CN102322581A - LED (light-emitting diode) light source module with high-whiteness substrate - Google Patents
LED (light-emitting diode) light source module with high-whiteness substrate Download PDFInfo
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- CN102322581A CN102322581A CN201110266640A CN201110266640A CN102322581A CN 102322581 A CN102322581 A CN 102322581A CN 201110266640 A CN201110266640 A CN 201110266640A CN 201110266640 A CN201110266640 A CN 201110266640A CN 102322581 A CN102322581 A CN 102322581A
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- led
- source module
- light source
- reflector
- substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 239000011521 glass Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 26
- 239000002184 metal Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides an LED (light-emitting diode) light source module with a high-whiteness substrate. The LED light source module comprises a base and LED chips, wherein the base comprises a substrate and a plurality of reflector cups arranged on the substrate linearly, at least one LED chip is fixed on the bottom of each reflector cup through an insulating adhesive, fluorescent powder and an adhesive layer are coated on the upper surface of each LED chip, and the whiteness of a light-emitting surface on which LEDs are mounted on each reflector cup is not less than 70. According to the invention, the manufacturing process of a reflective layer on a traditional LED metal base can be eliminated, the production process is simplified, and the production cost is lowered greatly, therefore, the industrial production of the LED light source module can be implemented favorably; moreover, the base can be produced directly in a fabricating manner; since the whiteness of the base is improved, the light extraction efficiency of the LED chips can be greatly increased, loss caused by the conversion from light energy to heat can be reduced greatly and the heat radiating performance of the LED light source module can be improved greatly. An LED light equipped with the LED light source module has good safety performance and greatly prolonged service life and is not conductive and not fragile.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present; If traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp; Its reflector efficiency is not high; Particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way; At first its technology is complicated; Production cost is higher, simultaneously, because after having increased one deck reflector layer; Traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.Simultaneously, in traditional led light source module encapsulation construction, be connected owing to need lead-in wire between led chip and the wiring board; But led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing; Be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people; Greatly reduce production efficiency, and production process also becomes more complicated, the increase production cost.
Summary of the invention
The technical problem that the present invention will solve is to provide a kind of and can either saves production cost, enhances productivity, and can keep the high whiteness substrate led light source module of heat dispersion preferably again.
The technical scheme that the present invention adopts is: a kind of high whiteness substrate led light source module; Comprise base and led chip; Said base comprises substrate and is arranged on the some reflectors arranged in a straight line that have on the substrate; The bottom of each reflector is adhesively fixed with at least one led chip through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer, it is characterized in that: light-emitting area whiteness >=70 that are used to install LED on the said reflector.
Said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.
The light-emitting area whiteness that is used to install LED on the said reflector is more preferred from >=and 85.
Be used on the said reflector to install that the light-emitting area whiteness of LED is best is >=88.
The sidewall locations of said adjacent reflector is equipped with opening, forms one group of reflector of strip, also is provided with the circuit board slot on this base, and wiring board is installed in the groove, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of said circuit board slot is provided with a through hole and extends base.
Said circuit board slot is positioned at the reflector at the two ends of base.
The bottom of said circuit board slot is lower than the bottom of reflector.
Said base is a strip, and reflector is circular.
Compared with prior art; The present invention has following advantage: owing to substrate and reflector adopt with pottery or glass through one-body molded fire the high whiteness LED base that forms after; The reflector layer production process that can adopt prefabricated mode Direct Production base can reduce traditional LED employing metab and need to increase; Both simplify production technology, can save production cost, helped large batch of suitability for industrialized production.The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to >=70, can promote well and get optical efficiency, and heat dispersion is excellent; Its whiteness is >=88 best results if lifting is better for >=85 effects if promote; Because after the whiteness of base improves, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, so its heat dispersion also will improve greatly; Good, non-conductive with its its security performance of LED lamp of processing, also improve greatly non-friable service life.Adopt above-mentioned in addition with led chip and wiring board and the lead between them; All be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Simplify production technology, can save production cost greatly.
Description of drawings
Combine embodiment that the present invention is further described with reference to the accompanying drawings.
Fig. 1 is the overall structure sketch map of the high whiteness substrate of the present invention led light source module.
Fig. 2 is the A-A generalized section of Fig. 1.
Fig. 3 is the structural representation of the base of the high whiteness substrate of the present invention led light source module.
Fig. 4 is the B-B generalized section of Fig. 3.
The specific embodiment
Come the present invention is carried out detailed explanation below in conjunction with specific embodiment.
As depicted in figs. 1 and 2; Be a kind of structural representation of high whiteness substrate led light source module, comprise base 10 and some led chips 20, like Fig. 3 and shown in Figure 4; Said base 10 comprises substrate 1 and is arranged on the some reflectors arranged in a straight line 2 that have on the substrate 1; Sidewall 22 positions of adjacent reflector 2 are equipped with opening 21, therefore form one group of reflector of strip, and the bottom of the reflector at the two ends of this base 10 is respectively equipped with circuit board slot 3; The bottom of said circuit board slot 3 is lower than the bottom of reflector 2, is convenient to after wiring board is installed equal with the reflector bottom.Led chip 20 is bonded and fixed at the bottom of one group of reflector 2 of strip through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40; Wiring board 30 is installed in the circuit board slot 3; Said led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity, and base described in the present embodiment is a strip, and reflector is circle.
Said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.
In addition; Can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production; All leads all are encapsulated in fluorescent material and the glue layer, better must reach the object of the invention.
Because traditional general whiteness of LED metab is all less than 70; Therefore in actual production, need light-emitting area above that to increase the reflector layer production process; But do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention adopts the pottery or the glass base of high whiteness, according to the prefabricated size that processes needs of production needs, has both met the requirement of whiteness >=70; Can improve heat dispersion again, adopt above-mentionedly in addition, all be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer led chip and wiring board and the lead between them; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.
Claims (9)
1. one kind high whiteness substrate led light source module; Comprise base and led chip; Said base comprises substrate and is arranged on the some reflectors arranged in a straight line that have on the substrate; The bottom of each reflector is adhesively fixed with at least one led chip through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer, it is characterized in that: light-emitting area whiteness >=70 that are used to install LED on the said reflector.
2. high whiteness substrate led light source module according to claim 1 is characterized in that: said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.
3. high whiteness substrate led light source module according to claim 1 is characterized in that: the light-emitting area whiteness that is used to install LED on the said reflector is more preferred from >=and 85.
4. high whiteness substrate led light source module according to claim 1 is characterized in that: be used on the said reflector to install that the light-emitting area whiteness of LED is best is >=88.
5. high whiteness substrate led light source module according to claim 1; It is characterized in that: the sidewall locations of said adjacent reflector is equipped with opening; Form one group of reflector of strip; Also be provided with the circuit board slot on this base, wiring board is installed in the groove, said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
6. high whiteness substrate led light source module according to claim 5, it is characterized in that: the below of said circuit board slot is provided with a through hole and extends base.
7. high whiteness substrate led light source module according to claim 6, it is characterized in that: said circuit board slot is positioned at the reflector at the two ends of base.
8. high whiteness substrate led light source module according to claim 5, it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.
9. high whiteness substrate led light source module according to claim 1, it is characterized in that: it is characterized in that: said base is a strip, reflector is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110266640A CN102322581A (en) | 2011-09-09 | 2011-09-09 | LED (light-emitting diode) light source module with high-whiteness substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110266640A CN102322581A (en) | 2011-09-09 | 2011-09-09 | LED (light-emitting diode) light source module with high-whiteness substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102322581A true CN102322581A (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110266640A Pending CN102322581A (en) | 2011-09-09 | 2011-09-09 | LED (light-emitting diode) light source module with high-whiteness substrate |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000353406A (en) * | 1999-06-08 | 2000-12-19 | Shinichi Kobayashi | Lamp made of many light emitting diode chips |
| CN1612369A (en) * | 2003-10-30 | 2005-05-04 | 京瓷株式会社 | Light-emitting element reception package, light-emitting device and lighting device |
| CN101749553A (en) * | 2008-12-11 | 2010-06-23 | 上海恒烁光电科技有限公司 | Packaging module of low-power light emitting diode (LED) luminescent chip |
| CN102007609A (en) * | 2008-04-18 | 2011-04-06 | 旭硝子株式会社 | Light-emitting diode package |
| CN201884982U (en) * | 2010-09-30 | 2011-06-29 | 福建省万邦光电科技有限公司 | Novel LED (light-emitting diode) light source module encapsulation structure |
-
2011
- 2011-09-09 CN CN201110266640A patent/CN102322581A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000353406A (en) * | 1999-06-08 | 2000-12-19 | Shinichi Kobayashi | Lamp made of many light emitting diode chips |
| CN1612369A (en) * | 2003-10-30 | 2005-05-04 | 京瓷株式会社 | Light-emitting element reception package, light-emitting device and lighting device |
| CN102007609A (en) * | 2008-04-18 | 2011-04-06 | 旭硝子株式会社 | Light-emitting diode package |
| CN101749553A (en) * | 2008-12-11 | 2010-06-23 | 上海恒烁光电科技有限公司 | Packaging module of low-power light emitting diode (LED) luminescent chip |
| CN201884982U (en) * | 2010-09-30 | 2011-06-29 | 福建省万邦光电科技有限公司 | Novel LED (light-emitting diode) light source module encapsulation structure |
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Application publication date: 20120118 |