DD161115A3 - Halbleiter-modul - Google Patents

Halbleiter-modul Download PDF

Info

Publication number
DD161115A3
DD161115A3 DD81229458A DD22945881A DD161115A3 DD 161115 A3 DD161115 A3 DD 161115A3 DD 81229458 A DD81229458 A DD 81229458A DD 22945881 A DD22945881 A DD 22945881A DD 161115 A3 DD161115 A3 DD 161115A3
Authority
DD
German Democratic Republic
Prior art keywords
kopnyca
nyhkty
nyhkt
noyhkty
κορ
Prior art date
Application number
DD81229458A
Other languages
German (de)
English (en)
Inventor
Michal Pellant
Jiri Lanka
Timotej Simko
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of DD161115A3 publication Critical patent/DD161115A3/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Thyristors (AREA)
DD81229458A 1980-06-10 1981-04-21 Halbleiter-modul DD161115A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS804087A CS214034B1 (en) 1980-06-10 1980-06-10 Semiconductor modulus

Publications (1)

Publication Number Publication Date
DD161115A3 true DD161115A3 (de) 1984-10-24

Family

ID=5382853

Family Applications (1)

Application Number Title Priority Date Filing Date
DD81229458A DD161115A3 (de) 1980-06-10 1981-04-21 Halbleiter-modul

Country Status (3)

Country Link
CS (1) CS214034B1 (enExample)
DD (1) DD161115A3 (enExample)
DE (1) DE3123036A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406528A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3621994A1 (de) * 1986-07-01 1988-01-14 Bbc Brown Boveri & Cie Leistungshalbleitermodul
DE9413550U1 (de) * 1994-08-23 1996-01-11 Dylec Ltd., Saint Peter Port, Guernsey Halbleiteranordnung mit wenigstens einem Halbleiterbauelement
FR2754390A1 (fr) * 1996-10-07 1998-04-10 Gec Alsthom Transport Sa Module de puissance a composants electroniques semi-conducteurs de puissance et interrupteur de forte puissance comportant au moins un tel module de puissance
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss
EP2489956B2 (de) * 2011-02-21 2020-09-09 Gerdes Holding GmbH & Co. KG Kühleinrichtung eines elektrischen, sich erwärmenden Bauelements

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3363150A (en) * 1964-05-25 1968-01-09 Gen Electric Glass encapsulated double heat sink diode assembly
GB1183291A (en) * 1968-02-14 1970-03-04 Siemens Ag Rectifier Arrangement
DE2456955A1 (de) * 1974-12-02 1976-07-08 Licentia Gmbh Anordnung fuer aus leiterplatten zusammengesetzte dioden- und gleichrichterschaltungen
JPS583386B2 (ja) * 1975-10-11 1983-01-21 株式会社日立製作所 ソウホウコウセイホトサイリスタ
DE2639974A1 (de) * 1976-09-04 1978-03-09 Thermoplan Waermetechnische An Vorrichtung zum verschwelen von abfaellen aller art
DE2641032C2 (de) * 1976-09-11 1982-09-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Stromrichtermodul
DE2728564A1 (de) * 1977-06-24 1979-01-11 Siemens Ag Halbleiterbauelement
US4160992A (en) * 1977-09-14 1979-07-10 Raytheon Company Plural semiconductor devices mounted between plural heat sinks
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit

Also Published As

Publication number Publication date
CS214034B1 (en) 1982-04-09
DE3123036A1 (de) 1982-03-18
DE3123036C2 (enExample) 1989-05-03

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