DE102005041095A1 - Lichtemissionsvorrichtung und Lichtemissionselement - Google Patents

Lichtemissionsvorrichtung und Lichtemissionselement Download PDF

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Publication number
DE102005041095A1
DE102005041095A1 DE102005041095A DE102005041095A DE102005041095A1 DE 102005041095 A1 DE102005041095 A1 DE 102005041095A1 DE 102005041095 A DE102005041095 A DE 102005041095A DE 102005041095 A DE102005041095 A DE 102005041095A DE 102005041095 A1 DE102005041095 A1 DE 102005041095A1
Authority
DE
Germany
Prior art keywords
light
light emitting
led element
layer
refractive index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102005041095A
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German (de)
English (en)
Inventor
Yoshinobu Nishikasugai Suehiro
Koji Nishikasugai Tasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Publication of DE102005041095A1 publication Critical patent/DE102005041095A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE102005041095A 2004-08-31 2005-08-30 Lichtemissionsvorrichtung und Lichtemissionselement Withdrawn DE102005041095A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004253447 2004-08-31
JP2004-253447 2004-08-31
JP2005204983A JP2006100787A (ja) 2004-08-31 2005-07-13 発光装置および発光素子
JP2005-204983 2005-07-13

Publications (1)

Publication Number Publication Date
DE102005041095A1 true DE102005041095A1 (de) 2006-05-11

Family

ID=35941797

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005041095A Withdrawn DE102005041095A1 (de) 2004-08-31 2005-08-30 Lichtemissionsvorrichtung und Lichtemissionselement

Country Status (3)

Country Link
US (1) US7453092B2 (https=)
JP (1) JP2006100787A (https=)
DE (1) DE102005041095A1 (https=)

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DE102011012608A1 (de) * 2011-02-28 2012-08-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Lichtauskoppelstrukturen in einem Halbleiterkörper und Licht emittierender Halbleiterkörper
WO2019091830A1 (de) * 2017-11-09 2019-05-16 Osram Opto Semiconductors Gmbh Träger, anordnung mit einem substrat und einem träger und verfahren zum herstellen eines trägers

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Publication number Priority date Publication date Assignee Title
DE102011012608A1 (de) * 2011-02-28 2012-08-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Lichtauskoppelstrukturen in einem Halbleiterkörper und Licht emittierender Halbleiterkörper
WO2019091830A1 (de) * 2017-11-09 2019-05-16 Osram Opto Semiconductors Gmbh Träger, anordnung mit einem substrat und einem träger und verfahren zum herstellen eines trägers
US11810845B2 (en) 2017-11-09 2023-11-07 Osram Oled Gmbh Carrier, assembly comprising a substrate and a carrier, and method for producing a carrier

Also Published As

Publication number Publication date
US7453092B2 (en) 2008-11-18
US20060043402A1 (en) 2006-03-02
JP2006100787A (ja) 2006-04-13

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120301