DE102004052902B4 - A structure for housing a light-emitting element, light-emitting device and lighting device - Google Patents

Abstract

A light emitting element mounting structure comprising: a ceramic base body (42, 51, 61, 71, 81) having an attachment portion (42a, 51a, 61a, 71a, 81a) on its upper surface to have a light emitting element thereon (44, 55, 65, 75, 85); a frame body (43, 52, 62, 72, 82) connected to the outer periphery of the upper surface of the base body (42, 51, 61, 71, 81) so as to have the fixing portion (42a, 51a, 61a, 71a , 81a), the inner peripheral surface of which is formed into a reflection surface (43b, 52b, 62b, 72b, 82b) for reflecting light emitted from the light-emitting element (44, 55, 65, 75, 85) to be fastened to the fastening section; and a wiring conductor, one end of which is formed on the upper surface of the base body (42, 51, 61, 71, 81) so as to be connected to an electrode of the light-emitting element (44, 55, 65, 75, 85 to be attached to the attachment portion) ) is electrically connectable, and its ...

Description

BACKGROUND OF THE INVENTION

1. Field of the invention

The present invention relates to a structure for housing a light-emitting element, a light-emitting device and a lighting device, and more particularly to a structure for housing a light-emitting element, a light-emitting device and a lighting device which transmits light emitted from a light-emitting element and wavelength-converted by fluorescent materials will, let radiate.

2. Description of the Related Art

31 shows a light-emitting device 11 according to a first prior art, wherein light, such as near ultraviolet light or blue light, is composed of a light-emitting element 14 , for example, a light emitting diode (LED), is wavelength-converted by a plurality of fluorescent materials (not shown) excited by the light emitted from the light-emitting element, and generates fluorescence of different colors such as red, blue, green, and yellow, to be emitted from it as white light. In 31 is the light-emitting device 11 mainly from a base body 12 of an insulating material, a frame-like frame body 13 , a translucent component 15 and a light-emitting element 14 , The base body 12 has a mounting portion in the middle of its upper surface 12a on to the light-emitting element 14 to fix. The base body 12 also has a wiring conductor (not shown) formed of a terminal, a metallized wiring line, or the like, around the light emitting device inside and outside in and around the fixing portion 12a to connect electrically conductive around. The on the upper surface of the base body 12 firmly connected frame body 13 has a through hole 13a shaped so that its upper opening is larger than its lower opening. Furthermore, in the frame body 13 the inner peripheral surface to a reflection surface 13b for reflecting light formed from the light-emitting element 14 is emitted. The translucent component 15 becomes inside the frame body 13 charged and contains fluorescent materials by the light emitted by the light-emitting element 14 is emitted to effect a wavelength conversion. The light-emitting element 14 is on the attachment section 12a firmly attached.

32 shows a structure for housing a light-emitting element 25 , such as a light emitting diode (LED) according to a second prior art. In 32 For example, the structure for housing the light-emitting element mainly consists of a base body 21 and a frame-like reflection part 22 , The base body 21 has a mounting portion in the middle of its upper surface 21a on to the light-emitting element 25 to attach, and also has a conductor layer 27 formed of a terminal, a metallized wiring line or the like so as to extend from the attachment portion 21a to the outer surface of the base body 21 extends to electrically connect the bearing structure of the light-emitting element inside and outside. The reflection part 22 is fixed to the upper surface of the base body 21 connected and has a through hole 22a shaped so that its upper opening is larger than its lower opening. Furthermore, in the reflection part 22 the inner peripheral surface to a reflection surface 22b for reflecting light formed from the light-emitting element 25 is emitted.

First, the light-emitting element 25 on the attachment section 21a of the structure for housing the light-emitting element. Then an electrode 26 of the light-emitting element 25 electrically with the conductor layer 27 connected. Last is the translucent component 13 containing fluorescent materials for long wavelength conversion by exciting the light emitting element 25 emitted light, within the reflective part 22 charged to the light-emitting element 25 cover. This is the light-emitting device 20 realized.

In the light-emitting device 20 becomes the light that comes out of the light-emitting element 25 is emitted, such as near ultraviolet light or blue light, of a plurality of fluorescent materials of different colors, such as red, green, blue, and yellow, in the light transmissive member 13 are wavelength converted to be emitted therefrom as white light.

33 shows a light-emitting device 30 according to a third prior art, in which light, such as near ultraviolet light or blue light, is composed of a light-emitting element 14 , for example, a light emitting diode (LED), is wavelength-converted by a plurality of fluorescent materials (not shown) of different colors, such as red, green, blue and yellow, to be emitted therefrom as white light. In 33 is the light-emitting device 30 mainly one base body 31 of an insulating material, a frame-like frame body 32 , a translucent resin 33 and a light-emitting element 35 , The base body 31 has a mounting portion in the middle of its upper surface 31a on to the light-emitting element 35 to install. The base body also has a wiring conductor (not shown) formed of a terminal, a metallized wiring line or the like around the light emitting device inside and outside on and around the fixing portion 31a to connect electrically conductive around. The reflection part 32 is fixed to the upper surface of the base body 31 connected and has a through hole 32a shaped so that its upper opening is larger than its lower opening. Furthermore, in the reflection part 32 the inner peripheral surface to a reflection surface 32b for reflecting light formed from the light-emitting element 35 is emitted. The translucent resin 33 becomes inside the reflection part 32 charged and contains fluorescent materials 34 passing through the light-emitting element 35 emitted light are excited to cause a wavelength conversion. The light-emitting element 35 is firmly on the attachment section 31a appropriate.

The base body 12 . 21 . 31 It is made of ceramics such as an alumina sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body or glass ceramics or a resin material such as epoxy resin. If the base body 12 . 21 . 31 is made of ceramics, a wiring conductor is formed on its upper surface by firing a metal paste of tungsten (W) or molybdenum-manganese (Mo-Mn) at high temperature. In contrast, when the base body 12 . 21 . 31 is made of a resin material, a junction of copper (Cu), an iron (Fe) nickel (Ni) alloy or the like material by molding inside the base body 12 . 21 . 31 fixed arranged.

Furthermore, the frame body 13 and the reflection part 22 . 32 a through hole 13a . 22a . 32a which is formed so that its upper opening is larger than its lower opening, and it also has a reflection surface 13b . 22b . 32b which is formed on its inner peripheral surface for reflecting light. In particular, the frame body 13 and the reflection part 22 . 32 made of a metal material such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, or ceramics such as alumina ceramics or a resin material such as epoxy resin by a cutting process or a molding technique such as die casting or extrusion.

Furthermore, the reflection surface 13b . 22b . 32b of the frame body 13 and the reflection part 22 . 32 by polishing and smoothing the inner peripheral surface of the through hole 13a . 22a . 32a formed or by coating the inner peripheral surface of the through hole 13a . 22a . 32a with a metal such as aluminum by means of vapor deposition or plating, to form the light-emitting element 14 . 25 . 35 to effectively reflect emitted light. The frame body 13 and the reflection part 22 . 32 are by means of a solder, a brazing material such as silver (Ag) -Hartlot or a synthetic resin adhesive so with the upper surface of the base body 12 . 21 . 31 connected to that of the attachment section 12a . 21a . 31a from the inner peripheral surface of the frame body 13 and the reflection part 22 . 32 is surrounded.

In the first and third prior art, first, the wiring conductor that is close to the mounting portion 12a . 31a is arranged with the light-emitting element 14 . 35 by electrical connection means (not shown) and an electrode 36 , such as a lead wire or a metal ball, electrically connected. Then the translucent component 15 and the translucent resin 33 , such as epoxy resin or silicone resin containing fluorescent materials, within the frame body 13 and the reflection part 32 charged by a feeding device such as an output device to the light-emitting element 14 and 35 to cover. Finally, the charged translucent member is thermoset in an oven. Subsequently, the light-emitting device 11 and 30 realized that can take out light with a desired wavelength spectrum by the light emitting element 14 and 35 emitted light is subjected to a wavelength conversion, which is caused by the fluorescent materials.

In the second prior art, the light-emitting element 25 with the conductor layer 27 on the attachment section 21a by a on a lower surface of the light-emitting element 25 attached electrode 26 is arranged, electrically connected. The electrode 26 of the light-emitting element 25 and the conductor layer 27 are by means of a conductive adhesive 28 , such as solder, an Ag paste (Ag particle-containing resin) or the like, bonded together.

The translucent component 23 is made of a translucent resin such as epoxy resin or silicone resin containing fluorescent materials, and is prepared by charging the translucent resin within the reflective part 22 by a feeding device, such as an output device, formed around the light-emitting element 25 and then the charged translucent member is thermoset in an oven. Subsequently, it is possible to take out light having a desired wavelength spectrum by the light emitting element 25 emitted light is subjected to a caused by the fluorescent materials wavelength conversion.

The present light-emitting device 30 is used to activate the light-emitting element 25 is driven with a power voltage supplied from an external electric circuit (not shown), and thereby visible light is emitted from the light-emitting device. The light-emitting device has a wider range of applications, including various types of indicators, an optical sensor, a display device, an optical coupler, a backlight source, and an optical printhead.

In recent years, such light-emitting devices as shown above have become more and more in use as lighting devices. This trend has created a growing demand for a more sophisticated light-emitting device excellent in radiation intensity and heat dissipating property. In addition, as is often the case with a light-emitting device using a light-emitting element, an improvement in the operation time has been expected.

With regard to the prior art, the Japanese Unexamined Patent Publication JP 2003-37298 A in front.

In the light-emitting device 11 according to the first in 31 As shown in the prior art, so that from the light-emitting element 14 emitted light from the light-emitting device 11 can radiate with high efficiency, for example, the upper surface of the base body made of ceramic 12 smoothed by a polishing process, or the upper surface of the base body 12 is coated with a film of a metal such as Al or Au to reflect the reflectivity of the upper surface of the base body 12 to improve. In the light-emitting device 11 in which the light emitting element 14 emitted light through in the translucent member 15 however, becomes fluorescent from the light-emitting element 14 emitted light through the translucent component 15 transferred and then from the upper surface of the base body 12 mirror reflected. In this case, fluorescent materials other than the fluorescent materials in a mirror-reflection direction can not easily be excited. That is, the wavelength conversion is mainly effected by a part of the fluorescent materials, resulting in a poor wavelength conversion effect. This causes the problem that the optical performance, brightness and color reproduction deteriorate.

Furthermore, if the base body 12 made of ceramic, light through the substrate 12 absorbs, and thus the reflectivity of the upper surface of the base body tends 12 to become weaker. As a result, the light emitting device can not provide the desired optical performance, as well as the recently required satisfactory initial light efficiency. Furthermore, if the upper surface of the base body 12 coated with a metal film to absorb light on the substrate 12 to prevent the metal film from being formed by plating or vapor deposition, resulting in an undesirable increase in the steps in the manufacturing process and the manufacturing cost.

On the other hand, if the base body 12 is made of a resin material such as epoxy resin or liquid crystal polymer, heat that is emitted from the light-emitting element 14 emanating, not very effective through the base body 12 to disperse outside. Thus, the remaining heat leads to a considerable deterioration of the light emitting efficiency of the light-emitting element 14 , As a result, the optical performance of the light-emitting device decreases 11 from.

In the translucent component 15 which is the light-emitting element 14 covering and fluorescent materials for performing a wavelength conversion with that from the light-emitting element 14 Further, when the content of the fluorescent materials for enhancing the wavelength conversion efficiency is increased, the light irradiated from the light-emitting device will be susceptible to interference by the fluorescent materials. This makes it impossible to improve the optical performance. In contrast, when the content of fluorescent materials is reduced, the wavelength conversion efficiency is lowered, and thus no light having a desired wavelength can be obtained. As a result, amplification of the optical power becomes impossible.

In the light-emitting device 20 according to the in 32 However, as shown in the second prior art, at the time when the light-emitting element 25 with the conductor layer 27 of the attachment section 21a firmly connected, for example, the conductive adhesive used 28 from the conductor layer 27 out and thus cause a change in thickness. In this case, the light-emitting element 25 be connected in an inclined state. When the light-emitting element 25 at the attachment portion 21a is mounted in a tilted state, it becomes difficult, that from the light-emitting element 25 emitted light from the reflection part 22 to be reflected at a desired beam angle so that it radiates satisfactorily. This causes the problem that the radiation intensity of the light emitted from the light-emitting device becomes lower.

Further, it makes the change in the thickness of the conductive adhesive 28 which is used to the light-emitting element 25 on the conductor layer 27 firmly attach, difficult, out of the light-emitting element 25 outgoing heat through the conductive adhesive 28 and the base body 21 to disperse the outside with great efficiency. As a result, the light-emitting element undergoes 25 a temperature rise, and thereby the radiation intensity of the light emitting element tends 25 to become weaker. This causes the problem that the radiation intensity of the light emitted from the light-emitting device can not be stably maintained.

Further, the conductive adhesive flows 28 that is used to the conductor layer 27 and the light-emitting element 25 from each other, from the outer periphery of the light-emitting element 25 out and covers the upper surface of the base body 21 , In this case, there is a probability that the light emitting element 25 and the fluorescent materials emitting light from the flowing conductive adhesive 28 is absorbed. This causes the problem that the radiation intensity, brightness and color reproduction of the light emitted from the light-emitting device deteriorate.

As is the conductive adhesive 28 for connecting the conductor layer 27 with the light-emitting element 25 in front of the area between the attachment portion 21a and the light-emitting element 25 exposed, it follows that from the light-emitting element 25 and the fluorescent materials emitted light on the conductive adhesive 28 is applied. That on the conductive adhesive 28 Applied light is believed to be partly from the conductive adhesive 28 absorbed. This causes the problem that the radiation intensity, brightness and color reproduction of the light emitted from the light-emitting device deteriorate.

If that from the light-emitting element 25 emitted light is ultraviolet light, undergoes the conductive adhesive 28 Further, a deterioration in quality when the emitted light on the conductive adhesive 28 shine. This causes the bond strength between the conductor layer 27 and the light-emitting element 25 decreases, resulting in difficulty in maintaining the permanent attachment between the conductor layer 27 and the light-emitting element 25 for a longer period of time. As a result, a problem such as a break between the electrode is disadvantageously generated 26 of the light-emitting element 25 and the conductor layer 27 , This makes it difficult to achieve a longer service life in the light-emitting device.

In addition, in recent years, a further increase in radiation intensity has been demanded of light-emitting devices. In the light-emitting device 30 however, according to the third prior art, when the amperage of one enters the light-emitting element 35 is increased input current for amplifying the radiation light intensity, the light emission intensity of the light-emitting element 35 is not improved in proportion to the amperage of the current and therefore tends to fluctuate. This makes it impossible to obtain a stable radiation intensity.

In detail, when the amperage of one in the light-emitting element 35 is increased input current for amplifying the radiation light intensity, the junction temperature of the light-emitting element 35 increases, with the result that the light emission efficiency remarkably deteriorates. This causes the problem that the radiation intensity, which is proportional to an input current, can not be obtained. In addition, there is a problem that a stable radiation intensity can not be obtained due to variations in the light emission wavelength due to heat.

In the translucent resin 33 which is the light-emitting element 35 covering and the fluorescent materials 34 for performing a wavelength conversion with that from the light-emitting element 35 contains emitted light, there is also a probability that the light passing through the fluorescent materials 34 wavelength is converted by the other fluorescent materials is disturbed when the content of fluorescent materials 34 is increased to improve the wavelength conversion efficiency. This makes it impossible to enhance the radiation intensity.

In contrast, when the content of fluorescent material 34 is lowered, the wavelength conversion efficiency decreases, and thus no light of a desired wavelength can be obtained. As a result, the enhancement of the radiation intensity is made impossible.

Further, heat is emitted from the light-emitting element 35 goes out, easily through the base body 31 to the reflection part 32 transfer. As a result, the reflection part experiences 32 thermal expansion and, as a result, due to the differential thermal expansion between the reflection part 32 and the base body 31 deformed. This causes the problems that the radiation angle fluctuates and the radiation intensity is reduced.

The US Pat. No. 6,184,544 B1 describes a semiconductor light emitting device having a light reflecting current distribution layer. An LED element is adhered to a wiring pattern on the surface of a first substrate.

The GB 1 472 204 describes ceramic materials. The ceramic bodies considered there can have particle sizes between 1 and 10 μm.

The DE 103 49 038 A1 describes a light source with an LED and a luminescence conversion body and a method for producing the luminescence conversion body. An LED emits primary radiation. A luminescence conversion body has at least one phosphor for converting the primary radiation into a secondary radiation. The luminescence conversion body is a polycrystalline ceramic body.

SUMMARY OF THE INVENTION

The object of the invention is to provide a light-emitting device having an improved light reflectivity.

This object is achieved with the features of the independent claims. The dependent claims are directed to preferred embodiments of the invention.

The invention provides a structure for housing a light-emitting element, comprising:
a base body of ceramics having on its upper surface a fixing portion for fixing thereon a light-emitting element;
a frame body connected to the outer periphery of the upper surface of the base body so as to surround the fixing portion, the inner peripheral surface of which is formed into a reflection surface for reflecting light emitted from the light-emitting element; and
a wiring conductor whose one end is formed on the upper surface of the base body so as to be electrically connected to an electrode of the light-emitting element and the other end of which is guided outwardly to a side or lower surface of the base body;
wherein the base body is designed such that crystal grains contained in the ceramic have an average particle diameter range of 1 to 5 μm.

The invention provides a light emitting device comprising:
the structure described above; and
a light-emitting element mounted on the mounting portion and electrically connected to the wiring conductor.

In the invention, the light-emitting device further comprises a light transmitting member disposed in the frame body to cover the light-emitting element containing fluorescent materials for performing wavelength conversion with the light emitted from the light-emitting element.

In the invention, a distance between an upper surface of the transparent member and an active layer of the light-emitting element is maintained in a range of 0.1 to 0.8 mm.

In the invention, one end of the wiring conductor is designed as a conductor layer to which the light-emitting element is electrically connected by a conductive adhesive, and a bulge is formed of an insulating material around the conductor layer.

In the invention, the conductor layer is configured so that the conductor layer is within an outer periphery of the light-emitting element.

In the invention, the bulge is formed so that its side surfaces gradually extend outwardly inclined with increasing proximity to the base body.

In the invention, one end of the wiring conductor is designed as a conductor layer to which the light-emitting element is electrically connected by a conductive adhesive, and a bulge is formed in a part of an upper surface of the conductor layer, which part is inside the outer periphery of the light-emitting element.

In the invention, the fixing portion protrudes from the upper surface of the base body.

In the invention, the protruding attachment portion is formed so that its side surfaces gradually extend outwardly inclined with increasing proximity to the base body.

In the invention, the fixing portion protrudes from the upper surface of the base body, an active layer of the light-emitting element has a higher level than a lower end of the reflecting surface, and the light transmitting member is arranged so that a distance between its upper surface and the light-emitting section is kept in a range of 0.1 to 0.5 mm.

In the invention, the translucent member is designed so that its center portion in the arithmetical average of the surface roughness is larger than its outer peripheral portion.

In the invention, the fixing portion protrudes from the upper surface of the base body, and on an upper surface of the fixing portion, there is formed a conductor layer made of the one end of the wiring conductor and to which the light-emitting element is electrically connected by a conductive adhesive Bulge is formed of an insulating material around the conductor layer.

In the invention, the conductor layer is configured so that the conductor layer is within an outer periphery of the light-emitting element.

In the invention, the bulge is formed so that its side surfaces gradually extend outwardly inclined with increasing proximity to the base body.

The invention provides a light emitting device comprising:
a base body which is plate-shaped and made of ceramics;
a light emitting element and
a reflection member connected to an upper surface of the base body having a convex attachment portion in the center of its upper major surface to mount the light-emitting element thereon, and further having on an outer periphery of its upper major surface a side wall portion shaped that it surrounds the attachment portion, wherein an inner peripheral surface of this side wall portion is formed in a reflection surface for reflecting light emitted from the light-emitting element,
wherein the base body is formed so that crystal grains contained in the ceramic are in an average particle diameter range of 1 to 5 μm.

In the invention, the light-emitting device further comprises a light transmitting member disposed inside the side wall portion to cover the light emitting element containing fluorescent materials to perform wavelength conversion with the light emitted from the light emitting element.

In the invention, the translucent member is arranged so that a distance between its upper surface and the light-emitting section is kept within a range of 0.1 to 0.5 mm.

In the invention, the fixing portion is formed in a convex shape.

In the invention, the base body has a wiring conductor formed so as to extend from its upper surface to the outer surface, the reflection part has a through hole around the fixing portion, which is completely bored through from the upper main surface to a lower main surface thereof to be below the optical path line, and an electrode of the light emitting element and the wiring conductor formed on the upper surface of the base body are electrically connected to each other by means of a wire inserted through the through hole.

In the invention, the through hole is filled with an insulating paste containing insulating light-reflecting particles.

The invention provides a lighting device constructed by setting up the above-described light-emitting device in a predetermined arrangement.

According to the invention, the base body is designed so that crystal grains contained in the ceramic are in an average particle diameter range of 1 to 5 μm. Therefore, the density of the crystal grains is so large that the inter-grain boundary and gaps are extremely small, and the proportion of crystal grains present in the surface portion of the base body is increased. In the present construction, the light emitted from the light-emitting element can thereby be prevented from finding its way into the base body, and thereby the reflectance is improved. As a result, the optical performance of the light-emitting device can be increased.

Further, since a proper amount of bumps are formed on the surface of the base body due to the high-density crystal body existing in the surface portion of the base body, it is possible to cause a moderate diffuse reflection of the light emitted from the light-emitting element, thereby reducing the number of fluorescent materials. which are subjected to light irradiation. As a result, the wavelength conversion efficiency can be increased, therefore, the optical performance, brightness, and color reproduction can be improved.

Further, since the base body is composed of high-density crystal grains, it follows that the thermal conductivity of the base body is improved, and thus, outgoing heat from the light-emitting element can be diffused outward through the base body with great efficiency. Thereby, it is possible to effectively prevent a heat-induced deterioration in the light-emitting efficiency of the light-emitting element, thereby a reduction in the optical performance of the light-emitting device can be avoided.

According to the invention, the light emitting device has the structure for housing the light emitting element of the invention and the light emitting element mounted on the fixing portion and electrically connected to the wiring conductor. Therefore, the light emitted from the light-emitting element can be efficiently reflected, and the number of fluorescent materials subjected to excitation is increased, thereby lighting characteristics such as optical performance, brightness, and color reproduction can be improved.

According to the invention, the distance between the upper surface of the transparent member and the light-emitting section of the light-emitting element is preferably maintained in a range of 0.1 to 0.8 mm. Therefore, the light emitted from the light-emitting element can be wavelength-converted with high efficiency by the fluorescent materials contained in the light-transmitting member, and the wavelength-converted light can be efficiently emitted from the light-transmissive member without being affected by noises caused by the fluorescent materials. Thus, excellent lighting properties such as brightness and color reproduction can be achieved.

According to the invention, the one end of the wiring conductor is designed as a conductor layer to which the light-emitting element is electrically connected by the conductive adhesive. Around the conductor layer, a bulge is formed of an insulating material. Therefore, with the bulge, the conductive adhesive can be prevented from spreading outward from the conductor layer, thereby giving the conductive adhesive a uniform thickness. Accordingly, the light-emitting element can be mounted horizontally on the conductor layer. As a result, light is emitted from the light-emitting element at a desired angle of reflection and the emitted light is then reflected by the frame body at a desired beam angle to be properly radiated, thereby making it possible to irradiate the radiation intensity of the light emitted from the light-emitting device increase.

Further, since the light-emitting element can be horizontally mounted on the conductor layer, it follows that the heat emanating from the light-emitting element can be diffused outward by the conductive adhesive and the base body with high efficiency. As a result, the temperature of the light-emitting element can be stably maintained, thereby the radiation intensity of the light emitted from the light-emitting element can be maintained with high stability.

Further, the light emitted from the light-emitting element can be effectively prevented from being applied to the conductive adhesive by the bulge. Therefore, it never happens that the light emitted from the light-emitting device is absorbed by the conductive adhesive, and thus an undesirable reduction in radiation intensity, brightness, and color reproduction can be effectively avoided. Thus, there is provided the light-emitting device which offers high radiation intensity and excellent light emission characteristics.

According to the invention, the conductor layer is configured to be within the outer periphery of the light-emitting element. Therefore, the conductive adhesive for bonding the conductor layer to the light-emitting element can be prevented from being exposed in front of the region between the conductor layer and the light-emitting element, preventing the light emitted from the light-emitting element from being very effectively applied to the conductive adhesive. As a result, it never happens that the light emitted from the light-emitting element is absorbed by the conductive adhesive or reflected therefrom as light showing a low radiation intensity. Accordingly, the radiation intensity of the light emitted from the light-emitting device can be kept high, and excellent brightness and color reproduction can be achieved.

Another advantage is that even if the light emitted from the light-emitting element is ultraviolet light, the conductive adhesive does not deteriorate. Thus, the bonding strength between the conductor layer and the light-emitting element can remain sufficiently high, thereby the permanent attachment between the conductor layer and the light-emitting element can be maintained for a longer period of time. As a result, the electrical connection between the electrode of the light-emitting element and the conductor layer can be ensured for a longer period of time. Accordingly, the light-emitting device can offer a longer service life.

According to the invention, the bulge is shaped so that its side surfaces gradually extend outwardly inclined with increasing proximity to the base body. Therefore, it is easy to suck air, which is present in a corner portion between the side surfaces of the bulge and the upper surface of the base body, and to prevent the air from remaining in the corner portion. Accordingly, it can be effectively prevented that a bubble is generated in the conductive adhesive and the translucent member, and a flaking or a crack is caused by the expansion of air in the bladder due to temperature change or the like. In addition, it is possible to reflect light on the outer inclined side surfaces of the bulge well upwards and to improve the light emission efficiency.

According to the invention, one end of the wiring conductor is designed as a conductor layer to which the light-emitting element is electrically connected by a conductive adhesive. The bulge is formed in the part of an upper surface of the conductor layer which is part inside the outer periphery of the light-emitting element. Therefore, with this bulge, the light-emitting element can be lifted to a higher level than the conductor layer, thereby inevitably creating a gap between the lower surface of the light-emitting element and the upper surface of the conductor layer. Therefore, it never happens that the weight of the light-emitting element presses the conductive adhesive out of the conductor layer, and thus the conductive adhesive is applied to the conductor layer in a uniform thickness. Accordingly, the light-emitting element can be mounted horizontally on the conductor layer. As a result, light is emitted from the light-emitting element at a desired angle of reflection and the emitted light is then reflected by the frame body at a desired beam angle so that it radiates correctly, thereby making it possible to increase the radiation intensity of the light emitted from the light-emitting device ,

Since the conductive adhesive is applied to the conductor layer in a uniform thickness, it is possible to mount the light-emitting element horizontally on the conductor layer. Thus, the heat emitted from the light-emitting element can be dissipated by the conductive adhesive and the base body to the outside with high efficiency. As a result, the temperature of the light-emitting element can be stably maintained, thereby the radiation intensity of the light emitted from the light-emitting element can be stably maintained high.

Further, since the conductive adhesive is effectively prevented from flowing out of the outer periphery of the light-emitting element, it remains under the light-emitting element. Thereby, the light emitted from the light-emitting element can be prevented from being absorbed by conductive adhesive flowing outward from the outer periphery of the light-emitting element. As a result, there is provided the light-emitting device which offers high radiation intensity and excellent optical characteristics such as brightness and color reproduction.

According to the invention, since the fixing portion is formed to protrude, it follows that insulation is inevitably provided between the fixing portion and the lower end of the frame body. Thereby, the lower end of the frame body can be brought close to the attachment portion, seen in the plane, and thereby the light emitted from the light-emitting element can be more satisfactorily reflected by the reflecting surface of the frame body.

According to the invention, the protruding attachment portion is shaped so that its side surfaces gradually extend outwardly inclined with increasing proximity to the base body. Thereby, it is possible to enhance the diffusibility of heat emanating from the light-emitting element and to effectively reflect light upward from the side surface of the protruding fixing portion. As a result, the light emitting efficiency of the light emitting element as well as the wavelength conversion efficiency of the fluorescent materials can be increased, and further, the light emitted from the light emitting element or the fluorescent materials can be efficiently reflected upward. As a result, a light output with high radiation intensity can be achieved for a longer period of time.

According to the invention, the light emitting section of the light emitting element has a higher level than the lower end of the reflecting surface, and the light transmitting member is arranged so that the distance between its upper surface and the light emitting section is in a range of 0.1 to 0.5 mm is held. Thus, of the light rays emitted from the light-emitting element, the one directly emitted from the upper opening of the frame body without being reflected by the reflection surface can have an extremely high intensity. That is, the light emitted from the light-emitting element can be wavelength-converted with high efficiency by the fluorescent materials contained in the part of the transparent member of predetermined thickness disposed above the light-emitting section of the light-emitting element, and then the wavelength-converted light can can be directly leaked out of the translucent member without being affected by a disturbance caused by the fluorescent materials. As a result, the light-emitting device can provide increased radiation intensity and excellent optical characteristics such as axial luminance, brightness, and color reproduction.

Even if heat emanating from the light-emitting element is transmitted to the base body, since the fixing portion is formed so as to protrude, a distance between the fixing portion and the frame body, which is as long as possible, and the contact area between the protruding part of the base body and the translucent member are increased, whereby the heat dissipation property is improved. Thus, the heat transfer to the frame body can be effectively prevented. As a result, the frame body can be effectively protected from deformation due to the differential thermal expansion between the frame body and the base body.

According to the invention, the translucent member is preferably designed so that its center portion in the arithmetical average of the surface roughness is larger than its outer peripheral portion. This helps to reduce the difference in radiation intensity between the light emerging from the central portion and the light exiting the outer peripheral portion in the transparent member. In particular, the light emitted from the light-emitting element and then radiated directly from the central portion of the surface of the transparent member without being reflected by the frame body or the like has a high intensity. This light is properly dispersed by a rough surface in the central portion of the surface of the transparent member, so that its intensity may be slightly reduced. In this way, the intensity of the light emitted from the central portion of the surface of the transparent member can be approximated to a low intensity of the light emitted from the outer peripheral portion of the surface of the transparent member after being reflected by the reflecting member become. Thereby, the difference in the radiation intensity between the central portion and the outer peripheral portion in the light transmissive member can be reduced. As a result, the light-emitting device can emit uniform light in a wider range. Furthermore, it is possible to make a bright shine, d. H. a phenomenon in which the human eye hurts, which results from the concentration of the radiation intensity in a certain part of the light-emitting surface, to avoid. Thus, adverse effects on the human eye can be minimized.

According to the invention, the fixing portion protrudes from the upper surface of the base body, and on a top surface of the fixing portion, there is formed a conductor layer made of the one end of the wiring conductor and to which the light-emitting element is electrically connected by a conductive adhesive Bulging of an insulating material is formed around the conductor layer. Therefore, the light that has been emitted laterally or obliquely downward from the side of the light-emitting element can be satisfactorily reflected by the reflection surface of the frame body. Thus, the light from the frame body can be reflected at a desired irradiation angle so that it radiates satisfactorily without being absorbed by the connecting portion between the frame body and the base body or the surface of the base body. As a result, the radiation intensity of the light emitted from the light-emitting device can be stably maintained high.

Since the fixing portion is formed so as to protrude, it follows that insulation between the fixing portion and the lower end of the reflecting portion is inevitably provided. This makes it possible to bring the lower end of the frame body close to the attachment portion, seen in the plane, and thereby to more satisfactorily reflect the light emitted from the light-emitting element from the reflecting surface of the frame body.

Furthermore, with the bulge of insulating material can be prevented the conductive adhesive spreads out of the conductor layer, therefore, the conductive adhesive has a uniform thickness. Accordingly, the light-emitting element can be mounted horizontally on the conductor layer. As a result, light is emitted from the light-emitting element at a desired angle of reflection, and the emitted light is then reflected by the frame body at a desired beam angle so as to radiate correctly, thereby making it possible to irradiate the radiation intensity of the light emitted from the light-emitting device increase.

Further, since the light-emitting element can be horizontally mounted on the conductor layer, it follows that the heat emitted from the light-emitting element can be dissipated by the conductive adhesive and the base body to the outside with high efficiency. As a result, the temperature of the light-emitting element can be stably preserved; therefore, the radiation intensity of the light emitted from the light-emitting element can be stably maintained high.

Furthermore, the light emitted from the light-emitting element can be effectively prevented from being applied to the conductive adhesive by the bulge. Therefore, it never happens that the light emitted from the light-emitting device is absorbed by the conductive adhesive, and thus an undesirable reduction in radiation intensity, brightness, and color reproduction can be effectively avoided. Thus, there is provided the light-emitting device which offers high radiation intensity and excellent light emission characteristics.

According to the invention, the conductor layer lies within the outer periphery of the light-emitting element. In this way, the adhesive for bonding the conductor layer to the light-emitting element can be prevented from being exposed in front of the region between the conductor layer and the light-emitting element. Therefore, the light emitted from the light-emitting element can be effectively prevented from being applied to the conductive adhesive. As a result, it never happens that the light emitted from the light-emitting element is absorbed by the conductive adhesive or reflected therefrom as light showing a low radiation intensity. Accordingly, the radiation intensity of the light emitted from the light-emitting device can be high and excellent brightness and color reproduction can be achieved.

Another advantage is that even if the light emitted from the light-emitting element is ultraviolet light, the conductive adhesive does not undergo quality deterioration. Thus, the strength of the connection between the conductor layer and the light-emitting element can be maintained sufficiently high; therefore, the permanent attachment between the conductor layer and the light-emitting element can be maintained for a longer period of time. As a result, the electrical connection between the electrode of the light-emitting element and the conductor layer can be ensured for a longer period of time. Accordingly, the light-emitting device offers a longer service life.

According to the invention, the bulge is shaped so that its side surfaces gradually extend obliquely outwards with increasing proximity to the base body. Thereby, it is easy to peel off air present in a corner portion between the side surfaces of the bulge and the upper surface of the fixing portion, and the air is prevented from remaining in the corner portion. Accordingly, it can be effectively prevented that a bubble is generated in the conductive adhesive and the translucent member, and a peeling or a crack is caused by air expansion in the bladder due to a temperature change or the like. In addition, it is possible to well reflect light on the outer oblique side surfaces of the bulge and to improve the light emission efficiency.

According to the invention, the light emitting device comprises: a base body which is plate-shaped and made of ceramics; the light-emitting element; the reflection member connected to the upper surface of the base body having, at the center of its upper major surface, the attachment portion for mounting the light emitting element thereon, and further comprising the side wall portion formed on the outer periphery of its upper major surface surrounding the attachment portion, the inner peripheral surface of this side wall portion being shaped to the reflection surface for reflecting light emitted from the light-emitting element; and the translucent member disposed within the sidewall portion to cover the light-emitting element containing fluorescent materials to perform wavelength conversion with the light emitted from the light-emitting element. The translucent member is arranged so that a distance between its upper surface and the light-emitting section is kept in a range of 0.1 to 0.5 mm and the base body. Thus, of the light beams emitted from the light-emitting element, the one radiating directly upward from the light-emitting element is left without being reflected by the reflection surface to have an extremely high intensity. That is, the light emitted from the light-emitting element can be wavelength-converted with high efficiency by the fluorescent materials contained in that part of the light-transmissive device of predetermined thickness located above the light-emitting section of the light-emitting element, and then the wavelength-converted Light is allowed to escape directly from the translucent member without being affected by a disturbance caused by the fluorescent materials. As a result, the light-emitting device can provide increased radiation intensity and excellent optical properties such as axial luminance, brightness, and color reproduction.

Furthermore, heat emanating from the light-emitting element is easily transmitted from the attachment portion to the side wall portion integrally formed. In particular, when the reflection member is made of metal, heat can be transferred to the sidewall portion more quickly and then satisfactorily scattered from the outside of the sidewall portion to the outside. Thus, the reflection member can be effectively prevented from deformation due to the difference in thermal expansion between the reflection member and the base body; As a result, the desired radiation light properties can be preserved for a longer period of time.

Further, the lower end of the reflection surface is located at or below the optical path line that the light-emitting section located at the end of the light-emitting element and the corner between the upper surface and the side surface of the fixing portion. Thereby, direct light emitted laterally or downwardly from the light-emitting element can be effectively reflected by the reflection surface, thereby attaining an extremely high radiation light intensity.

According to the invention, the base body has a wiring conductor which is formed to extend from its upper surface to the outer surface. The reflection member has a through hole around the attachment portion, which is completely drilled through from its upper major surface to the lower major surface to be below the optical path. An electrode of the light-emitting element and the wiring conductor formed on the upper surface of the base body are electrically connected to each other by means of a wire inserted through the through-hole. In this construction, direct light emitted from the light-emitting element is reflected by the reflecting surface above the through-hole drilled in the reflection part for inserting the wire. Thus, it can be effectively prevented that the direct light is guided into the transmitted light and absorbed therein, whereby the radiation light intensity is increased.

However, the light-emitting element is connected at its entire lower surface to the attachment portion of the reflection member. Thereby, it is possible to satisfactorily transmit the outgoing heat from the light-emitting element to the reflection part, thereby improving the heat-dissipating property.

Furthermore, it can be effectively prevented that light through the through hole for inserting the wire, which through-hole is formed in the reflection member, is leaked and absorbed into the base body by setting the average particle diameter of the crystal grains contained in the ceramic within a range of 1 to 5 μm is set to improve the reflectivity of the base body.

According to the invention, the through-hole is filled with an insulating paste containing insulating, light-reflecting particles. In this way, even if the light emitted from the light-emitting element or the fluorescent materials is directed into the through-hole, the light can be efficiently reflected upward from the light-reflecting particles. Therefore, the light-emitting device is capable of providing satisfactory optical characteristics such as high radiation intensity, axial luminance, brightness, and color reproduction.

According to the invention, the lighting device according to the invention is constructed by arranging the light-emitting device of the invention in a predetermined arrangement. In this construction, the light emission is effected by utilizing the recombination of electrons in the light-emitting element made of a semiconductor. Thus, there is provided a compact lighting apparatus which is advantageous in terms of energy saving and long service life over a conventional lighting apparatus for effecting light emission by electric discharge. As a result, a fluctuation in the central wavelength of the light emitted from the light-emitting element can be suppressed; Therefore, the illumination device succeeds in emitting light with stable intensity of radiation intensity and stable angle (luminous intensity distribution) over a longer period of time and to avoid unequal color distribution and unbalanced illumination distribution on a surface to be irradiated.

It is by constructing the light emitting device of the invention as a light source in a predetermined arrangement, followed by arranging an optical component around the light emitting device optically designed in a given configuration such as a reflection device, an optical lens, or a light scattering lens Further, it is possible to realize a lighting device capable of emitting light with a given luminance distribution.

BRIEF DESCRIPTION OF THE DRAWINGS

Other and further objects, features and advantages of the invention will become more apparent from the following detailed description with reference to the drawings.

1 Fig. 10 is a sectional view showing a light-emitting device according to the first embodiment of the invention;

2 Fig. 10 is a sectional view showing a light-emitting device according to a second embodiment of the invention;

3A FIG. 10 is an enlarged plan view showing an example of a conductor layer and a bulge arranged in the light-emitting device of the invention, and FIG 3B Fig. 10 is an enlarged plan view showing another example of a conductor layer and a bulge arranged in the light-emitting device of the invention;

4 Fig. 10 is a sectional view showing a light-emitting device according to a third embodiment of the invention;

5 Fig. 10 is a sectional view showing a light-emitting device according to a fourth embodiment of the invention;

6 Fig. 10 is a sectional view showing a light-emitting device according to a fifth embodiment of the invention;

7 Fig. 10 is a sectional view showing a light-emitting device according to a sixth embodiment of the invention;

8th Fig. 10 is a sectional view for explaining a distance between an upper surface of a transparent member and an active layer disposed in the light-emitting device of the invention;

9 Fig. 12 is a sectional view for explaining a distance between an upper surface of the transparent member and an active layer disposed in the light-emitting device of the invention;

10 Fig. 10 is a sectional view showing a light-emitting device according to a seventh embodiment of the invention;

11 Fig. 10 is a sectional view showing a light-emitting device according to an eighth embodiment of the invention;

12A FIG. 10 is an enlarged plan view showing an example of a conductor layer and a bulge arranged in the light-emitting device of the invention, and FIG 12B Fig. 10 is an enlarged plan view showing another example of a conductor layer and a bulge arranged in the light-emitting device of the invention;

13A FIG. 10 is an enlarged plan view showing an example of a conductor layer and a bulge arranged in the light-emitting device of the invention, and FIG 13B Fig. 10 is an enlarged plan view showing another example of a conductor layer and a bulge arranged in the light-emitting device of the invention;

14 Fig. 10 is a sectional view showing a light-emitting device according to a ninth embodiment of the invention;

15A Fig. 15 is an enlarged perspective view showing an example of a conductor layer and a bulge arranged in the light-emitting device of the invention, and Figs 15B Fig. 10 is an enlarged perspective view showing another example of a conductor layer and a bulge arranged in the light-emitting device of the invention;

16A FIG. 10 is an enlarged plan view showing an example of a conductor layer and a bulge arranged in the light-emitting device according to the invention; and FIG 16B Fig. 10 is an enlarged plan view showing another example of a conductor layer and a bulge arranged in the light-emitting device according to the invention;

17 Fig. 10 is a sectional view showing a light-emitting device according to a tenth embodiment of the invention;

18 Fig. 10 is a sectional view showing a light-emitting device according to an eleventh embodiment of the invention;

19 Fig. 10 is a sectional view showing a light-emitting device according to a twelfth embodiment of the invention;

20 Fig. 10 is a sectional view showing a light-emitting device according to a thirteenth embodiment of the invention;

21 Fig. 12 is a sectional view for explaining a distance between an upper surface of the transparent member and an active layer disposed in the light-emitting device of the invention;

22 Fig. 10 is a sectional view for explaining a distance between an upper surface of a transparent member and an active layer disposed in the light-emitting device of the invention;

23 Fig. 10 is a plan view showing a lighting apparatus according to a fourteenth embodiment of the invention;

24 is a sectional view of an in 23 shown lighting device;

25 Fig. 10 is a plan view showing a lighting apparatus according to a fifteenth embodiment of the invention;

26 is a sectional view of an in 25 shown lighting device;

27 Fig. 12 is a view showing a result of intensity measurement of the light-emitting device according to the first embodiment of the invention;

28 Fig. 12 is a graph showing the relationship between the light emission intensity and a distance from the upper surface of a transparent member and an active layer disposed in the light-emitting device according to the sixth embodiment of the invention;

29 FIG. 11 is a sectional view showing a variety of optical path line patterns as shown in FIG 19 to be seen shown light-emitting device;

30 Fig. 12 is a graph showing the relationship between a length L of the fixing portion, a distance X between an upper surface of the transparent member and an active layer, and an axial luminance as seen in the light-emitting device of the invention.

31 Fig. 10 is a sectional view of a light-emitting device according to the first prior art;

32 Fig. 10 is a sectional view of a structure for housing a light-emitting element according to the second prior art; and

33 Fig. 10 is a sectional view of a third prior art light-emitting device.

DETAILED DESCRIPTION

Now, preferred embodiments of the invention will be described below with reference to the drawings.

Hereinafter, a detailed description will be given of a structure for housing a light-emitting element (hereinafter simply referred to as "structure") and a light-emitting device according to the invention. 1 Fig. 10 is a sectional view showing a light-emitting device 41 according to a first embodiment of the invention. The light-emitting device 41 consists mainly of a base body 42 , a frame body 43 a light-emitting element 44 and a translucent member 45 containing fluorescent materials (not shown). Thus, the light-emitting device 41 from the light-emitting element 44 emit emitted light to the outside.

The structure embodying the invention comprises the base body 42 , the frame body 43 , a wiring conductor (not shown), and the light transmitting member 45 on. The base body 42 It is made of ceramic and has a fixing section on its upper surface 42a on to the light-emitting element 44 to install. The frame body 43 is with the outer periphery of the upper surface of the base body 42 connected to the attachment section 42a to surround. Furthermore, the inner peripheral surface of the frame body 43 to a reflection surface 43a for reflecting from the light-emitting element 44 shaped light emitted. The one end of the wiring conductor is on the upper surface of the base body 42 for electrical connection to the electrode of the light-emitting element 44 formed and its other end leads to a side surface or a lower surface of the base body 42 out. The translucent component 45 is in the frame body 43 arranged to the light-emitting element 44 and includes fluorescent materials for performing wavelength conversion with that from the light-emitting element 44 emitted light.

The base body 42 It is made of an insulating ceramic material such as an alumina sintered body, an aluminum nitride sintered body, a mullite sintered body or a glass ceramic. The base body 42 has on its upper surface the attachment portion 42a on to the light-emitting element 44 so as to be used as a support member for supporting the light-emitting element 44 can serve.

Furthermore, are in the base body 42 the ceramic crystal grains in an average particle diameter range of 1 to 5 μm. That is, the density of the crystal grains is so high that the proportion of the crystal grains present in the surface portion of the base body 42 are present, is increased. Thus, light can travel the path between the crystal grains out into the base body 42 can be effectively turned off, and the reflectivity of the upper surface of the base body 42 is improved accordingly. Therefore, the optical performance of the light-emitting device 41 be strengthened.

Further, the arithmetic average roughness of the upper surface of the base body 42 of such an appropriate extent that the light-emitting element 44 emitted light from the upper surface of the base body 42 is reflected in every direction. As a result, the number of fluorescent materials that emit light after passing through the inner peripheral surface of the frame body becomes 43 reflected light were raised, increased. Therefore, the optical performance, brightness and color reproduction of the light-emitting device 41 be strengthened.

When the average particle diameter of the ceramic crystal grains is larger than 5 μm, the proportion in the surface part of the base body is 42 existing crystal grains reduced. Thus, light will be the way out of the crystal grains into the base body 42 the reflectivity of the upper surface of the base body tends to be increased and accordingly 42 to become weaker. Since that from the light-emitting element 44 or the fluorescent materials emitted light with high efficiency from the upper surface of the base body 42 As a result, it follows that the optical performance of the light-emitting device 41 tends to lose weight. In contrast, when the average particle size of the ceramic crystal grains is smaller than 1 μm, the arithmetic average roughness is the upper surface of the base body 42 decreases, and thus it is out of the light-emitting element 44 emitted light prone to from the upper surface of the base body 42 to be mirror-reflected. This makes it difficult to achieve reflection in all directions. As a result, since the fluorescent materials can not easily be excited unlike the specular fluorescent materials, it is mainly that the specular-fluorescent materials are responsible for wavelength conversion, resulting in poor wavelength conversion efficiency. This can reduce the optical performance of the light-emitting device 41 to lead.

Furthermore, the base body 42 designed so that the ceramic crystal grains are in an average particle diameter range of 1 to 5 microns. Thus, in the base body 42 the density of the crystal grains, which show a high thermal conductivity, so high that the thermal conductivity of the base body 42 is reinforced. This makes it possible to remove the light emitting element 44 outgoing heat through the base body 42 to disperse the outside with high efficiency. Thus, heat-induced deterioration of the light-emitting efficiency of the light-emitting element 44 successfully prevented. Therefore, a reduction in the optical performance of the light-emitting device 41 effectively avoided.

On the attachment section 42a the wiring conductor (not shown) is formed with which the light-emitting element 44 electrically connected. The wiring conductor is passed through a wiring layer (not shown) in the base body 42 is formed, to the outer surface of the light-emitting device 41 to be connected to an external electrical circuit board through a terminal made of a brazing material or a metal material. As a result, an electrical connection between the light-emitting element 44 and the external electrical circuit.

The examples of means for connecting the light-emitting element 44 to the wiring conductor include a wire connection method and a flip-chip connection method. According to the former, a connection is made by using a wire such as an Au line or an Al line. According to the latter, a connection is made by connecting one to the lower surface of the light-emitting element 44 formed electrode with the wiring conductor by such connecting means as a solder bump of Au-tin (Sn) solder, Sn-Ag solder, Sn-Ag-Cu solder or Sn-lead (Pb) or a metal solder bump of a metal, such as for example Au or Ag. For the connection, the flip-chip connection method is more preferable. By Application of such methods, the wiring conductor immediately under the light-emitting element 44 on the upper surface of the base body 42 to be ordered. Thus, it is no longer necessary to have a separate area for the wiring conductor around the light-emitting element 44 on the upper surface of the base body 42 to secure. Therefore, it never happens that the light emitting element 44 emitted light in this wiring conductor region of the base body 42 is absorbed. Accordingly, the lowering of the optical radiation power can be effectively prevented.

The wiring conductor formed of a metallized layer of the powder of a metal such as W, Mo, Mn, Cu or Ag is on the surface of or in the base body 42 arranged. The wiring conductor may also be made by connecting a metal, such as Fe-Ni-Co alloy, terminal in the base body 42 is relocated. In another alternative, the wiring conductor may be fabricated by fitting an input / output terminal formed of an insulator which penetrates a wiring conductor into the base body 42 drilled through hole leads.

Further, in the wiring conductor, it is preferable that the exposed surface is coated with a high-corrosion-resistant metal such as Ni or Au in a thickness of 1 to 20 μm. Thereby, the wiring conductor can be effectively protected against oxidative corrosion and the connection between the light-emitting element 44 and the wiring conductor to be strengthened. Accordingly, the exposed surface of the wiring conductor should preferably be coated successively with, for example, 1 to 10 μm thick Ni plating layer and 0.1 to 3 μm thick Au plating layer by the electrodeposition method or the plating method without external power source.

On the upper surface of the base body 42 is the frame body 43 by means of a bonding material such as solder, a brazing material such as Ag brazing filler or an epoxy adhesive. The frame body 43 has a through hole 43a shaped so that its upper opening is larger than its lower opening, and a reflection surface on its inner peripheral surface 43b which is capable of that from the light-emitting element 44 reflected light with high reflectivity. The inner peripheral surface having such a reflection surface is obtained as follows. For example, first becomes the frame body 43 made of a high reflectivity metal such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr) or Cu by a cutting process, a pressure forming process or the like process. Then, its inner peripheral surface is smoothed to a reflection surface by a polishing process such as electrolytic polishing or chemical polishing. In one alternative, the frame body is first 43 made of a Cu-W alloy or a SUS (stainless steel) alloy which exhibits excellent weatherability and moisture resistance. Then, on its inner circumferential surface, a thin metal film such as Al, Ag or Au is formed by metal deposition or vapor deposition. When the inner circumferential surface is made of a metal such as Ag or Cu, which is susceptible to discoloration due to oxidation, it is preferred to have low-melting-point glass, sol-gel glass, silicone resin or epoxy resin on its surface which exhibits excellent transfer in areas ranging from ultraviolet light to visible light. Thereby, the corrosion resistance and chemical resistance or weather resistance of the inner circumferential surface of the frame body can be improved 43 be improved.

Further, an arithmetic average roughness Ra is on top of the inner peripheral surface of the frame body 43 preferably set to 0.1 μm or less. This can be done from the light-emitting element 44 emitted light can be satisfactorily reflected by it towards the upper part of the light-emitting device. If Ra exceeds 0.1 μm, it may be out of the light-emitting element 44 emitted light is not satisfactory from the inner peripheral surface of the frame body 43 are reflected toward the upper part of the light-emitting device, and in addition, there is a tendency that a diffuse reflection in the light-emitting device 41 occurs. As a result, the loss of light in the light emitting device 41 become considerable, resulting in difficulty in satisfactorily radiating light at a desired irradiation angle.

In the invention, the translucent member 45 preferably made of a material which is not very much of the refractive index of the light-emitting element 44 differs and exhibits excellent transferability in ranges ranging from ultraviolet light to visible light. For example, the translucent component 45 preferably made of translucent resin, such as silicone resin, epoxy or urea resin, or a low melting point or sol-gel glass. In this way, an occurrence of light reflection loss resulting from the different refractive index between the light transmitting member 45 and the light-emitting element 44 effectively avoided. Thus, the light-emitting device succeeds 41 To radiate light very efficiently with desired radiation intensity and radiation angle distribution. The translucent component 45 As shown herein, the material is formed in the frame body 43 is charged to the light-emitting element 44 by a feeder, such as an output device, and thereafter thermosetting it in an oven.

Furthermore, the translucent component has 45 a given content of inorganic or organic fluorescent materials that individually emit light of different colors, such as blue, red, green and yellow, by recombination of electrons present in them, after passing through the light-emitting element 44 emitted light were excited. As a result, light can be output which has the desired emission spectrum and the desired color.

Furthermore, the translucent component 45 preferably arranged such that a distance between its upper surface and the light-emitting section 46 of the light-emitting element 44 in the range between 0.1 and 0.8 mm. In this way, this can be done from the light-emitting element 44 emitted light with high efficiency of the fluorescent materials in that part of the translucent component 45 are included of predetermined thickness, which is above the light-emitting section 46 of the light-emitting element 44 is wavelength converted. In addition, the wavelength-converted light can be effectively protected from the disturbances caused by the fluorescent materials, making it efficient from the transparent member 45 can radiate. As a result, the translucent device is 41 capable of providing improved optical performance and illumination characteristics such as brightness and color reproduction.

When the distance X between the light-emitting section 46 of the light-emitting element 44 and the upper surface of the translucent member 45 (please refer 1 ) is longer than 0.8 mm, it is, although of the fluorescent materials, those closer to the light-emitting element 44 are capable of satisfying a wavelength conversion satisfactorily with that of the light-emitting element 44 To perform emitted light difficult, the wavelength-converted light efficiently from the light-transmitting member 45 to let escape. That is, because the path of the wavelength-converted light is close to the upper surface of the transparent member 45 interfering with existing fluorescent materials, it follows that the radiation of light to the outside can not be successfully achieved.

In contrast, when the distance X between the light-emitting section 46 of the light-emitting element 44 and the upper surface of the translucent member 45 shorter than 0.1 mm, then the number of fluorescent materials emitted by the light emitting element 44 emitted light are reduced. This makes effective wavelength conversion difficult. In this case, there is an undesirable increase in the amount of low-intensity light of a certain wavelength passing through the transparent member 45 is transmitted without experiencing wavelength conversion, with the result that satisfactory optical performance and excellent lighting characteristics such as brightness and color reproduction can not be obtained.

Furthermore, the light-emitting element 44 be formed of any arbitrary element as long as it emits light having an emission energy spectrum with a peak wavelength in the ranges of ultraviolet to infrared. From the standpoint of emission of white light or light of different colors with high visibility, it is preferred to use an element emitting near ultraviolet to blue light having a wavelength in the range of 300 to 500 nm. For example, there is known an element prepared by stacking a buffer layer, an n-type layer, a light-emitting layer, and a p-type layer sequentially on a sapphire substrate, the light-emitting layer being made of a gallium nitride-based compound semiconductor such as GaN, GaAlN, InGaN or InGaAlN, or consists of a silicon carbide-based compound semiconductor or ZnSe (zinc selenide).

2 FIG. 10 is a sectional view illustrating the light-emitting device. FIG 50 according to a second embodiment of the invention. The light-emitting device 50 consists mainly of a base body 51 a reflective part serving as a frame body 52 , a translucent component 53 , a conductor layer 57 and a bulge 59 ,

A structure for housing a light-emitting element embodying the invention comprises the base body 51 , the frame-like reflection part 52 and the conductor layer 57 , The base body 51 has a mounting portion in the middle of its upper surface 51a on to a light-emitting element 55 to install. The reflection part 52 is on the outer periphery of the upper surface of the base body 51 arranged and surrounds the attachment section 51a , The conductor layer 57 is on the mounting part 51a formed, with which conductor layer, the light-emitting element 55 through a conductive adhesive 58 electrically connected. Furthermore, the bulge 59 in a part of an upper surface of the conductor layer 57 formed, which part within the outer periphery of the light-emitting element 55 lies. It should be noted that a wiring conductor is provided in the structure. The one end of the wiring conductor is on the upper surface of the base body 51 formed and with an electrode of the light-emitting element 55 electrically connected, and its other end leads to a side surface or lower surface of the base body 51 , The one end of the wiring conductor is as a conductor layer 57 designed.

In the invention, the base body 51 of ceramics such as alumina ceramics, an aluminum nitride sintered body, a mullite sintered body or glass ceramic or a resin material such as epoxy resin. The base body 51 has on its upper surface the attachment portion 51a on to the light-emitting element 55 to install. If the base body 51 is made of ceramic, as the first embodiment of the invention, it is preferred that the ceramic crystal grains are in an average particle diameter range of 1 micron to 5 microns.

On the attachment section 51a is the conductor layer 57 formed, with which the light-emitting element 55 is electrically connected to the light-emitting element 55 firmly on the base body 51 to install. The conductor layer 57 is passed through a wiring layer (not shown) in the base body 51 is formed, led to the outer surface of the light-emitting device. On this part, which is led out to the outer surface of the light-emitting device connected to an external electric circuit board, an electrical connection is made between the light-emitting element 55 and the external electrical circuit.

When the base body is made of ceramics, the conductor layer is on its upper surface 57 by firing a metal paste of W, Mo-Mn, Cu or Ag at high temperature. On the other hand, if the base body 51 is made of a resin material, a molded junction made of a Cu or Fe-Ni alloy firmly in the base body 51 arranged. The conductor layer 57 is made in this way.

The bulge 59 is in the part of the upper surface of the conductor layer 57 formed within the outer periphery of the light-emitting element 55 lies. The bulge 59 can be made of either a conductive material or an insulating material. If the bulge 59 For example, made of insulating ceramic is the bulge 59 by pressure-coating a ceramic paste consisting primarily of a material used to form the base body, followed by firing the ceramic paste at high temperature together with the metal paste from which the conductor layer 57 is formed. If continue the base body 51 For example, is made of a resin material, the bulge 59 by die casting using the same material as for the base body 51 was used, produced simultaneously with the production of the base body 51 ,

When a conductive material is used, the bulge becomes 59 by pressure-coating a metal paste on the upper surface of the conductor layer 57 , followed by firing, or it is made by forming a projection in the terminal by a cutting process or the like method.

As described above, in the conductor layer 57 the bulge 59 formed in that part of its upper surface which is within the outer periphery of the light-emitting element 55 lies. With the bulge 59 can the light-emitting element 55 to a higher level than the ladder layer 57 , whereby inevitably a gap between the lower surface of the light-emitting element 55 and the upper surface of the conductor layer 57 arises. Thus, it never happens that the weight of the light-emitting element 55 a conductive adhesive 58 from the conductor layer 57 and thereby is the conductive adhesive 58 of uniform thickness. The light-emitting element 55 can accordingly horizontally on the conductor layer 57 be attached. As a result, light is emitted from the light-emitting element 55 is emitted at a desired angle of reflection, and the emitted light is then emitted from the reflection part 52 at a desired irradiation angle to radiate correctly, whereby the radiation intensity of the light emitted from the light-emitting device can be increased.

As the conductive adhesive 58 evenly thick on the conductor layer 57 is applied, it is possible to use the light-emitting element 55 to be mounted horizontally on the conductor layer. Thus, the light emitted from the element 55 outgoing heat through the conductive adhesive 58 and the base body 51 be dissipated to the outside with high efficiency. As a result, the temperature of the light-emitting element 55 stable can be kept, therefore, the radiation intensity of the light-emitting element 55 emitted light with stability are maintained high.

Furthermore, the conductive adhesive remains 58 which is prevented effectively from the outer periphery of the light-emitting element 55 to flow out, under the light-emitting element 55 , This can prevent that from the light-emitting element 55 emitted light through the conductive adhesive 58 coming from the outer periphery of the light-emitting element 55 flows out, is absorbed. As a result, the light-emitting device becomes 50 which offers a high radiation intensity and excellent optical properties, such as brightness and color reproduction.

It is preferred that the bulge 59 in a height of 0.01 mm to 0.1 mm. In this way, a good meniscus of the conductive adhesive 58 between the light-emitting element 55 and the conductor layer 57 be created, whereby the outflow of the conductive adhesive 58 is more effectively prevented, and thereby the bonding strength between the light-emitting element 55 and the conductor layer 57 is increased.

The 3A and 3B show enlarged plan views of the conductor layer 57 and the bulge 59 , Such as in 3A Shown are several hemispherical bulges 59 in that part of the upper surface of the conductor layer 57 formed within the outer periphery of the light-emitting element 55 lies. In the alternative, as in 3B Shown are several rectangular bulges 59 in that part of the upper surface of the conductor layer 57 formed within the outer periphery of the light-emitting element 55 lies so that they are parallel to the outer edges of the light-emitting element 55 are. As in the 3A and 3B can be shown by providing multiple bulges 59 inevitably a gap between the lower surface of the light-emitting element 55 and the upper surface of the conductor layer 57 and thereby a good meniscus of the conductive adhesive can be produced 58 between the upper surface of the conductor layer 57 and the lower surface of the light-emitting element 55 be generated. In the present case, it is important that the bulges 59 well-balanced, so that the light-emitting element 55 horizontally to the conductor layer 57 remains. By forming the bulge 59 on the conductor layer 57 having a smaller area than that of the lower surface of the light-emitting element 55 represents, even if the lower surface of the light-emitting element 55 with the conductor layer 57 through the conductive adhesive 58 connected, can be prevented that the conductive adhesive 58 for connecting the conductor layer 57 and the light-emitting element 55 from the conductor layer 57 flows out. As the conductive adhesive 58 evenly on the attachment section 51 is applied, it follows that the light-emitting element 55 horizontally on the attachment section 51 is appropriate.

The connection of the light-emitting element 55 takes place at the electrode formed on its lower surface by the conductive adhesive 58 such as an Ag paste or a gold (Au) tin (Sn) solder.

It is preferable that the exposed surface of the conductor layer 57 is coated with a highly corrosion-resistant metal, such as Ni or Au, a thickness of 1 to 20 microns. This allows the conductor layer 57 effectively protected against oxidative corrosion and the connection between the light-emitting element 55 and the conductor layer 57 be strengthened. Accordingly, the exposed surface of the conductor layer should 57 preferably successively coated with, for example, a 1 to 10 μm thick Ni plating layer and a 0.1 to 3 μm thick Au plating layer by the electrolytic plating method or the plating method without external power source.

Furthermore, on the upper surface of the base body 51 the reflection part 52 by means of a bonding material such as solder, a brazing material such as Ag brazing filler or an epoxy adhesive. In the middle of the reflection part 52 is a through hole 2a drilled. Preferably, the inner peripheral surface of the through hole 2a to a reflecting surface for reflecting out of the light-emitting element 55 and the light emitted from the fluorescent materials.

The reflection surface 2 B is performed by performing cutting, die casting or polishing on the reflection member 52 formed to obtain a smooth surface, which shows a high light reflection efficiency, or by coating the inner peripheral surface of the through hole 2a with a metal thin film of high reflectance, such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr) or Cu, by metal deposition or vapor deposition. When the reflection surface 2 B is made of a metal such as Ag or Cu, which is susceptible to discoloration resulting from oxidation, it is preferred to have, on its surface, successively, for example, a 1 to 10 μm thick Ni plating layer and a 0.1 to 3 μm thick Au plating layer by the electrodeposition method or the Deposition method without external power source to laminate. This can reduce the corrosion resistance of the reflective surface 2 B be improved.

Further, an arithmetic average roughness Ra becomes on top of the reflecting surface 2 B preferably adjusted to fall within a range of 0.004 to 4 μm. This can be done from the light-emitting element 55 and the fluorescent materials emitted light satisfactorily from the reflection surface 2 B be reflected. If Ra exceeds 4 μm, it may be out of the light-emitting element 55 light emitted is not easily reflected uniformly, and diffuse reflection tends to occur within the light-emitting device. In contrast, when Ra is less than 0.004 μm, it becomes difficult to obtain such a reflecting surface which offers the above-described effect with stability and high efficiency.

For example, in the reflection surface 2 B their vertical section profile preferably defined by a linear inclined surface, as in 1 is shown, which is shaped so that it extends gradually from bottom to top outwards, or by a curved inclined surface, which is shaped so that it extends gradually from bottom to top outwards, or by a rectangular area.

Thus, in the structure embodying the invention, the light-emitting element first becomes 55 on the attachment section 51a attached and then through the conductive adhesive 58 with the conductor layer 57 electrically connected. Then, the light-emitting element becomes 55 with a translucent component 53 covered. This is the light-emitting device 50 realized.

In the invention, the translucent member 53 made of a translucent resin such as epoxy resin or silicone resin. The translucent component 53 is done by loading the resin material in the reflection part 52 by a feeding device, such as an output device, formed around the light-emitting element 55 cover, followed by heat curing in an oven or the like equipment is performed.

It should be noted that the translucent component 53 may contain fluorescent materials capable of wavelength conversion at the light-emitting element 55 perform emitted light.

Furthermore, as in 2 is shown, the upper surface of the translucent member 53 preferably shaped so that it rises convexly. This allows approximations to be made to the lengths of the optical paths along which the light emitting element 55 emitted light beams in different directions individually through the transparent component 53 can be transmitted and thereby unevenness in the radiation intensity can be effectively avoided.

4 FIG. 10 is a sectional view illustrating the light-emitting device. FIG 60 according to a third embodiment of the invention. The light-emitting device 60 consists mainly of a base body 61 , a reflection part 62 , which serves as a frame body, and a translucent member 63 , the fluorescent materials 64 contains. The light-emitting device 60 lets out a light-emitting element 65 emit emitted light with directivity.

In the invention, the base body 61 of ceramic material such as alumina ceramic, an aluminum nitride sintered body, a mullite sintered body or glass ceramic or a resin material such as epoxy resin. The base body 61 has on its upper surface a mounting portion 61a on to the light-emitting element 65 to install. The attachment section 61a is shaped so that it protrudes from the upper surface. If the base body 61 is made of a ceramic material in the same manner as the above-described embodiment of the invention, it is preferable that the ceramic crystal grains are in an average particle diameter range of 1 to 5 μm.

The attachment section 61a is on the upper surface of the base body 61 formed as follows. First, a bulge 61b using ceramic material such as alumina ceramic, an aluminum nitride sintered body, a mullite sintered body or glass ceramic or a metal material such as Fe-Ni-Co alloy or Cu-W alloy, or a resin material such as epoxy resin , Then the bulge 61b on the upper surface of the base body 61 by means of a binding material such as a brazing material or an adhesive, whereby the attachment portion 61a is realized. Alternatively, the bulge 61b with the upper surface of the base body 61 be integrally formed or the bulge 61b The material mentioned above can be fitted in a through-hole formed in the center of the base body 61 is drilled so that its upper part from the upper surface of the base body 61 protrudes.

Preference is given to the bulge 61b and the base body 61 made of the same material. As a result, the different thermal expansion between the attachment portion 61a and the base body 61 be minimized. Thus, it never happens that the light-emitting element 65 due to distortion in the attachment portion 61a is shifted in its position and accordingly, a reduction in the light emission efficiency can be avoided.

More preferred are the bulge 61b and the base body 61 formed integrally with each other. This eliminates the need for a binding material between the bulge 61b and insert the base body, resulting in an excellent dissipation of heat from the light-emitting element 65 in the base body 61 goes out, leads.

A one-piece construction of the bulge 61b and the base body 61 is realized by stacking ceramic green sheets together to make them bulge 61b and the base body 61 It is realized by performing metal processing such as cutting, or it is realized by molding resin by injection molding or a similar method.

Furthermore, as the light-emitting device 60A according to a fourth embodiment of the invention, which in 5 shown is the bulge 61b preferably shaped so that their side surfaces are growing with proximity to the base body 61 gradually extend obliquely outwards. This allows the diffusivity of heat coming from the light-emitting element 65 emanates, be improved and effective light from the side surface of the protruding attachment portion 61a to be reflected upwards. As a result, the light-emitting efficiency of the light-emitting element 65 as well as the wavelength conversion efficiency of the fluorescent materials 64 can be increased and also that from the light-emitting element 65 or the fluorescent materials 64 emitted light can be effectively reflected upwards. Therefore, a light output with high radiation intensity can be achieved over a long period of time.

On the attachment section 61a An electrical connection pattern is formed which serves as a wiring conductor (not shown) and for electrically connecting the light-emitting element 65 is used. The electrical connection pattern is formed by a wiring layer (not shown) provided in the base body 61 is formed, led to the outer surface of the light-emitting device. At this led-out part, which is connected to an external electric circuit board, an electrical connection between the light-emitting element 65 and the external electrical circuit.

Examples of the means for connecting the light-emitting element 65 The electrical connection pattern includes a wire connection connection method and a flip chip connection method by which a connection is made using an electrode 66 , such as a solder bump, on the lower surface of the light-emitting element 65 will be produced. For the connection, the flip-chip connection method is more preferable. By using such methods, the electrical connection pattern can immediately under the light-emitting element 65 to be ordered. Thus, it is no longer necessary to have a separate area for the electrical connection pattern around the light-emitting element 65 on the upper surface of the base body 61 to secure. Therefore, it never happens that the light emitting element 65 emitted light in the space of the base body 61 , which is secured to the electrical connection pattern, is absorbed. Accordingly, an undesirable reduction of the axial luminosity can be effectively prevented.

The electrical connection pattern is realized, for example, by placing a metallized layer of the powder of a metal, such as W, Mo, Cu or Ag, on the surface of or in the base body 61 is formed or realized by a junction of a metal, such as an Fe-Ni-Co alloy, in the base body 61 is implemented, or it is realized by an input / output terminal is fitted, which is formed of an insulator, a wiring conductor through a in the base body 61 drilled through hole leads.

Further, in the electrical connection pattern, it is preferable that the exposed surface is coated with a high-corrosion-resistant metal such as Ni or Au in a thickness of 1 to 20 μm. Thereby, the electrical connection pattern can be effectively protected against oxidative corrosion and the connection between the light-emitting element 65 and the electrical connection pattern are strengthened. Accordingly, the exposed surface of the electrical connection pattern should preferably be coated successively with, for example, a 1 to 10 μm thick Ni plating layer and a 0.1 to 3 μm thick Au plating layer by the electrodeposition method or the no external power source deposition method.

Further, as in the second embodiment of the invention, on the upper surface of the base body 61 the reflection part 62 by means of a bonding material such as solder, a brazing material such as Ag brazing filler or an epoxy adhesive. The reflection part 62 has a through hole 62 which is bored in its center, and its inner peripheral surface is a reflecting surface 62b for reflecting from the light-emitting element 65 shaped light emitted.

The reflection surface 62b is made in the same manner as in the second embodiment of the invention, and the description is therefore omitted.

Further, as in the second embodiment of the invention, an arithmetic average roughness Ra is on top of the reflecting surface 62b preferably adjusted to fall within a range of 0.004 to 4 microns. This can be done from the light-emitting element 65 or the fluorescent materials 64 emitted light satisfactorily from the reflection surface 62b be reflected.

For example, in the reflection surface 62b the vertical sectional profile of which is preferably defined by a linear inclined surface shaped to gradually extend outwards from the bottom upwards, like the light-emitting device 60 . 60A and 60B according to the third to fifth embodiments of the invention, which in the 4 to 6 or by a curved inclined surface shaped to gradually extend outwards from below upwards or through a rectangular surface such as the light-emitting device 60C according to the sixth embodiment of the invention, which in 7 is shown.

Although the reflection part 62 at every point of the base body 61 except for the area where the bulge 61b is formed, it is preferably around the light-emitting element 65 attached with the desired surface accuracy. For example, the reflection part 62 specially attached so that its reflective surfaces 62b facing on both sides of the light-emitting element 65 are arranged to be symmetrical to each other when viewed in the vertical section of the light-emitting device. In this way, not only that of the light-emitting element 65 emitted light directly after passing through the fluorescent materials 64 It can also be transmitted laterally or in other directions from the light-emitting element 65 emitted light or that of the fluorescent materials 64 Down light emitted evenly from the reflection surface 62b be reflected. Accordingly, the axial luminance, brightness, color rendering and the like properties can be effectively improved.

In particular, as in 6 is shown, the smaller the distance between the reflection member, the larger the effects just described above 62 and the bulge 61b is. Thus, by forming the reflection part 62 so that it's the bulge 61b with the attachment section 61a Surrounds as much light as possible to be reflected, whereby an ever higher axial luminosity is achieved.

Furthermore, the light emitting section is located 69 of the light-emitting element 65 on the attachment section 61a attached, at a higher level than a lower end 62c the reflection surface 62b , That is, the level of the light-emitting section of the light-emitting element 65 with regard to the upper surface of the base body 61 is greater than a thickness L of that part of the reflection part 62 near the lower opening of the through-hole 62 lies. As a result, a diffuse reflection of from the light-emitting element 65 emitted light, by a ridge, etc., at the bottom 62c the reflection surface 62b during processing of the reflection part 62 occurs, or originates from a part of a brazing material which propagates at the time when the reflection part 62 with the base body 61 is effectively prevented. Another advantage is that the light emitting element 65 emitted light on a variety of fluorescent materials 64 can be applied, which is close to the surface of the translucent component 63 are located. Accordingly, the wavelength conversion efficiency can be significantly improved.

In the invention, the translucent member 63 made of a translucent resin, such as epoxy or silicone resin, containing the fluorescent materials 64 which are capable of wavelength conversion at that of the light-emitting element 65 perform emitted light. The translucent component 63 is done by loading the resin material in the reflection part 62 by a feeding device, such as an output device, formed around the light-emitting element 65 cover, followed by heat curing in an oven or the like equipment is performed. Thus, light having a desired wavelength spectrum can be taken out by the light emitting element 65 emitted light is subjected to a wavelength conversion made by the fluorescent materials 64 is effected.

Furthermore, the translucent component 63 preferably arranged so that a distance K between its upper surface and the light-emitting section 69 of the light-emitting Elements 65 in the range between 0.1 and 0.5 mm. In this way, this can be done from the light-emitting element 65 emitted light with high efficiency by the fluorescent materials 64 that are in part of the translucent component 63 of predetermined thickness extending above the light-emitting section 69 of the light-emitting element 65 can be wavelength converted, and then the wavelength-converted light can be emitted directly from the translucent component 63 be radiated without being affected by interference caused by the fluorescent materials 64 caused. As a result, the light-emitting device is capable of providing improved radiation intensity and excellent lighting characteristics such as axial luminance, brightness, and color reproduction.

When the distance X between the light-emitting section 69 of the light-emitting element 65 and the surface of the translucent member 63 is longer than 0.5 mm, as in 8th It is shown, though, by the fluorescent materials 64 those closer to the light-emitting element 65 present (hatched fluorescent materials 64 ) are capable of wavelength conversion by direct excitation of the light-emitting element 65 To perform emitted light, difficult, the wavelength-converted light directly from the translucent component 63 to let escape. That is, because the path of the wavelength-converted light through the near the surface of the light-transmitting member 63 existing fluorescent materials 64 (those who are not the hatched fluorescent materials 64 in 8th are disturbed, it becomes difficult to obtain a satisfactory external axial luminosity.

If, in contrast, as in 9 is shown, the distance X between the light emitting section 69 of the light-emitting element 65 and the surface of the translucent member 63 shorter than 0.1 mm, it becomes difficult to effectively convert the wavelength of the light-emitting element 65 to reach emitted light. In this case, there is an undesirable increase in the amount of low-intensity light and a particular wavelength passing through the translucent member 63 is transmitted without undergoing wavelength conversion, with the result that no satisfactory optical characteristics such as axial luminance, brightness and color reproduction can be obtained.

Furthermore, as with the light-emitting device, for example 60D the seventh embodiment of the invention, which in 10 is shown, the translucent component 63 is preferably designed so that its central portion in the arithmetical average surface roughness is larger than its outer peripheral portion. This contributes to the difference in radiation intensity between the light emerging from the central portion and the light emerging from the outer peripheral portion in the transparent member 63 exit, decrease. In particular, the light coming out of the light-emitting element 65 was emitted and then directly from the central portion of the surface of the translucent member 63 was radiated without the reflection part 62 or the like, has a high intensity. This light is through a rough surface 67 in the central portion of the surface of the translucent member 63 scattered so that its intensity can be slightly reduced. In this way, the intensity of the light coming out of the middle section of the surface of the translucent member 63 is emitted to the low intensity of the light emitted from the outer peripheral portion of the surface of the transparent member 63 is radiated after it from the reflection part 62 was reflected, approximated. Therefore, the different irradiation intensity between the middle portion and the outer peripheral portion in the translucent member 63 be reduced. As a result, the light-emitting device is capable of emitting uniform light in a wider range. Furthermore, a glare can be avoided, that is, a phenomenon that hurts the human eye and results from a radiation intensity concentration in a certain part of the light-emitting surface. Thus, negative effects on the human eye can be minimized.

It is preferred that on the surface of the translucent member 63 the central portion has an arithmetic average roughness of 0.5 μm or more, whereas the outer peripheral portion exhibits an arithmetic average roughness of 0.1 μm or less. In this way, the radiation intensity as it appears on the surface of the translucent member 63 is seen to be generated as evenly as possible and satisfactorily.

If at the translucent component 63 the area ranging from the middle portion to the outer peripheral portion is made to be a smooth surface in the middle portion because the distance between the light-emitting element 65 and the translucent member 63 is short, it follows that the transmission loss is low and the radiation intensity is high. On the outer peripheral portion of the transparent member 63 on the other hand, since that from the light-emitting element 65 emitted light exits the light-emitting device after it has come from the reflection part 62 has been reflected, it follows that the optical path lengthens and the radiation intensity due to reflection losses occurring in the reflection part is low. As a result, a large difference in light intensity occurs between the central portion and the outer peripheral portion in the translucent member 63 and this leads to unevenness in the color of the light emitted from the light-emitting device and unevenness in the illumination distribution on a surface to be irradiated. In view of the above, unevenness of the color of the light emitted from the light-emitting device and unevenness in the illumination distribution on a surface to be irradiated can be avoided by exposing the light-transmitting member 63 is designed so that the central portion is larger in the arithmetic average surface roughness than the outer peripheral portion.

Such a rough surface 67 is obtained, for example, that the surface of the transparent component 63 by roughening ceramic powder or the like from above the light-emitting device, wherein the outer edge of the surface is covered by a metal film.

Furthermore, as in 4 is shown, the upper surface of the translucent member 63 preferably shaped so that it rises convexly. This allows the distance between the light emitting section 69 and the surface of the translucent member 63 be kept in a range of 0.1 to 0.5 mm. Thus, the radiation intensity can be increased even when light obliquely upward from the light-emitting element 65 is emitted.

11 Fig. 10 is a sectional view showing a light-emitting device 70 according to an eighth embodiment of the invention. The light-emitting device 70 consists mainly of a base body 71 , a reflection part 72 , which serves as a frame body, a translucent component 73 , a conductor layer 77 and a bulge 79 ,

A structure for housing a light-emitting element embodying the invention includes the base body 71 , the frame-like reflection part 72 and the conductor layer 77 , The base body 71 has a mounting portion in the middle of its upper surface 71a on to a light-emitting element 75 to install. The reflection part 72 is on the outer periphery of the upper surface of the base body 71 arranged and surrounds the attachment portion 71a , The conductor layer 77 is on the mounting part 71a educated. The light-emitting element 75 is with the conductor layer 77 through a conductive adhesive 78 electrically connected. Around the conductor layer 77 is a bulge 79 formed of an insulating material. It should be noted that a wiring conductor is provided in the structure. The one end of the wiring conductor is on the upper surface of the base body 71 formed and with an electrode of the light-emitting element 75 electrically connected, and its other end leads to a side surface or lower surface of the base body 71 , The one end of the wiring conductor is as a conductor layer 77 designed.

In the invention, the base body 71 of ceramics such as alumina ceramics, an aluminum nitride sintered body, a mullite sintered body or glass ceramic or a resin material such as epoxy resin. The base body 71 has on its upper surface the attachment portion 71a on to the light-emitting element 75 to install. If the base body 71 is made of ceramic such as the above embodiment of the invention, it is further preferable that the ceramic crystal grains are in an average particle diameter range of 1 μm to 5 μm.

On the attachment section 71a is the conductor layer 77 formed, with which the light-emitting element 75 is electrically connected to the light-emitting element 75 firmly on the base body 71 to install. The conductor layer 77 is passed through a wiring conductor (not shown) in the base body 71 is formed, led to the outer surface of the light-emitting device. On this part, which is led out to the outer surface of the light-emitting device, which is connected to an external electrical circuit board, an electrical connection between the light-emitting element 75 and the external electrical circuit.

If the base body 71 Made of ceramic is on the upper surface of the base body 71 the conductor layer 77 by burning one into the conductor layer 77 formed metal paste from W, Mo-Mn, Cu or Ag formed at high temperature. On the other hand, if the base body 71 is made of a resin material, a molded junction made of a Cu or Fe-Ni alloy firmly in the base body 71 arranged. The conductor layer 77 is made in this way.

The bulge 59 is around the conductor layer 77 educated. If the base body 71 For example, made of ceramic, the bulge is 79 made by pressure coating a ceramic paste, which consists primarily of a Material exists that contributes to the formation of the base body 71 followed by firing of the ceramic paste at high temperature together with the metal paste from which the conductor layer 77 is formed. If, however, the base body 71 For example, is made of a resin material, the bulge 79 produced by die casting using the same material as for the base body 71 is used, simultaneously with the production of the base body 71 , It should be noted that the bulge 79 not necessarily the same material as the base body 71 used, but can be made of any other material.

As described above, around the conductor layer 77 the bulge 79 formed of an insulating material. Therefore, with the bulge 79 prevents the conductive adhesive 78 from the conductor layer 77 spreads; therefore, the conductive adhesive has a uniform thickness. The light-emitting element 75 can accordingly horizontally on the conductor layer 77 be attached. As a result, light is emitted from the light-emitting element 75 is emitted at a desired angle of reflection, and the emitted light is then emitted from the reflection part 72 at a desired irradiation angle to radiate correctly, whereby the radiation intensity of the light emitted from the light-emitting device can be increased.

Since the light-emitting element 75 horizontally on the conductor layer 77 is attached further, it follows that the light-emitting element 75 Outgoing heat evenly through the conductive adhesive 78 and the base body 71 transferred and finally dissipated with high efficiency to the outside. As a result, the temperature of the light-emitting element 75 be kept stable, therefore, the radiation intensity of the light-emitting element 75 emitted light with stability are maintained high.

Further, it can be effectively prevented that from the light-emitting element 75 emitted light through the bulge 79 on the conductive adhesive 78 is applied. Therefore, it never happens that the light emitted from the light-emitting device becomes light from the conductive adhesive 78 is absorbed, and thus an undesirable reduction of the radiation intensity, brightness and color reproduction can be effectively avoided. Thus, there is provided the light-emitting device which offers high radiation intensity and excellent light emission characteristics.

It should be noted that the bulge 79 is either formed so that it the outer circumference of the conductor layer 77 covered, or so that it does not cover the outer circumference. If the conductor layer 77 repeatedly formed, the bulge can 79 continuing by the perimeter of each conductor layer 77 be trained as in 12A is shown, or it can be around the group of several conductor layers 77 be trained as in 12B is shown.

As in 13A is shown, the conductor layer 77 be configured so that its exposed part outside the outer periphery of the light-emitting element 75 lies. More preferable is as in 13B is shown, the conductor layer 77 configured so that its exposed part in the outer periphery of the light-emitting element 75 lies. In this way it can be prevented that the conductive adhesive 78 for connecting the conductor layer 77 with the light-emitting element 75 in front of the area between the conductor layer 77 and the light-emitting element 75 exposed; Therefore, it can be very effectively prevented that from the light-emitting element 75 emitted light on the conductive adhesive 78 shine. As a result, it never happens that the light emitting element 75 emitted light from the conductive adhesive 78 absorbed or reflected therefrom as light showing a low radiation intensity. Accordingly, the radiation intensity of the light emitted from the light-emitting device can be maintained high, and excellent brightness and color reproduction can be achieved.

Another advantage is that, even if that from the light-emitting element 75 emitted light is ultraviolet light, the conductive adhesive 78 no quality reduction. Thus, the strength of the bond between the conductor layer 77 and the light-emitting element 75 can be maintained sufficiently high, therefore, the permanent attachment between the conductor layer 77 and the light-emitting element 75 be preserved over a longer period. As a result, the electrical connection between the electrode 76 of the light-emitting element 75 and the conductor layer 77 be ensured for a longer period of time. Accordingly, the light-emitting device can offer a longer service life.

In addition, the bulge 79 shaped so that their side faces become closer to the base body 71 gradually extend obliquely outwards. This allows air to enter a corner section between the side surfaces of the bulge 79 and the upper surface of the base body is present, easily peeled off and it can be prevented that the air remains in the corner section. Accordingly, it can be effectively prevented that in the conductive adhesive 78 and the translucent member 73 forms a bubble and peeling or cracking is caused by the expansion of air in the bubble due to a temperature change or the like. In addition, it is possible to light on the sloping outside surfaces of the bulge 79 to reflect well upwards and to improve the light emission efficiency.

It is preferred that the bulge 79 a reflectance of 60% or more with respect to that from the light-emitting element 75 and the fluorescent materials contained in the translucent member 73 are included. In this way it can be more effectively prevented that from the light-emitting element 75 or the fluorescent materials emitted light from the bulge 79 is absorbed or reflected therefrom as light showing a low radiation intensity. Accordingly, the radiation intensity of the light emitted from the light emitting device can be maintained extremely high. If the reflectivity of the bulge 79 is less than 60%, which may be from the light-emitting element 75 or the amount of light emitted by the fluorescent materials, that of the bulge 79 can be increased, resulting in an undesirable reduction in the radiation intensity of the light emitted from the light-emitting device.

The connection of the light-emitting element 75 takes place on the electrode formed on its lower surface 76 through the conductive adhesive 78 such as an Ag paste or a gold (Au) tin (Sn) solder.

It is preferable that, as in the second embodiment of the invention, the exposed surface of the conductor layer 77 coated with a highly corrosion-resistant metal, such as Ni or Au, in a thickness of 1 to 20 microns.

On the upper surface of the base body 71 becomes the reflection part 72 by means of a bonding material such as solder, a brazing material such as Ag brazing or an epoxy adhesive. In the middle of the reflection part 72 is a through hole 72a drilled. Preferably, the inner peripheral surface of the through hole 72a to a reflection surface 72b for reflecting from the light-emitting element 75 and the light emitted from the fluorescent materials.

The reflection surface 72b is formed in the same manner as the second embodiment of the invention, the description is therefore omitted.

Further, as in the second embodiment of the invention, an arithmetic average roughness Ra becomes on top of the reflecting surface 72b preferably adjusted to fall within a range of 0.004 to 4 μm. This can be done from the light-emitting element 75 and the fluorescent materials emitted light satisfactorily from the reflection surface 72b be reflected.

For example, in the reflection surface 72b the vertical sectional profile of which is preferably defined by a linear inclined surface shaped to extend gradually from bottom to top, as in 11 is shown, or by a curved inclined surface which is shaped so that it extends gradually from bottom to top outwards, or by a rectangular surface.

Thus, in the structure embodying the invention, the light-emitting element becomes 75 first on the attachment section 71a attached and then through the conductive adhesive 78 with the conductor layer 77 electrically connected. Then, the light-emitting element becomes 75 with a translucent component 73 covered. This is the light-emitting device 70 realized.

In the invention, the translucent member 73 made of a translucent resin such as epoxy resin or silicone resin. The translucent component 73 is done by loading the resin material in the reflection part 72 by a feeding device, such as an output device, formed around the light-emitting element 75 to cover, followed by a heat curing in an oven or similar equipment is performed.

It should be noted that the translucent component 73 may contain fluorescent materials capable of wavelength conversion at the light-emitting element 75 perform emitted light.

Furthermore, as in 11 is shown, the upper surface of the translucent member 73 preferably shaped so that it rises convexly. This allows approximations to be made to the lengths of the optical paths along which the light emitting element 75 emitted light beams in different directions individually through the transparent component 53 can be transmitted and thereby unevenness in the radiation intensity can be effectively avoided.

14 Fig. 10 is a sectional view showing a light-emitting device 80 according to a ninth embodiment of the invention. The light-emitting device 80 consists mainly of a base body 81 , a reflection part 82 , which serves as a frame body, a translucent component 83 , a conductor layer 87 and a bulge 89 ,

A structure for housing a light-emitting element embodying the invention includes the base body 81 , the frame-like reflection part 82 and the conductor layer 87 , The base body 81 indicates a projection 81b projecting from its upper surface, a fixing portion 81a on to a light-emitting element 85 to install. The reflection part 82 is with the upper surface of the base body 81 connected to the attachment section 81a to surround. The inner peripheral surface of the reflection part 82 is to a reflection surface 82b for reflecting light emerging from the light-emitting element 85 emitted is formed. The conductor layer 87 is on the upper surface of the attachment section 81a educated. The light-emitting element 85 is with the conductor layer by a conductive adhesive 88 electrically connected. The conductor layer 87 is from a bulge 89 surrounded by an insulating material. It should be noted that a wiring conductor is provided in the structure. The one end of the wiring conductor is on the upper surface of the base body 81 formed and with an electrode of the light-emitting element 85 electrically connected, and another end leads to a side surface or lower surface of the base body 81 , The one end of the wiring conductor is as a conductor layer 87 designed.

In the present construction, the light can be laterally and obliquely downward from the side of the light-emitting element 85 has been emitted from the reflecting surface 82b of the reflection part 82 be reflected satisfactorily. Thus, the light from the reflection part 82 are reflected at a desired irradiation angle to radiate satisfactorily without departing from the connecting portion between the reflecting portion 82 and the base body 81 or the surface of the base body 81 to be absorbed. As a result, the radiation intensity of the light emitted from the light-emitting device can be stably maintained high.

Because the lead 81b is shaped so that the attachment section 81a from the upper surface of the base body 81 spaced apart, it follows that inevitably an insulation between the attachment portion 81a and the lower end of the reflection part 82 is provided. Therefore, the lower end of the reflection part 82 can be brought close to the attachment portion, as can be seen in the direction of the plane, and thereby can from the light-emitting element 85 emitted light from the reflection surface of the reflection part 82 to be left more satisfactory.

Furthermore, with the bulge 89 Made of insulating material prevents the conductive adhesive 88 from the conductor layer 87 spreads, therefore, the conductive adhesive 88 a uniform thickness. Accordingly, the light-emitting element 85 horizontally on the conductor layer 87 be attached. As a result, light is emitted from the light-emitting element 85 is emitted at a desired angle of reflection and the emitted light is then emitted from the reflection part 82 is reflected at a desired irradiation angle so that it radiates correctly, thereby making it possible to increase the radiation intensity of the light emitted from the light-emitting device.

Since the light-emitting element 85 horizontally on the conductor layer 87 is attached, it follows that the light emitting element 85 Outgoing heat evenly through the conductive adhesive 88 and the base body 81 transferred and finally dissipated with high efficiency to the outside. As a result, the temperature of the light-emitting element 85 be preserved with stability; Therefore, the radiation intensity of the light-emitting element 85 emitted light with stability are maintained high.

Furthermore, it can be effectively prevented that from the light-emitting element 85 emitted light through the bulge 89 on the conductive adhesive 88 is applied. Therefore, it never happens that the light emitted from the light-emitting device is transmitted through the conductive adhesive 88 is absorbed, and thus an undesirable reduction of the radiation intensity, brightness and color reproduction can be effectively avoided.

Thus, there is provided the light-emitting device which offers high radiation intensity and excellent light emission characteristics.

In the invention, the base body 81 of ceramics such as alumina ceramics, an aluminum nitride sintered body, a mullite sintered body or glass ceramic or a resin material such as epoxy resin. The base body 81 indicates the projection 81b projecting from its upper surface, the attachment portion 81a on to the light-emitting element 85 to install. If the base body 81 is made of ceramic such as the above embodiment of the invention, it is further preferable that the ceramic crystal grains are in an average particle diameter range of 1 μm to 5 μm.

The lead 81b can with the base body 81 be integrally formed. In this case, the production is carried out by the well-known technique of stacking ceramic green sheets, cutting, die-casting or the like.

Furthermore, the projection 81b also by connecting a rectangular parallelepipedic projection section 81b with the upper surface of the base body 81b be prepared by brazing or by using an adhesive. Preferably, the projection 81b made of ceramics, resin, an inorganic crystal, a metal or the like material.

On the attachment section 81a is the conductor layer 87 formed, with which the light-emitting element 85 is electrically connected to the light-emitting element 85 firmly on the base body 81 to install. The conductor layer 87 is passed through a wiring layer (not shown) in the base body 81 is formed, led to the outer surface of the light-emitting device. At this part, which leads to the outer surface of the light-emitting device connected to an external electric circuit board, an electrical connection is made between the light-emitting element 85 and the external electrical circuit.

If the base body 81 Made of ceramic is on the upper surface of the base body 81 the conductor layer 87 by firing a metal paste of W, Mo-Mn, Cu or Ag at high temperature. On the other hand, if the base body 81 is made of a resin material, a molded junction made of a Cu or Fe-Ni alloy firmly in the base body 81 arranged. The conductor layer 87 is made in this way.

The bulge 89 is around the conductor layer 87 educated. If the base body 81 For example, made of ceramic, the bulge is 89 produced by pressure coating a ceramic paste, which consists primarily of a material which is used to form the base body 81 followed by firing of the ceramic paste at high temperature together with the metal paste from which the conductor layer 87 is formed. If, however, the base body 81 For example, is made of a resin material, the bulge 89 produced by die casting using the same material as for the base body 81 was used, simultaneously with the production of the base body 81 , It should be noted that the bulge 89 not necessarily the same material as the base body 81 used, but can be made of any other material.

As described above, around the conductor layer 87 the bulge 89 formed of an insulating material. Therefore, with the bulge 89 prevents the conductive adhesive 88 from the conductor layer 87 spreads; thus receives the conductive adhesive 88 a uniform thickness. The light-emitting element 85 can accordingly horizontally on the conductor layer 87 be attached. As a result, light is emitted from the light-emitting element 85 is emitted at a desired angle of reflection, and the emitted light is then emitted from the reflection part 82 at a desired irradiation angle to radiate correctly, whereby the radiation intensity of the light emitted from the light-emitting device can be increased.

Since the light-emitting element 85 horizontally on the conductor layer 87 is attached further, it follows that the light-emitting element 85 Outgoing heat evenly through the conductive adhesive 88 and the base body 81 transferred and finally dissipated to the outside with high efficiency. As a result, the temperature of the light-emitting element 85 be kept stable, therefore, the radiation intensity of the light-emitting element 85 emitted light with stability are maintained high.

Further, it can be effectively prevented that from the light-emitting element 85 emitted light through the bulge 89 on the conductive adhesive 88 is applied. Therefore, it never happens that the light emitted from the light-emitting device becomes light from the conductive adhesive 88 is absorbed, and thus an undesirable reduction of the radiation intensity, brightness and color reproduction can be effectively avoided. Thus, there is provided the light-emitting device which offers high radiation intensity and excellent light emission characteristics.

It should be noted that the bulge 89 is either formed so that it the outer circumference of the conductor layer 88 total covered in the circumferential direction or along the outer edge of the conductor layer 87 is trained without covering it. If the conductor layer 87 repeatedly formed, the bulge can 89 continue through the extent of each conductor layer 87 be trained as in 15A is shown, or it can be around the group of several conductor layers 87 be trained as in 15B is shown.

As in 16A is shown, the conductor layer 87 be configured so that its exposed part outside the outer periphery of the light-emitting element 85 lies. More preferable is as in 16B is shown, the conductor layer 87 configured so that its exposed part in the outer periphery of the light-emitting element 85 lies. In this way it can be prevented that the conductive adhesive 88 for connecting the conductor layer 87 with the light-emitting element 85 in front of the area between the conductor layer 87 and the light-emitting element 85 exposed; Therefore, it can be very effectively prevented that from the light-emitting element 85 emitted light on the conductive adhesive 88 is applied. As a result, it never happens that the light emitting element 85 emitted light from the conductive adhesive 88 is absorbed or reflected therefrom as light showing a low radiation intensity. Accordingly, the radiation intensity of the light emitted from the light-emitting device can be maintained high, and excellent brightness and color reproduction can be achieved. By the conductor layer 87 is configured so that its exposed part within the outer periphery of the light-emitting element 85 Further, the size of the attachment portion may be 81a be reduced. Accordingly, the reflection part 82 be downsized. The reduction of the size of the reflection part 82 allows a reduction of the base body 81 , which in turn makes it possible to make the overall structure compact.

Another advantage is that even if that from the light-emitting element 85 emitted light is ultraviolet light, the conductive adhesive 88 no quality reduction. Thus, the strength of the bond between the conductor layer 87 and the light-emitting element 85 can be maintained sufficiently high, therefore, the permanent attachment between the conductor layer 87 and the light-emitting element 85 be preserved over a longer period. As a result, the electrical connection between the electrode 86 of the light-emitting element 85 and the conductor layer 87 be ensured for a longer period of time. Accordingly, the light-emitting device can offer a longer service life.

In addition, the bulge 89 shaped so that their side faces become closer to the base body 81 gradually extend obliquely outwards. This allows air to enter a corner section between the side surfaces of the bulge 89 and the upper surface of the attachment portion 81a is present, easily peeled off and it can be prevented that the air remains in the corner portion. Accordingly, it can be effectively prevented that in the conductive adhesive 88 and the translucent member 83 forms a bubble and peeling or cracking is caused by the expansion of air in the bubble due to a temperature change or the like. In addition, it is possible to light on the sloping outside surfaces of the bulge 89 to reflect well upwards and to improve the light emission efficiency.

It is preferred that, as in the eighth embodiment of the invention, the bulge 89 shows a reflectivity of 60% or more with respect to the light emitted from the light-emitting element 85 and the fluorescent materials contained in the translucent member 83 are emitted.

The connection of the light-emitting element 85 takes place on the electrode formed on its lower surface 86 through the conductive adhesive 88 such as an Ag paste or a gold (Au) tin (Sn) solder.

It is preferable that, as in the second embodiment of the invention, the exposed surface of the conductor layer 87 is coated with a highly corrosion-resistant metal, such as Ni or Au, in a thickness of 1 to 20 microns.

On the upper surface of the base body 81 is the reflection part 82 by means of a bonding material such as solder, a brazing material such as Ag brazing, or an epoxy adhesive. In the middle of the reflection part 82 is a through hole 82a drilled. Preferably, the inner peripheral surface of the through hole 82a to a reflection surface 82b for reflecting from the light-emitting element 85 and the light emitted from the fluorescent materials.

The reflection surface 82b is formed in the same manner as the second embodiment of the invention, the description is therefore omitted.

Further, as in the second embodiment of the invention, an arithmetic average roughness Ra becomes on top of the reflecting surface 82b preferably adjusted to fall within a range of 0.004 to 4 μm. This can be done from the light-emitting element 85 and the fluorescent materials emitted light satisfactorily from the reflection surface 82b be reflected.

For example, in the reflection surface 82b their vertical section profile preferably defined by a linear inclined surface, as in 14 4, which is shaped to gradually extend outward from the bottom to the top, or a curved inclined surface formed to gradually extend outward from the bottom to the top, or a rectangular surface.

Thus, in the structure embodying the invention, the light-emitting element becomes 85 first on the attachment section 81a attached and then through the conductive adhesive 88 with the conductor layer 87 electrically connected. Then, the light-emitting element becomes 85 with a translucent component 83 covered. This is the light-emitting device 80 realized.

In the invention, the translucent member 83 made of a translucent resin such as epoxy resin or silicone resin. The translucent component 83 is done by loading the resin material into the reflection part 82 by a feeding device, such as an output device, formed around the light-emitting element 85 to cover, followed by a heat curing in an oven or similar equipment is performed.

It should be noted that the translucent component 83 may contain fluorescent materials capable of wavelength conversion with that of the light-emitting element 85 perform emitted light.

Furthermore, as in 14 is shown, the upper surface of the translucent member 83 preferably shaped so that it rises convexly. This allows approximations to be made to the lengths of the optical paths along which the light emitting element 85 emitted light beams in different directions individually through the transparent component 83 can be transmitted and thereby unevenness in the radiation intensity can be effectively avoided.

17 Fig. 10 is a sectional view showing a light-emitting device 90 according to a tenth embodiment of the invention. The light-emitting device 90 consists mainly of a base body 91 , a reflection part 92 , a translucent component 93 , the fluorescent materials 94 contains, and a light-emitting element 95 , The light-emitting device 90 leaves out the light-emitting element 95 emit emitted light with directivity.

In the invention, the base body 91 made of ceramics such as alumina ceramics, an aluminum nitride sintered body, a mullite sintered body or glass ceramic or a resin material such as epoxy, or a metal material such as Fe-Ni-Co alloy or Al. The base body 91 has the function that on it the reflection part 92 firmly attached. The reflection part 92 has on its upper main surface a mounting portion 92d on to him the light-emitting element 95 to install. If the base body 91 is made of ceramic such as the above embodiment of the invention, it is further preferable that the ceramic crystal grains are in an average particle diameter range of 1 to 5 μm.

On the upper surface of the base body 91 is the reflection part 92 by means of a binding material, such. As solder, a brazing material, such as an Ag brazing, or an epoxy resin adhesive attached. The reflection part 92 has in the center of its upper major surface a convex mounting portion 92b on to it the light-emitting element 95 to install. Also, the reflection part 92 on the outer periphery of its upper major surface, a side wall portion 92a on, which is designed so that he the attachment section 92b surrounds, wherein the inner peripheral surface of the side wall portion to a reflection surface 92c for reflecting from the light-emitting element 95 emitted light is shaped. In this way, not only that of the light-emitting element 95 emitted light directly after it from the fluorescent materials 94 it has been correctly converted to wavelength, can be radiated, but it can also be the light that flows laterally or in other directions out of the light-emitting element 95 was emitted, or the light emitted by the fluorescent materials 94 was emitted down, evenly from the reflection surface 92c to be left reflected. Accordingly, the axial luminance, brightness, color rendering and the like properties can be effectively improved.

The reflection part 92 is made of ceramic materials such as aluminum ceramics, an aluminum nitride sintered body, a mullite sintered body, or glass ceramics or a resin material such as epoxy resin or a metal material such as Fe-Ni-Co alloy, Cu-W or Al, produced. The production is carried out by cutting, die casting or the like. The reflection surface 92c is performed by performing cutting or die-casting on the inner peripheral surface of the side wall portion 92a of the reflection part 92 performed or by coating the inner peripheral surface of the side wall portion 92a with a thin metal film of high metal Reflectances such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr) or Cu are produced by plating or vapor deposition.

When the reflection surface 92c is made of a metal such as Ag or Cu, which is susceptible to oxidation-staining discoloration in the same manner as the second embodiment of the invention, it is preferable to have, for example, a 1 to 10 μm-thick Ni plating layer on its surface and laminating a 0.1 to 3 μm thick Au plating layer successively by the electrolytic plating method or the plating method without external power source. This can reduce the corrosion resistance of the reflective surface 92c be improved.

Further, as in the second embodiment of the invention, an arithmetic average roughness Ra is on top of the reflecting surface 92c preferably adjusted to fall within a range of 0.004 to 4 μm. This can be done from the light-emitting element 95 and the fluorescent materials 94 emitted light satisfactorily from the reflection surface 92c be reflected.

At the reflection surface 92c its vertical sectional profile is preferably defined by a linear inclined surface which is shaped to extend gradually from bottom to top, as the light emitting devices 90 and 90A according to the tenth and eleventh embodiments of the invention disclosed in the 17 and 18 or by a curved inclined surface which is shaped to extend gradually from the bottom upwards to the outside, or by a rectangular surface such as the light-emitting device 90B according to the twelfth embodiment of the invention, which in 19 is shown.

In the invention, the lower end of the reflecting surface 92c arranged on or under an optical path line, the light emitting section 98 at the end of the light-emitting element 95 and the corner between the top surface 92d and the side surface of the attachment portion 92b combines. This allows the side or bottom of the light-emitting element 95 emitted direct light efficiently from the reflection surface 92c be reflected, whereby a significantly high radiation light intensity is achieved.

The light-emitting element 95 is on the upper surface 92d of the attachment section 92d attached, and its electrode is provided with an electrode pad on the upper surface of the mounting portion 92d is formed, or on an electrode pad, from the part of a on the upper surface of the base body 91 trained wiring conductor, electrically connected. The electrode pad is passed through the wiring conductor (not shown) in the base body 91 and the reflection part 92 is formed, to the outer surface of the light-emitting device 90 (a side surface or a bottom surface of the base body 91 ) led out. This led out part is connected to an external electrical circuit board. Thus, an electrical connection between the light-emitting element 95 and the external electrical circuit.

Such an electrode pad is produced, for example, by forming a metallized layer of the powder of a metal, such as W, Mo, Cu or Ag, on the surface of or in the base body 91 or the reflection part 92 is formed or by laying a junction of a metal, such as an Fe-Ni-Co alloy, in the base body 91 or the reflection part 92 realized, or it is realized by fitting an input / output terminal, which is made of an insulator, which is a wiring conductor in a in the base body 91 or the reflection part 92 bored through hole bears.

It is preferable that the exposed surfaces of the electrode pad and the wiring conductor are coated with a highly corrosion-resistant metal such as Ni or gold (Au) in a thickness of 1 to 20 μm. Thereby, the electrode pad and the wiring conductor can be effectively protected against oxidative corrosion and the connection between the light-emitting element 95 and the electrode pad are strengthened. Accordingly, the exposed surfaces of the electrode pad and the wiring conductor should be successively preferably coated with, for example, a 1 to 10 μm thick Ni plating layer and a 0.1 to 3 μm thick Au plating layer by the electrolytic plating method or the plating method with no external power source.

Furthermore, the attachment portion 92b be configured differently. In 17 are the side surfaces of the attachment portion 92b perpendicular to the base body 91 shaped. In 18 the side surfaces are shaped so that they move towards the base body 91 widen gradually. In the latter case, heat may be emitted from the light-emitting element 95 goes out, effectively down from the attachment section 92b whereby the heat dissipating property of the light-emitting element 95 is improved. The light-emitting element 95 can be kept in good working condition.

If the reflection part 92 is made of an insulating material, as in 17 is shown, an electrical connection between the light-emitting element 95 and the one on the top surface 92d of the attachment section 92b formed electrode pad by the flip-chip connection method, such as a solder bump (electrical connection means 96 ) Connection, made. When the electrode pad on the upper surface of the reflection part 92 is educated, can continue, although not in 17 is shown, the wire connection method, such as a gold wire (electrical connection means 96 ' ) Connection, be applied. For the connection, the flip-chip connection method is more preferable. By using it, the electrode pad can immediately under the light-emitting element 95 to be ordered. Thus, it is no longer necessary to have a separate area for the electrical connection pattern around the light-emitting element 95 on the upper surface of the base body 91 to secure. Therefore, it never happens that the light emitting element 95 emitted light in the space secured to the electrical connection pattern of the base body 91 is absorbed. Accordingly, an undesirable lowering of the axial luminosity can be effectively prevented.

If the base body 91 is made of an insulating material, as in 18 is shown, continues to be a through hole 97 around the attachment section 92b of the reflection part 92 made of an insulating material or a metal material. The through hole 97 from the upper major surface to the lower major surface of a portion of the reflective portion 92 is completely drilled, located below the optical Weglinie. Preferably, the electrode of the light-emitting element 95 and that on the upper surface of the base body 91 formed wiring conductors by means of a wire (electrical connection means 96 ' ), through the through hole 97 is introduced, electrically connected. In this way, the light-emitting element becomes 95 emitted direct light from the reflection surface 92c over the through hole 97 reflected in the reflection part 92 is bored to the wire 96 ' to introduce it there. Thus, the direct light can be effectively prevented from entering the through hole 97 is passed and absorbed there, whereby the radiation light intensity is increased. Furthermore, the light-emitting element 95 on its entire lower surface with the attachment portion 92b of the reflection part 92 connected, whereby it is possible that from the light-emitting element 95 outgoing heat satisfactory to the reflection part 92 to transmit and thereby improve the heat dissipation property.

It should be noted that the depth of the through hole 97 (ie the thickness of the lower portion of the reflective part 92 ) and the opening diameter of the through hole 97 taking into account the different thermal expansion between the reflection part 92 and the base body 91 , the conductivity for heat coming from the light-emitting element 95 and other factors are appropriately determined. Also, in the case of 17 the thickness of the lower portion of the reflection part 92 determined accordingly.

Furthermore, it is possible to effectively prevent light from passing through the through hole 97 for inserting the wire 96 ' which passes through hole in the reflection part 92 is formed, and in the base body 91 is absorbed by fixing the average particle diameter of the crystal grains contained in the ceramic to a range of 1 to 5 μm to reflect the reflectivity of the base body 91 to improve.

In the light-emitting device 90C according to a thirteenth embodiment of the invention, which in 20 is shown, is the through hole 97 preferably with an insulating paste 97a filled, which contains insulating light-reflecting particles so that they are connected to the upper main surface of the reflection part 92 flees. In this way, even if that from the light-emitting element 95 and the fluorescent materials 94 emitted light into the through hole 97 is passed, the light from the light-reflecting particles are effectively reflected upwards. Thus, in the light-emitting device, satisfactory optical characteristics such as axial luminance, brightness, and color reproduction can be achieved.

It is preferred that the insulating paste 97a containing light-reflecting particles having a composition of barium sulfate, calcium carbonate, alumina, silica, etc. with the addition of Ca, Ti, Ba, Al, Si, Mg, K and O, and that the total reflectivity on the surface is set to be 80% or more. Thereby, satisfactory optical characteristics such as axial luminance, brightness and color reproduction can be achieved in the light-emitting device.

The translucent component 93 is made of translucent resin, such as epoxy or silicone resin, or glass containing the fluorescent materials 94 which is capable of being on the light-emitting element 95 emitted light to perform a wavelength conversion. The translucent component 93 is made in which the material in the reflection part 92 by a feeding device such as an output device the light-emitting element 95 cover, followed by a heat curing in an oven or the like equipment is performed on it. Thus, light having a desired wavelength spectrum can be taken out by the light emitting element 95 emitted light is subjected to a wavelength conversion by the fluorescent materials 94 is effected.

Furthermore, the translucent component 93 arranged so that a distance X between its upper surface and the light-emitting section of the light-emitting element 95 in a range between 0.1 and 0.5 mm. In this way, this can be done from the light-emitting element 95 emitted light with high efficiency from the fluorescent materials 94 that are in part of the translucent component 93 of predetermined thickness, which part over the light-emitting section of the light-emitting element 95 is wavelength converted, and then the wavelength converted light directly from the translucent component 93 leak without being affected by interference caused by the fluorescent materials 94 caused. As a result, the light-emitting device is capable of providing improved radiation intensity and optical characteristics such as axial luminance, brightness, and color reproduction.

When the distance X between the light-emitting section of the light-emitting element 95 and the surface of the translucent member 93 is longer than 0.5 mm, as in 21 It is shown, though, by the fluorescent materials 94 those closer to the light-emitting element 95 present (hatched fluorescent materials 94 in 21 ) are capable of wavelength conversion by direct excitation of the light-emitting element 95 To perform emitted light, difficult, the wavelength-converted light directly from the translucent component 93 to let escape. That is, because the path of light through the near the surface of the translucent member 93 existing fluorescent materials 94 (those who are not the hatched fluorescent materials 94 are disturbed, it becomes difficult to obtain a satisfactory external axial luminosity.

If, in contrast, as in 22 is shown, the distance X between the light-emitting section of the light-emitting element 95 and the surface of the translucent member 93 shorter than 0.1 mm, it becomes difficult to effectively convert the wavelength of the light-emitting element 95 to reach emitted light. In this case, there is an undesirable increase in the amount of low-intensity light and a particular wavelength passing through the translucent member 93 is transmitted without undergoing wavelength conversion, with the result that no satisfactory optical characteristics such as axial luminance, brightness and color reproduction can be obtained.

Furthermore, as in 17 is shown, the upper surface of the translucent member 93 preferably shaped so that it rises convex. In this way, the distance between the light emitting section and the surface of the translucent member 92 be kept in a range of 0.1 to 0.5 mm. Thus, even if light is obliquely upward from the light-emitting element 95 is emitted, the radiation intensity can be increased.

Thus, the light-emitting device 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C embodying the invention may represent a lighting device, some possibilities are considered, that is, the setting up of a single piece of the light-emitting device 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C in a given arrangement, setting up a plurality of light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C in a lattice, staggered or radial arrangement and the establishment of a plurality of concentrically arranged circular or polygonal units of the light-emitting device 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C consisting of several light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C exist in a predetermined arrangement. In the thus constructed lighting device, a light emission by utilizing the recombination of electrons in the light-emitting elements 44 . 55 . 65 . 75 . 85 and 95 , which are composed of a semiconductor causes. Thus, the lighting device is advantageous in terms of energy saving and long service life over a conventional lighting device for effecting light emission by electric discharge. A compact lighting device with low heat generation can be realized accordingly. As a result, a fluctuation in the central wavelength of the light-emitting element can be caused 44 . 55 . 65 . 75 . 85 and 95 emitted light are suppressed; therefore, the illuminating device will succeed in emitting light having stable irradiation light intensity and stable angle (luminous intensity distribution) over a long period of time, and to avoid color nonuniformity and unbalanced illumination distribution on a surface to be irradiated.

By the light emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C of the invention as a light source in a given arrangement, followed by arranging an optical component which has been optically designed in a given configuration around the light-emitting device 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C For example, such as a reflection device, an optical lens or a light diffusion plate, a lighting device capable of emitting light with a given luminance distribution can be realized.

For example, the show 23 and 24 a plan view and a sectional view of a lighting device, which consists of a plurality of light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C consisting in rows and columns on a light emitting device driving circuit board 101 are arranged, and a reflection device 100 optically designed in a given configuration surrounding the light-emitting device 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C is positioned. In this construction, adjacent arrays are multiple light emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C preferably arranged so as to maximize the space between the adjacent light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C secure, ie the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C are staggered. When the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C are arranged in a grid-like arrangement, ie the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C , which serve as light sources, are arranged in a straight line, a glare is amplified. A lighting device having such a grid-shaped arrangement of the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C tends to cause discomfort or problems to the human eye. In view of the above, by applying the staggered arrangement, bright illumination can be suppressed, thereby reducing discomfort or problems to the human eye. Another advantage is that, since the space between the adjacent light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C as long as possible, a heat interference between the adjacent light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C can be effectively prevented. Therefore, confinement of heat within the light-emitting device driving circuit board 101 containing the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C bears, be avoided; thus, heat can pass through the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C be dissipated to the outside with high efficiency. As a result, there is provided a long-life lighting device which has little adverse effect on the human eye and provides stable optical characteristics over a long period of time.

The 25 and 26 On the other hand, a plan view and a sectional view, respectively, of another lighting device manufactured by mounting on the light-emitting device driving circuit board 101 a plurality of concentrically arranged circular or polygonal units of light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C are positioned, consisting of several light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C are composed. In this construction, it is preferred that in a single circular or polygonal unit of light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C are arranged so that their number gradually increases from the center to the outer edge of the lighting device. This allows the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C be arranged in the largest possible number, the space between the adjacent light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C is secured accordingly, and thereby the light level of the lighting device can be improved. As the density of light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C is lower in a center portion of the lighting device, heat can be trapped in the center portion of the light-emitting device driving circuit board 101 be avoided. Therefore, the light emitting device driving circuit board 101 a uniform temperature distribution, and thus heat can be transmitted to an external electrical circuit board with the lighting plate or a heat sink with high efficiency, thereby preventing a temperature rise in the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C occurs. As a result, there is provided a long-life lighting apparatus wherein the light-emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C while can be operated stably for a longer period of time.

The lighting device as shown herein has a wider range of applications, including: general-purpose lighting fixtures for indoor or outdoor use: chandelier lighting lamps, home-use lighting fixtures; Lighting fixtures for offices; Lighting fixtures for shops or shops, lighting fixtures for shop windows, street lighting; Beacons, signaling devices; Lighting fixtures for stages or studios; Lighting in advertising; Lighting pole; Underwater lighting lamps; strobe lights; headlights; Security lighting fixtures embedded in electrical posts or the like; An emergency lighting body; electric flashlights; electric billboards, dimmers; automatic flashers; Taillights for displays or other purposes; Screening devices; decorative objects; illuminated switches; Light sensors; Lamps for medical use and lamps on vehicles.

(Embodiment)

example 1

The following is the description of an embodiment of the light-emitting device 41 according to the first embodiment of the invention.

At first it was called the base body 42 an alumina ceramic substrate made of crystalline particles of various diameters. Then it was around the attachment section 42a to it the light-emitting element 44 to attach a wiring conductor formed around the light-emitting element 44 with the external electrical circuit board through one in the base body 42 electrically connect trained internal wiring line. It should be noted that on the upper surface of the base body 42 formed wiring conductor was formed by means of a metallized layer of Mo-Mn powder into a circular pad of 0.1 mm in diameter. The surface of the wiring conductor was successively coated with a 3 μm-thick Ni plating layer and a 2 μm-thick Au plating layer. Furthermore, it was in the base body 42 formed internal wiring line of an electrical connection portion, which was formed by a via conductor, that is, a so-called through hole. Like the wiring conductor, the through hole was formed from a metallized layer of Mo-Mn powder.

Subsequently, a 0.08 mm thick light-emitting element 44 for emitting near ultraviolet light at the attachment portion 42a by means of an Ag-Pate, and then the light-emitting element 44 is electrically connected to the wiring conductor through a bonding wire made of Au.

Next was silicone resin (translucent component 45 ) is applied by an output device to the light-emitting element 44 to cover, followed by the implementation of a heat-hardening followed him. The silicone resin contains fluorescent materials that emit yellow light after being emitted from the light-emitting element 44 emitted light were excited. Subsequently, a pattern of the light-emitting device 41 produced. Then the optical power of the sample was measured.

In the silicone resin, the fluorescent materials were evenly distributed at 1/4 filling factor (mass%). The fluorescent materials used were yttrium aluminate-based fluorescent materials with a garnet match for emitting yellow light. The grains of the fluorescent materials are in an average particle diameter range of 1.5 μm to 80 μm.

When the average particle diameter of the ceramic crystal grains containing the base body 42 was set to approximately 10 microns, it was found that the optical power 14 mW was. In contrast, when the average particle diameter of the ceramic crystal grains constituting the base body 42 When set to fall within a range of 1 to 5 μm, it was found that the optical performance 17 mW was. As understood from this fact, as compared with the case where the average particle diameter was set at approximately 10 μm, the optical power energy was increased by more than 20%. That is, by designing the base body so that the average particle diameter of the ceramic crystal falls within a range of 1 to 5 μm, light can make the way into the base body 42 finds, to be cut more efficiently and the number of fluorescent materials that are exposed to a light irradiation, that of one on the surface of the base body 42 occurring light scattering can be increased. In this way, the optical performance was enhanced.

In addition, it was confirmed that when the ampere-number for enhancing the optical performance of the light-emitting device 41 was increased, wherein the base body has a ceramic average particle diameter in the range of 1 to 5 μm, an undesirable reduction in light emission efficiency with respect to a forward direction current can be more effectively avoided.

Example 2

Next were patterns of the light-emitting device 41 produced. The patterns, each having the same structure as that of the above-mentioned embodiment, are identical in construction with each other, but differ in the average particle diameter of the ceramic crystal grains, as after sintering of the base body 42 was observed: 1 (μm), 5 (μm) and 10 (μm). Then, the total light beams (optical power) with respect to the load current for the light-emitting element 44 measured. It should be noted that the light-emitting devices 41 were individually mounted in heat sinks which were identical in terms of their cooling capacity. The optical power was measured by means of an integration sphere. The results are in 27 listed.

Out 27 It will be seen that when the load current for the light-emitting element 44 with 20 (mA), ie rated current and rated voltage of 3.4 (V), the light-emitting device 41 with the average particle diameter of the ceramic crystal grains of 1 (μm) showed an optical power of 0.96 (1 m) and a light emission efficiency of 14 (1 m / W), whereas the light-emitting device 41 with an average particle diameter of the ceramic crystal grains of 5 (μm) showed an optical power of 0.8 (1 m) and a light emission efficiency of 12 (1 n / W). In contrast, the light-emitting device showed 41 with an average particle diameter of the ceramic crystal grains of 10 (μm), an optical power of 0.55 (1 m) and a light emission efficiency of 8 (1 m / W). That is, at this rated current, the optical power of the light-emitting device became 41 with an average particle diameter of the ceramic crystal grains of 1 (μm) to 5 (μm) in proportion to the optical power of the light-emitting device 41 in which the average particle diameter of the ceramic crystal grains containing the base body 42 set to 10 (μm), increased by 45 to 74%.

By the base body 42 is designed so that the average particle diameter of the ceramic crystal grains falls within a range of 1 to 5 microns, in particular light, which can be the way into the base body 42 finds to be effectively cut off. In addition, with the bumps on the surface of the base body 42 are created by the crystal grains, that from the light-emitting element 44 emitted light can be reflected in a substantially completely dispersed state. Therefore, the fluorescent materials contained in the frame body 43 are irradiated with uniform light intensity, and also the number of fluorescent materials subjected to light irradiation is increased. This helps to reduce the likelihood of fluorescent materials from that from the light-emitting element 44 emitted light is increased, whereby the light conversion efficiency of the fluorescent materials is improved. As a result, in the light-emitting device 41 in which the average particle diameter of the ceramic crystal grains containing the base body 42 is set to fall within a range of 1 to 5 (μm), its light-emitting efficiency is equal to or greater than the light-emitting efficiency of an incandescent lamp, ie, 12 (1 m / W). Accordingly, the light-emitting device finds 41 Practical use as a display or illumination light source.

When the load current has been increased, the optical power of the light-emitting device 41 Furthermore, the following results were observed. When the average particle diameter of the ceramic crystal grains containing the base body 42 As shown, the increase in optical power proportional to the load current peaked at an amperage of approximately 100 (mA) or less. In contrast, when the average particle diameter of the ceramic crystal was small, the optical power continued to increase in proportion to the increase in the amperage until it reached a certain higher level. In particular, when the average particle diameter was set to 1 μm, the optical performance of the light-emitting device increased 41 Proportional until the amperage reached approximately 110 mA. That is, by decreasing the average particle diameter of the ceramic crystal grains containing the base body 42 can represent the heat dissipation property within the base body 42 thereby improving and preventing a rise in temperature caused by the load current in the light-emitting element 44 is caused, and the reduction of the light-emitting efficiency of the light-emitting element can be suppressed.

Further, patterns of the light emitting device became 41 with varying average particle diameters of the ceramic crystal grains, and each of them was measured for the peak wavelength of the light-emitting element 44 with respect to the load current in the light-emitting device 41 carried out. As a result, it was confirmed that a fluctuation in the peak wavelength of the light-emitting element 44 can be minimized by the average particle diameter of the ceramic crystal grains containing the base body 42 represent, is set to 1 micron. In this way, a fluctuation in the conversion efficiency of the fluorescent materials depending on the peak wavelength of the light-emitting element 44 be minimized. When the light-emitting device 41 Further, a plurality of fluorescent materials having different excitation spectra may further exhibit a fluctuation in the conversion efficiency of the fluorescent materials resulting from a fluctuation of the peak wavelength of the light-emitting element 44 results are minimized. As a result, a variation of the color of the light emerging from the light-emitting device 41 output as a mixture of light components excited by multiple fluorescent materials. For example, suppose that the fluorescent materials are composed of red color phosphors, blue color phosphors, and green color phosphors, and that the peak wavelength of the light emitting element 44 varies with the load current. In this case, the light emission intensities of the phosphors become dead color, blue color and green color with the peak wavelength of the light-emitting element 44 vary in their own properties. When the light-emitting device outputs light in this state because the proportion of light intensity in a mixture of light components excited by the phosphors of red color, blue color and green color is different, it follows that the hue of the output light is on varies undesirably. As a result, it is impossible to obtain light having a desired hue. Therefore, by adjusting the average particle diameter, the base body 42 1 μm, the fluctuation of the peak wavelength of the light-emitting element 44 can be minimized and, accordingly, fluctuation of the color tone of the output light can be minimized. Thereby, a light emitting device having stable light emission and lighting characteristics suitable for use in display or lighting purposes can be manufactured.

Example 3

The following is the description of an embodiment of the light-emitting device 60C according to the sixth embodiment of the invention with reference to 7 ,

At first it was called the base body 61 made an alumina ceramic substrate. It should be noted that the base body 61 the bulge 61b with a fastening portion integrally formed therewith 61a having. The upper surface of the attachment section 61a and the upper surface of the base body 61 with the exception of a part of the attachment section 61a were arranged parallel to each other.

The base body 61 consists of a cylindrically shaped plate with a diameter of 0.8 mm and a thickness of 0.5 mm and a cylindrically shaped bulge 61b with a diameter of 0.4 mm and a thickness of any value. The bulge 61b is formed in the middle of the upper surface of the cylindrically-shaped plate.

The bulge 61b has the attachment portion 61a on to the light-emitting element 65 to install. On the attachment section 61a An electrical connection pattern is formed around the light-emitting element 65 with the external electrical circuit board through an internal wiring line formed in the base body 61 is designed to connect electrically. The electrical connection pattern was formed into a circular base having a diameter of 0.1 mm by means of a metallized layer of Mo-Mn powder. The surface of the electrical connection pattern is successively coated with a 3 μm-thick Ni plating layer and a 2 μm-thick Au plating layer. The in the base body 61 formed internal wiring line consisted of an electrical connection portion, which was formed of a via conductor, that is, a so-called through hole. Like the electrical connection pattern, the through hole was formed of a metallized layer of Mo-Mn powder.

Furthermore, the base body 61 on its entire upper surface except for the part of the bulge 61b a connecting portion for connecting the base body 61 with the reflection part 62 using an Au-tin (Sn) braze. The bonding portion was formed by coating the surface of a metallized layer of Mo-Mn powder with a 3 μm-thick Ni plating layer and a 2 μm-thick Au plating layer.

Further, the reflection part became 62 produced. The reflection part 62 has a through hole 62 with a rectangular inner peripheral surface when in the in 7 shown vertical section is seen. The upper portion of the inner circumferential surface of the through hole 62 became one reflecting surface 62 formed whose Ra was set to 0.1 microns.

In addition, the reflection part became 62 its dimensions are 0.8 mm in outer diameter, 1.0 mm in height, 0.8 mm in diameter of the upper opening, 0.5 mm in diameter of the lower opening and 0.15 mm in height of the lower end 62c the reflection surface 62b (thickness L of a part of the reflection part 62 which lies around the lower opening).

Next, an Au-Sn solder bump (electrode 66 ) in the 0.08 mm thick light-emitting element 65 arranged to emit near ultraviolet light. The Au-Sn solder bump became the light-emitting element 65 connected to the electrical connection pattern. At the same time, the reflection part became 62 with the on the upper surface of the base body 61 formed connecting portion connected by Au-Sn brazing. The plane of the light-emitting section of the light-emitting element 65 with respect to the lower surface of the Au-Sn solder bump, namely, the distance from the attachment portion 61a to the light-emitting section was set to approximately 0.03 mm.

Next was silicone resin (translucent component 63 ) in the region of the base body 61 and the reflection part 62 is charged by an output device until the level of the silicone resin is the uppermost end of the inner peripheral surface of the reflection member 62 achieved. The silicone resin contains fluorescent materials 64 of three different species that individually emit red light, green light, and yellow light. Subsequently, a pattern of a light-emitting device was prepared.

Then, by varying the value, the thickness of the bulge 61b represents the height H (mm) of the light-emitting section of the light-emitting element 65 , seen from the base body 61 , varies (H is the sum of the thickness of the bulge 61b and the plane of the light-emitting section with respect to the attachment portion 61a defined: 0.03 mm). It should be noted that the distance X (mm) between the light-emitting section of the light-emitting element 65 and the upper surface of the translucent member 63 can be represented by a value obtained by subtracting H (mm) from the distance between the upper surface of the transparent member 63 and the base body 61 can be determined: 1.0 mm.

28 Fig. 12 is a graph showing the result of measurement of the axial luminance performed on each pattern on the basis of the values H and X. As is apparent from the graph, when H is given as 0.1~0.15 mm (the height of the light-emitting section is less than or equal to the height of the lower end 62c the reflection surface 62b : 0.15 mm), the axial luminosity low. In contrast, when H is given as 0.16 mm or higher (the height of the light-emitting section is greater than the height of the lower end 62c the reflection surface 62b : 0.15 mm), the axial luminosity extremely high. This is because, by making the light-emitting section higher than the lower end 62c the reflection surface 62b is made of the light-emitting element 65 emitted light satisfactorily from the reflection surface 62b can be reflected, resulting in that the reflection efficiency is increased.

If H is increased further, the axial luminosity gently increases more and more. In the present case, it has been confirmed that the axial luminance is sharply increased when X assumes a value ranging from 0.1 to 0.5 mm. As a reason, it may be considered that by properly setting the distance between the light-emitting section and the upper surface of the transparent member 63 that from the light-emitting element 65 emitted light with greater efficiency by the fluorescent materials 64 Wavelength can be converted, and the wavelength-converted light is highly efficient from the translucent component 63 leak without being disturbed by unneeded fluorescent materials 64 is caused to be impaired. Also, it was confirmed that such a pattern as that showing remarkably high axial luminance provides sufficiently high brightness, color reproduction, etc.

Example 4

The following is the description of an embodiment of the light-emitting device 90B according to the twelfth embodiment of the invention with reference to FIGS 19 . 29 and 30 ,

At first it was called the base body 91 An alumina ceramic substrate was made from a rectangular plate having an outer dimension of 2.5 mm × 0.8 mm and a thickness of 0.4 mm. In addition, the reflection part became 92 using a rectangular element made of Al with an external dimension of 2.5 × 0.8 mm. The reflection part 92 has a cylindrically shaped mounting portion in the center of its upper major surface 92b with a diameter L (mm). The thickness of that part of the reflection part 92 around the attachment section 92b is (the distance between its upper and lower surface) is up 0.2 mm. The reflection part 92 also has on its outer periphery a frame-like side wall portion 92a which has a height of 1.0 mm (projecting from the lower major surface by 0.8 mm) from the lower major surface and a lateral thickness of 0.2 mm. It should be noted that in the sidewall portion 92a the to the base body 91 vertical inner peripheral surface to a reflection surface 92c whose arithmetic average roughness Ra was set to 0.1 μm.

Furthermore, a single through hole was made 97 on both sides of the attachment section 92b more precisely, both in the part between the attachment portion 92b and one side of the sidewall portion 92a as well as in the part between the attachment portion 92b and the other side of the sidewall portion 92a in the direction of the longer side of the reflection part 92 which, seen from above, is rectangular in shape. The through hole 97 was from the upper major surface to the lower major surface of the reflective part 92 completely pierced.

Next, an electrode which is part of the wiring conductor was formed on that part of the upper surface of the base body 91 formed, which is the bottom of the through hole 97 opposite. The electrode was shaped like a circle with a diameter of 0.1 mm by means of a metallized layer of Mo-Mn powder. The surface of the electrode is successively coated with a 3 μm-thick Ni plating layer and a 2 μm-thick Au plating layer. The one in the base body 91 formed wiring conductor was prepared by an electrical connection portion, which was formed from a through conductor, that is, a so-called through hole. Like the electrical connection pattern, the through hole was also formed from a metallized layer of Mo-Mn powder.

Furthermore, in the base body 91 formed around the outer periphery of its upper surface around a connecting portion to the base body 91 and the reflection part 92 using Au tin (Sn) hard solder to connect. The bonding portion was formed by coating the surface of a metallized layer of Mo-Mn powder with a 3 μm-thick Ni plating layer and a 2 μm-thick Au plating layer.

Next was on the upper surface 92d of the attachment section 92b the 0.08 mm thick light-emitting element 95 for emitting near ultraviolet light connected by Au-Sn brazing. At the same time, the reflection part became 92 with the on the upper surface of the base body 91 formed connecting portion connected by Au-Sn brazing. Furthermore, the light-emitting element 95 and the bottom of the through hole 97 arranged electrode wire-connected and electrically connected to each other by a gold wire.

From here, silicone resin (translucent component 93 ) in the area of the base body 91 and the reflection part 92 is charged by an output device until the level of the silicone resin is the uppermost end of the inner peripheral surface of the reflection member 92 reached. The silicone resin contains fluorescent materials 94 in three different ways that individually emit red light, green light and yellow light. Subsequently, a pattern of the light-emitting device 90B produced.

The value representing the height H (mm) of the light-emitting section of the light-emitting element 95 , seen from the base body 91 , By varying the height of the attachment portion, can be represented 92b be varied widely. The distance X (mm) between the upper surface of the translucent member 93 and the light emitting section is given by: X = 1.0 - H. Further, as in 29 is shown by varying the diameter L of the mounting portion 92b the angle of the optical path line 99 covering the light-emitting section and the corner between the upper surface 92d and the side surface of the attachment portion 92b connects, be changed.

30 Fig. 12 is a graph showing the result of measurement of the axial luminance performed on each pattern on the basis of the values L and X. As can be seen from the graph, axial luminance fluctuations are dependent on the ratio between L and X. That is, if L is less than 0.3 mm, then the optical path line is located 99 under a line containing the light-emitting section 98 and the lower end of the reflecting surface 92c combines. Thus, it can be considered that the reflection efficiency has been lowered since that of the light-emitting element 95 Light emitted the way into the through hole 97 found without looking at the reflection surface 92c get.

In contrast, if L is 0.3 mm or above, then the optical path line is located 99 above the line, which is the light-emitting section 98 and the lower end of the reflecting surface 92c combines. In this case, ie, if no direct light on the through hole 97 For example, it was found that the axial luminance was 500 mcd or more, provided that X takes a value in the range of 0.1 to 0.5 mm. As a reason, it can be considered that by properly setting the distance X between the light-emitting section 98 and the upper surface of the translucent member 93 that from the light-emitting element 95 emitted light through the fluorescent materials 94 can be wavelength converted with greater efficiency and that the wavelength-converted light with high efficiency from the translucent component 93 is allowed to escape without interference caused by unneeded fluorescent materials 94 caused to be impaired.

As apparent from the above results, excellent axial luminance can be obtained under the conditions that the lower end of the reflecting surface 92c is positioned on or below the optical path line, which is the light-emitting section 98 and the corner between the top surface 92d and the side surface of the attachment portion 92b connects and that the distance between the light-emitting section 98 and the upper surface of the translucent member 93 is kept in a range of 0.1 to 0.5 mm. It has also been confirmed that such a pattern as that showing a remarkably high axial luminance provides sufficiently high brightness, color reproduction, etc.

Of course, the application of the invention is not limited to the above-described first to thirteenth embodiments, and many modifications and variations of the invention are possible within the spirit and scope of the invention. In the first embodiment of the invention, for example, an optical lens or a plate-shaped translucent lid may be additionally provided with the upper surface of the frame body 43 be connected by means of solder or an adhesive. Since the optical lens or the plate-shaped translucent lid is capable of coming out of the light-emitting device 41 In this case, it becomes possible to discharge light at a desired angle and the immersion resistance within the light-emitting device to freely condense or scatter emitted light 41 improve, which leads to an improvement in long-term reliability. Furthermore, the inner peripheral surface of the frame body 43 be shaped so that it has a flat (straight) cutting profile or an arcuate (curved) cutting profile. With the arc-shaped section profile that can be from the light-emitting element 44 emitted light to be reflected thoroughly and thus allowed to radiate evenly with high directivity. Further, in the first to thirteenth embodiments of the invention, the base bodies 42 . 51 . 61 . 71 . 81 and 91 with several light-emitting elements 44 . 55 . 65 . 75 . 85 and 95 be provided for amplifying the optical power. In addition, the angle of the reflection surfaces 43b . 52b . 62b . 72b . 82b and 92c or the distance from the lower end of the reflective surfaces 43b . 52b . 62b . 72b . 82b and 92c to the upper surface of the translucent members 45 . 53 . 63 . 73 . 83 and 93 be set as desired. As a result, complementary color ranges can be ensured; thus, a more satisfactory color rendering effect can be achieved.

It should also be noted that the lighting device embodying the invention can be constructed by either multiple light emitting devices 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C be arranged in a predetermined arrangement or by a single piece of the light-emitting device 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B and 90C is set up in a predetermined arrangement.

The invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and thus all changes that come within the meaning and equivalency range of the claims are therein to be included.

Claims (22)

A structure for mounting a light-emitting element, comprising: a base body ( 42 . 51 . 61 . 71 . 81 ) made of ceramic, which has on its upper surface a fixing portion ( 42a . 51a . 61a . 71a . 81a ) in order to have a light-emitting element ( 44 . 55 . 65 . 75 . 85 ) to fix; a frame body ( 43 . 52 . 62 . 72 . 82 ) connected to the outer periphery of the upper surface of the base body ( 42 . 51 . 61 . 71 . 81 ) is connected so that it the attachment section ( 42a . 51a . 61a . 71a . 81a ) whose inner peripheral surface to a reflection surface ( 43b . 52b . 62b . 72b . 82b ) for reflecting light emitting element to be attached to the attachment portion (Fig. 44 . 55 . 65 . 75 . 85 ) emitted light is formed; and a wiring conductor having one end thereof on the upper surface of the base body ( 42 . 51 . 61 . 71 . 81 ) is formed so as to be in contact with an electrode of the light-emitting element (10) to be attached to the attachment portion (5) 44 . 55 . 65 . 75 . 85 ) is electrically connectable, and the other end to the outside to a side or bottom surface of the base body ( 42 . 51 . 61 . 71 . 81 ), wherein the base body ( 42 . 51 . 61 . 71 . 81 ) is designed such that crystal grains contained in the ceramic have an average particle diameter range of 1 to 5 μm. Light emitting device ( 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 ) comprising: the structure of claim 1; and a light-emitting element ( 44 . 55 . 65 . 76 . 85 ) mounted on the attachment section ( 42a . 51a . 61a . 71a . 81a ) and electrically connected to the wiring conductor. Device according to claim 2, comprising a translucent component ( 45 . 53 . 63 . 73 . 83 ) in the frame body ( 43 . 52 . 62 . 72 . 82 ) is arranged to the light-emitting element ( 44 . 55 . 65 . 75 . 85 ) which fluorescent materials ( 64 ) for performing a wavelength conversion with the light emitted from the light-emitting element ( 44 . 55 . 65 . 75 . 85 ) is emitted. Apparatus according to claim 3, wherein a distance between an upper surface of the translucent member ( 45 ) and an active layer of the light-emitting element ( 55 ) is maintained in a range of 0.1 to 0.8 mm. Device according to Claim 2, in which the one end of the wiring conductor is in the form of a conductor layer ( 77 ) is designed, with which the light-emitting element ( 75 ) by a conductive adhesive ( 78 ) is electrically connected, and a bulge ( 79 ) of an insulating material around the conductor layer ( 77 ) is formed around. Device according to Claim 5, in which the conductor layer ( 77 ) is configured so that the conductor layer ( 77 ) within an outer periphery of the light-emitting element (FIG. 75 ) lies. Device according to claim 5, in which the bulge ( 79 ) is shaped so that its side surfaces gradually with increasing proximity to the base body ( 71 ) extend outwardly inclined. Device according to Claim 2, in which the one end of the wiring conductor is in the form of a conductor layer ( 57 ) is designed, with which the light-emitting element ( 55 ) by a conductive adhesive ( 58 ) is electrically connected, and a bulge ( 59 ) in a part of an upper surface of the conductor layer ( 57 ) is formed, which part within the outer periphery of the light-emitting element ( 55 ) lies. Device according to Claim 2, in which the attachment section ( 61a ) from the upper surface of the base body ( 61 ) protrudes. A device according to claim 9, wherein the projecting attachment portion (Fig. 61a ) is shaped so that its side surfaces gradually with increasing proximity to the base body ( 61 ) extend outwardly inclined. Device according to Claim 3, in which the fixing section ( 61a ) from the upper surface of the base body ( 61 ), an active layer ( 69 ) of the light-emitting element ( 65 ) has a higher level than a lower end of the reflection surface ( 62b ) and the translucent component ( 63 ) is arranged so that a distance between its upper surface and the active layer ( 69 ) is maintained in a range of 0.1 to 0.5 mm. Device according to Claim 11, in which the translucent component ( 63 ) is designed so that its central portion in the arithmetic average of the surface roughness is larger than its outer peripheral portion. Device according to Claim 2, in which the attachment section ( 81a ) from the upper surface of the base body ( 81 ) protrudes and on an upper surface of the mounting portion ( 81a ) a conductor layer ( 87 ), which is made of the one end of the wiring conductor and with which the light-emitting element ( 85 ) by a conductive adhesive ( 88 ) is electrically connected, and a bulge ( 89 ) of an insulating material around the conductor layer ( 87 ) is formed around. Device according to Claim 13, in which the conductor layer ( 87 ) is configured so that the conductor layer ( 87 ) within an outer periphery of the light-emitting element (FIG. 85 ) lies. Apparatus according to claim 13, wherein the bulge ( 89 ) is shaped so that its side surfaces gradually with increasing proximity to the base body ( 81 ) extend outwardly inclined. Contraption ( 90 . 90A . 90B . 90C ) comprising: a base body ( 91 ), which is plate-shaped and made of ceramic; a light-emitting element ( 95 ) and a reflection part ( 92 ) connected to an upper surface of the base body ( 91 ), which in the middle of its upper main surface has a convex attachment section ( 92d ), in order to receive the light-emitting element ( 95 ), and further, on an outer periphery of its upper main surface, a side wall portion (FIG. 92a ) which is shaped so that it the attachment portion ( 92d ), wherein an inner peripheral surface of this side wall portion to a reflection surface ( 92c ) for reflecting light, that from the light-emitting element ( 95 ) is formed, wherein the base body ( 91 ) is formed so that crystal grains contained in the ceramic are in an average particle diameter range of 1 to 5 μm. Contraption ( 90 . 90A . 90B . 90C ) according to claim 16, with a translucent component ( 93 ), which within the sidewall portion ( 92a ) is arranged to the light-emitting element ( 95 ) covering fluorescent materials ( 94 ) to perform a wavelength conversion with the light emerging from the light-emitting element ( 95 ) is emitted. Contraption ( 90 . 90A . 90B . 90C ) according to claim 17, in which the translucent component ( 93 ) is arranged so that a distance between its upper surface and the active layer ( 98 ) is maintained in a range of 0.1 to 0.5 mm. Contraption ( 90 . 90A . 90B . 90C ) according to claim 16, wherein the fixing portion is formed in a convex shape. Contraption ( 90A . 90B . 90C ) according to claim 16, wherein the base body ( 91 ) has a wiring conductor formed so as to extend from its upper surface to the outer surface, the reflection member (14). 92 ) around the attachment section ( 92d ) a through hole ( 97 ), which is completely drilled through from the upper main surface to its lower main surface to under the optical Weglinie ( 99 ), and an electrode of the light-emitting element (FIG. 95 ) and on the upper surface of the base body ( 91 ) formed wiring conductor by means of a wire ( 96 ' ) passing through the through hole ( 97 ) is electrically connected to each other. Contraption ( 90C ) according to claim 20, wherein the through-hole ( 97 ) is filled with an insulating paste containing insulating, light-reflecting particles. Illumination device obtained by setting up the light-emitting device ( 41 . 50 . 60 . 60A . 60B . 60C . 60D . 70 . 80 . 90 . 90A . 90B . 90C ) is constructed according to one of claims 2 to 21 in a predetermined arrangement.

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