US20070137846A1 - Thermal device for heat generating source - Google Patents
Thermal device for heat generating source Download PDFInfo
- Publication number
- US20070137846A1 US20070137846A1 US11/308,941 US30894106A US2007137846A1 US 20070137846 A1 US20070137846 A1 US 20070137846A1 US 30894106 A US30894106 A US 30894106A US 2007137846 A1 US2007137846 A1 US 2007137846A1
- Authority
- US
- United States
- Prior art keywords
- thermal device
- base
- fins
- heat generating
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to thermal devices, and particularly to a thermal device for dissipating heat from or cooling off a heat generating source.
- Computers may not work properly when the temperature of their central processing units (CPUs) rises above 64° C.
- CPUs central processing units
- To prevent overheating of a CPU a thermal device is often attached to the CPU for heat dissipation.
- FIG. 4 shows one of a currently used thermal device 1 , including a base 12 , a plurality of parallel fins 14 , and two heat pipes 16 .
- the base 12 is a slab-shaped metal block with a rectangular bottom. Two holes are defined in the base 12 .
- the fins 14 extend up from the base 12 . Two pairs of holes are respectively defined in the base 12 and the fins 14 for receiving the heat pipes 16 therein.
- the base 12 is coupled to a CPU.
- the area of the base 12 is larger than that of the CPU.
- manufacturing the thermal device 1 requires comparatively more metal raw material, which adds greatly to the cost of manufacture.
- a thermal device for dissipating heat from a heat generating source includes a first portion, and a second portion formed on the bottom of the first portion.
- An area of a bottom of the second portion is smaller than an area of a bottom of the first portion, and the area of the bottom of the second portion accords with an area of a contacting surface of the heat generating source.
- FIG. 1 is an isometric view of a thermal device, in accordance with a preferred embodiment of the present invention
- FIG. 2 is a front view of FIG. 1 without the heat pipes
- FIG. 3 is a side view of FIG. 1 with a motherboard thereunder;
- FIG. 4 is an isometric view of a conventional thermal device.
- a thermal device 2 in accordance with a preferred embodiment of the present invention, including a base 22 , a plurality of parallel fins 24 , and two heat pipes 26 is shown.
- the base 22 includes a first portion 222 and a second portion 224 .
- the first portion 222 is generally rectangular-shaped.
- the second portion 224 is generally square shaped, and protrudes from a middle of a bottom of the first portion 222 .
- the dimensions of the second portion 224 are less than that of the first portion 222 . Therefore, the base 22 has a cross section that is wide at the top and narrow at the bottom.
- An area of the bottom of the second portion 224 is the same as a top contacting surface area of a heat generating source, such as a CPU used as an example in the preferred embodiment.
- Two parallel, arc shaped holes 226 a are defined in the first portion 222 from one end of the first portion 222 to near another end of the base 22 .
- two arc-shaped parallel holes 226 b are defined in the second portion 224 aligned with the holes 226 a .
- the holes 226 a , 226 b cooperate to receive ends of the heat pipes 26 .
- the fins 24 extend up from a top surface of the first portion 222 perpendicular to the base 22 .
- Each fin 24 is a slim rectangular-shaped metal piece with two circular holes 242 symmetrically defined near a top edge thereof. The two holes 242 are for receiving other ends of the two heat pipes 26 .
- the generally U-shaped heat pipes 26 are inserted into the holes 226 of the base 22 and the holes 242 of the fins 24 . Heat in the base 22 will be conducted to the fins 24 by the heat pipes 26 to accelerate the process of dissipating heat from the chip.
- the thermal device 2 is fixed on a chip 50 of a motherboard 70 .
- the second portion 224 of the base 22 contacts the chip 50 .
- Heat produced by the chip 50 is conducted to the second portion 224 , and then to the first portion 222 . Thereafter, the heat is conducted to the fins 24 through the heat pipes 26 , so that the chip 50 can be kept at acceptable working temperatures.
- thermal device 2 of the preferred embodiment is comparable to the thermal device 1 .
Abstract
A thermal device for cooling a heat generating source is provided, including a first portion and a second portion which is formed from the first portion, the area of the bottom of the second portion is smaller than the area of the bottom of the first portion, and the area of the bottom of the second portion accords with a contact surface area of the heat generating source.
Description
- The present invention relates to thermal devices, and particularly to a thermal device for dissipating heat from or cooling off a heat generating source.
- Computers may not work properly when the temperature of their central processing units (CPUs) rises above 64° C. To prevent overheating of a CPU a thermal device is often attached to the CPU for heat dissipation.
-
FIG. 4 shows one of a currently usedthermal device 1, including abase 12, a plurality ofparallel fins 14, and twoheat pipes 16. Thebase 12 is a slab-shaped metal block with a rectangular bottom. Two holes are defined in thebase 12. Thefins 14 extend up from thebase 12. Two pairs of holes are respectively defined in thebase 12 and thefins 14 for receiving theheat pipes 16 therein. Thebase 12 is coupled to a CPU. The area of thebase 12 is larger than that of the CPU. However, manufacturing thethermal device 1 requires comparatively more metal raw material, which adds greatly to the cost of manufacture. - What is needed, therefore, is a lower cost thermal device which still provides good heat sink performance.
- A thermal device for dissipating heat from a heat generating source is provided. The thermal device includes a first portion, and a second portion formed on the bottom of the first portion. An area of a bottom of the second portion is smaller than an area of a bottom of the first portion, and the area of the bottom of the second portion accords with an area of a contacting surface of the heat generating source.
- Other advantages and novel features will be drawn from the following detailed description of a preferred embodiment with attached drawings, in which:
-
FIG. 1 is an isometric view of a thermal device, in accordance with a preferred embodiment of the present invention; -
FIG. 2 is a front view ofFIG. 1 without the heat pipes; -
FIG. 3 is a side view ofFIG. 1 with a motherboard thereunder; and -
FIG. 4 is an isometric view of a conventional thermal device. - Referring to
FIG. 1 , athermal device 2 in accordance with a preferred embodiment of the present invention, including abase 22, a plurality ofparallel fins 24, and twoheat pipes 26 is shown. - As shown in
FIG. 1 andFIG. 2 , thebase 22 includes afirst portion 222 and asecond portion 224. Thefirst portion 222 is generally rectangular-shaped. Thesecond portion 224 is generally square shaped, and protrudes from a middle of a bottom of thefirst portion 222. The dimensions of thesecond portion 224 are less than that of thefirst portion 222. Therefore, thebase 22 has a cross section that is wide at the top and narrow at the bottom. An area of the bottom of thesecond portion 224 is the same as a top contacting surface area of a heat generating source, such as a CPU used as an example in the preferred embodiment. Two parallel, arcshaped holes 226 a are defined in thefirst portion 222 from one end of thefirst portion 222 to near another end of thebase 22. And two arc-shapedparallel holes 226 b are defined in thesecond portion 224 aligned with theholes 226 a. Theholes heat pipes 26. - As shown in
FIG. 2 andFIG. 3 , thefins 24 extend up from a top surface of thefirst portion 222 perpendicular to thebase 22. Eachfin 24 is a slim rectangular-shaped metal piece with twocircular holes 242 symmetrically defined near a top edge thereof. The twoholes 242 are for receiving other ends of the twoheat pipes 26. - Referring to
FIG. 1 , the generallyU-shaped heat pipes 26 are inserted into the holes 226 of thebase 22 and theholes 242 of thefins 24. Heat in thebase 22 will be conducted to thefins 24 by theheat pipes 26 to accelerate the process of dissipating heat from the chip. - As shown in
FIG. 3 , in use, thethermal device 2 is fixed on achip 50 of amotherboard 70. Thesecond portion 224 of thebase 22 contacts thechip 50. Heat produced by thechip 50 is conducted to thesecond portion 224, and then to thefirst portion 222. Thereafter, the heat is conducted to thefins 24 through theheat pipes 26, so that thechip 50 can be kept at acceptable working temperatures. - In comparing the conventional
thermal device 1 ofFIG. 4 with thethermal device 2 in accordance with the preferred embodiment of the present invention ofFIG. 1 , it can be seen that a volume of the material used for manufacturing thebase 22 of thethermal device 2 is less than the volume of material used for the conventionalthermal device 1. Thereby there is a reduction in cost of manufacture. - In comparing the conventional
thermal device 1 with thethermal device 2 of the preferred embodiment under same testing conditions, (ambient temperature of 35° C., rotation speed of a cooling fan 3800 round/min, BTX style layout) we have the results:Testing Thermal device 1Thermal device 2Temperature component temperature (° C.) temperature (° C.) required (° C.) CPU 63.26 63.61 <64.1 Sound card 43.32 43.69 <100 Video card 67.52 67.3 <85 Clock chips 54.81 56.87 <85 - It is evident that the cooling performance of the
thermal device 2 of the preferred embodiment is comparable to thethermal device 1. - It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of a preferred embodiments, together with details of the structure and function of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (12)
1. A thermal device for a heat generating package, comprising:
a plurality of fins; and
a base having a first portion and a second portion, the first portion supporting the plurality of fins, and the second portion formed from a bottom of the first portion, the area of a contacting surface of the second portion being less than that of the bottom of the first portion, and according with that of a contacting surface of the heat generating package.
2. The thermal device as claimed in claim 1 , further comprising at least a heat pipe extending from the base to the fins.
3. The thermal device as claimed in claim 2 , wherein a portion of the heat pipe is exposed where the second portion does not cover the bottom of the first portion.
4. The thermal device as claimed in claim 2 , wherein a hole is defined in the base for receiving the heat pipe, a top longitudinal portion of the hole is defined in the first portion, and a bottom longitudinal portion of the hole is defined in the second portion.
5. The thermal device as claimed in claim 1 , wherein both the first portion and the second portion are slab-shaped metal blocks.
6. The thermal device as claimed in claim 1 , wherein the second portion protrudes from the first portion.
7. The thermal device as claimed in claim 2 , wherein the heat pipe is U-shaped.
8. A thermal device for cooling a heat generating source comprising:
a base with a cross section having a top dimension wider than a bottom dimension, the area of a contacting surface of the base according with a contacting surface of the heat generating source;
a plurality of fins extending from the base, and
at least a heat pipe extending from the base to the fins.
9. The thermal device as claimed in claim 8 , wherein the base includes a slab-shaped first portion and a slab-shaped second portion, the area of bottom of the second portion being smaller than the area of the bottom of the first portion.
10. The thermal device as claimed in claim 12 , wherein a hole is defined in the base for receiving the heat pipe, a top longitudinal portion of the hole is defined in the first portion, and a bottom longitudinal portion of the hole is defined in the second portion.
11. The thermal device as claimed in claim 8 , wherein the second portion protrudes from the first portion.
12. The thermal device as claimed in claim 8 , wherein the heat pipe is U-shaped.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200520120943.4 | 2005-12-20 | ||
CN200520120943.4U CN2874771Y (en) | 2005-12-20 | 2005-12-20 | Radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070137846A1 true US20070137846A1 (en) | 2007-06-21 |
Family
ID=37781367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/308,941 Abandoned US20070137846A1 (en) | 2005-12-20 | 2006-05-29 | Thermal device for heat generating source |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070137846A1 (en) |
CN (1) | CN2874771Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080078528A1 (en) * | 2006-10-02 | 2008-04-03 | Foxconn Technology Co., Ltd. | Heat sink with heat pipes |
US20080316707A1 (en) * | 2007-06-22 | 2008-12-25 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040238946A1 (en) * | 2002-11-07 | 2004-12-02 | Kabushik Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Heat spreader and semiconductor device and package using the same |
US6849941B1 (en) * | 2004-01-07 | 2005-02-01 | Thermagon, Inc. | Heat sink and heat spreader assembly |
US20050067144A1 (en) * | 2003-08-25 | 2005-03-31 | Tatung Co., Ltd. | Cooling device |
US20050092465A1 (en) * | 2003-11-05 | 2005-05-05 | Kuo-Len Lin | Dual-layer heat dissipating structure |
US20050183843A1 (en) * | 2004-02-13 | 2005-08-25 | Fujikura Ltd. | Heat sink |
US6945319B1 (en) * | 2004-09-10 | 2005-09-20 | Datech Technology Co., Ltd. | Symmetrical heat sink module with a heat pipe for spreading of heat |
US20050241808A1 (en) * | 2004-04-29 | 2005-11-03 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US20060158850A1 (en) * | 2005-01-19 | 2006-07-20 | Foxconn Technology Co., Ltd. | Heat dissipation device with a heat pipe |
US20070029072A1 (en) * | 2005-08-08 | 2007-02-08 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20070095508A1 (en) * | 2005-11-02 | 2007-05-03 | Foxconn Technology Co., Ltd. | Heat dissipation device having louvered heat-dissipating fins |
US7295437B2 (en) * | 2005-04-22 | 2007-11-13 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device for multiple heat-generating components |
US7327576B2 (en) * | 2005-06-24 | 2008-02-05 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
-
2005
- 2005-12-20 CN CN200520120943.4U patent/CN2874771Y/en not_active Expired - Fee Related
-
2006
- 2006-05-29 US US11/308,941 patent/US20070137846A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040238946A1 (en) * | 2002-11-07 | 2004-12-02 | Kabushik Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Heat spreader and semiconductor device and package using the same |
US20050067144A1 (en) * | 2003-08-25 | 2005-03-31 | Tatung Co., Ltd. | Cooling device |
US20050092465A1 (en) * | 2003-11-05 | 2005-05-05 | Kuo-Len Lin | Dual-layer heat dissipating structure |
US6849941B1 (en) * | 2004-01-07 | 2005-02-01 | Thermagon, Inc. | Heat sink and heat spreader assembly |
US20050183843A1 (en) * | 2004-02-13 | 2005-08-25 | Fujikura Ltd. | Heat sink |
US20050241808A1 (en) * | 2004-04-29 | 2005-11-03 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US6945319B1 (en) * | 2004-09-10 | 2005-09-20 | Datech Technology Co., Ltd. | Symmetrical heat sink module with a heat pipe for spreading of heat |
US20060158850A1 (en) * | 2005-01-19 | 2006-07-20 | Foxconn Technology Co., Ltd. | Heat dissipation device with a heat pipe |
US7295437B2 (en) * | 2005-04-22 | 2007-11-13 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device for multiple heat-generating components |
US7327576B2 (en) * | 2005-06-24 | 2008-02-05 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US20070029072A1 (en) * | 2005-08-08 | 2007-02-08 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20070095508A1 (en) * | 2005-11-02 | 2007-05-03 | Foxconn Technology Co., Ltd. | Heat dissipation device having louvered heat-dissipating fins |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080078528A1 (en) * | 2006-10-02 | 2008-04-03 | Foxconn Technology Co., Ltd. | Heat sink with heat pipes |
US7694718B2 (en) | 2006-10-02 | 2010-04-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
US20080316707A1 (en) * | 2007-06-22 | 2008-12-25 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
US7548426B2 (en) * | 2007-06-22 | 2009-06-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
Also Published As
Publication number | Publication date |
---|---|
CN2874771Y (en) | 2007-02-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, NING-YU;YAO, ZHI-JIANG;REEL/FRAME:017686/0655 Effective date: 20060421 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |