CN221151628U - Novel copper foil with double rough surfaces - Google Patents
Novel copper foil with double rough surfaces Download PDFInfo
- Publication number
- CN221151628U CN221151628U CN202323168094.7U CN202323168094U CN221151628U CN 221151628 U CN221151628 U CN 221151628U CN 202323168094 U CN202323168094 U CN 202323168094U CN 221151628 U CN221151628 U CN 221151628U
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- Prior art keywords
- copper foil
- strip
- layer
- adhesive layer
- double
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 236
- 239000011889 copper foil Substances 0.000 title claims abstract description 216
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 238000000926 separation method Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000007704 transition Effects 0.000 claims abstract description 23
- 239000011241 protective layer Substances 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 38
- 244000025254 Cannabis sativa Species 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920003192 poly(bis maleimide) Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229920006259 thermoplastic polyimide Polymers 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000009172 bursting Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Laminated Bodies (AREA)
Abstract
The utility model provides a novel double-matted surface copper foil. Comprises an upper copper foil, a substrate and a lower copper foil; the manufacturing method is characterized in that adhesive layers are arranged between the upper copper foil and the substrate and between the lower copper foil and the substrate, and protective layers are arranged on the top surface of the upper copper foil and the bottom surface of the lower copper foil; the upper copper foil, the substrate and the lower copper foil are respectively provided with a rough surface on the upper surface and the lower surface, the periphery of the bottom surface of the upper copper foil and the periphery of the top surface of the lower copper foil are respectively fixedly connected with a retaining strip, the middle parts of the bottom surface of the upper copper foil and the top surface of the lower copper foil are respectively fixedly connected with a separation strip, and the inner sides of the retaining strips and the two sides of the separation strips are respectively fixedly connected with a transition strip. The utility model has the advantages that: the adhesive layer, the upper copper foil and the lower copper foil form a connection mode of ' I in you and you in I ' in you ', so that the connection strength between the adhesive layer and the upper copper foil is greatly increased, the upper copper foil, the lower copper foil and the adhesive layer form a whole, and the connection is more stable.
Description
Technical Field
The utility model relates to the technical field of copper foil of printed circuit boards, in particular to a novel double-roughened copper foil.
Background
At present, electronic systems are developed in the directions of light weight, short weight, high heat resistance, multifunction, high density, high reliability and low cost, so that the selection of copper foil substrates becomes an important influencing factor.
The existing copper foil substrate is usually connected with the substrate by coating an adhesive layer on the copper foil and drying the copper foil, but the coated adhesive layer is generally flat and has limited bonding strength. For example, the copper foil laminate for printed circuit with the authorized bulletin number of CN206790783U can make the connection between the copper foil and the adhesive layer more stable by arranging the first protruding part and the second protruding part. However, the reinforcing effect of the convex portion on the connection between the convex portion and the base plate is relatively general, and the copper foil can be separated from the base plate when a relatively strong external force is applied. Therefore, a novel double-roughened copper foil is provided for improvement.
Disclosure of utility model
The object of the present utility model is to solve at least one of the technical drawbacks.
Therefore, an object of the present utility model is to provide a novel double-roughened copper foil to solve the problems mentioned in the background art and overcome the shortcomings in the prior art.
In order to achieve the above object, an embodiment of an aspect of the present utility model provides a double-sided novel copper foil, including an upper copper foil, a substrate, and a lower copper foil; adhesive layers are arranged between the upper copper foil and the substrate and between the lower copper foil and the substrate, and protective layers are arranged on the top surface of the upper copper foil and the bottom surface of the lower copper foil;
The upper copper foil, the substrate and the upper and lower surfaces of the lower copper foil are respectively provided with a rough surface, the periphery of the bottom surface of the upper copper foil and the periphery of the top surface of the lower copper foil are respectively fixedly connected with a retaining strip, the middle parts of the bottom surface of the upper copper foil and the top surface of the lower copper foil are respectively fixedly connected with a separation strip, the inner sides of the retaining strips and the two sides of the separation strips are respectively fixedly connected with a transition strip, the bottom surface of the upper copper foil and the top surface of the lower copper foil are respectively provided with a clamping groove, and one side of the adhesive layer, which is close to the upper copper foil and the lower copper foil, is provided with a clamping block and is provided with a separation groove.
In any of the above embodiments, the thickness of the upper layer copper foil and the lower layer copper foil is preferably 5 to 12 μm.
In any of the above embodiments, it is preferable that the upper layer copper foil and the lower layer copper foil are both carrier-attached copper foils.
The technical scheme is adopted: because the upper layer copper foil and the lower layer copper foil are small in thickness and easy to fold and difficult to take, the upper layer copper foil and the lower layer copper foil are both made of carrier-bearing copper foil and are used as supports in the body layer so as to take the copper foil. The carrier copper foil used for the upper layer copper foil is one of a rolled copper foil (RA carrier copper foil) and a high-temperature and high-buckling copper foil (electrolytic carrier copper foil), and the thickness of the upper layer copper foil is preferably 5 to 9 μm; the copper foil used for the lower layer copper foil is not particularly limited, and a general electrolytic carrier copper foil can be used, and the thickness of the lower layer copper foil is preferably 5 to 9 μm.
In any of the above embodiments, it is preferable that the adhesive layer is a polyimide layer or a polyamideimide layer.
The technical scheme is adopted: in order to reduce the quality problems of warping, bursting and the like of the flexible printed circuit board manufactured by the copper foil substrate for the printed circuit board, the composition and the thickness of the adhesive layer of the copper foil for the printed circuit board can be adjusted according to requirements. In order to improve the heat resistance of the copper foil, the adhesive layer preferably has a glass transition temperature of more than 170 ℃. The adhesive layer is generally made of one or more materials selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin, wherein the polyimide resin can be thermoplastic polyimide. Preferably, the adhesive layer is a mixed adhesive layer formed by combining an epoxy resin with a thermoplastic polyimide selected from bismaleimide resin, acrylic resin, and the like.
By any of the above schemes, it is preferable that the roughened surface is a grass pattern roughened surface, and the roughened surfaces of the bottom surface of the upper copper foil and the top surface of the lower copper foil are arranged between the guard bar and the separator bar.
By any of the above schemes, preferably, the dividing strip adopts a cross structure and the end part is fixedly connected with the enclosing strip, and the height of the transition strip is smaller than the heights of the enclosing strip and the dividing strip.
By any of the above schemes, it is preferable that the fixing groove and the fixing block are provided correspondingly, and the separation groove and the separation bar are provided correspondingly.
The technical scheme is adopted: through setting up deckle edge, make upper copper foil, lower floor's copper foil and between the protective layer, upper copper foil, lower floor's copper foil and the connection between base plate and the adhesive layer more stable. The surrounding strips, the separating strips and the transition strips are arranged to enable the adhesive layer to be fused into the upper copper foil and the lower copper foil, and the adhesive layer, the upper copper foil and the lower copper foil form a connection form of ' you have me in me ' and you have me in me ' through the clamping grooves and the clamping blocks, so that the connection strength between the adhesive layer and the upper copper foil and the lower copper foil is greatly improved. The transition strip is used as a transition structure of the enclosure strip and the separation strip, so that the problem that the adhesive layer cannot be filled at the internal corners of the enclosure strip and the separation strip due to the fact that the heights of the enclosure strip and the separation strip are high can be solved.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
1. According to the novel double-matte-surface copper foil, the matte surfaces are arranged on the upper surface and the lower surface of the upper copper foil, the substrate and the lower copper foil, and the matte surfaces are made of grass patterns, so that the connection among the upper copper foil, the lower copper foil and the protective layer, the connection among the upper copper foil, the lower copper foil and the substrate and the adhesive layer are more stable due to the fact that the grass patterns are very large in friction force. Through setting up and enclosing the protection strip, separate the strip, transition strip makes the adhesive layer fuse into upper copper foil and lower floor's copper foil in, through setting up card solid groove and card solid piece, makes adhesive layer and upper copper foil, lower floor's copper foil form "there is I in you, there is you in I's, greatly increased the joint strength between them, makes upper copper foil, lower floor's copper foil and adhesive layer become a whole between them, even also can't break away from each other under strong exogenic action, connect more stably.
2. This novel copper foil of double-wool surface sets up the transition strip through the both sides at the inboard of enclosing strip, dividing strip, and the highly be less than the height of enclosing strip and dividing strip of transition strip, and the transition strip is as the transition structure of enclosing strip and dividing strip, can solve the unable problem that is full of two reentrant corner departments because of the adhesive layer that the enclosing strip, dividing strip highly lead to. Through setting up the protective layer in the top surface of upper copper foil and the bottom surface of lower floor's copper foil, make upper copper foil and lower floor's copper foil all obtain the protection, can effectively improve the life of copper foil.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
fig. 2 is a schematic structural view of an upper copper foil according to the present utility model.
In the figure: the copper foil comprises a 1-upper copper foil layer, a 2-substrate, a 3-lower copper foil layer, a 4-adhesive layer, a 5-protective layer, a 6-rough surface, a 7-enclosure strip, an 8-separation strip, a 9-transition strip, a 10-clamping groove, an 11-clamping block and a 12-separation groove.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1 to 2, an embodiment of an aspect of the present utility model provides a double-sided novel copper foil, which includes an upper copper foil 1, a substrate 2 and a lower copper foil 3; an adhesive layer 4 is arranged between the upper copper foil 1 and the substrate 2 and between the lower copper foil 3 and the substrate 2, and a protective layer 5 is arranged on the top surface of the upper copper foil 1 and the bottom surface of the lower copper foil 3;
The upper copper foil 1, the substrate 2 and the upper and lower surfaces of the lower copper foil 3 are respectively provided with a rough surface 6, the periphery of the bottom surface of the upper copper foil 1 and the top surface of the lower copper foil 3 are respectively fixedly connected with a retaining strip 7, the middle parts of the bottom surface of the upper copper foil 1 and the top surface of the lower copper foil 3 are respectively fixedly connected with a separation strip 8, the inner sides of the retaining strips 7 and the two sides of the separation strips 8 are respectively fixedly connected with a transition strip 9, clamping grooves 10 are respectively formed in the bottom surface of the upper copper foil 1 and the top surface of the lower copper foil 3, and one side, close to the upper copper foil 1 and the lower copper foil 3, of the adhesive layer 4 is provided with clamping blocks 11 and separation grooves 12.
Example 1: the thickness of the upper copper foil 1 and the lower copper foil 3 is 5 to 12 μm. The upper layer copper foil 1 and the lower layer copper foil 3 are both copper foil with carrier. Because the upper layer copper foil 1 and the lower layer copper foil 2 are small in thickness, are easy to fold and difficult to take, the upper layer copper foil 1 and the lower layer copper foil 3 are both made of carrier-bearing copper foil, and an in-body layer is used as a support so as to take the copper foil. The carrier copper foil used for the upper layer copper foil 1 is one of a rolled copper foil (RA carrier copper foil) and a high-temperature and high-buckling copper foil (electrolytic carrier copper foil), and the thickness of the upper layer copper foil 1 is preferably 5 to 9 μm; the copper foil used for the lower layer copper foil 2 is not particularly limited, and a general electrolytic carrier copper foil can be used, and the thickness of the lower layer copper foil 2 is preferably 5 to 9 μm.
Example 2: the adhesive layer 4 is a polyimide layer or a polyamideimide layer. In order to reduce the quality problems of warping, bursting and the like of the flexible printed circuit board manufactured by the copper foil substrate for the printed circuit board, the composition and the thickness of the adhesive layer 4 can be adjusted according to the requirement. In order to improve the heat resistance of the copper foil, the adhesive layer 4 preferably has a glass transition temperature of more than 170 ℃. The material of the adhesive layer 4 is generally one or a mixture of more selected from the group consisting of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin, wherein the polyimide resin may be thermoplastic polyimide. Preferably, the mixed adhesive layer 4 is formed by combining an epoxy resin with a thermoplastic polyimide selected from bismaleimide resin, acrylic resin, and the like.
Example 3: the rough surface 6 adopts grass pattern rough surfaces, and the rough surface 6 of the bottom surface of the upper copper foil 1 and the top surface of the lower copper foil 3 is arranged between the enclosure strip 7 and the separation strip 8. The separation strip 8 adopts a cross structure, the end part of the separation strip is fixedly connected with the enclosing strip 7, and the height of the transition strip 9 is smaller than the heights of the enclosing strip 7 and the separation strip 8. The clamping groove 10 and the clamping block 11 are correspondingly arranged, and the separation groove 12 is correspondingly arranged with the separation strip 8. By providing burrs 6, the connection between the upper copper foil 1, the lower copper foil 3 and the protective layer 5, and between the upper copper foil 1, the lower copper foil 3, and the substrate 2 and the adhesive layer 4 is made more stable. The surrounding strip 7, the separating strip 8 and the transition strip 9 are arranged, so that the adhesive layer 4 is fused into the upper copper foil 1 and the lower copper foil 3, and the adhesive layer 4, the upper copper foil 1 and the lower copper foil 3 form a connection form of 'you have me in you and you in me' by arranging the clamping groove 10 and the clamping block 11, so that the connection strength between the adhesive layer 4 and the upper copper foil 1 and the lower copper foil 3 is greatly improved. The transition strip 9 is used as a transition structure of the enclosure strip 7 and the separation strip 8, so that the problem that the adhesive layer 4 cannot be filled at the internal corners of the enclosure strip 7 and the separation strip 8 due to the fact that the heights of the enclosure strip and the separation strip are higher can be solved.
The working principle of the utility model is as follows:
S1, coating an adhesive layer 4 on an upper copper foil 1 and a lower copper foil 3, automatically filling the space between a surrounding strip 7 and a separation strip 8 after the adhesive layer 4 is coated, and forming a clamping block 11 and a separation groove 12, wherein the adhesive layer 4 is stably connected with the upper copper foil 1 and the lower copper foil 3;
S2, attaching the substrate 2 to the adhesive layer 4, and stably connecting the adhesive layer 4 with the substrate 2 under the action of the rough surface 6;
S3, detaching the carriers of the upper layer copper foil 1 and the lower layer copper foil 3, and adding a protective layer 5 on the top surface of the upper layer copper foil 1 and the bottom surface of the lower layer copper foil 3.
Compared with the prior art, the utility model has the following beneficial effects compared with the prior art:
1. According to the double-matte novel copper foil, the matte surfaces 6 are arranged on the upper surface and the lower surface of the upper copper foil 1, the substrate 2 and the lower copper foil 3, and the matte surfaces 6 are grass pattern matte surfaces, so that the connection between the upper copper foil 1, the lower copper foil 3 and the protective layer 5, and between the upper copper foil 1, the lower copper foil 3 and the substrate 2 and the adhesive layer 4 is more stable due to the fact that the grass pattern matte surfaces have very large friction force. Through setting up the enclosure strip 7, separate the strip 8, transition strip 9 makes the adhesive layer 4 blend into in upper copper foil 1 and the lower floor copper foil 3, through setting up card solid groove 10 and card solid piece 11, makes adhesive layer 4 and upper copper foil 1, lower floor copper foil 3 form "you have me in you, I have you in me" connected mode, greatly increased their joint strength, make upper copper foil 1, lower floor copper foil 3 and adhesive layer 4 become a whole between them, even also can't break away from each other under strong exogenic action, connect more stably.
2. This novel copper foil of double-wool surface, through setting up transition strip 9 in the inboard of enclosure strip 7, the both sides of parting bead 8, the highly be less than the height of enclosure strip 7 and parting bead 8 of transition strip 9, transition strip 9 is as the transition structure of enclosure strip 7 and parting bead 8, can solve the problem that adhesive layer 4 can't be full of two reentrant corner departments because of enclosure strip 7, parting bead 8 high results in. Through setting up protective layer 5 in the top surface of upper copper foil 1 and the bottom surface of lower floor's copper foil 3, make upper copper foil 1 and lower floor's copper foil 3 all obtain the protection, can effectively improve the life of copper foil.
Claims (7)
1. The novel double-roughened copper foil comprises an upper copper foil (1), a substrate (2) and a lower copper foil (3); the manufacturing method is characterized in that adhesive layers (4) are arranged between the upper copper foil (1) and the substrate (2) and between the lower copper foil (3) and the substrate (2), and protective layers (5) are arranged on the top surface of the upper copper foil (1) and the bottom surface of the lower copper foil (3);
the utility model discloses a copper foil, including upper copper foil (1), base plate (2) and lower floor's copper foil (3), upper and lower both sides all are provided with ground (6), all fixedly connected with enclosure strip (7) around the bottom surface of upper copper foil (1) and the top surface of lower floor's copper foil (3), the bottom surface of upper copper foil (1) and the middle part of the top surface of lower floor's copper foil (3) all fixedly connected with separate strip (8), the inboard of enclosure strip (7), the both sides of separate strip (8) all fixedly connected with transition strip (9), clamping groove (10) have all been seted up to the bottom surface of upper copper foil (1) and the top surface of lower floor's copper foil (3), one side that adhesive layer (4) is close to upper copper foil (1) and lower floor's copper foil (3) is provided with clamping piece (11) and has seted up separating groove (12).
2. The double-sided new copper foil according to claim 1, wherein: the thickness of the upper copper foil (1) and the lower copper foil (3) is 5-12 micrometers.
3. The double-sided new copper foil according to claim 2, wherein: the upper layer copper foil (1) and the lower layer copper foil (3) are copper foils with carriers.
4. A double-sided new copper foil according to claim 3, wherein: the adhesive layer (4) adopts a polyimide layer or a polyamide imide layer.
5. The double-sided new copper foil according to claim 4, wherein: the rough surface (6) adopts grass pattern rough surfaces, and the rough surface (6) of the bottom surface of the upper copper foil (1) and the top surface of the lower copper foil (3) is arranged between the enclosure strip (7) and the separation strip (8).
6. The double-sided new copper foil according to claim 5, wherein: the separation strip (8) adopts a cross structure, the end part of the separation strip is fixedly connected with the enclosing strip (7), and the height of the transition strip (9) is smaller than the heights of the enclosing strip (7) and the separation strip (8).
7. The double-sided new copper foil according to claim 6, wherein: the clamping groove (10) and the clamping block (11) are correspondingly arranged, and the separation groove (12) and the separation strip (8) are correspondingly arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323168094.7U CN221151628U (en) | 2023-11-23 | 2023-11-23 | Novel copper foil with double rough surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323168094.7U CN221151628U (en) | 2023-11-23 | 2023-11-23 | Novel copper foil with double rough surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221151628U true CN221151628U (en) | 2024-06-14 |
Family
ID=91425361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323168094.7U Active CN221151628U (en) | 2023-11-23 | 2023-11-23 | Novel copper foil with double rough surfaces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221151628U (en) |
-
2023
- 2023-11-23 CN CN202323168094.7U patent/CN221151628U/en active Active
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| GR01 | Patent grant | ||
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