CN1855456A - 热管散热装置 - Google Patents

热管散热装置 Download PDF

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Publication number
CN1855456A
CN1855456A CNA2005100345169A CN200510034516A CN1855456A CN 1855456 A CN1855456 A CN 1855456A CN A2005100345169 A CNA2005100345169 A CN A2005100345169A CN 200510034516 A CN200510034516 A CN 200510034516A CN 1855456 A CN1855456 A CN 1855456A
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heat
pipe
radiator
radiating
pedestal
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CN100407416C (zh
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李学坤
夏万林
李涛
校敏奇
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2005100345169A priority Critical patent/CN100407416C/zh
Priority to US11/268,079 priority patent/US7269012B2/en
Publication of CN1855456A publication Critical patent/CN1855456A/zh
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种热管散热装置,包括一基座、若干第一散热鳍片,与基座间隔相对的一盖板及一连接基座与盖板的热管,热管一自由端另连接一散热体,该散热体与第一散热鳍片并列设置,上述第一散热鳍片夹设在基座与盖板之间。由于热管两端分别与基座、盖板连接,热量经热管均匀分布在第一散热鳍片上,热管利用率得到充分发挥。

Description

热管散热装置
【技术领域】
本发明涉及一种散热装置,特别是一种用于冷却电子元件的热管散热装置。
【背景技术】
随着计算机技术不断发展,电子元件(尤其是中央处理器)运行频率和速度不断提升,发热量越来越大,若不及时排除,将使热量累积引起温度升高,影响发热电子元件的正常运行。
通常业界在电子元件上安装散热器辅助其散热,在散热器上安装风扇,由风扇提供强制气流使散热器的热量快速散发,从而能够对电子元件进行更为有效地散热。
一种传统的热管散热装置如中国台湾专利公告第M255648号揭示,其包括一基座、设置在该基座上的第一散热鳍片、远离第一散热鳍片的第二散热鳍片及连接两散热鳍片的热管,该热管一端连接基座,另一端穿过第二散热鳍片。基座吸收热量一部分直接传向第一散热鳍片,另一部分由热管传至第二散热鳍片,使热量同时能在两散热器上散发。但是,由于热管仅一端连接在第一散热鳍片的基座内,热量容易集中在第一散热鳍片底部,而顶部则距离热管较远,热管与第一散热鳍片接触面积小,第一散热鳍片利用率不高,散热性能有限,热管性能没有得到最大限度发挥,整体散热性能有待提高。
【发明内容】
以下通过实施例对本发明予以说明。
本发明实施例的热管散热装置包括一基座、若干第一散热鳍片,与基座间隔相对的一盖板及一连接基座与盖板的热管,热管一自由端另连接一散热体,该散热体与第一散热鳍片并列设置,上述第一散热鳍片夹设在基座与盖板之间。
该实施方式与现有技术相比具有如下优点:由于热管两端分别与基座、盖板连接,热量经热管由基座、盖板经第一散热鳍片两侧边均匀向第一散热鳍片传热,同时热管延伸段连接散热体加强散热,热管利用率得到充分发挥,整个热管散热装置的性能提高。
下面参照附图,结合实施例对本发明作进一步的描述。
【附图说明】
图1是本发明实施例热管散热装置的立体组合图。
图2是图1的立体分解图。
【具体实施方式】
请参阅图1,本发明实施例热管散热装置是用于冷却电子元件,其包括第一散热器10、散热体20、连接该第一散热器10与散热体20的热管30及安装在第一散热器10与散热体20之间的散热风扇40。
请参阅图2,上述第一散热器10包括一基座12、与基座12间隔相对的一盖板14,连设在基座12与盖板14间的若干第一散热鳍片16。基座12上表面设有一对平行沟槽122,盖板14下表面设有一对平行凹槽142。上述散热体20并排设置在第一散热器10一侧,该散热体20包括若干叠置的第二散热鳍片22,每一第二散热鳍片22设有一对供热管30穿过的孔洞24。上述热管30包括二根热管,每一热管30包括一容置在基座12的沟槽122内的第一传热段32、穿过盖板14凹槽142的第二传热段36、连接第一传热段32与第二传热段36的连接段34及由第一传热段32延伸并穿过第二散热器20孔洞24的一延伸段38。热管30的第一传热段32连接基座12,第二传热段36连接盖板14,使热管30绕设在第一散热器10上、下端,同时延伸段38穿过散热体20第二散热鳍片22,热管30呈断开的口字形。
上述实施例中,基座12吸收热量,直接向第一散热鳍片16传送,另一部分热量由热管30传至盖板14,由盖板14向下传至第一散热鳍片16中部,使基座12吸收的热量在第一散热鳍片16上、下两端分布。热管30的延伸段38穿设在散热体20中,将第二传热段36吸收的热量传至各第二散热鳍片22再散发到周围空间。热管将热量均匀分散在第一散热器10与第二散热鳍片22各部分,散热均衡。
另外,由散热风扇40一侧引入的气流经过第一散热器10再吹向散热体20,在二者之间形成一气体流场,加快热量与周围空气对流速度,提高整体热管散热装置散热效率。
可以理解地,本发明实施例热管散热装置中,也可用盖体14接触电子元件吸收热量,将盖体14作为第一散热器10的底部,基座12为其顶部,即将本发明实施例热管散热装置倒置安装。此时盖体14吸收热量后由第二传热段36同时向两端即第一传热段32、延伸段38传递,热量一部分传至基座12再由基座12传到第一散热鳍片16下部,一部分由延伸段38传至第二散热鳍片22中,即在原热管散热装置中用来吸热的第一传热段32变为用来放热,而用来传热的第二传热段36变为用来吸热。
本发明热管散热装置,由于热管30第一传热段32、第二传热段36与基座12、盖体14连接,热量均匀分布在第一散热器10上,热管30的利用率得到充分发挥。此外,热管30的延伸段38连接散热体20加强散热,使整个热管散热装置的性能提高。

Claims (7)

1.一种热管散热装置,包括一基座及若干第一散热鳍片,其特征在于:还包括与基座间隔相对的一盖板及一连接基座与盖板的热管,热管一自由端另连接一散热体,该散热体与第一散热鳍片并列设置,上述第一散热鳍片夹设在基座与盖板之间。
2.如权利要求1所述的热管散热装置,其特征在于:上述散热体包括若干第二散热鳍片,上述热管自由端由盖板伸出并穿过第二散热鳍片。
3.如权利要求1所述的热管散热装置,其特征在于:上述散热体包括若干第二散热鳍片,上述热管自由端由基座伸出并穿过第二散热鳍片。
4.如权利要求2或3所述的热管散热装置,其特征在于:上述第二散热鳍片与第一散热鳍片相互垂直。
5.如权利要求4所述的热管散热装置,其特征在于:上述热管包括两相互平行而分别与基座及盖板接触的传热段。
6.如权利要求5所述的热管散热装置,其特征在于:上述热管呈断开的口字形。
7.如权利要求4所述的热管散热装置,其特征在于:其进一步包括一设置在第一散热器与第二散热器之间的散热风扇。
CN2005100345169A 2005-04-29 2005-04-29 热管散热装置 Expired - Fee Related CN100407416C (zh)

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CN2005100345169A CN100407416C (zh) 2005-04-29 2005-04-29 热管散热装置
US11/268,079 US7269012B2 (en) 2005-04-29 2005-11-07 Heat dissipation device for heat-generating electronic component

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CN100407416C (zh) 2008-07-30
US20060245162A1 (en) 2006-11-02

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