CN220823358U

CN220823358U - PCB with absorption circuit and power board

Info

Publication number: CN220823358U
Application number: CN202322461889.0U
Authority: CN
Inventors: 廖剑飞; 周博; 王颖曜; 周云飞
Original assignee: Changsha Guangyi Converting Technique Co ltd
Current assignee: Changsha Guangyi Converting Technique Co ltd
Priority date: 2023-09-11
Filing date: 2023-09-11
Publication date: 2024-04-19
Anticipated expiration: 2033-09-11

Abstract

The utility model discloses a PCB with an absorption circuit, which comprises a PCB body, wherein the PCB body is provided with the absorption circuit or a driving circuit, one side of the PCB body is provided with a plurality of openings, bonding pads are arranged at the openings, and each bonding pad is electrically connected with the absorption circuit or the driving circuit. The utility model also discloses a power board, which comprises a power board body and the PCB with the absorption circuit, wherein the power board body is packaged with a power device, pins of the power device are inserted into an opening at one side of the PCB body, and bonding pads at the opening are welded with the pins of the power device. The utility model has simple integral structure, no increase of the size of the power board, convenient connection and replacement and low cost.

Description

PCB with absorption circuit and power board

Technical Field

The utility model mainly relates to the technical field of power electronics, in particular to a PCB with an absorption circuit and a power board.

Background

The current power electronics technology is developed rapidly, and the miniaturization of the product high frequency is the current trend, so that the switching speeds of power devices such as SI, SIC, IGBT MOS of gallium nitride and the like are faster and faster. For high-voltage high-current products, how to ensure reliable operation of the device in rapid switching changes is a major concern of current engineers, and voltage stress to the power device is one of the important issues in switching moment. Voltage stress is suppressed by adding an absorption circuit when practical. The prior art is to add an absorption loop to the power board to suppress the voltage stress, but this has several problems:

1. The absorption loop occupies the PCB space when installed on the power board, the size of the power board can be increased, and the length and width of the product structure can be increased.

2. The absorption loop is arranged beside a device on the power board, driving signals are not well wired, and meanwhile, the part is high-frequency fluctuation, large electromagnetic interference exists, the driving signals are easy to interfere, and misoperation is caused to damage the power tube.

3. The parameters of the absorption loop need to be adjusted according to the actually measured waveform, and when the absorption is unsuitable, the power main board needs to be changed, so that the cost is increased. Some power devices, capacitors, devices which are welded on the main board originally, are not easy to weld and the like need to be scrapped, so that the cost is increased.

4. The development period is increased while the edition is changed, and the project exchange period is influenced.

Disclosure of utility model

The technical problem to be solved by the utility model is as follows: aiming at the technical problems in the prior art, the utility model provides the PCB with the absorption circuit and the power board which have simple integral structure, do not increase the size of the power board and are convenient to connect and replace.

In order to solve the technical problems, the technical scheme provided by the utility model is as follows:

The utility model provides a take absorption circuit's PCB board, includes the PCB plate body, be provided with absorption circuit on the PCB plate body, one side of PCB plate body is provided with a plurality of openings, each the opening part all is provided with the pad, each the pad all is connected with absorption circuit electricity.

As a further improvement of the above technical scheme:

The opening is in a semicircular shape.

The absorption circuit is an RCD absorption circuit or an RC absorption circuit.

The RC absorption circuit comprises a resistor R1 and a capacitor C1, wherein the resistor R1 is connected with the capacitor C1 in parallel, and two ends of the resistor R1 connected with the capacitor C1 in parallel are connected with the power device.

The RCD absorption circuit comprises a resistor R1, a capacitor C1 and a diode D1, wherein the resistor R1 is connected with the capacitor C1 in parallel, one end of the resistor R1 connected with the capacitor C1 in parallel is connected with the cathode of the diode D1, the other end of the resistor R1 connected with the capacitor C1 in parallel is connected with the anode of the diode D1, and the anode of the diode D1 is connected with the power device.

The utility model also discloses a power board, which comprises a power board body and the PCB with the absorption circuit, wherein the power board body is packaged with a power device, pins of the power device are inserted into an opening at one side of the PCB body, and bonding pads at the opening are welded with the pins of the power device.

As a further improvement of the above technical scheme:

and a radiating fin is stuck on the power device, and an insulating heat conducting medium layer is arranged between the power device and the radiating fin.

The insulating heat-conducting medium layer is a ceramic substrate or a mica sheet.

An insulating support assembly is arranged between the PCB body and the power board body.

The insulating support assembly includes a plurality of insulating columns.

Compared with the prior art, the utility model has the advantages that:

according to the PCB with the absorption circuit, the absorption circuit is placed on the independent small PCB body instead of the power board, and the PCB body adopts the half-open type bonding pad structure, so that the PCB is conveniently welded on a pin of a power device or conveniently taken down to change parameters, and the PCB with the absorption circuit has the advantages of simple integral structure, no increase of the size of the power board, convenience in connection and replacement and low cost.

Drawings

Fig. 1 is a schematic structural diagram of a power board according to an embodiment of the utility model.

Fig. 2 is a schematic structural diagram of a PCB body according to an embodiment of the present utility model.

Fig. 3 is a second schematic structural diagram of a power board according to an embodiment of the utility model.

Fig. 4 is a schematic circuit diagram of an absorption circuit in an embodiment of the utility model.

Legend description: 1. a PCB body; 2. an opening; 3. a bonding pad; 4. an absorption circuit; 5. a power board body; 6. a power device; 61. pins; 7. an insulating heat-conducting medium layer; 8. a heat sink.

Detailed Description

The utility model is further described below with reference to the drawings and specific examples.

As shown in fig. 2, the PCB board with the absorption circuit in the embodiment of the present utility model is conveniently fixed on pins of a package of an insert such as TO247, and includes a PCB board body 1, where the absorption circuit 4 or the driving circuit is disposed on the PCB board body 1, one side of the PCB board body 1 is provided with a plurality of openings 2, each opening 2 is provided with a bonding pad 3, and each bonding pad 3 is electrically connected with the absorption circuit 4 or the driving circuit. According to the PCB with the absorption circuit, the absorption circuit 4 or the driving circuit is placed on the independent small PCB body 1 instead of the power board, and the PCB body 1 adopts the structure of the semi-open type bonding pad 3, so that the PCB is conveniently welded on the pins 61 of the power device 6 or conveniently taken down for parameter change, and the PCB has the advantages of simple integral structure, no increase of the size of the power board, convenient connection and replacement and low cost.

In one embodiment, the opening 2 is semi-circular in shape. Of course, in other embodiments, different opening shapes may be selected according to the actual situation.

In one embodiment, as shown in fig. 4, the snubber circuit 4 is an RCD snubber circuit. The power device specifically comprises a resistor R1, a capacitor C1 and a diode D1, wherein the resistor R1 is connected with the capacitor C1 in parallel, one end of the resistor R1 connected with the capacitor C1 in parallel is connected with the cathode of the diode D1, the other end of the resistor R1 connected with the capacitor C1 in parallel is connected to the E pin (IGBT) or the S pin (MOSfet) of a power device 6 (such as a power tube) or the cathode of the power diode, and the anode of the diode D1 is connected to the C pin (IGBT) or the D pin (MOSfet) of the power tube or the anode of the power diode. The circuit is simple in structure and easy to realize.

In other embodiments, RC absorption circuits may also be employed. The power device specifically comprises a resistor R1 and a capacitor C1, wherein the resistor R1 is connected with the capacitor C1 in parallel, one end of the resistor R1 connected with the capacitor C1 in parallel is connected to a C pin (IGBT) or a D pin (MOSfet) of a power tube or an anode of a power diode, and the other end of the resistor R1 connected with the capacitor C1 in parallel is connected to an E pin (IGBT) or an S pin (MOSfet) of a power device 6 (such as a power tube) or a cathode of the power diode. The circuit is simple in structure and easy to realize.

As shown in fig. 1, the embodiment of the utility model further provides a power board, which comprises a power board body 5 and the PCB board with the absorption circuit, wherein the power board body 5 is packaged with the power device 6, the pin 61 of the power device 6 is inserted into the opening 2 at one side of the PCB board body 1, and the bonding pad 3 at the opening 2 is welded with the pin 61 of the power device 6. The power board of the utility model comprises a PCB board as described above, and also has the advantages as described above for the PCB board.

Wherein the power device 6 is stuck with a radiating fin 8, and an insulating heat conducting medium layer 7 is arranged between the power device 6 and the radiating fin 8. The insulating and heat-conducting medium layer 7 is a ceramic substrate or a mica sheet, etc.

In a specific embodiment, an insulation support assembly (not shown in the figure) is disposed between the PCB board 1 and the power board 5, such as a plurality of insulation support columns (e.g. plastic columns, etc.), so that insulation between the PCB board 1 and the power board 5 is ensured on one hand, and reliability of installation of the PCB board 1 is also ensured on the other hand.

In a specific application, the power device 6 is mounted in the configuration shown in fig. 1 when it is welded to the power board body 5 standing. When the power device 6 is mounted against the heat sink, the mounting is performed in the structure shown in fig. 3, and the specific mounting manner is simple. Of course, auxiliary supporting feet can be added in places with extremely high vibration requirements.

As used in this disclosure and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

The above is only a preferred embodiment of the present utility model, and the protection scope of the present utility model is not limited to the above examples, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. It should be noted that modifications and adaptations to the utility model without departing from the principles thereof are intended to be within the scope of the utility model as set forth in the following claims.

Claims

1. The utility model provides a take absorption circuit's PCB board, its characterized in that includes PCB plate body (1), be provided with absorption circuit (4) on PCB plate body (1), one side of PCB plate body (1) is provided with a plurality of openings (2), each opening (2) department all is provided with pad (3), each pad (3) all are connected with absorption circuit (4) electricity.

2. The PCB board with absorption circuit according to claim 1, wherein the opening (2) is semi-circular in shape.

3. The PCB board with absorption circuit according to claim 1 or 2, characterized in that the absorption circuit (4) is an RCD absorption circuit (4) or an RC absorption circuit (4).

4. A PCB board with an absorption circuit according to claim 3, wherein the RC absorption circuit (4) comprises a resistor R1 and a capacitor C1, the resistor R1 is connected in parallel with the capacitor C1, and two ends of the resistor R1 connected in parallel with the capacitor C1 are connected with the power device (6).

5. A PCB board with an absorption circuit according to claim 3, wherein the RCD absorption circuit (4) comprises a resistor R1, a capacitor C1 and a diode D1, the resistor R1 is connected in parallel with the capacitor C1, one end of the resistor R1 connected in parallel with the capacitor C1 is connected with the cathode of the diode D1, the other end of the resistor R1 connected in parallel with the capacitor C1, and the anode of the diode D1 is connected with the power device (6).

6. A power board, characterized by comprising a power board body (5) and the PCB board with an absorption circuit (4) according to any one of claims 1-5, wherein a power device (6) is packaged on the power board body (5), a pin (61) of the power device (6) is inserted into an opening (2) at one side of the PCB board body (1), and a bonding pad (3) at the opening (2) is welded with the pin (61) of the power device (6).

7. The power board according to claim 6, wherein a heat sink (8) is attached to the power device (6), and an insulating heat conducting medium layer (7) is disposed between the power device (6) and the heat sink (8).

8. The power board according to claim 7, characterized in that the insulating and heat conducting medium layer (7) is a ceramic substrate or a mica sheet.

9. The power board according to any of claims 6-8, characterized in that an insulating support assembly is arranged between the PCB body (1) and the power board body (5).

10. The power board of claim 9, wherein the insulating support assembly comprises a plurality of insulating columns.