DE10196596T1 - Verbindungshalbleiter-Mehrschichtsstruktur und Bipolar-Transistor unter Verwendung derselben - Google Patents

Verbindungshalbleiter-Mehrschichtsstruktur und Bipolar-Transistor unter Verwendung derselben

Info

Publication number
DE10196596T1
DE10196596T1 DE10196596T DE10196596T DE10196596T1 DE 10196596 T1 DE10196596 T1 DE 10196596T1 DE 10196596 T DE10196596 T DE 10196596T DE 10196596 T DE10196596 T DE 10196596T DE 10196596 T1 DE10196596 T1 DE 10196596T1
Authority
DE
Germany
Prior art keywords
same
compound semiconductor
bipolar transistor
multilayer structure
semiconductor multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10196596T
Other languages
English (en)
Other versions
DE10196596B4 (de
Inventor
Taichi Okano
Takashi Udagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000272840A external-priority patent/JP2002083816A/ja
Priority claimed from JP2000362534A external-priority patent/JP2002164533A/ja
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of DE10196596T1 publication Critical patent/DE10196596T1/de
Application granted granted Critical
Publication of DE10196596B4 publication Critical patent/DE10196596B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/15Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
    • H01L29/151Compositional structures
    • H01L29/152Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
    • H01L29/155Comprising only semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/207Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds further characterised by the doping material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/737Hetero-junction transistors
    • H01L29/7371Vertical transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Bipolar Transistors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE10196596T 2000-09-08 2001-08-31 Verfahren zur Herstellung einer Kristallschicht in einer Verbindungshalbleiter-Mehrschichtsstruktur Expired - Fee Related DE10196596B4 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2000-272840 2000-09-08
JP2000272840A JP2002083816A (ja) 2000-09-08 2000-09-08 化合物半導体ヘテロ接合構造体
US23773000P 2000-10-05 2000-10-05
US60/237,730 2000-10-05
JP2000362534A JP2002164533A (ja) 2000-11-29 2000-11-29 化合物半導体積層構造体及びそれを用いたバイポーラトランジスタ
JP2000-362534 2000-11-29
US25489700P 2000-12-13 2000-12-13
US60/254,897 2000-12-13
PCT/JP2001/007536 WO2002021599A2 (en) 2000-09-08 2001-08-31 Compound semiconductor multilayer structure and bipolar transistor using the same

Publications (2)

Publication Number Publication Date
DE10196596T1 true DE10196596T1 (de) 2003-07-10
DE10196596B4 DE10196596B4 (de) 2009-03-05

Family

ID=27481599

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10196596T Expired - Fee Related DE10196596B4 (de) 2000-09-08 2001-08-31 Verfahren zur Herstellung einer Kristallschicht in einer Verbindungshalbleiter-Mehrschichtsstruktur

Country Status (4)

Country Link
US (1) US6876013B2 (de)
AU (1) AU2001282579A1 (de)
DE (1) DE10196596B4 (de)
WO (1) WO2002021599A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6955858B2 (en) * 2001-12-07 2005-10-18 North Carolina State University Transition metal doped ferromagnetic III-V nitride material films and methods of fabricating the same
TWI281833B (en) 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
JP2007335508A (ja) * 2006-06-13 2007-12-27 Nec Electronics Corp 電界効果トランジスタおよびその製造方法
US20190272994A1 (en) * 2009-10-14 2019-09-05 Alta Devices, Inc. High growth rate deposition for group iii/v materials
US11393683B2 (en) 2009-10-14 2022-07-19 Utica Leaseco, Llc Methods for high growth rate deposition for forming different cells on a wafer
EP2628183A4 (de) * 2010-10-12 2014-04-02 Alliance Sustainable Energy Gruppe-iii-v-legierungen mit hoher bandlücke für hocheffiziente optoelektronik
JP6303998B2 (ja) * 2014-11-28 2018-04-04 三菱電機株式会社 アバランシェフォトダイオードの製造方法
JP6852703B2 (ja) * 2018-03-16 2021-03-31 信越半導体株式会社 炭素濃度評価方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162471A (ja) * 1994-12-01 1996-06-21 Furukawa Electric Co Ltd:The ヘテロ接合バイポーラトランジスタ
JP3537246B2 (ja) * 1995-11-14 2004-06-14 三菱電機株式会社 化合物半導体装置の製造方法
JP3227083B2 (ja) 1996-01-24 2001-11-12 日本電信電話株式会社 バイポーラトランジスタの作製方法

Also Published As

Publication number Publication date
US6876013B2 (en) 2005-04-05
US20030183816A1 (en) 2003-10-02
WO2002021599A2 (en) 2002-03-14
DE10196596B4 (de) 2009-03-05
WO2002021599A3 (en) 2002-06-20
AU2001282579A1 (en) 2002-03-22

Similar Documents

Publication Publication Date Title
DE60042045D1 (de) Heteroübergangsbipolartransistoren und entsprechende Herstellungsverfahren
DE60034070D1 (de) Integrierte Halbleitervorrichtung
DE60043122D1 (de) Halbleiterbasis ihre Herstellung und Halbleiterkristallhersetllungsmethode
DE60238361D1 (de) Halbleitersubstratschablone
DK1157023T3 (da) C-21-modificerede epothiloner
DE50112868D1 (de) Halbleiter-chip
DE60227475D1 (de) Halbleiterbauelement
DE60140691D1 (de) Halbleiterdiodenbauelement
DE60131811D1 (de) Heteroübergangsbipolartransistor
DE69940029D1 (de) Halbleiterbauelement
DE69937739D1 (de) Halbleitervorrichtung
DE60033252D1 (de) Mehrschichtige halbleiter-struktur mit phosphid-passiviertem germanium-substrat
DE10238843B8 (de) Halbleiterbauelement
DE60005959D1 (de) Halbleiteranordnung
DE60133429D1 (de) Verdrahtungssubstrat, seine Herstellung und Halbleiterbauteil
DE60040430D1 (de) Halbleiter-Verbindungsstruktur
DE60134189D1 (de) Halbleiteranordnung und Herstellungsverfahren
DE10196596T1 (de) Verbindungshalbleiter-Mehrschichtsstruktur und Bipolar-Transistor unter Verwendung derselben
DE60225790D1 (de) Halbleiterbauelement
DE60025820D1 (de) Monolithische halbleiteranordnung
DE60032651D1 (de) Halbleitermodul
DE50202931D1 (de) Halbleiterstruktur mit feldplatte
DE60019144D1 (de) Halbleitervorrichtung
DE60229812D1 (de) Zusammengesetzte Halbleitervorrichtung
DE60037072D1 (de) Verbindungshalbleiter-Feldeffekttransistor und dessen Herstellungsverfahren

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law

Ref document number: 10196596

Country of ref document: DE

Date of ref document: 20030710

Kind code of ref document: P

8125 Change of the main classification

Ipc: H01L 29207

8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20130301