DE10131123A1 - Photoresistzusammensetzung, die einen Photoradikalbildner und einen Photosäurebildner enthält - Google Patents
Photoresistzusammensetzung, die einen Photoradikalbildner und einen Photosäurebildner enthältInfo
- Publication number
- DE10131123A1 DE10131123A1 DE10131123A DE10131123A DE10131123A1 DE 10131123 A1 DE10131123 A1 DE 10131123A1 DE 10131123 A DE10131123 A DE 10131123A DE 10131123 A DE10131123 A DE 10131123A DE 10131123 A1 DE10131123 A1 DE 10131123A1
- Authority
- DE
- Germany
- Prior art keywords
- photoresist
- photoresist composition
- diphenyl
- triflate
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 104
- 239000000203 mixture Substances 0.000 title claims abstract description 57
- 239000002253 acid Substances 0.000 title claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- -1 alkyl radical Chemical class 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 235000010290 biphenyl Nutrition 0.000 claims description 6
- 239000004305 biphenyl Substances 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- PHSXOZKMZYKHLY-UHFFFAOYSA-N 2-hydroxyethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCO)CC1C=C2 PHSXOZKMZYKHLY-UHFFFAOYSA-N 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 150000001925 cycloalkenes Chemical class 0.000 claims description 3
- 125000005574 norbornylene group Chemical group 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- ZLZZZUYVKRXMRS-UHFFFAOYSA-N (4-benzhydrylphenyl) trifluoromethanesulfonate Chemical compound O(S(=O)(=O)C(F)(F)F)C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 ZLZZZUYVKRXMRS-UHFFFAOYSA-N 0.000 claims description 2
- VUBUXALTYMBEQO-UHFFFAOYSA-N 2,2,3,3,3-pentafluoro-1-phenylpropan-1-one Chemical compound FC(F)(F)C(F)(F)C(=O)C1=CC=CC=C1 VUBUXALTYMBEQO-UHFFFAOYSA-N 0.000 claims description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 claims description 2
- MCVRAVYDLNZUCY-UHFFFAOYSA-N 2-methylhept-5-enoic acid Chemical compound CC=CCCC(C)C(O)=O MCVRAVYDLNZUCY-UHFFFAOYSA-N 0.000 claims description 2
- FYGUSUBEMUKACF-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C(=O)O)CC1C=C2 FYGUSUBEMUKACF-UHFFFAOYSA-N 0.000 claims description 2
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- BZBMBZJUNPMEBD-UHFFFAOYSA-N tert-butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC(C)(C)C)CC1C=C2 BZBMBZJUNPMEBD-UHFFFAOYSA-N 0.000 claims description 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 claims description 2
- CYJIAJHBQYSDNE-UHFFFAOYSA-N [4-(2-methylpropyl)-2,3-diphenylphenyl] trifluoromethanesulfonate Chemical compound C=1C=CC=CC=1C=1C(CC(C)C)=CC=C(OS(=O)(=O)C(F)(F)F)C=1C1=CC=CC=C1 CYJIAJHBQYSDNE-UHFFFAOYSA-N 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 8
- 150000003254 radicals Chemical class 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000031700 light absorption Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- WJYYHJOAZPZSQG-UHFFFAOYSA-N (4-methoxy-2,3-diphenylphenyl) trifluoromethanesulfonate Chemical compound C=1C=CC=CC=1C=1C(OC)=CC=C(OS(=O)(=O)C(F)(F)F)C=1C1=CC=CC=C1 WJYYHJOAZPZSQG-UHFFFAOYSA-N 0.000 description 1
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 1
- AQTMPYCVJDXCIR-UHFFFAOYSA-N 2-hydroxyethyl bicyclo[2.2.2]oct-2-ene-5-carboxylate Chemical compound C1CC2C(C(=O)OCCO)CC1C=C2 AQTMPYCVJDXCIR-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- RFIHUFUZAHTZOQ-UHFFFAOYSA-N butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCCC)CC1C=C2 RFIHUFUZAHTZOQ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229940070721 polyacrylate Drugs 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LXAWHMFHGHNIHC-UHFFFAOYSA-N sulfanyl trifluoromethanesulfonate Chemical compound FC(F)(F)S(=O)(=O)OS LXAWHMFHGHNIHC-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/117—Free radical
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/124—Carbonyl compound containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/126—Halogen compound containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000037228A KR100583095B1 (ko) | 2000-06-30 | 2000-06-30 | 광산 발생제와 함께 광 라디칼 발생제(prg)를 포함하는포토레지스트 조성물 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10131123A1 true DE10131123A1 (de) | 2002-02-14 |
Family
ID=19675463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10131123A Withdrawn DE10131123A1 (de) | 2000-06-30 | 2001-06-28 | Photoresistzusammensetzung, die einen Photoradikalbildner und einen Photosäurebildner enthält |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6692891B2 (https=) |
| JP (1) | JP3875519B2 (https=) |
| KR (1) | KR100583095B1 (https=) |
| CN (1) | CN1241065C (https=) |
| DE (1) | DE10131123A1 (https=) |
| GB (1) | GB2364392B (https=) |
| TW (1) | TWI225967B (https=) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2197869B1 (en) * | 2007-10-10 | 2013-04-24 | Basf Se | Sulphonium salt initiators |
| JP5834630B2 (ja) * | 2011-02-04 | 2015-12-24 | 日立化成株式会社 | 樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP5884961B2 (ja) * | 2011-04-27 | 2016-03-15 | 日産化学工業株式会社 | 光ラジカル重合開始剤を含む感光性レジスト下層膜形成組成物 |
| CN103582605B (zh) | 2011-05-23 | 2017-04-05 | 奥的斯电梯公司 | 多边形补偿联接系统、乘客输送系统和减小链驱动系统中的多边形效应的方法 |
| WO2013090892A1 (en) * | 2011-12-16 | 2013-06-20 | The University Of Akron | Substituted phenacyl molecules and photoresponsive polymers |
| JP5772642B2 (ja) * | 2012-02-09 | 2015-09-02 | Jsr株式会社 | 硬化性樹脂組成物、表示素子用硬化膜、表示素子用硬化膜の形成方法及び表示素子 |
| WO2013119134A1 (en) * | 2012-10-16 | 2013-08-15 | Eugen Pavel | Photoresist with rare-earth sensitizers |
| WO2014126834A2 (en) | 2013-02-12 | 2014-08-21 | Eipi Systems, Inc. | Method and apparatus for three-dimensional fabrication with feed through carrier |
| CA2898098A1 (en) | 2013-02-12 | 2014-08-21 | Carbon3D, Inc. | Method and apparatus for three-dimensional fabrication |
| WO2015142546A1 (en) | 2014-03-21 | 2015-09-24 | Carbon3D, Inc. | Method and apparatus for three-dimensional fabrication with gas injection through carrier |
| EP3656559A1 (en) | 2014-04-25 | 2020-05-27 | Carbon, Inc. | Continuous three dimensional fabrication from immiscible liquids |
| US10569465B2 (en) | 2014-06-20 | 2020-02-25 | Carbon, Inc. | Three-dimensional printing using tiled light engines |
| US10661501B2 (en) | 2014-06-20 | 2020-05-26 | Carbon, Inc. | Three-dimensional printing method using increased light intensity and apparatus therefor |
| KR20170017941A (ko) | 2014-06-20 | 2017-02-15 | 카본, 인크. | 중합성 액체의 왕복 공급을 통한 3차원 프린팅 |
| BR112016029755A2 (pt) | 2014-06-23 | 2017-08-22 | Carbon Inc | métodos de produção de objetos tridimensionais a partir de materiais tendo múltiplos mecanismos de endurecimento |
| US11390062B2 (en) | 2014-08-12 | 2022-07-19 | Carbon, Inc. | Three-dimensional printing with supported build plates |
| EP3240671B1 (en) | 2014-12-31 | 2020-12-16 | Carbon, Inc. | Three-dimensional printing of objects with breathing orifices |
| WO2016112084A1 (en) | 2015-01-06 | 2016-07-14 | Carbon3D, Inc. | Build plate for three dimensional printing having a rough or patterned surface |
| WO2016112090A1 (en) | 2015-01-07 | 2016-07-14 | Carbon3D, Inc. | Microfluidic devices and methods of making the same |
| EP3245044B1 (en) | 2015-01-13 | 2021-05-05 | Carbon, Inc. | Three-dimensional printing with build plates having surface topologies for increasing permeability and related methods |
| EP3250369B8 (en) | 2015-01-30 | 2020-10-28 | Carbon, Inc. | Build plates for continuous liquid interface printing having permeable base and adhesive for increasing permeability and related method and apparatus |
| US20180133959A1 (en) | 2015-01-30 | 2018-05-17 | Carbon, Inc. | Build plates for continuous liquid interface printing having permeable sheets and related methods, systems and devices |
| EP3253558B1 (en) | 2015-02-05 | 2020-04-08 | Carbon, Inc. | Method of additive manufacturing by fabrication through multiple zones |
| WO2016133759A1 (en) | 2015-02-20 | 2016-08-25 | Carbon3D, Inc. | Methods and apparatus for continuous liquid interface printing with electrochemically supported dead zone |
| US20180015662A1 (en) | 2015-03-05 | 2018-01-18 | Carbon, Inc. | Fabrication of three dimensional objects with variable slice thickness |
| US10391711B2 (en) | 2015-03-05 | 2019-08-27 | Carbon, Inc. | Fabrication of three dimensional objects with multiple operating modes |
| WO2016140891A1 (en) | 2015-03-05 | 2016-09-09 | Carbon3D, Inc. | Continuous liquid interface production with sequential patterned exposure |
| WO2016145050A1 (en) | 2015-03-10 | 2016-09-15 | Carbon3D, Inc. | Microfluidic devices having flexible features and methods of making the same |
| WO2016145182A1 (en) | 2015-03-12 | 2016-09-15 | Carbon3D, Inc. | Additive manufacturing using polymerization initiators or inhibitors having controlled migration |
| WO2016149097A1 (en) | 2015-03-13 | 2016-09-22 | Carbon3D, Inc. | Three-dimensional printing with reduced pressure build plate unit |
| WO2016149104A1 (en) | 2015-03-13 | 2016-09-22 | Carbon3D, Inc. | Three-dimensional printing with flexible build plates |
| WO2016149151A1 (en) | 2015-03-13 | 2016-09-22 | Carbon3D, Inc. | Three-dimensional printing with concurrent delivery of different polymerizable liquids |
| WO2017048710A1 (en) | 2015-09-14 | 2017-03-23 | Carbon, Inc. | Light-curable article of manufacture with portions of differing solubility |
| JP6889155B2 (ja) | 2015-09-25 | 2021-06-18 | カーボン,インコーポレイテッド | ライティングパネルを有する継続的液体相間印刷用のビルドプレートアセンブリー、及び関連した方法、システム並びにデバイス |
| US20180243976A1 (en) | 2015-09-30 | 2018-08-30 | Carbon, Inc. | Method and Apparatus for Producing Three- Dimensional Objects |
| US12010287B2 (en) | 2015-10-09 | 2024-06-11 | Southern Methodist University | System and method for a three-dimensional optical switch display device |
| US12558845B2 (en) | 2015-10-09 | 2026-02-24 | Southern Methodist University | System and method for a three-dimensional optical switch display device |
| US10647873B2 (en) | 2015-10-30 | 2020-05-12 | Carbon, Inc. | Dual cure article of manufacture with portions of differing solubility |
| WO2017112521A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Production of flexible products by additive manufacturing with dual cure resins |
| CN108139665B (zh) | 2015-12-22 | 2022-07-05 | 卡本有限公司 | 用于用双重固化树脂的增材制造的双重前体树脂系统 |
| WO2017112483A2 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Accelerants for additive manufacturing with dual cure resins |
| JP6944935B2 (ja) | 2015-12-22 | 2021-10-06 | カーボン,インコーポレイテッド | 二重硬化樹脂を用いた積層造形による複数の中間体からの複合生産物の製作 |
| WO2017112571A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products |
| SG11201809614VA (en) | 2016-05-31 | 2018-11-29 | Univ Northwestern | Method for the fabrication of three-dimensional objects and apparatus for same |
| CN109153173B (zh) | 2016-07-01 | 2021-08-24 | 卡本有限公司 | 用于通过建造板脱气来减少气泡的三维打印方法和设备 |
| WO2018094131A1 (en) | 2016-11-21 | 2018-05-24 | Carbon, Inc. | Method of making three-dimensional object by delivering reactive component for subsequent cure |
| US10239255B2 (en) | 2017-04-11 | 2019-03-26 | Molecule Corp | Fabrication of solid materials or films from a polymerizable liquid |
| US11693318B2 (en) * | 2018-07-17 | 2023-07-04 | Shin-Etsu Chemical Co., Ltd. | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix |
| NL2022372B1 (en) | 2018-12-17 | 2020-07-03 | What The Future Venture Capital Wtfvc B V | Process for producing a cured 3d product |
| CN118636467A (zh) | 2019-03-07 | 2024-09-13 | 西北大学 | 形成三维物体的方法和形成三维物体的设备 |
| AU2020271078A1 (en) | 2019-04-09 | 2021-11-04 | Azul 3D, Inc. | Methodologies to rapidly cure and coat parts produced by additive manufacturing |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US245029A (en) * | 1881-08-02 | Sole-fastening staple | ||
| US4245029A (en) * | 1979-08-20 | 1981-01-13 | General Electric Company | Photocurable compositions using triarylsulfonium salts |
| US4968582A (en) * | 1988-06-28 | 1990-11-06 | Mcnc And University Of Nc At Charlotte | Photoresists resistant to oxygen plasmas |
| ES2110987T3 (es) * | 1990-11-05 | 1998-03-01 | Tokyo Ohka Kogyo Co Ltd | Composiciones fotopolimerizables. |
| JPH04349463A (ja) * | 1991-05-27 | 1992-12-03 | Nippon Telegr & Teleph Corp <Ntt> | ポジ型レジスト材料 |
| US5393642A (en) * | 1992-12-31 | 1995-02-28 | The University Of North Carolina At Charlotte | Ionic modification of organic resins and photoresists to produce photoactive etch resistant compositions |
| WO1997033198A1 (en) * | 1996-03-07 | 1997-09-12 | The B.F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
| KR100265597B1 (ko) * | 1996-12-30 | 2000-09-15 | 김영환 | Arf 감광막 수지 및 그 제조방법 |
| JP3802179B2 (ja) * | 1997-02-07 | 2006-07-26 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP3832013B2 (ja) | 1997-03-17 | 2006-10-11 | Jsr株式会社 | プラズマディスプレイパネル用螢光面の形成方法 |
| JPH1195435A (ja) | 1997-09-17 | 1999-04-09 | Fuji Photo Film Co Ltd | ポジ型感光性着色組成物 |
| JPH11305433A (ja) * | 1998-04-21 | 1999-11-05 | Toppan Printing Co Ltd | 感光性組成物、感光性着色組成物及びその感光性着色組成物を用いたカラーフィルタ |
| KR100279497B1 (ko) * | 1998-07-16 | 2001-02-01 | 박찬구 | 술포늄 염의 제조방법 |
| KR20000056355A (ko) * | 1999-02-19 | 2000-09-15 | 김영환 | 고농도의 아민 존재하에서 우수한 특성을 갖는 포토레지스트 조성물 |
| KR100481601B1 (ko) | 1999-09-21 | 2005-04-08 | 주식회사 하이닉스반도체 | 광산 발생제와 함께 광염기 발생제를 포함하는 포토레지스트 조성물 |
-
2000
- 2000-06-30 KR KR1020000037228A patent/KR100583095B1/ko not_active Expired - Fee Related
-
2001
- 2001-06-12 GB GB0114259A patent/GB2364392B/en not_active Expired - Fee Related
- 2001-06-12 US US09/879,325 patent/US6692891B2/en not_active Expired - Fee Related
- 2001-06-21 TW TW090115057A patent/TWI225967B/zh not_active IP Right Cessation
- 2001-06-28 DE DE10131123A patent/DE10131123A1/de not_active Withdrawn
- 2001-06-29 CN CNB011188952A patent/CN1241065C/zh not_active Expired - Fee Related
- 2001-07-02 JP JP2001200816A patent/JP3875519B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6692891B2 (en) | 2004-02-17 |
| JP3875519B2 (ja) | 2007-01-31 |
| KR100583095B1 (ko) | 2006-05-24 |
| GB2364392B (en) | 2004-08-18 |
| JP2002082440A (ja) | 2002-03-22 |
| GB0114259D0 (en) | 2001-08-01 |
| GB2364392A (en) | 2002-01-23 |
| TWI225967B (en) | 2005-01-01 |
| CN1330288A (zh) | 2002-01-09 |
| CN1241065C (zh) | 2006-02-08 |
| US20020012873A1 (en) | 2002-01-31 |
| KR20020002877A (ko) | 2002-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE10131123A1 (de) | Photoresistzusammensetzung, die einen Photoradikalbildner und einen Photosäurebildner enthält | |
| DE69936750T2 (de) | Photoresist-Zusammenstetzungen, die Gemische ionischer und nicht-ionischer Fotosäureerzeuger umfassen | |
| EP0031592B1 (de) | Photopolymerisierbares Gemisch und damit hergestelltes photopolymerisierbares Kopiermaterial | |
| DE69131658T2 (de) | Licht- oder strahlungsempfindliche Zusammensetzung | |
| DE10046891A1 (de) | Photoresistzusammensetzung, die einen Photobase-Bildner und einen Photosäure-Bildner enthält | |
| DE19912047B4 (de) | Resistzusammensetzung des Negativtyps | |
| EP0342498B1 (de) | Positiv und negativ arbeitende strahlungsempfindliche Gemische sowie Verfahren zur Herstellung von Reliefmustern | |
| DE69930832T2 (de) | Benutzung einer zusammensetzung für eine antireflexunterschicht | |
| DE69431618T2 (de) | Strahlungsempfindliches Material und Verfahren zur Herstellung eines Musters | |
| DE3750937T2 (de) | Lithographische Methode unter Benutzung hochempfindlicher, wärmebeständiger Photolacke, die ein Netz von Wasserstoffbrücken bilden. | |
| DE69800033T2 (de) | Strahlungsempfindliches Resistmaterial und Verfahren zur Herstellung einer Vorrichtung unter Benutzung des strahlungsempfindlichen Resistmaterials | |
| DE69926963T2 (de) | Chemisch verstärkte Positivphotoresistzusammensetzungen | |
| DE19956531A1 (de) | Vernetzer für ein Photoresist und diesen enthaltende Photoresistzusammensetzung | |
| DE2706878A1 (de) | Strahlungsempfindliches material | |
| DE19907700B4 (de) | Polymermaterial für ein Photoresist, dieses enthaltende Photoresistzusammensetzung und Herstellungsverfahren hierfür | |
| DE19800633A1 (de) | Verfahren und Vorrichtung unter Verwendung eines ArF Photoresists | |
| EP0553737B1 (de) | Strahlungsempfindliches Gemisch | |
| DE3817011A1 (de) | Strahlungsempfindliches gemisch und verfahren zur herstellung von reliefmustern | |
| DE4400975C2 (de) | Verfahren zum Ausbilden von Mustern | |
| DE69610161T2 (de) | Positiv arbeitende Fotoresistzusammensetzung | |
| DE10040963A1 (de) | Vernetzermonomer, umfassend eine Doppelbindung, und ein dieses enthaltendes Photoresist-Copolymer | |
| DE10147011B4 (de) | Chemisch verstärkte Resistzusammensetzung und Verfahren zur Bildung eines gemusterten Films unter Verwendung derselben | |
| DE19956532A1 (de) | Vernetzer für ein Photoresist und diesen enthaltende Photoresistzusammensetzung | |
| DE10120673B4 (de) | Verfahren zur Strukturierung einer Photolackschicht | |
| DE4203557C2 (de) | Verfahren zur Bildung eines Photoresistmusters und Verwendung einer organischen Silanverbindung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8127 | New person/name/address of the applicant |
Owner name: MAGNACHIP SEMICONDUCTOR, LTD., CHEONGJU, KR |
|
| 8127 | New person/name/address of the applicant |
Owner name: HYNIX SEMICONDUCTOR INC., ICHON, KYONGGI, KR |
|
| 8139 | Disposal/non-payment of the annual fee |