CN2704113Y - Multi heat source radiating device - Google Patents

Abstract

The utility model provides a multi-heat source radiating device which is used for radiating heat generated by a plurality of corresponding heat source, comprising a plurality of bases, a heat pipe, a heat radiation assembly and at least a bridgeware. Each base is correspondingly arranged on a heat source. The heat pipe is extended on the base. One end of the heat pipe is provided with the heat radiation assembly. The bridgeware is arranged between the two contiguous bases and is provided with elasticity which can make the bases be not affected mutually and tightly approach to each heat source. So heat radiation effect is better.

Description

Multiple Heat Source Heat Dissipating Device

Technical field

The utility model relates to a kind of Multiple Heat Source Heat Dissipating Device, is meant especially a kind ofly to reach shockproof effect with Flexible Design, improves heat sinking benefit, and applicable to the Multiple Heat Source Heat Dissipating Device of different distance thermal source.

Background technology

Because the usefulness of electronic product promotes day by day, so no longer have only central processing unit (CPU) to need heat radiation in the whole system, for other compute chip, or the chip on the expansion board all can produce higher heat, so be to need heat radiation equally.

As Fig. 1, shown in 2, be a kind of existing Multiple Heat Source Heat Dissipating Device 100, it is in order to be attached at 20 liang of adjacent chips 21 of a circuit board, on 23, in order to chip 21, the heat that is produced during 23 runnings is left, this heat abstractor 100 includes a pedestal 10, one heat pipe 12 and a radiating subassembly 14, this pedestal 10 is one lamellar, and have a upper surface 101 and a lower surface 103, lower surface 103 is in order to be attached at two chips 21, on 23, and because two chips 21,23 height is difference to some extent, therefore in lower surface 103 and two chips 21,23 have additional a liner 104 in addition, or in two chips 21, smear some auxiliary thermal greases on 23, make lower surface 103 and two chips 21,23 heat transfer effect is better, and be concaved with a conduit 105 in upper surface 101, this conduit 105 extends corresponding two chips 21,23 position, and conduit 105 1 ends then extend to outside the pedestal 10, and end outside extending pedestal 10 and the 14 mutual windings of this radiating subassembly, radiating subassembly 14 has several radiating fins 141, and is provided with a fan (figure does not show) in hot fin 141 1 side groups.

This heat pipe 12 is to extend in this conduit 105, and an end is positioned at this two chips, 21,23 positions accordingly, the other end then is to extend to the side of radiating subassembly 14 in contrast to radiating fin 141, is prior art as for heat pipe 12 application principles and structure, so no longer describe in detail at this.

Heat abstractor 100 is that the lower surface 103 with pedestal 10 is attached on two chips 21,23 when using, certainly be provided with liner 104 in lower surface 103 and 21,23 of two chips, and fixed with several rubber-like screws (figure does not show) again, pedestal 10 and 21,23 uniform pressure of two chips are provided.Therefore, the heat that two chips 21,23 are produced when running can pass to pedestal 10 via liner 104 earlier, be passed to radiating subassembly 14 by the heat pipe on the pedestal 10 12 again, heat taken away from radiating fin 141, make two chips 21,23 reach radiating effect by the air-flow that fan causes.

But, in general notebook, or other portable electric product more or less all can be subjected to the vibrations of external force, therefore make that easily the lower surface 103 of pedestal 10 is not very smooth in two chips 21, on 23, because whole pedestal 10 is integrated metal materials, so be difficult for producing temporary transient distortion along with vibrations, and the rigidity of circuit board 20 is more weak, so produce distortion because of bestowing of external force easily, therefore work as circuit board 20 and produce distortion because of external force, and pedestal 10 does not have the time of distortion, two chips 21,23 surfaces towards pedestal 10 may no longer be to be parallel to each other just, so will make that itself and pedestal 10 lower surfaces 103 can't be smooth mutually, so that the heat transferred difficulty, make the heat abstractor 100 can't efficiently radiates heat.

The utility model content

The purpose of this utility model is to provide a kind of and can really heat be transmitted, and reaches the Multiple Heat Source Heat Dissipating Device of preferable radiating effect.

Another purpose of the present utility model is to provide a kind of shockproof bridgeware of elasticity that has, and makes each pedestal can more be attached on the thermal source Multiple Heat Source Heat Dissipating Device that heat-transfer effect is better.

Multiple Heat Source Heat Dissipating Device of the present utility model, leave in order to the heat that a plurality of thermal source produced correspondence, it includes several pedestals, at least one bridgeware, a heat pipe and a radiating subassembly, be characterized in: described pedestal is mounted on the thermal source respectively accordingly, makes the heat on the thermal source be passed to pedestal; This bridgeware has flexibly to add to be located between the adjacent pedestal of two-phase; This heat pipe extends on the pedestal, in order to the other end of the heat transferred on the pedestal to this heat pipe; And this radiating subassembly is mounted on this heat pipe on the contrary in an end of pedestal.

For further specifying above-mentioned purpose of the present utility model, design feature and effect, the utility model is described in detail below with reference to accompanying drawing.

Description of drawings

Fig. 1 is the schematic perspective view of general Multiple Heat Source Heat Dissipating Device.

Fig. 2 is the use end view of Fig. 1 Multiple Heat Source Heat Dissipating Device.

Fig. 3 is the perspective exploded view of the utility model Multiple Heat Source Heat Dissipating Device preferred embodiment.

Fig. 4 is the solid combination schematic diagram of Fig. 3 preferred embodiment.And

Fig. 5 is the three-dimensional combination of side view of Fig. 3 preferred embodiment.

Embodiment

Shown in Fig. 3,4,5, be a preferred embodiment of the utility model Multiple Heat Source Heat Dissipating Device 300, present embodiment is in order to be used on the two adjacent thermals source, therefore to include two pedestals 41,43, a heat pipe 5, a radiating subassembly 6 and a bridgeware 7.

Pedestal 41 has a upper surface 411 and a lower surface 413, on upper surface 411, be concaved with one first conduit 415, and be provided with a shell fragment 417 in each corner group of pedestal 41 upper surfaces 411, one end of shell fragment 417 is fixed on the upper surface 411, and the other end then is in order to be fixed on the corresponding circuit board (figure does not show).

And another pedestal 43 also has a upper surface 431 and a lower surface 433, be concaved with second conduit 435 of a collocation first conduit 415 in upper surface 431, and this second conduit 435 is extended a side of pedestal 43 by upper surface 431, and being provided with several shell fragments 437 in the lateral margin group of pedestal 43, the effect of shell fragment 437 is identical with aforementioned shell fragment 417.

This bridgeware 7 is to be mounted on two pedestals 41,43, and constituted by a laminar shell fragment, bridgeware 7 has two first overlap joint arms 71 near a side of pedestal 41 in present embodiment, side near another pedestal 43 then has two second overlap joint arms 72, two first overlap joint arms 71 are the upper surfaces 411 that are set up in pedestal 41, and lay respectively at the both sides of first conduit 415, and two second overlap joint arms 72 are the upper surfaces 431 that are set up in pedestal 43, and lay respectively at the both sides of second conduit 435, its mode of setting up can be with welding, riveted joint or other suitable mode can.

This heat pipe 5 is to be mounted in first conduit 415 and second conduit 435, just by first conduit, 415 process bridgewares 7, and extend by the other end of second conduit 435, make the protruding outside that is exposed to second conduit 435 in contrast to first conduit 415, end of heat pipe 5, this radiating subassembly 6 then is to be mounted on heat pipe 5 below the end that evagination reveals, so radiating subassembly 6 and pedestal the 41, the 43rd are positioned at the same side of heat pipe 5, this radiating subassembly 6 has several radiating fins that is parallel to each other 61, in order to the contact area of increase with extraneous air-flow.

Present embodiment is with pedestal 41 when using, 43 lower surface 413,433 are attached at respectively on the thermal source (figure does not show), certainly in thermal source and lower surface 413,433 can have additional liner (figure does not show), or smear an amount of thermal grease, then with the aforementioned pedestal 41 of being located at, shell fragment 417 on 43,437 are fixedly arranged on the thermal source periphery respectively, therefore pedestal 41 is independent separately with pedestal 43, and there is no direct influence to each other, and also can relax the strength transmission of 43 of pedestal 41 and pedestals by bridgeware 7, so just can make each pedestal 41,43 more are close on the thermal source respectively, make heat that preferable pipeline be arranged.

Because pedestal 41 is connected with bridgeware 7 with pedestal 43, and pedestal 41 and the corresponding different heat sources of pedestal 43 difference, therefore when different heat sources made relative position moment change because of vibrations, pedestal 41 also can change simultaneously with the relative position of pedestal 43.Because bridgeware 7 can bear distortion, that is to say to have shockproof effect, can make pedestal 41 lower surfaces 413 be close to a thermal source, and pedestal 43 lower surfaces 433 are close to another thermal source, therefore can be certain heat be transmitted makes entire heat dissipation device 300 reach preferable radiating effect.

As for the heat transfer process of present embodiment as previously mentioned, therefore no longer describe in detail, what just must be illustrated is that the bridgeware 7 of present embodiment has only one, because present embodiment is to use on two adjacent thermals source, if on other embodiment, more thermals source are arranged, and when more pedestals was just arranged, then the quantity of bridgeware was also along with increasing.

Though the utility model is described with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the utility model, under the situation that does not break away from the utility model spirit, also can make the variation or the replacement of various equivalences, therefore, as long as in connotation scope of the present utility model in the scope to the variation of the foregoing description, claims that modification all will drop on the application.

Claims (3)

1. a Multiple Heat Source Heat Dissipating Device leaves in order to the heat that a plurality of thermal source produced with correspondence, and it includes several pedestals, at least one bridgeware, a heat pipe and a radiating subassembly, it is characterized in that:

Described pedestal is mounted on the thermal source respectively accordingly, makes the heat on the thermal source be passed to pedestal;

This bridgeware has flexibly to add to be located between the adjacent pedestal of two-phase;

This heat pipe extends on the pedestal, in order to the other end of the heat transferred on the pedestal to this heat pipe; And

This radiating subassembly is mounted on this heat pipe on the contrary in an end of pedestal.

2. Multiple Heat Source Heat Dissipating Device as claimed in claim 1 is characterized in that:

The same side in aforementioned pedestal all is respectively equipped with a conduit, and this heat pipe then is to be mounted in the conduit.

3. Multiple Heat Source Heat Dissipating Device as claimed in claim 1 is characterized in that:

This bridgeware is made of a laminar shell fragment.

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