CN2713632Y - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN2713632Y
CN2713632Y CNU2004200452871U CN200420045287U CN2713632Y CN 2713632 Y CN2713632 Y CN 2713632Y CN U2004200452871 U CNU2004200452871 U CN U2004200452871U CN 200420045287 U CN200420045287 U CN 200420045287U CN 2713632 Y CN2713632 Y CN 2713632Y
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heat
radiating fin
heat transfer
heat sink
fan
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Expired - Lifetime
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CNU2004200452871U
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盛剑青
李孟慈
林淑和
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNU2004200452871U priority Critical patent/CN2713632Y/zh
Priority to US11/092,451 priority patent/US7575045B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本实用新型散热装置，包括一吸热元件、至少一传热元件、一散热鳍片组及位于散热鳍片组一侧的风扇，该传热元件包括一与吸热元件热性接触的吸热部及一与散热鳍片组热性接触的传热部，该散热鳍片组包括若干套设于传热元件上的散热鳍片，所述散热鳍片组靠近风扇的一侧形成一导风结构，该导风结构包括设于散热鳍片上的凸起部，各凸起部共同形成一与风扇的气流方向呈一定夹角的风道。该凸起部使到达散热鳍片组上传热元件附近区域的风速较快，有利于热量的散发，加强了整体的散热效果。

Description

散热装置
【技术领域】
本实用新型是关于一种散热装置，特别是一种用于高频率电子元件散热的散热装置。
【背景技术】
随着电子信息业的不断发展，电子产品的性能快速提升，频率越来越高，随之产生的热量也在不断增加，如果不将这些热量及时散发出去，就会使电子元件的内部温度越来越高，过高的温度不仅会影响电子元件运行时的稳定性和准确性，严重时还可能将整个元件烧毁，因此必需解决电子元件的散热问题。
最初的散热器为一体成型，它由一基板和从基板上延伸出的若干相互平行的散热鳍片构成，散热时将这种散热器紧贴在发热电子元件上，在散热器上安装一风扇辅助散热，这种散热器在最初的一段时间里能够满足电子元件的散热需求，但其散热量极其有限，要增加散热面积就必须增加散热器的体积，这使得它所占的空间和本身的质量都大大增加，和电子元件日益轻薄化的发展趋势相违背，难以符合愈来愈高的散热需要。
后来，出现了将导热性较佳的柱体和堆叠式鳍片结合起来的散热器，这种散热器是在堆叠式鳍片中部穿入一定数量的导热柱，利用导热柱将热量传给散热鳍片，然后再通过散热风扇将鳍片上的热量吹走。这种散热器利用导热柱将热量迅速而均匀地传递给散热鳍片，传热效率高，散热效果良好，可满足高频电子元件的散热需求。但其传热过程主要依靠导热柱将发热电子元件产生的热量传给散热鳍片，对于每一散热鳍片，导热柱周围区域获得的热量较多，而远离导热柱的区域获得的热量则较少，利用风扇辅助散热时，风从鳍片边缘吹向鳍片中心，当到达导热柱处时由于风能向四周发散，风力已大大减弱，带走的热量较少，而此处由于导热柱的作用，散发出来的热量较多，因此，导热柱周围的热量散发不充分，不能满足更高频率电子元件的散热需求。
【发明内容】
本实用新型的目的在于提供一种改善风流、加强散热效果的散热装置。
本实用新型散热装置，包括一吸热元件、至少一传热元件、一散热鳍片组及位于散热鳍片组一侧的风扇，该传热元件包括一与吸热元件热性接触的吸热部及一与散热鳍片组热性接触的传热部，该散热鳍片组包括若干套设于传热元件上的散热鳍片，所述散热鳍片组靠近风扇的一侧形成一导风结构，该导风结构包括设于散热鳍片上的凸起部，各凸起部共同形成一与风扇的气流方向呈一定夹角的风道。
该凸起部使到达散热鳍片组上传热元件附近区域的风速较快，有利于热量的散发，加强了整体的散热效果。
下面参照附图，结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型散热装置的立体组装图。
图2是本实用新型散热装置的立体分解图。
图3是本实用新型散热装置单一散热鳍片的立体图。
【具体实施方式】
请参阅图1及图2，本实用新型散热装置10包括一紧贴于发热电子元件的吸热元件2、若干传热元件6、一散热鳍片组4及一位于散热鳍片组4一侧的风扇8。其中，吸热元件2上设有若干收容传热元件6的容置结构22，散热鳍片组4由若干相互平行的单一散热鳍片40组成，传热元件6为具良好导热性的元件，本实用新型采用热管为传热元件6，其包括一与吸热元件2热性接触的吸热部60及一与散热鳍片组4热性接触的传热部62，该热管可为利于散热的任意形状，如直线形或“U”形，以下以直线形热管为例加以说明。
图3是本实用新型散热装置10单一散热鳍片40的立体图，该散热鳍片40具有一本体401，本体401上开设有若干容置热管的圆孔402，散热鳍片组4在靠近风扇8的一侧形成一导风结构，该导风结构包括若干向上冲成半碗底形状的凸起部404，各凸起部404共同形成一与风扇8的气流方向呈一定夹角的风道，散热鳍片组4在远离风扇8的一侧可设导风结构，该导风结构可为设于散热鳍片40上的一向上冲成半碗底形状的凸起部或向下冲成半碗底形状的凹陷部，半碗底形状的尺寸可根据热管的位置做适当调整，另外，在散热鳍片40的本体401两侧分别设有垂直向下弯折而成的折边408，上方散热鳍片40的两侧折边408与下方散热鳍片40的本体401相接触。
当发热电子元件工作时，吸热元件2吸收发热电子元件产生的热量，并通过热管将热量传递给散热鳍片组4，散热鳍片组4一侧固设的风扇8转动，带动气流从风扇8吹向散热鳍片组4，半碗底形状的凸起部404导引气流吹向热管周围热量较多的地方，凸起部404自身的形状结构使到达热管周围的风压较大，较大的风压使热管周围的风速有所增加，随着风扇8的工作，热管周围的气流带着热量快速散发，实现对发热电子元件的散热。

Claims (7)

1.一种散热装置，包括一吸热元件、至少一传热元件、一散热鳍片组及位于散热鳍片组一侧的风扇，该传热元件包括一与吸热元件热性接触的吸热部及一与散热鳍片组热性接触的传热部，散热鳍片组包括若干套设于传热元件上的散热鳍片，其特征在于：所述散热鳍片组靠近风扇的一侧形成一导风结构，该导风结构包括设于散热鳍片上的凸起部，各凸起部共同形成一与风扇的气流方向呈一定夹角的风道。
2.如权利要求1所述的散热装置，其特征在于：所述吸热元件上设有收容传热元件的容置结构。
3.如权利要求1所述的散热装置，其特征在于：所述传热元件为热管。
4.如权利要求1所述的散热装置，其特征在于：所述凸起部为半碗底形状。
5.如权利要求1所述的散热装置，其特征在于：所述散热鳍片设有收容传热元件的容置孔。
6.如权利要求1所述的散热装置，其特征在于：所述散热鳍片远离风扇的一侧设有向上冲成半碗底形状的凸起部。
7.如权利要求1所述的散热装置，其特征在于：所述散热鳍片远离风扇的一侧设有向下冲成半碗底形状的凹陷部。
CNU2004200452871U 2004-04-23 2004-04-23 散热装置 Expired - Lifetime CN2713632Y (zh)

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US11/092,451 US7575045B2 (en) 2004-04-23 2005-03-29 Heat dissipating device

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CN102478228A (zh) * 2010-11-29 2012-05-30 西安中科麦特电子技术设备有限公司 太阳光谱模拟器散热装置

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