CN221306182U - Novel copper foil for printed circuit - Google Patents
Novel copper foil for printed circuit Download PDFInfo
- Publication number
- CN221306182U CN221306182U CN202323168095.1U CN202323168095U CN221306182U CN 221306182 U CN221306182 U CN 221306182U CN 202323168095 U CN202323168095 U CN 202323168095U CN 221306182 U CN221306182 U CN 221306182U
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- China
- Prior art keywords
- copper foil
- adhesive layer
- substrate
- trapezoid
- printed circuit
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 201
- 239000011889 copper foil Substances 0.000 title claims abstract description 194
- 239000012790 adhesive layer Substances 0.000 claims abstract description 118
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 239000010410 layer Substances 0.000 claims description 35
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920003192 poly(bis maleimide) Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229920006259 thermoplastic polyimide Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000009172 bursting Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Abstract
The utility model provides a novel copper foil for a printed circuit. The copper foil adhesive layer is arranged on the bottom surface of the upper copper foil and the top surface of the lower copper foil, and the substrate adhesive layers are arranged on the top surface and the bottom surface of the substrate; trapezoid grooves are formed in the bottom surface of the upper copper foil, the top surface of the lower copper foil and the top and bottom surfaces of the substrate, trapezoid connecting blocks are arranged on the copper foil adhesive layer and the substrate adhesive layer, columnar connecting blocks are arranged on the bottom surface of the upper copper foil, the top surface of the lower copper foil and the top and bottom surfaces of the substrate, and columnar grooves are formed in the copper foil adhesive layer and the substrate adhesive layer; and the copper foil adhesive layer is provided with a longitudinal connecting groove. The utility model has the advantages that: the stability of connection between the copper foil adhesive layer and the copper foil and between the substrate adhesive layer and the substrate is greatly increased. The upper copper foil, the lower copper foil and the base plate are firmly connected.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a novel copper foil for a printed circuit.
Background
At present, electronic systems are developed in the directions of light weight, short weight, high heat resistance, multifunction, high density, high reliability and low cost, so that the selection of copper foil substrates becomes an important influencing factor.
The existing copper foil substrate is usually connected with the substrate by coating an adhesive layer on the copper foil and drying the copper foil, but the coated adhesive layer is generally flat and has limited bonding strength. For example, the copper foil laminate for printed circuit with the authorized bulletin number of CN206790783U can make the connection between the copper foil and the adhesive layer more stable by arranging the first protruding part and the second protruding part. However, the reinforcing effect of the protruding portion on the connection between the two is relatively general, and the connection between the adhesive layer and the substrate is still to be reinforced. For this reason, a novel copper foil for printed circuits has been proposed for improvement.
Disclosure of utility model
The object of the present utility model is to solve at least one of the technical drawbacks.
Therefore, an object of the present utility model is to provide a novel copper foil for printed circuit to solve the problems mentioned in the background art and overcome the disadvantages of the prior art.
In order to achieve the above object, an embodiment of an aspect of the present utility model provides a novel copper foil for a printed circuit, including an upper copper foil, a substrate, and a lower copper foil, wherein a copper foil adhesive layer is disposed on a bottom surface of the upper copper foil and a top surface of the lower copper foil, and substrate adhesive layers are disposed on the top surface and the bottom surface of the substrate;
Trapezoid grooves are formed in the bottom surface of the upper copper foil, the top surface of the lower copper foil and the top and bottom surfaces of the substrate, trapezoid connecting blocks are arranged on the copper foil adhesive layer and the substrate adhesive layer, columnar connecting blocks are arranged on the bottom surface of the upper copper foil, the top surface of the lower copper foil and the top and bottom surfaces of the substrate, and columnar grooves are formed in the copper foil adhesive layer and the substrate adhesive layer;
the copper foil adhesive layer is provided with a longitudinal connecting groove, the substrate adhesive layer is provided with a longitudinal connecting block, the copper foil adhesive layer is provided with a transverse connecting groove, and the substrate adhesive layer is provided with a transverse connecting block.
In any of the above embodiments, the thickness of the upper layer copper foil and the lower layer copper foil is preferably 5 to 12 μm.
In any of the above embodiments, it is preferable that the upper layer copper foil and the lower layer copper foil are both carrier-attached copper foils.
The technical scheme is adopted: because the upper layer copper foil and the lower layer copper foil are small in thickness and easy to fold and difficult to take, the upper layer copper foil and the lower layer copper foil are both made of carrier-bearing copper foil and are used as supports in the body layer so as to take the copper foil. The carrier copper foil used for the upper layer copper foil is one of a rolled copper foil (RA carrier copper foil) and a high-temperature and high-buckling copper foil (electrolytic carrier copper foil), and the thickness of the upper layer copper foil is preferably 5 to 9 μm; the copper foil used for the lower layer copper foil is not particularly limited, and a general electrolytic carrier copper foil can be used, and the thickness of the lower layer copper foil is preferably 5 to 9 μm.
In any of the above embodiments, it is preferable that the copper foil adhesive layer and the substrate adhesive layer each be a polyimide layer or a polyamideimide layer.
The technical scheme is adopted: in order to reduce the quality problems of warping, bursting and the like of the flexible printed circuit board manufactured by the copper foil substrate for the printed circuit board, the copper foil for the printed circuit board can adjust the composition and the thickness of the copper foil adhesive layer and the substrate adhesive layer according to the requirements. In order to improve the heat resistance of the copper foil for a printed circuit board of the present utility model, the adhesive layer preferably has a glass transition temperature of more than 170 ℃. The adhesive layer is generally made of one or more materials selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin, wherein the polyimide resin can be thermoplastic polyimide. Preferably, the adhesive layer is a mixed adhesive layer formed by combining an epoxy resin with a thermoplastic polyimide selected from bismaleimide resin, acrylic resin, and the like.
By any of the above schemes, it is preferable that the trapezoid groove, the trapezoid connecting block, the cylindrical connecting block and the cylindrical groove are all provided with a plurality of trapezoid grooves, trapezoid connecting blocks, cylindrical connecting blocks and cylindrical grooves.
By any of the above schemes, preferably, the trapezoid groove is arranged corresponding to the trapezoid connecting block, and the cylindrical connecting block is arranged corresponding to the cylindrical groove.
In any of the above embodiments, it is preferable that the longitudinal connecting grooves are provided corresponding to the longitudinal connecting blocks, and the lateral connecting grooves are provided corresponding to the lateral connecting blocks.
The technical scheme is adopted: the trapezoid groove, the trapezoid connecting block and the cylindrical connecting block are matched with the cylindrical groove, so that the upper copper foil, the lower copper foil, the copper foil adhesive layer and the substrate adhesive layer are tightly connected with the substrate, and the stability of connection between the copper foil adhesive layer and the copper foil and between the substrate adhesive layer and the substrate is greatly improved. The longitudinal connecting grooves, the longitudinal connecting blocks, the transverse connecting grooves and the transverse connecting blocks are matched with each other, so that the substrate adhesive layer and the copper foil adhesive layer are tightly connected, the friction force between the substrate adhesive layer and the copper foil adhesive layer is increased, and the substrate adhesive layer and the copper foil adhesive layer are firmly connected.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
1. This novel copper foil for printed circuit has all seted up the dovetail groove through the bottom surface of upper copper foil, the top surface of lower floor copper foil and the top, the bottom both sides of base plate, be provided with trapezoidal connecting block on copper foil adhesive layer, base plate adhesive layer to the cooperation sets up cylindrical groove, cylindricality connecting block, dovetail groove, trapezoidal connecting block and cylindricality connecting block, cylindricality groove cooperation can upper copper foil, lower floor copper foil and copper foil adhesive layer, base plate adhesive layer and base plate zonulae occludens, greatly increases between copper foil adhesive layer and the copper foil, the stability of being connected between base plate adhesive layer and the base plate.
2. This novel copper foil for printed circuit has offered vertical spread groove through on the copper foil adhesive layer, is provided with vertical connecting block on the base plate adhesive layer, cooperation transverse connection groove, transverse connection piece, vertical connecting groove, vertical connecting block and transverse connection groove, transverse connection piece mutually support can make base plate adhesive layer and copper foil adhesive layer zonulae occludens, increase frictional force between the two, make the two connect more firm, and then make the connection between upper copper foil, lower floor copper foil and the base plate more firm.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic structural view of a copper foil adhesive layer according to the present utility model;
FIG. 3 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;
Fig. 4 is an enlarged schematic view of the structure of fig. 1B according to the present utility model.
In the figure: the copper foil comprises a 1-upper copper foil layer, a 2-substrate layer, a 3-lower copper foil layer, a 4-copper foil adhesive layer, a 5-substrate adhesive layer, a 6-trapezoid groove, a 7-trapezoid connecting block, an 8-cylindrical connecting block, a 9-cylindrical groove, a 10-longitudinal connecting groove, a 11-longitudinal connecting block, a 12-transverse connecting groove and a 13-transverse connecting block.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1 to 4, the utility model comprises an upper copper foil 1, a substrate 2 and a lower copper foil 3, wherein a copper foil adhesive layer 4 is arranged on the bottom surface of the upper copper foil 1 and the top surface of the lower copper foil 3, and a substrate adhesive layer 5 is arranged on the top surface and the bottom surface of the substrate 2;
Trapezoid grooves 6 are formed in the bottom surface of the upper copper foil 1, the top surface of the lower copper foil 3 and the top and bottom surfaces of the substrate 2, trapezoid connecting blocks 7 are arranged on the copper foil adhesive layer 4 and the substrate adhesive layer 5, columnar connecting blocks 8 are arranged on the bottom surface of the upper copper foil 1, the top surface of the lower copper foil 3 and the top and bottom surfaces of the substrate 2, and columnar grooves 9 are formed in the copper foil adhesive layer 4 and the substrate adhesive layer 5;
The copper foil adhesive layer 4 is provided with a longitudinal connecting groove 10, the substrate adhesive layer 5 is provided with a longitudinal connecting block 11, the copper foil adhesive layer 4 is provided with a transverse connecting groove 12, and the substrate adhesive layer 5 is provided with a transverse connecting block 13.
Example 1: the thickness of the upper copper foil 1 and the lower copper foil 3 is 5 to 12 μm. The upper layer copper foil 1 and the lower layer copper foil 3 are both copper foil with carrier. Because the upper layer copper foil 1 and the lower layer copper foil 2 are small in thickness, are easy to fold and difficult to take, the upper layer copper foil 1 and the lower layer copper foil 3 are both made of carrier-bearing copper foil, and an in-body layer is used as a support so as to take the copper foil. The carrier copper foil used for the upper layer copper foil 1 is one of a rolled copper foil (RA carrier copper foil) and a high-temperature and high-buckling copper foil (electrolytic carrier copper foil), and the thickness of the upper layer copper foil 1 is preferably 5 to 9 μm; the copper foil used for the lower layer copper foil 2 is not particularly limited, and a general electrolytic carrier copper foil can be used, and the thickness of the lower layer copper foil 2 is preferably 5 to 9 μm.
Example 2: the copper foil adhesive layer 4 and the substrate adhesive layer 5 are polyimide layers or polyamideimide layers. In order to reduce the quality problems of warping, bursting and the like of the flexible printed circuit board manufactured by the copper foil substrate for the printed circuit board, the composition and the thickness of the copper foil adhesive layer 4 and the substrate adhesive layer 5 can be adjusted according to the requirements. In order to improve the heat resistance of the copper foil for a printed circuit board of the present utility model, the adhesive layer preferably has a glass transition temperature of more than 170 ℃. The adhesive layer is generally made of one or more materials selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin, wherein the polyimide resin can be thermoplastic polyimide. Preferably, the adhesive layer is a mixed adhesive layer formed by combining an epoxy resin with a thermoplastic polyimide selected from bismaleimide resin, acrylic resin, and the like.
Example 3: the trapezoid groove 6, the trapezoid connecting block 7, the cylindrical connecting block 8 and the cylindrical groove 9 are all provided with a plurality of trapezoid grooves. The trapezoid groove 6 is arranged corresponding to the trapezoid connecting block 7, and the cylindrical connecting block 8 is arranged corresponding to the cylindrical groove 9. The longitudinal connecting grooves 10 are provided corresponding to the longitudinal connecting blocks 11, and the transverse connecting grooves 12 are provided corresponding to the transverse connecting blocks 13. The trapezoid groove 6, the trapezoid connecting block 7, the columnar connecting block 8 and the columnar groove 9 are matched with each other, so that the upper copper foil 1, the lower copper foil 3, the copper foil adhesive layer 4 and the substrate adhesive layer 5 are tightly connected with the substrate 2, and the stability of connection between the copper foil adhesive layer 4 and the copper foil and between the substrate adhesive layer 5 and the substrate 2 is greatly improved. The longitudinal connecting grooves 10, the longitudinal connecting blocks 11, the transverse connecting grooves 12 and the transverse connecting blocks 13 are matched with each other, so that the substrate adhesive layer 5 and the copper foil adhesive layer 4 can be tightly connected, the friction force between the substrate adhesive layer 5 and the copper foil adhesive layer 4 is increased, and the connection between the substrate adhesive layer and the copper foil adhesive layer is firmer.
The working principle of the utility model is as follows:
S1, coating a copper foil adhesive layer 4 on an upper copper foil 1 and a lower copper foil 3, and automatically forming a trapezoid connecting block 7 and a columnar groove 9 after the copper foil adhesive layer 4 is coated, wherein the copper foil adhesive layer 4 is stably connected with the upper copper foil 1 and the lower copper foil 3. Coating substrate adhesive layers 5 on two sides of a substrate 2, automatically forming trapezoid connecting blocks 7 and cylindrical grooves 9 after the substrate adhesive layers 5 are coated, and stably connecting the substrate adhesive layers 5 with the substrate 2;
S2, forming a longitudinal connecting groove 10 and a transverse connecting groove 12 on the copper foil adhesive layer 4, brushing a longitudinal connecting block 11 and a transverse connecting block 13 on the substrate adhesive layer 5, butting the copper foil adhesive layer 4 with the substrate adhesive layer 5, and drying;
S3, the trapezoid groove 6, the trapezoid connecting block 7, the cylindrical connecting block 8 and the cylindrical groove 9 are matched, so that the upper copper foil 1, the lower copper foil 3, the copper foil adhesive layer 4 and the substrate adhesive layer 5 can be tightly connected with the substrate 2. The longitudinal connecting grooves 10, the longitudinal connecting blocks 11, the transverse connecting grooves 12 and the transverse connecting blocks 13 are matched with each other, so that the substrate adhesive layer 5 and the copper foil adhesive layer 4 can be tightly connected.
Compared with the prior art, the utility model has the following beneficial effects compared with the prior art:
1. This novel copper foil for printed circuit is through all having seted up trapezoidal slot 6 in the bottom surface of upper copper foil 1, the top surface of lower floor's copper foil 3 and the top, the bottom both sides of base plate 2, be provided with trapezoidal connecting block 7 on copper foil adhesive layer 4, base plate adhesive layer 5 to the cooperation sets up cylindrical groove 9, cylindrical connecting block 8, trapezoidal slot 6, trapezoidal connecting block 7 and cylindrical connecting block 8, cylindrical groove 9 cooperation can upper copper foil 1, lower floor's copper foil 3 and copper foil adhesive layer 4, base plate adhesive layer 5 and base plate 2 zonulae occludens, greatly increase the stability of being connected between copper foil adhesive layer 4 and the copper foil, between base plate adhesive layer 5 and the base plate 2.
2. This novel copper foil for printed circuit is through having seted up vertical spread groove 10 on copper foil adhesive layer 4, is provided with vertical connecting block 11 on base plate adhesive layer 5, cooperation transverse connection groove 12, transverse connection piece 13, vertical spread groove 10, vertical connecting block 11 and transverse connection groove 12, transverse connection piece 13 mutually support can make base plate adhesive layer 5 and copper foil adhesive layer 4 zonulae occludens, increases frictional force between the two, makes the two connect more firm, and then makes the connection between upper copper foil 1, lower floor copper foil 3 and the base plate 2 more firm.
Claims (7)
1. A novel copper foil for a printed circuit comprises an upper copper foil (1), a substrate (2) and a lower copper foil (3); the copper foil adhesive layer (4) is arranged on the bottom surface of the upper copper foil (1) and the top surface of the lower copper foil (3), and the substrate adhesive layers (5) are arranged on the top surface and the bottom surface of the substrate (2);
Trapezoid grooves (6) are formed in the bottom surface of the upper copper foil (1), the top surface of the lower copper foil (3) and the top and bottom surfaces of the substrate (2), trapezoid connecting blocks (7) are arranged on the copper foil adhesive layer (4) and the substrate adhesive layer (5), columnar connecting blocks (8) are arranged on the bottom surface of the upper copper foil (1), the top surface of the lower copper foil (3) and the top and bottom surfaces of the substrate (2), and columnar grooves (9) are formed in the copper foil adhesive layer (4) and the substrate adhesive layer (5);
The copper foil adhesive layer (4) is provided with a longitudinal connecting groove (10), the substrate adhesive layer (5) is provided with a longitudinal connecting block (11), the copper foil adhesive layer (4) is provided with a transverse connecting groove (12), and the substrate adhesive layer (5) is provided with a transverse connecting block (13).
2. The novel copper foil for a printed circuit according to claim 1, wherein: the thickness of the upper copper foil (1) and the lower copper foil (3) is 5-12 micrometers.
3. The novel copper foil for a printed circuit according to claim 2, wherein: the upper layer copper foil (1) and the lower layer copper foil (3) are copper foils with carriers.
4. A novel copper foil for printed circuits as claimed in claim 3, wherein: the copper foil adhesive layer (4) and the substrate adhesive layer (5) are both polyimide layers or polyamide-imide layers.
5. The novel copper foil for a printed circuit according to claim 4, wherein: the trapezoid groove (6), the trapezoid connecting block (7), the cylindrical connecting block (8) and the cylindrical groove (9) are all provided with a plurality of trapezoid grooves.
6. The novel copper foil for a printed circuit according to claim 5, wherein: the trapezoid groove (6) is arranged corresponding to the trapezoid connecting block (7), and the cylindrical connecting block (8) is arranged corresponding to the cylindrical groove (9).
7. The novel copper foil for a printed circuit according to claim 6, wherein: the longitudinal connecting grooves (10) are arranged corresponding to the longitudinal connecting blocks (11), and the transverse connecting grooves (12) are arranged corresponding to the transverse connecting blocks (13).
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221306182U true CN221306182U (en) | 2024-07-09 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |