DE10118231A1 - Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung - Google Patents

Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung

Info

Publication number
DE10118231A1
DE10118231A1 DE10118231A DE10118231A DE10118231A1 DE 10118231 A1 DE10118231 A1 DE 10118231A1 DE 10118231 A DE10118231 A DE 10118231A DE 10118231 A DE10118231 A DE 10118231A DE 10118231 A1 DE10118231 A1 DE 10118231A1
Authority
DE
Germany
Prior art keywords
optoelectronic component
dam
potting material
potting
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10118231A
Other languages
German (de)
English (en)
Inventor
Lutz Rissing
Florian Obermayer
Florian Schroll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dr Johannes Heidenhain GmbH
Original Assignee
Dr Johannes Heidenhain GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7681320&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE10118231(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dr Johannes Heidenhain GmbH filed Critical Dr Johannes Heidenhain GmbH
Priority to DE10118231A priority Critical patent/DE10118231A1/de
Priority to US10/474,953 priority patent/US6861683B2/en
Priority to EP02732539.8A priority patent/EP1380056B2/de
Priority to PCT/EP2002/003564 priority patent/WO2002084746A2/de
Priority to AT02732539T priority patent/ATE363132T1/de
Priority to JP2002581589A priority patent/JP4369127B2/ja
Priority to DE50210203T priority patent/DE50210203D1/de
Publication of DE10118231A1 publication Critical patent/DE10118231A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Photovoltaic Devices (AREA)
DE10118231A 2001-04-11 2001-04-11 Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung Withdrawn DE10118231A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE10118231A DE10118231A1 (de) 2001-04-11 2001-04-11 Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung
US10/474,953 US6861683B2 (en) 2001-04-11 2002-03-30 Optoelectronic component using two encapsulating materials and the method of making the same
EP02732539.8A EP1380056B2 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung
PCT/EP2002/003564 WO2002084746A2 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung
AT02732539T ATE363132T1 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung
JP2002581589A JP4369127B2 (ja) 2001-04-11 2002-03-30 光電素子配置
DE50210203T DE50210203D1 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10118231A DE10118231A1 (de) 2001-04-11 2001-04-11 Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung

Publications (1)

Publication Number Publication Date
DE10118231A1 true DE10118231A1 (de) 2002-10-17

Family

ID=7681320

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10118231A Withdrawn DE10118231A1 (de) 2001-04-11 2001-04-11 Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung
DE50210203T Expired - Lifetime DE50210203D1 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE50210203T Expired - Lifetime DE50210203D1 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung

Country Status (6)

Country Link
US (1) US6861683B2 (enExample)
EP (1) EP1380056B2 (enExample)
JP (1) JP4369127B2 (enExample)
AT (1) ATE363132T1 (enExample)
DE (2) DE10118231A1 (enExample)
WO (1) WO2002084746A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722420A1 (de) 2005-05-09 2006-11-15 Dr. Johannes Heidenhain GmbH Optoelekrtonische Anordnung und Verfahren zu deren Herstellung

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US7273767B2 (en) * 2004-12-31 2007-09-25 Carsem (M) Sdn. Bhd. Method of manufacturing a cavity package
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US7354800B2 (en) * 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7663214B2 (en) * 2005-07-25 2010-02-16 Kingston Technology Corporation High-capacity memory card and method of making the same
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US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7723146B2 (en) * 2006-01-04 2010-05-25 Stats Chippac Ltd. Integrated circuit package system with image sensor system
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
US8704349B2 (en) 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
RU2308788C1 (ru) * 2006-03-31 2007-10-20 Федеральное государственное унитарное предприятие "НПО "ОРИОН" ФГУП "НПО "ОРИОН" Способ сборки фотоприемников на основе сернистого свинца с применением метода полимерной герметизации
US20080122122A1 (en) * 2006-11-08 2008-05-29 Weng Fei Wong Semiconductor package with encapsulant delamination-reducing structure and method of making the package
CA2609611A1 (en) * 2007-09-10 2009-03-10 Veris Industries, Llc Split core status indicator
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US8212548B2 (en) 2008-06-02 2012-07-03 Veris Industries, Llc Branch meter with configurable sensor strip arrangement
US8421443B2 (en) 2008-11-21 2013-04-16 Veris Industries, Llc Branch current monitor with calibration
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US10006948B2 (en) 2011-02-25 2018-06-26 Veris Industries, Llc Current meter with voltage awareness
US9146264B2 (en) 2011-02-25 2015-09-29 Veris Industries, Llc Current meter with on board memory
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CN102931178A (zh) * 2012-07-30 2013-02-13 易美芯光（北京）科技有限公司 一种新型led集成光源封装结构
US10242969B2 (en) * 2013-11-12 2019-03-26 Infineon Technologies Ag Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
US9196510B2 (en) 2013-11-12 2015-11-24 Infineon Technologies Ag Semiconductor package comprising two semiconductor modules and laterally extending connectors
US10371730B2 (en) 2015-12-28 2019-08-06 Veris Industries, Llc Branch current monitor with client level access
US10274572B2 (en) 2015-12-28 2019-04-30 Veris Industries, Llc Calibration system for a power meter
US10408911B2 (en) 2015-12-28 2019-09-10 Veris Industries, Llc Network configurable system for a power meter
US10371721B2 (en) 2015-12-28 2019-08-06 Veris Industries, Llc Configuration system for a power meter
WO2018008539A1 (ja) * 2016-07-08 2018-01-11 住友化学株式会社 紫外線発光半導体装置およびその製造方法
US11215650B2 (en) 2017-02-28 2022-01-04 Veris Industries, Llc Phase aligned branch energy meter
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EP0732740A2 (de) * 1995-03-15 1996-09-18 Siemens Aktiengesellschaft Halbleiterbauelement mit Kunststoffumhüllung
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DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722420A1 (de) 2005-05-09 2006-11-15 Dr. Johannes Heidenhain GmbH Optoelekrtonische Anordnung und Verfahren zu deren Herstellung
US7535729B2 (en) 2005-05-09 2009-05-19 Dr. Johannes Heidenhain Gmbh Optoelectronic system and method for its manufacture

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ATE363132T1 (de) 2007-06-15
EP1380056B1 (de) 2007-05-23
DE50210203D1 (de) 2007-07-05
JP4369127B2 (ja) 2009-11-18
WO2002084746A2 (de) 2002-10-24
US6861683B2 (en) 2005-03-01
EP1380056B2 (de) 2014-07-09
JP2004528713A (ja) 2004-09-16
WO2002084746A3 (de) 2003-10-30
US20040150064A1 (en) 2004-08-05
EP1380056A2 (de) 2004-01-14

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