CN216915119U

CN216915119U - Black low-light-transmission copper-clad plate with low dielectric constant and low dielectric loss

Info

Publication number: CN216915119U
Application number: CN202122804447.2U
Authority: CN
Inventors: 季荣梅; 曹小进; 陈佳伟; 何亚祥
Original assignee: Shenzhen Xinrongjin Insulation Materials Co ltd
Current assignee: Shenzhen Xinrongjin Insulation Materials Co ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-07-08
Anticipated expiration: 2031-11-16

Abstract

The utility model relates to the technical field of copper clad plates, in particular to a black low-transmittance copper clad plate with low dielectric constant and dielectric loss, which comprises a copper clad laminate, wherein the upper surface and the lower surface of the copper clad laminate are respectively coated with a first low-dielectric-constant dielectric layer and a second low-dielectric-constant dielectric layer, the upper surface of the first low-dielectric-constant dielectric layer is also provided with a thermosetting polyimide film layer, the lower surface of the second low-dielectric-constant dielectric layer is also provided with an RCC dielectric layer, the upper surface of the thermosetting polyimide film layer and the lower surface of the RCC dielectric layer are both coated with a copper clad layer, and four corners of the thermosetting polyimide film layer, the first low-dielectric-constant dielectric layer, the copper clad laminate and the RCC dielectric layer are fixedly connected with four corner stable support blocks, and the empty groove that is equipped with can improve equipment self thermal diffusivity, has improved the life of equipment.

Description

Black low-light-transmission copper-clad plate with low dielectric constant and low dielectric loss

Technical Field

The utility model relates to the technical field of copper-clad plates, in particular to a black low-transmittance copper-clad plate with low dielectric constant and low dielectric loss.

Background

With the development of advanced communication equipment and technology, the demand of various high frequency electronic devices widely applied to the communication field is also rapidly increasing, in order to meet the transmission of high frequency signals, the seeking of high transmission speed and high frequency low loss, various copper clad laminate base materials with low dielectric constant and low dielectric loss are also continuously developed, for example, the application number is CN201820996708.0, a low dielectric constant double-sided flexible copper clad laminate comprises: the single-sided copper-clad plate comprises a copper foil layer, a low-dielectric-constant adhesive layer coated on the copper foil layer and a thermosetting polyimide film layer laminated on the low-dielectric-constant adhesive layer, wherein the thermosetting polyimide film layer is arranged adjacent to the low-dielectric-constant dielectric layer; the utility model discloses a two-sided flexible copper-clad plate of low dielectric constant, it not only has low dielectric constant, low dielectric loss tangent, has excellent stability and heat resistance moreover.

In the technical scheme, the low-dielectric-constant adhesive layer on the copper foil layer and the thermosetting polyimide thin film layer laminated on the low-dielectric-constant adhesive layer are coated, the thermosetting polyimide thin film layer and the low-dielectric-constant dielectric layer are adjacently arranged, so that the copper-clad plate has the advantages of low dielectric constant and low dielectric loss, but the problem that the ambient temperature of internal equipment is high can exist when the copper-clad plate is applied to the inside of electronic equipment, so that the copper-clad plate has heat resistance, but the problem that hot melting exists due to high temperature still exists in the internal adhesive layer, and ambient high temperature enters the inside of the copper-clad plate, heat cannot be well dissipated, and therefore improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a black low-transmittance copper-clad plate with low dielectric constant and low dielectric loss, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the black low-transmittance copper-clad plate with low dielectric constant and low dielectric loss comprises a copper-clad laminate, wherein the upper surface and the lower surface of the copper-clad laminate are respectively coated with a first low-dielectric-constant dielectric layer and a second low-dielectric-constant dielectric layer, the upper surface of the first low-dielectric-constant dielectric layer is also provided with a thermosetting polyimide film layer, the lower surface of the second low-dielectric-constant dielectric layer is also provided with an RCC dielectric layer, the upper surface of the thermosetting polyimide film layer and the lower surface of the RCC dielectric layer are both coated with copper foil layers, and four corners of the thermosetting polyimide film layer, the first low-dielectric-constant dielectric layer, the copper-clad laminate, the second low-dielectric-constant dielectric layer and the RCC dielectric layer are fixedly connected with four corner stabilizing support blocks.

Preferably, the thermosetting polyimide film layer is fixedly connected with the first low-dielectric-constant dielectric layer through a first resin bonding layer, and the second low-dielectric-constant dielectric layer is fixedly connected with the RCC dielectric layer through a second resin bonding layer.

Preferably, the copper-clad laminate is provided with a plurality of upper convex plates and lower concave grooves, and each upper convex plate and each lower concave groove are sequentially arranged at equal intervals.

Preferably, a space is left between each of the lower grooves and the second low dielectric constant medium layer to form a hollow groove.

Preferably, the upper convex plate and the lower concave groove are equal in thickness, and the lower surface of the first low-dielectric-constant dielectric layer is provided with a plurality of empty grooves for clamping the upper convex plate.

Preferably, the thicknesses of the thermosetting polyimide film layer, the first low-dielectric-constant dielectric layer, the copper-clad laminate, the second low-dielectric-constant dielectric layer and the RCC dielectric layer are equal.

Compared with the prior art, the utility model has the following beneficial effects:

(1) make equipment still have the pliability, be located high temperature environment such as workshop at equipment, the problem of hot melt appears in the resin bond line that has avoided inside to be equipped with, make equipment have high stability, the equidistance setting of the last flange that is equipped with and low groove simultaneously makes the totality of covering copper foil laminate be the wave line, further improvement the pliability of equipment to the dead slot that is equipped with can improve the thermal diffusivity of equipment self, improved the life of equipment.

(2) The equipment has high-strength heat resistance and stability, and the low-dielectric-constant dielectric layer and the RCC dielectric layer are arranged, so that the dielectric function of the equipment is met, and the functionality of the equipment is further improved.

Drawings

FIG. 1 is a schematic view of the overall structure of a black low-transmittance copper-clad plate with low dielectric constant and dielectric loss according to the present invention;

FIG. 2 is a schematic structural diagram of a copper clad laminate of a black low-transmittance copper clad laminate with low dielectric constant and dielectric loss according to the present invention;

FIG. 3 is a schematic view of the overlooking structure of the black low-transmittance copper clad laminate with low dielectric constant and dielectric loss of the present invention.

In the figure: 1. a four-corner stable support block; 2. a copper foil layer; 3. a thermosetting polyimide film layer; 4. a first resin adhesive layer; 5. a first low dielectric constant dielectric layer; 6. a copper clad laminate; 601. an upper convex plate; 602. a lower groove; 7. a second low dielectric constant dielectric layer; 701. an empty groove; 8. a second resin adhesive layer; 9. an RCC dielectric layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Examples

As shown in fig. 1-3, the black low-transmittance copper clad laminate with low dielectric constant and dielectric loss comprises a copper clad laminate 6, wherein the upper surface and the lower surface of the copper clad laminate 6 are respectively coated with a first low-dielectric-constant dielectric layer 5 and a second low-dielectric-constant dielectric layer 7, the upper surface of the first low-dielectric-constant dielectric layer 5 is further provided with a thermosetting polyimide film layer 3, the lower surface of the second low-dielectric-constant dielectric layer 7 is further provided with an RCC dielectric layer 9, the upper surface of the thermosetting polyimide film layer 3 and the lower surface of the RCC dielectric layer 9 are both coated with a copper foil layer 2, and four corners of the thermosetting polyimide film layer 3, the first low-dielectric-constant dielectric layer 5, the copper clad laminate 6, the second low-dielectric-constant dielectric layer 7 and the RCC dielectric layer 9 are fixedly connected with four corner stabilizing support blocks 1.

In this embodiment, the thermosetting polyimide film layer 3 and the first low-k dielectric layer 5 are fixedly connected through the first resin bonding layer 4, and the second low-k dielectric layer 7 and the RCC dielectric layer 9 are fixedly connected through the second resin bonding layer 8.

In this embodiment, the copper clad laminate 6 is provided with a plurality of upper convex plates 601 and lower concave grooves 602, and each of the upper convex plates 601 and the lower concave grooves 602 are sequentially arranged at equal intervals.

In the present embodiment, a space left between each lower groove 602 and the second low dielectric constant medium layer 7 is set as a hollow groove 701.

In this embodiment, the thickness of each of the upper convex plate 601 and the lower concave groove 602 is equal, a plurality of empty grooves 701 are formed on the lower surface of the first low-k dielectric layer 5, and the empty grooves 701 are used for clamping the upper convex plate 601.

In this embodiment, the thicknesses of the thermosetting polyimide film layer 3, the first low-dielectric-constant dielectric layer 5, the copper clad laminate 6, the second low-dielectric-constant dielectric layer 7, and the RCC dielectric layer 9 are equal.

The working principle of the black low-transmittance copper-clad plate with low dielectric constant and low dielectric loss is as follows: at thermosetting polyimide film layer 3, first low dielectric constant dielectric layer 5, copper clad laminate 6, second low dielectric constant dielectric layer 7, RCC dielectric layer 9's four corners department fixedly connected with four corners is stabilized a piece 1, when can carrying out the chucking to equipment, make equipment still have the pliability, under high temperature environment such as equipment is located the workshop, the problem of hot melt appears in the resin bond line of having avoided inside to be equipped with, make equipment have high stability, the equidistance setting of last flange 601 and low groove 602 that is equipped with simultaneously, make copper clad laminate 6's totality be the wave line, further improvement the pliability of equipment, and the dead slot 701 that is equipped with can improve the thermal diffusivity of equipment self, the life of equipment has been improved.

The thermosetting polyimide film layer 3 is modified by epoxy resin to reduce the molding temperature, thus obtaining practical application. The liquid crystal polyamide-imide is strengthened by liquid crystal phase, and the mechanical strength is further improved. Has the advantages of low price, good wear resistance and alkali resistance, good cohesive force and storage stability, and the like, is suitable for being used as heat-resistant wire enamel and adhesive enamel of glass laminated plates, and can also be used as a high-temperature adhesive. When the adhesive is actually used, the polyamide-imide prepolymer can be prepared firstly, closed-loop film forming is carried out at high temperature after coating construction, the adhesive can be used after being adjusted to proper viscosity, the equipment has high-strength heat resistance and stability, the arranged resin bonding layer has room-temperature fast curing property and can be cured at low temperature, the adhesive is suitable for bonding most of metal and non-metal materials, the adhesive has the advantage of high bonding strength, the low-dielectric-constant dielectric layer and the RCC dielectric layer are arranged at the same time, the dielectric function of the equipment is met, and the adhesive has the characteristics of voltage resistance, heat resistance, corrosion resistance, high resistance coefficient, small dielectric constant, convenience in processing and the like, so that the functionality of the equipment is further improved.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, and such changes and modifications are within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. Low dielectric constant and dielectric loss's low printing opacity copper-clad plate of black, including copper-clad laminate (6), its characterized in that: the upper surface and the lower surface of the copper-clad laminate (6) are respectively coated with a first low dielectric constant dielectric layer (5) and a second low dielectric constant dielectric layer (7), the upper surface of the first low dielectric constant dielectric layer (5) is also provided with a thermosetting polyimide thin film layer (3), the lower surface of the second low dielectric constant dielectric layer (7) is also provided with an RCC dielectric layer (9), the upper surface of the thermosetting polyimide thin film layer (3) and the lower surface of the RCC dielectric layer (9) are respectively coated with a copper foil layer (2), and four corners of the thermosetting polyimide thin film layer (3), the first low dielectric constant dielectric layer (5), the copper-clad laminate (6), the second low dielectric constant dielectric layer (7) and the RCC dielectric layer (9) are fixedly connected with four corner stable support blocks (1).

2. The low dielectric constant and dielectric loss black low light transmission copper clad laminate of claim 1, wherein: the thermosetting polyimide film layer (3) is fixedly connected with the first low-dielectric-constant dielectric layer (5) through a first resin bonding layer (4), and the second low-dielectric-constant dielectric layer (7) is fixedly connected with the RCC dielectric layer (9) through a second resin bonding layer (8).

3. The low dielectric constant and dielectric loss black low light transmission copper clad laminate of claim 1, wherein: the copper-clad laminate (6) is provided with a plurality of upper convex plates (601) and lower grooves (602), and the upper convex plates (601) and the lower grooves (602) are sequentially arranged at equal intervals.

4. The low dielectric constant and dielectric loss black low light transmission copper clad laminate of claim 3, wherein: and a gap is reserved between each lower groove (602) and the second low-dielectric-constant dielectric layer (7) to form a hollow groove (701).

5. The low dielectric constant and dielectric loss black low light transmission copper clad laminate of claim 3, wherein: the thicknesses of the upper convex plate (601) and the lower groove (602) are equal, the lower surface of the first low-dielectric-constant dielectric layer (5) is provided with a plurality of empty grooves (701), and the empty grooves (701) are used for clamping the upper convex plate (601).

6. The low dielectric constant and dielectric loss black low light transmission copper clad laminate of claim 1, wherein: the thicknesses of the thermosetting polyimide film layer (3), the first low-dielectric-constant dielectric layer (5), the copper-clad laminate (6), the second low-dielectric-constant dielectric layer (7) and the RCC dielectric layer (9) are equal.