example, the thickness of cardboard substrates 202 and 220 may be about 10 microns each. Further, the thickness of RFID inlay member 200 may be 50 microns.
[0040] In the example shown in Fig. 2C, the RFID inlay member 200 is affixed to substrate 202 such that antenna extension portion 218 of antenna structure 212 is adjacent to and electrically coupled to auxiliary antenna module 206 , forming an extended RFID inlay member 200 having a second performance characteristic different from the first or original performance characteristic.
[0041] Therefore, since hangtag 222 may carry more than one auxiliary antenna pattern (in the form of modules 204 and 206), producing different RFID performance characteristics, it is readily reconfigurable, based on the performance characteristics needed. Once a specific RFID performance characteristic has been selected, the antenna structure 212 of the inlay member 200 is electrically coupled to the correct auxiliary antenna module that provides the selected RFID performance characteristic by aligning the antenna structure of RFID inlay member with the antenna structure of the appropriate antenna module. With this approach, a single type of substrate with multiple antenna modules can be used with a single type of RFID inlay to produce RFID hang tags with various performance characteristics. Since printing of multiple antenna modules is relatively inexpensive this provides a low cost and efficient solution, especially compared to the current approach of using different RFID inlays for each type of RFID hangtag needed.
[0042] It is expressly contemplated that the material of the substrate that includes the auxiliary antenna modules is not limited to cardboard and hang tags are not the only type of RFID device that may use the design of this disclosure. The auxiliary antenna modules can also be included inside a sticker (label), in which case the inlay member is either placed directly on top and converted into an RFID enabled label; or, the inlay member is disposed on another substrate of a multi-substrate RFID label. In this case, the inlay member is placed on a different, but adjacent and overlapping, substrate than the auxiliary antenna modules that it is electrically or magnetically coupled to, necessitating an indirect connection, such as a capacitive, inductive, or magnetic connection. For example, when an inlay member is used in a multi-substrate RFID label, the inlay member may occupy the top-most substrate and the auxiliary antenna module may occupy the next substrate down, adjacent to and overlapping with the top-most substrate. The exact relative positioning of the respective antenna
structures of the inlay member and the auxiliary antenna module results in a high (read range) performance RFID label.
[0043] The advantageous use of the RFID inlay member electrically or magnetically coupled to an auxiliary antenna module results in a large combination of possible RFID performance profiles or performance characteristics. Selecting the correct auxiliary antenna module extends the performance of the inlay member, which results in a high performance RFID enabled hangtag, label, card or other type of substrate at a target RFID band. For example, the use of a specific inlay member with the correct auxiliary antenna module can result in optimized RFID read range performance of an RFID substrate in the European RFID band (ETSI) or the American RFID band (FCC), depending on in which geographical region the product is being sold. Alternatively, by selecting a different auxiliary antenna module, the RFID substrate can result in good read range across both RFID regions.
[0044] Fig. 3 depicts the above described example use of RFID inlay member 200. Here, RFID inlay 200 may be electrically coupled to either auxiliary antenna modules 302 or 304 in accordance with an embodiment of the invention. As described in more detail in reference to Figs. 2A, 2B, and 2C above, the performance characteristics of RFID inlay member 200 can be configured to conform to different requirements. Illustratively, auxiliary antenna module 302 is designed to configure the performance characteristic of inlay member 200 to conform to the requirements of the Federal Communications Commission (FCC) in the US. Similarly, auxiliary antenna module 304 is designed to configure the performance characteristic of inlay member 200 to conform to the requirements of the European Telecommunications Standards Institute (ETSI). A specific desired performance characteristic can be selected by electrically coupling the antenna structure of inlay member 200 to the appropriate auxiliary antenna module.
[0045] Fig. 4 A shows a first configuration of RFID inlay member 200 and auxiliary antenna modules 302 and 304 disposed on an exemplary hangtag substrate 400 for a product to be sold in Europe. The antenna structure of inlay 200 is electrically coupled to auxiliary antenna module 304. Specifically antenna extension portion 218 of antenna structure 212 is disposed adjacent to and is electrically coupled to auxiliary antenna module 304. This coupling configures the inlay member 200 to have a performance characteristic that conforms to ETSI requirements or optimizes performance in the ETSI frequency band. The
antenna structure of inlay member 200 is electrically decoupled from auxiliary antenna module 302.
[0046] Fig. 4B shows a second configuration of RFID inlay 200 and auxiliary antenna modules 302 and 306 each having a particular antenna structure disposed on an exemplary hangtag substrate 402 for a product to be sold in the US. The antenna structure of inlay 200 is electrically coupled to auxiliary antenna module 302. Specifically antenna extension portion 218 of antenna structure 212 is disposed adjacent to and is electrically coupled to auxiliary antenna module 302. This coupling configures the inlay member 200 to have a performance characteristic that conforms to FCC requirements or optimizes performance in the FCC frequency band. The antenna structure of inlay member 2020 is electrically decoupled from auxiliary antenna module 304.
[0047] Fig. 4C shows an alternative embodiment in accordance with the present invention of RFID inlay 200A and auxiliary antenna modules 302A and 304A. In the configuration shown in (a), auxiliary antenna modules 302A and 304A are disposed on an exemplary hangtag substrate 404. Auxiliary antenna modules 302A and 304A provide different performance characteristics for products to be sold in Europe or in the US. The RFID inlay 200A is configured to be electrically coupled to one of auxiliary antenna modules 302A or 304A, depending on where the product is being sold. Illustratively, the RFID inlay 200 A may include an RFID chip 201 A and two metallic structures 20 IB and 201C configured to couple to an auxiliary antenna module. The metallic structures 20 IB and 201C may exemplarily be made from aluminum. In the example shown, metallic structures 20 IB and 201C serve as the antenna structure of RFID inlay 200A. However, it is expressly contemplated that a more sophisticated antenna structure, such as the one shown in Figs. 4A and 4B, is used with RFID inlay 200 A to couple to auxiliary antenna modules 302 A and 304 A.
[0048] Configuration (b) in Fig. 4C is an alternative configuration of RFID inlay 200A and auxiliary antenna modules 302A and 304A disposed on an exemplary hangtag substrate 406 for a product to be sold in Europe. The antenna structure of inlay member 200A is electrically coupled to auxiliary antenna module 304A. This coupling configures the inlay member 200A to have a performance characteristic that conforms to ETSI requirements
or optimizes performance in the ETSI frequency band. The antenna structure of inlay member 200A is electrically decoupled from auxiliary antenna module 302A.
[0049] Configuration (c) in Fig. 4C is an alternative configuration of RFID inlay 200A and auxiliary antenna modules 302A and 304A disposed on an exemplary hangtag substrate 408 for a product to be sold in the US. The antenna structure of inlay member 200A is electrically coupled to auxiliary antenna module 302A. This coupling configures the inlay member 200A to have a performance characteristic that conforms to FCC requirements or optimizes performance in the FCC frequency band. The antenna structure of inlay member 200 A is electrically decoupled from auxiliary antenna module 304 A.
[0050] Fig. 4D shows yet another alternative embodiment in accordance with the present invention of RFID inlay 200A and a single auxiliary antenna module 412. In the configuration shown in (a), auxiliary antenna module 412 is disposed on an exemplary hangtag substrate 410. The auxiliary antenna module 412 includes connection points 414A and 414B and connection points 416A and 416B. These connection points provide different performance characteristics of auxiliary antenna module 412 for products to be sold in Europe or in the US. The RFID inlay 200A is configured to be electrically coupled to connections points 414A and 414B or to connection points 416A and 416B, depending on where the product is being sold.
[0051] Configuration (b) in Fig. 4D is an alternative configuration of RFID inlay 200A and auxiliary antenna module 412 disposed on an exemplary hangtag substrate 418 for a product to be sold in Europe. The antenna structure of inlay member 200A is electrically coupled to connection points 414A and 414B of auxiliary antenna module 412. This coupling configures the inlay member 200A to have a performance characteristic that conforms to ETSI requirements or optimizes performance in the ETSI frequency band. The antenna structure of inlay member 200A is electrically decoupled from connection points 416A and 416B of auxiliary antenna module 412.
[0052] Configuration (c) in Fig. 4D is an alternative configuration of RFID inlay 200A and auxiliary antenna module 412 disposed on an exemplary hangtag substrate 420 for a product to be sold in the US. The antenna structure of inlay member 200A is electrically coupled to connection points 416A and 416B of auxiliary antenna module 412. This coupling configures the inlay member 200A to have a performance characteristic that conforms to
FCC requirements or optimizes performance in the FCC frequency band. The antenna structure of inlay member 200A is electrically decoupled from connection points 414A and 414B of auxiliary antenna module 412.
[0053] Fig. 4E shows another alternative embodiment in accordance with the present invention of RFID inlays 430 and 432 and auxiliary antenna module 424. RFID inlays 430 and 432 may be from different vendors, have different chip types, and/or have different antenna requirements for a desired performance characteristic. The RFID inlays 430 and 432, for example, may be an NXP UCODE 8 and an Impinj R6P, respectively.
[0054] In the configuration shown in (a), auxiliary antenna module 424 is disposed on an exemplary hangtag substrate 422. The auxiliary antenna module 424 includes connection points 426 A and 426B and connection points 428 A and 428B. These connection points provide different performance characteristics of auxiliary antenna module 424 adapted to different RFID inlay chip types. This allows RFID chips or RFID inlays from various vendors to be used with a single auxiliary antenna module.
[0055] Exemplarily, the RFID inlay 430 is configured to be electrically coupled to connection points 426A and 426B, and the RFID inlay 432 is configured to be electrically coupled to connection points 428A and 428B. The performance of auxiliary antenna module 424 is therefore optimized for RFID inlay 430 if coupled to connection points 426 A and 426B and for RFID inlay 432 if coupled to connection points 428A and 428B. The performance of auxiliary antenna module 424 may be optimized for the same frequency band, regardless whether an RFID inlay is coupled to connection points 426A and 426B or to connection points 428 A and 428B. However, the performance of auxiliary antenna module 424 may also be optimized for different chip and types and different frequency bands, depending on which pair of connection points is used.
[0056] Configuration (b) in Fig. 4E depicts the antenna structure of inlay member 430 electrically coupled to connection points 426 A and 426B of auxiliary antenna module 424. This coupling configures auxiliary antenna module to be optimized for the inlay member 430. The antenna structure of inlay member 430 is electrically decoupled from connection points 428A and 428B of auxiliary antenna module 424.
[0057] Configuration (c) in Fig. 4E depicts the antenna structure of inlay member 432 electrically coupled to connection points 428A and 428B of auxiliary antenna module
424. This coupling configures auxiliary antenna module 424 to be optimized for the inlay member 432. The antenna structure of inlay member 432 is electrically decoupled from connection points 426A and 426B of auxiliary antenna module 424.
[0058] Fig. 5A shows an RFID inlay member 500 in accordance with a related embodiment of the disclosure. RFID inlay member 500 includes an RFID transponder 504 and antenna structures 502A and 502B. Similar to what is described above in reference to Fig. 2B, the antenna structures 502A and 502B may be made, for example, from aluminum and are designed to offer basic performance characteristics in this initial state. In other words, the RFID inlay member 500 may function as an RFID label without any additional structures.
[0059] Fig. 5B shows a sample configuration of RFID inlay 500 used in connection with an auxiliary antenna module 506 for a retail setting. The antenna structures 502A and 502B are each electrically coupled to discrete portions of the auxiliary antenna module 506 which has a particular antenna structure desired for the application. The auxiliary antenna module may be a metallic foil pattern printed on a substrate. The foil pattern of the antenna structure of the auxiliary antenna module 506 may be designed to be visible to the consumer. In this case, at least a portion of the foil pattern may take the form of a selected visual design pattern or brand logo. The overall antenna pattem/shape/configuration may be selected to produce the desired performance characteristic of the RFID inlay 500.
[0060] Similar to what is described above in reference to Figs. 2-4, it is expressly contemplated that the auxiliary antenna module may be manufactured from any metal, alloy or other conductive material or composite. Further, the auxiliary antenna module may be disposed on the substrate by printing or by being applied as a label with adhesive. There may be more than one auxiliary antenna module and, for a particular design/performance characteristic only one of the two antenna structures 502A or 502B may be electrically coupled to the antenna module(s).
[0061] Fig. 5C shows an alternative embodiment in accordance with the present invention of RFID inlay 508 used with an auxiliary antenna module 514 for a retail setting. The RFID inlay 508 has an antenna structure 510 configured to be electrically coupled to an auxiliary antenna module. Configuration (a) shows an exemplary hangtag substrate 512 with auxiliary antenna module 514. The auxiliary antenna module 514 may be a metallic foil
pattern printed on the substrate 512. The foil pattern of the antenna structure of the auxiliary antenna module 514 may be designed to be visible to the consumer and may take the form of a selected visual design pattern or brand logo.
[0062] Configuration (b) of Fig. 5C shows the RFID inlay 508 affixed to exemplary hangtag substrate 516. The antenna structure 510 of RFID inlay 508 is electrically coupled to the auxiliary antenna module 514 printed on hangtag substrate 516. The overall antenna pattern/shape/configuration of the auxiliary antenna module 514 may be selected to produce the desired performance characteristic of the RFID inlay 508.
[0063] Fig. 5D shows a cross-sectional view of two exemplary configurations (a) and (b) in accordance with embodiments of the present invention. As can be seen below in the description of configurations (a) and (b), the embodiment shown in Fig. 2 is configured as in configuration (b). The embodiments shown in Figs. 4A-E may be configured as in configuration (a) or as in configuration (b). The embodiments shown in Figs. 5B and 5C would typically be configured as in configuration (a) as the foil pattern of the antenna structure of the auxiliary antenna module may take the form of a selected visual design pattern or brand logo, since the foil pattern of the antenna structure is designed to be visible.
[0064] In configuration (a), RFID inlay member 524 is encapsulated between two substrates, a top substrate 522 and a bottom substrate 526. Auxiliary antenna module 520 is disposed on top of top substrate 522. The auxiliary antenna module may illustratively be a metallic foil printed on top substrate 522. The RFID inlay member 524 is integrated inside the cardboard substrates and not visible, but the auxiliary antenna module 520 is visible to the consumer. Auxiliary antenna module 520, top substrate 522, RFID inlay member 524, and bottom substrate 526 form an RFID hangtag 518. In the example shown in configuration (a), the RFID inlay member 524 is affixed to top substrate 522 and/or bottom substrate 526 such that the antenna structure (not shown) of the RFID inlay member 524 is electrically coupled to auxiliary antenna module 520.
[0065] In configuration (b), RFID inlay member 534 and auxiliary antenna module 532 are encapsulated between two substrates, a top substrate 530 and a bottom substrate 536. The RFID inlay member 534 and auxiliary antenna modules 532 are integrated inside the cardboard substrates and not visible, thereby forming an RFID hangtag 528. In the example shown in configuration (b), the RFID inlay member 534 is affixed to top substrate 530 and/or
bottom substrate 536 such that the antenna structure (not shown) of the RFID inlay member 534 is electrically coupled to auxiliary antenna module 532.
[0066] The embodiments of the invention described above are intended to be merely exemplary; numerous variations and modifications will be apparent to those skilled in the art All such variations and modifications are intended to be within the scope of the present invention as defined in any appended claims.
Claims
1. An RFID device, comprising: an inlay member including an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic; a first auxiliary antenna module including a second antenna structure; wherein the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic.
2. The RFID device of claim 1 further including a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with the second performance characteristic, different from the first performance characteristic.
3. The RFID device of claim 2 wherein, in a second configuration, the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a third performance characteristic, different from the first and second performance characteristics.
4. The RFID device of claim 3 wherein the second performance characteristic and the third performance characteristic differ by one of read range, read frequency band, or read angles in three-dimensional space.
5. The RFID device of claim 3 wherein in the first configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna
structure of the inlay member by disposing second antenna structure adjacent to the first antenna structure and in a second configuration the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing third antenna structure adjacent to the first antenna structure.
6. The RFID device of claim 3 wherein the first antenna structure includes a first antenna portion and a second antenna portion, the second antenna structure includes a first coupling portion spaced from a second coupling portion, and the third antenna structure includes a third coupling portion spaced from a fourth coupling portion; wherein in the first configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure respectively over the first coupling portion and second coupling portion of the second antenna structure; and wherein in the second configuration the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the third antenna structure.
7. The RFID device of claim 1 further including a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna is electrically de-coupled from the first antenna structure of the inlay member; and wherein the RFID transponder of the inlay member includes an RFID chip of a first chip type.
8. The RFID device of claim 1 wherein, in a second configuration, the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member and wherein the RFID transponder of the inlay member includes an RFID chip of a second chip
type.
9. The RFID device of claim 1 wherein the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing second antenna structure adjacent to the first antenna structure
10. The RFID device of claim 1 wherein the first antenna structure includes a first antenna portion and a second antenna portion and the second antenna structure includes a first coupling portion spaced from a second coupling portion; wherein the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure.
11. The RFID device of claim 1 wherein the first antenna structure includes a first antenna portion and a second antenna portion and the second antenna structure includes a first coupling portion spaced from a second coupling portion and a third coupling portion spaced from a fourth coupling portion; wherein in a first configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure; and wherein in a second configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the second antenna structure.
12. The RFID device of claim 11 wherein in the first configuration the second performance characteristic is provided and in the second configuration the third performance characteristic is provided; and wherein the first performance characteristics differ by one of read range, read frequency band, or read angles in three-dimensional space.
13. The RFID device of claim 11 wherein in the first configuration the RFID transponder of the inlay member includes an RFID chip of a first chip type and in the second configuration the RFID transponder of the inlay member includes an RFID chip of a second chip type.
14. The RFID device of claim 1 wherein the inlay member and the first auxiliary antenna module are disposed on a first substrate.
15. The RFID device of claim 1 wherein the inlay member is disposed on a first substrate and the first auxiliary antenna module is disposed on a second substrate, and wherein the first substrate overlays the second substrate.
16. The RFID device of claim 2 wherein the inlay member, the first auxiliary antenna module, and the second auxiliary antenna module are disposed on a first substrate.
17. The RFID device of claim 2 wherein the inlay member is disposed on a first substrate and the first auxiliary antenna module and the second auxiliary antenna module are disposed on a second substrate; and wherein the first substrate overlays the second substrate.
18. The RFID device of claim 1 wherein at least a portion of the second antenna structure of the first auxiliary antenna module form a visual design pattern or logo.
19. An RFID device, comprising: an inlay member including an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic; a first auxiliary antenna module including a second antenna structure; and a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic; and wherein, in a second configuration, the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a third performance characteristic, different than the first and second performance characteristics.
20. An RFID device, comprising: an inlay member including an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic; a first auxiliary antenna module including a second antenna structure; wherein the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member; wherein the first antenna structure includes a first antenna portion and a second antenna portion and the second antenna structure includes a first coupling portion spaced from a second coupling portion and a third coupling portion spaced from a fourth coupling portion; wherein in a first configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the
second antenna structure; and wherein in a second configuration the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the second antenna structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP21729622.7A EP4327243A1 (en) | 2021-04-22 | 2021-04-22 | Extensible and modular rfid device |
| PCT/IB2021/000262 WO2022224002A1 (en) | 2021-04-22 | 2021-04-22 | Extensible and modular rfid device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IB2021/000262 WO2022224002A1 (en) | 2021-04-22 | 2021-04-22 | Extensible and modular rfid device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022224002A1 true WO2022224002A1 (en) | 2022-10-27 |
Family
ID=76250381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2021/000262 WO2022224002A1 (en) | 2021-04-22 | 2021-04-22 | Extensible and modular rfid device |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP4327243A1 (en) |
| WO (1) | WO2022224002A1 (en) |
Citations (7)
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|---|---|---|---|---|
| US20060243811A1 (en) * | 2005-04-19 | 2006-11-02 | Aruze Corp. | Non-contact IC card system and attaching body for non-contact IC card |
| US20070200705A1 (en) * | 2006-02-24 | 2007-08-30 | Fujitsu Limited | RFID tag |
| US20080252460A1 (en) * | 2007-04-13 | 2008-10-16 | Astra Gesellschaft Fur Asset Management Mbh & Co. Kg | Method and device for protection against remote readout of goods identification data |
| US20090273474A1 (en) * | 2006-04-03 | 2009-11-05 | Aruze Corp. | Radio ic tag |
| US20100187316A1 (en) * | 2007-09-04 | 2010-07-29 | Martin Bohn | Chip module for an rfid system |
| US20180181853A1 (en) * | 2015-06-09 | 2018-06-28 | Assa Abloy Ab | Rifd tag with a tunable antenna |
| DE102018212594A1 (en) * | 2018-07-27 | 2020-01-30 | Textilma Ag | Dual band transponder and textile label with dual band transponder |
-
2021
- 2021-04-22 WO PCT/IB2021/000262 patent/WO2022224002A1/en active Application Filing
- 2021-04-22 EP EP21729622.7A patent/EP4327243A1/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060243811A1 (en) * | 2005-04-19 | 2006-11-02 | Aruze Corp. | Non-contact IC card system and attaching body for non-contact IC card |
| US20070200705A1 (en) * | 2006-02-24 | 2007-08-30 | Fujitsu Limited | RFID tag |
| US20090273474A1 (en) * | 2006-04-03 | 2009-11-05 | Aruze Corp. | Radio ic tag |
| US20080252460A1 (en) * | 2007-04-13 | 2008-10-16 | Astra Gesellschaft Fur Asset Management Mbh & Co. Kg | Method and device for protection against remote readout of goods identification data |
| US20100187316A1 (en) * | 2007-09-04 | 2010-07-29 | Martin Bohn | Chip module for an rfid system |
| US20180181853A1 (en) * | 2015-06-09 | 2018-06-28 | Assa Abloy Ab | Rifd tag with a tunable antenna |
| DE102018212594A1 (en) * | 2018-07-27 | 2020-01-30 | Textilma Ag | Dual band transponder and textile label with dual band transponder |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4327243A1 (en) | 2024-02-28 |
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