CN2874771Y - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN2874771Y
CN2874771Y CN200520120943.4U CN200520120943U CN2874771Y CN 2874771 Y CN2874771 Y CN 2874771Y CN 200520120943 U CN200520120943 U CN 200520120943U CN 2874771 Y CN2874771 Y CN 2874771Y
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CN
China
Prior art keywords
heat
radiator
conducting part
base
radiating fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200520120943.4U
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English (en)
Inventor
王宁宇
姚志江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200520120943.4U priority Critical patent/CN2874771Y/zh
Priority to US11/308,941 priority patent/US20070137846A1/en
Application granted granted Critical
Publication of CN2874771Y publication Critical patent/CN2874771Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器，用于电脑芯片的散热，该散热器包括一底座及若干散热鳍片，该底座包括一第一导热部及一形成于该第一导热部底面的第二导热部，该散热鳍片形成于该第一导热部上，该第二导热部底面面积与该电脑芯片表面面积大致相当。

Description

散热器
【技术领域】
本实用新型涉及一种散热器，特别是一种电脑芯片散热器。
【背景技术】
通常，电脑若要正常工作，CPU的温度一般要控制在64℃以下。为了降低CPU的温度，CPU上常常装有一散热器。
图1所示为现有技术中的一款散热器1，其包括一底座12、若干相互平行的散热鳍片14及两热管16。所述底座12为一底面为正方形的长方体金属块，其上开设两通孔。每一散热鳍片14为一自所述底座12上向上垂直延伸的金属薄片。每一散热鳍片14上开设有两通孔。所述两热管16通过所述底座12的两通孔及散热鳍片14的通孔而装设在所述底座12及散热鳍片14上。上述散热器1通过所述热管16将所述底座12与所述散热鳍片14连接，可以取得较佳的散热效果。但是，上述散热器所需散热材料较多，仍存在改进的空间。
【发明内容】
鉴于以上内容，有必要提供一种节省材料同时又能达到散热要求的散热器。
一种散热器，用于电脑芯片的散热，该散热器包括一底座及若干散热鳍片，该底座包括一第一导热部及一形成于该第一导热部底面的第二导热部，该散热鳍片形成于该第一导热部上，该第二导热部底面面积与该电脑芯片表面面积大致相当。
与现有技术相比，该散热器节省了制造材料，且其散热性能达到了电脑电脑芯片正常工作的要求。
【附图说明】
下面结合附图和具体实施方式对本实用新型作进一步详细的说明。
图1是现有技术中的一散热器的立体图。
图2是本实用新型较佳实施方式散热器的立体图。
图3是本实用新型较佳实施方式散热器(无热管)的前视图。
图4是本实用新型较佳实施方式散热器、主板的左视图。
【具体实施方式】
请参阅图2，本实用新型散热器2的较佳实施方式包括一底座22、若干相互平行的散热鳍片24及两热管26。
请参阅图2及图3，所述底座22包括一第一导热部222及一第二导热部224。所述第一导热部222及第二导热部224均为底面大致为正方形的长方体金属块。所述第二导热部224大致设在所述第一导热部222的底面中部，其底面面积大致和一电脑CPU相当。所述底座22对应所述两热管26开设两圆形通孔226。所述圆形通孔226自所述第一导热部222的一端穿入，并贯穿所述第二导热部224，且延伸自所述第一导热部222的另一端，但未贯穿所述第一导热部222。
请继续参阅图3及图4，每一散热鳍片24为一自所述底座22的第一导热部222的上表面向上垂直延伸的金属薄片。每一散热鳍片24对应所述两热管26开设两通孔242。
请参阅图2，每一热管26大致呈U形，其可穿入所述底座22的对应通孔226及所述散热鳍片24的对应通孔242，而装设在所述散热器2的底座22及散热鳍片24上。所述热管26将热量从所述底座22上迅速传递至所述散热鳍片24上，以加快热量的散发。
请参阅图4，使用时，将所述散热器2固定在一主板70的一CPU 50上，此时，所述散热器2的第二导热部224与所述CPU 50贴合，并恰可遮罩所述CPU 50。散热时，所述CPU 50所产生的热量传至所述第二导热部224上，并通过所述第二导热部224将热量传至所述第一导热部222、所述散热鳍片24及所述热管26上，以将热量散发出去，从而达到降低所述CPU 50的温度的目的。
请参阅图1及图2，与现有技术的散热器1相比，本实用新型散热器2的底座22由现有技术的散热器1的底座12切割形成，显然，制造本实用新型散热器2所需的材料要比现有技术的散热器1少。
在相同的测试条件下：环境温度35℃，CPU风扇转速3800转/分钟，测试机箱为标准BTX型机箱，现有技术的散热器1与本实用新型散热器2的模拟仿真散热性能对比测试结果如下表所示：
  测试元件 散热器1 温度(℃) 散热器2 温度(℃)   正常工作要求温度(℃)
  CPU 63.26 63.61   ＜64.1
  声卡 43.32 43.69   ＜100
  网卡 67.52 67.3   ＜85
  时钟芯片 54.87 56.87   ＜85
由上表中可以很容易看出，虽然，本实用新型散热器2的底座22相较现有技术散热器1的底座12来说，制造材料得到削减，但对CPU 50的散热效果影响很小，几乎可以忽略不计。

Claims (9)

1.一种散热器，用于电脑芯片的散热，该散热器包括一底座及若干散热鳍片，其特征在于：该底座包括一第一导热部及一形成于该第一导热部底面的第二导热部，该散热鳍片形成于该第一导热部上，该第二导热部底面面积与该电脑芯片表面面积大致相当。
2.如权利要求1所述的散热器，其特征在于：该散热器还包括插设于该散热器中的两热管。
3.如权利要求2所述的散热器，其特征在于：该散热器的底座为穿插该两热管开有两通孔。
4.如权利要求3所述的散热器，其特征在于：该两通孔的上半部分开设与该底座的第一导热部，该两通孔的下半部分开设于该底座的第二导热部。
5.如权利要求2所述的散热器，其特征在于：该等散热鳍片为穿插该两热管设有相应的通孔。
6.如权利要求5所述的散热器，其特征在于：该等散热鳍片为若干相互平行的矩形金属片。
7.如权利要求2所述的散热器，其特征在于：该两热管一端插入该散热器底座，另一端插入该散热器的散热鳍片。
8.如权利要求7所述的散热器，其特征在于：该两热管均大致成U型。
9.如权利要求1所述的散热器，其特征在于：该第一导热部及该第二导热部均呈长方体，该第二导热部底面面积小于该第一导热部底面面积。
CN200520120943.4U 2005-12-20 2005-12-20 散热器 Expired - Fee Related CN2874771Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200520120943.4U CN2874771Y (zh) 2005-12-20 2005-12-20 散热器
US11/308,941 US20070137846A1 (en) 2005-12-20 2006-05-29 Thermal device for heat generating source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200520120943.4U CN2874771Y (zh) 2005-12-20 2005-12-20 散热器

Publications (1)

Publication Number Publication Date
CN2874771Y true CN2874771Y (zh) 2007-02-28

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CN (1) CN2874771Y (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7694718B2 (en) 2006-10-02 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7548426B2 (en) * 2007-06-22 2009-06-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes

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Publication number Priority date Publication date Assignee Title
US7067903B2 (en) * 2002-11-07 2006-06-27 Kabushiki Kaisha Kobe Seiko Sho Heat spreader and semiconductor device and package using the same
TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US6849941B1 (en) * 2004-01-07 2005-02-01 Thermagon, Inc. Heat sink and heat spreader assembly
US20050183843A1 (en) * 2004-02-13 2005-08-25 Fujikura Ltd. Heat sink
CN2701072Y (zh) * 2004-04-29 2005-05-18 鸿富锦精密工业（深圳）有限公司 散热装置
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
CN2777753Y (zh) * 2005-01-19 2006-05-03 富准精密工业(深圳)有限公司 散热装置
CN100517665C (zh) * 2005-04-22 2009-07-22 富准精密工业(深圳)有限公司 热管散热装置
US7327576B2 (en) * 2005-06-24 2008-02-05 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
CN100543972C (zh) * 2005-08-08 2009-09-23 富准精密工业(深圳)有限公司 热管散热装置
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7694718B2 (en) 2006-10-02 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes

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Granted publication date: 20070228

Termination date: 20100120