DE10004964B4 - Mikromechanische Kappenstruktur - Google Patents

Mikromechanische Kappenstruktur Download PDF

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Publication number
DE10004964B4
DE10004964B4 DE10004964A DE10004964A DE10004964B4 DE 10004964 B4 DE10004964 B4 DE 10004964B4 DE 10004964 A DE10004964 A DE 10004964A DE 10004964 A DE10004964 A DE 10004964A DE 10004964 B4 DE10004964 B4 DE 10004964B4
Authority
DE
Germany
Prior art keywords
cavern
micromechanical
cap structure
substrate
micromechanical cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE10004964A
Other languages
German (de)
English (en)
Other versions
DE10004964A1 (de
Inventor
Stefan Dr. Pinter
Harald Emmerich
Hans-Peter Dr. Trah
Helmut Dr. Baumann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE10004964A priority Critical patent/DE10004964B4/de
Priority to JP2001027356A priority patent/JP2001269900A/ja
Priority to US09/776,839 priority patent/US6462392B1/en
Publication of DE10004964A1 publication Critical patent/DE10004964A1/de
Application granted granted Critical
Publication of DE10004964B4 publication Critical patent/DE10004964B4/de
Priority to JP2011237797A priority patent/JP2012091317A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/007—For controlling stiffness, e.g. ribs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0163—Reinforcing a cap, e.g. with ribs

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
DE10004964A 2000-02-04 2000-02-04 Mikromechanische Kappenstruktur Expired - Lifetime DE10004964B4 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE10004964A DE10004964B4 (de) 2000-02-04 2000-02-04 Mikromechanische Kappenstruktur
JP2001027356A JP2001269900A (ja) 2000-02-04 2001-02-02 マイクロメカニック式のキャップ構造及びその製造方法
US09/776,839 US6462392B1 (en) 2000-02-04 2001-02-05 Micromechanical cap structure and the respective manufacturing method
JP2011237797A JP2012091317A (ja) 2000-02-04 2011-10-28 マイクロメカニック式のキャップ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10004964A DE10004964B4 (de) 2000-02-04 2000-02-04 Mikromechanische Kappenstruktur

Publications (2)

Publication Number Publication Date
DE10004964A1 DE10004964A1 (de) 2001-08-09
DE10004964B4 true DE10004964B4 (de) 2010-07-29

Family

ID=7629842

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10004964A Expired - Lifetime DE10004964B4 (de) 2000-02-04 2000-02-04 Mikromechanische Kappenstruktur

Country Status (3)

Country Link
US (1) US6462392B1 (enExample)
JP (2) JP2001269900A (enExample)
DE (1) DE10004964B4 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940636B2 (en) 2001-09-20 2005-09-06 Analog Devices, Inc. Optical switching apparatus and method of assembling same
US6893574B2 (en) * 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US6933163B2 (en) 2002-09-27 2005-08-23 Analog Devices, Inc. Fabricating integrated micro-electromechanical systems using an intermediate electrode layer
US6964882B2 (en) 2002-09-27 2005-11-15 Analog Devices, Inc. Fabricating complex micro-electromechanical systems using a flip bonding technique
TWI251712B (en) * 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
US7405924B2 (en) 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US7573547B2 (en) 2004-09-27 2009-08-11 Idc, Llc System and method for protecting micro-structure of display array using spacers in gap within display device
US7184202B2 (en) 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7446926B2 (en) * 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
WO2007120885A2 (en) 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc. Mems devices and processes for packaging such devices
JP2008135690A (ja) * 2006-10-30 2008-06-12 Denso Corp 半導体力学量センサおよびその製造方法
DE102006061943B4 (de) 2006-12-29 2023-03-30 Pictiva Displays International Limited Lichtemittierende Vorrichtung
US8830695B2 (en) * 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
DE102007044806A1 (de) * 2007-09-20 2009-04-02 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
CN102196989A (zh) * 2008-10-29 2011-09-21 Nxp股份有限公司 集成部件和集成部件的制造方法
US8379392B2 (en) 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
EP2327658B1 (en) * 2009-11-30 2018-07-04 IMEC vzw Method for manufacturing microelectronic devices and devices according to such method
JP2013519917A (ja) * 2010-02-12 2013-05-30 エーゲンライト・コーポレーション 一列に並んだ光ファイバーデバイス用のリード線付き貫通接続部を有する気密性パッケージおよび作製方法
DE102012222426B4 (de) * 2012-12-06 2015-01-08 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauelement
ITTO20130247A1 (it) * 2013-03-26 2014-09-27 St Microelectronics Srl Metodo di incapsulamento di un dispositivo trasduttore mems e dispositivo trasduttore mems incapsulato

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD272704A1 (de) * 1988-05-18 1989-10-18 Teltov Geraete Regler Quadratische oder rechteckfoermige (100)-orientierte membran aus monokristallinem silizium und verfahren zur herstellung
DE4316279A1 (de) * 1992-05-15 1993-11-18 Hitachi Ltd Halbleiter-Beschleunigungsmesser
DE4218789A1 (de) * 1992-06-06 1993-12-09 Philips Patentverwaltung Mikroelektronikkompatibler pyroelektrischer Detektor und Verfahren zu seiner Herstellung
DE19620940A1 (de) * 1995-11-17 1997-05-22 Werner Prof Dr Buff Elektronisches Bauelement und Verfahren zu seiner Herstellung
DE19819456A1 (de) * 1998-04-30 1999-11-04 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements

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JPS6013314B2 (ja) * 1978-08-09 1985-04-06 株式会社日立製作所 圧力−電気信号変換装置
US4699006A (en) * 1984-03-19 1987-10-13 The Charles Stark Draper Laboratory, Inc. Vibratory digital integrating accelerometer
JP2728807B2 (ja) * 1991-07-24 1998-03-18 株式会社日立製作所 静電容量式加速度センサ
JPH07159432A (ja) * 1993-12-03 1995-06-23 Matsushita Electric Works Ltd 半導体加速度センサ
JPH0832088A (ja) * 1994-07-12 1996-02-02 Seiko Instr Inc 半導体加速度センサのストッパーの形成方法
SE9500729L (sv) * 1995-02-27 1996-08-28 Gert Andersson Anordning för mätning av vinkelhastighet i enkristallint material samt förfarande för framställning av sådan
JPH08274208A (ja) * 1995-03-29 1996-10-18 Toyo Commun Equip Co Ltd セラミックパッケージの封止蓋の構造
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
JP3767836B2 (ja) * 1997-06-13 2006-04-19 シャープ株式会社 変形可能ミラー及びその製造方法
DE19757197A1 (de) * 1997-12-22 1999-06-24 Bosch Gmbh Robert Herstellungsverfahren für mikromechanische Vorrichtung
US6201283B1 (en) * 1999-09-08 2001-03-13 Trw Inc. Field effect transistor with double sided airbridge

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD272704A1 (de) * 1988-05-18 1989-10-18 Teltov Geraete Regler Quadratische oder rechteckfoermige (100)-orientierte membran aus monokristallinem silizium und verfahren zur herstellung
DE4316279A1 (de) * 1992-05-15 1993-11-18 Hitachi Ltd Halbleiter-Beschleunigungsmesser
DE4218789A1 (de) * 1992-06-06 1993-12-09 Philips Patentverwaltung Mikroelektronikkompatibler pyroelektrischer Detektor und Verfahren zu seiner Herstellung
DE19620940A1 (de) * 1995-11-17 1997-05-22 Werner Prof Dr Buff Elektronisches Bauelement und Verfahren zu seiner Herstellung
DE19819456A1 (de) * 1998-04-30 1999-11-04 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Menz, W., Mohr, J.: "Mikrosystemtechnik für Ingenieure", 1997, ISBN 3-527-29405-8, S. 224 *

Also Published As

Publication number Publication date
DE10004964A1 (de) 2001-08-09
JP2012091317A (ja) 2012-05-17
JP2001269900A (ja) 2001-10-02
US6462392B1 (en) 2002-10-08

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8364 No opposition during term of opposition
R071 Expiry of right