DE102005012157A1 - Kompakter Drucksensor mit hoher Korrosionsbeständigkeit und hoher Genauigkeit - Google Patents

Kompakter Drucksensor mit hoher Korrosionsbeständigkeit und hoher Genauigkeit Download PDF

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Publication number
DE102005012157A1
DE102005012157A1 DE102005012157A DE102005012157A DE102005012157A1 DE 102005012157 A1 DE102005012157 A1 DE 102005012157A1 DE 102005012157 A DE102005012157 A DE 102005012157A DE 102005012157 A DE102005012157 A DE 102005012157A DE 102005012157 A1 DE102005012157 A1 DE 102005012157A1
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DE
Germany
Prior art keywords
substrate
resin layer
pressure sensor
chip
corrosion resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102005012157A
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English (en)
Other versions
DE102005012157B4 (de
Inventor
Inao Toyoda
Hiroaki Tanaka
Ichiharu Kondo
Makoto Totani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004077130A external-priority patent/JP4218558B2/ja
Priority claimed from JP2004077131A external-priority patent/JP4304482B2/ja
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE102005012157A1 publication Critical patent/DE102005012157A1/de
Application granted granted Critical
Publication of DE102005012157B4 publication Critical patent/DE102005012157B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
    • G01L23/24—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid specially adapted for measuring pressure in inlet or exhaust ducts of internal-combustion engines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

Ein Drucksensor enthält vorwiegend einen Sensorchip, einen Schaltungschip und ein Substrat. Der Sensorchip ist konfiguriert, ein elektrisches Signal entsprechend einem abzutastenden Druck zu erzeugen, und enthält eine Abtastfläche und eine Vielzahl von Kontaktstellen. Der Schaltungschip enthält eine Schaltung, die konfiguriert ist, das elektrische Signal zu verarbeiten, und eine Vielzahl von Kontaktstellen. Das Substrat enthält eine Harzschicht, welche eine Öffnung aufweist, und eine Vielzahl von Leitern innerhalb der Harzschicht. Das Substrat ist sowohl mit dem Sensorchip als auch dem Schaltungschip derart verbunden, dass die Abtastfläche des Sensorchips dem abzutastenden Druck durch die Öffnung der Harzschicht ausgesetzt ist, die Kontaktstellen des Sensorchips und des Schaltungschips mit den Leitern des Substrats elektrisch verbunden sind und alle Kontaktstellen und Leiter hermetisch in der Harzschicht des Substrats eingebettet sind.
DE102005012157.8A 2004-03-17 2005-03-16 Kompakter Drucksensor mit hoher Korrosionsbeständigkeit und hoher Genauigkeit Expired - Fee Related DE102005012157B4 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004077130A JP4218558B2 (ja) 2004-03-17 2004-03-17 圧力センサ
JP2004077131A JP4304482B2 (ja) 2004-03-17 2004-03-17 圧力センサ
JP2004-77130 2004-03-17
JP2004-77131 2004-03-17

Publications (2)

Publication Number Publication Date
DE102005012157A1 true DE102005012157A1 (de) 2005-10-20
DE102005012157B4 DE102005012157B4 (de) 2017-08-24

Family

ID=34914542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005012157.8A Expired - Fee Related DE102005012157B4 (de) 2004-03-17 2005-03-16 Kompakter Drucksensor mit hoher Korrosionsbeständigkeit und hoher Genauigkeit

Country Status (3)

Country Link
US (1) US7168326B2 (de)
DE (1) DE102005012157B4 (de)
FR (1) FR2867854B1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1947439B1 (de) * 2005-11-01 2012-02-08 Hitachi, Ltd. Halbleiter-drucksensor
US7591186B1 (en) * 2008-05-15 2009-09-22 Honeywell International Inc. Conductive seals and method for fabricating the same
US8373551B2 (en) * 2009-07-29 2013-02-12 Rimex Supply Ltd. Tire pressure sensor
US20110224907A1 (en) * 2010-03-11 2011-09-15 Petrospec Engineering Ltd. Mineral insulated cable for downhole sensors
CN101799344B (zh) * 2010-04-21 2014-07-09 无锡莱顿电子有限公司 硅压力传感器的封装结构
US8371176B2 (en) 2011-01-06 2013-02-12 Honeywell International Inc. Media isolated pressure sensor
US8516897B1 (en) 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
JP6445768B2 (ja) 2014-02-25 2018-12-26 株式会社ブリヂストン タイヤ状態検知装置
EP3410896A4 (de) 2016-02-04 2019-09-04 Roho, Inc. Ventilanordnung zum aufblasen eines kissens

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4930353A (en) * 1988-08-07 1990-06-05 Nippondenso Co., Ltd. Semiconductor pressure sensor
JPH02148768A (ja) 1988-11-29 1990-06-07 Masaki Esashi ガラスパッケージ小型圧力センサ
JP2719448B2 (ja) * 1991-01-24 1998-02-25 三菱電機株式会社 半導体圧力検出装置
JP2568952B2 (ja) 1991-08-08 1997-01-08 ティーディーケイ株式会社 立体ハイブリッド回路
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
JPH05203522A (ja) 1992-01-23 1993-08-10 Mitsubishi Electric Corp モールドパッケージ半導体圧力センサおよびその製造方法
JPH07209117A (ja) 1994-01-18 1995-08-11 Omron Corp 半導体センサの封止方法及び半導体センサ
JP3198779B2 (ja) 1994-03-04 2001-08-13 株式会社デンソー 半導体圧力検出器の製造方法
US5463374A (en) * 1994-03-10 1995-10-31 Delco Electronics Corporation Method and apparatus for tire pressure monitoring and for shared keyless entry control
JPH08193899A (ja) 1995-01-17 1996-07-30 Fuji Electric Co Ltd 半導体圧力センサ
JPH10185724A (ja) 1996-12-26 1998-07-14 Matsushita Electric Works Ltd 半導体圧力センサ
DE19720123C2 (de) * 1997-01-17 2001-03-01 Beru Ag Verfahren und Einrichtung zum Übertragen von Fernwirkbefehlen und von Meßdaten an einen oder mehrere Aktuatoren bzw. Überwachungsgeräte in einem Automobil
JPH11160179A (ja) * 1997-11-25 1999-06-18 Mitsubishi Electric Corp 半導体圧力センサ
DE29800955U1 (de) * 1998-01-21 1998-07-23 Grosmann Rainer Dipl Ing Funkabfragbarer Reifendrucksensor
JP2002071491A (ja) * 2000-08-25 2002-03-08 Denso Corp 圧力センサ
JP4320963B2 (ja) * 2000-11-27 2009-08-26 株式会社デンソー 圧力センサ
JP3653260B2 (ja) * 2002-09-03 2005-05-25 三菱電機株式会社 車両用圧力制御装置
DE20218044U1 (de) * 2002-11-20 2003-02-27 Infineon Technologies Ag Drucksensor
JP2004177343A (ja) * 2002-11-28 2004-06-24 Fujikura Ltd 圧力センサ
JP2004309212A (ja) * 2003-04-03 2004-11-04 Denso Corp 圧力センサ及び吸気系圧力測定装置

Also Published As

Publication number Publication date
US20050210993A1 (en) 2005-09-29
FR2867854A1 (fr) 2005-09-23
FR2867854B1 (fr) 2007-03-30
US7168326B2 (en) 2007-01-30
DE102005012157B4 (de) 2017-08-24

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