CN215912272U - Aluminum substrate circuit board of three-phase inverter bridge - Google Patents
Aluminum substrate circuit board of three-phase inverter bridge Download PDFInfo
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- CN215912272U CN215912272U CN202121099788.8U CN202121099788U CN215912272U CN 215912272 U CN215912272 U CN 215912272U CN 202121099788 U CN202121099788 U CN 202121099788U CN 215912272 U CN215912272 U CN 215912272U
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Abstract
The utility model discloses an aluminum substrate circuit board of a three-phase inverter bridge, relates to the technical field of motor driving, and aims to solve the problem of power device failure caused by poor heat dissipation of the existing three-phase inverter bridge circuit board. The three-phase inverter bridge aluminum substrate circuit board is a single-layer aluminum substrate printed board. A plurality of welding pads, a plurality of printed lines and a plurality of binding posts are arranged on the surface of the single-layer aluminum substrate printed board, each binding post is welded on the welding pad, each component included by the three-phase inverter bridge circuit is welded on the welding pad, and each component is connected with the binding post through the printed lines. The three-phase inverter bridge aluminum substrate circuit board provided by the utility model is used for bearing a three-phase inverter bridge circuit so as to drive a motor.
Description
Technical Field
The utility model relates to the technical field of motor driving, in particular to an aluminum substrate circuit board of a three-phase inverter bridge.
Background
The three-phase inverter bridge circuit is commonly used for motor driving, and outputs three paths of strong current signals by receiving weak current control signals. The three-phase inverter bridge circuit comprises more power devices, and the power devices can pass larger current in the working process, so that the temperature rise of the power devices is faster.
The existing three-phase inverter bridge circuit is generally welded on an epoxy glass cloth copper foil-clad laminated board, and has poor heat dissipation performance. When the power device continuously passes through large current for a long time, the temperature of the power device rises too fast, heat generated by the power device cannot be timely dissipated, when the temperature exceeds the temperature rated value of the power device, the power device fails, and the three-phase inverter bridge circuit stops working.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an aluminum substrate circuit board of a three-phase inverter bridge, which is used for solving the problem of power device failure caused by poor heat dissipation of the existing three-phase inverter bridge circuit board.
In order to achieve the above purpose, the utility model provides the following technical scheme:
a three-phase inverter bridge aluminum substrate circuit board is a single-layer aluminum substrate printed circuit board; the surface of the single-layer aluminum substrate printed board is provided with a plurality of bonding pads, a plurality of printed lines and a plurality of binding posts;
each binding post is welded on the bonding pad; each element included in the three-phase inverter bridge circuit is welded on the welding plate; each component is connected with the wiring terminal through the printed line.
Optionally, the plurality of terminals are respectively marked as a terminal P, a terminal N, a terminal AH, a terminal a, a terminal AL, a terminal BH, a terminal B, a terminal BL, a terminal CH, a terminal C and a terminal CL;
the wiring terminal P is connected with the positive electrode of a power supply, and the wiring terminal N is connected with the negative electrode of the power supply; the terminal AH, the terminal AL, the terminal BH, the terminal BL, the terminal CH and the terminal CL are all used for receiving external control signals; the wiring terminal A, the wiring terminal B and the wiring terminal C are all connected with a motor coil.
Optionally, the three-phase inverter bridge circuit includes a power sampling resistor R1 and a plurality of field effect transistors; the field effect transistors are respectively marked as a field effect transistor Q1, a field effect transistor Q2, a field effect transistor Q3, a field effect transistor Q4, a field effect transistor Q5 and a field effect transistor Q6;
a pin 1 of the field-effect tube Q3 is connected with the binding post BH through the printed line, a pin 2 of the field-effect tube Q3 is connected with the binding post P through the printed line, and a pin 3 of the field-effect tube Q3 is connected with the binding post B through the printed line;
the pin 1 of the field-effect tube Q5 is connected with the terminal CH through the printed line, the pin 2 of the field-effect tube Q5 is connected with the terminal P through the printed line, and the pin 3 of the field-effect tube Q5 is connected with the terminal C through the printed line;
one end of the power sampling resistor R1 is connected with the pin 3 of the field-effect tube Q4, the pin 3 of the field-effect tube Q6 and the pin 3 of the field-effect tube Q2 through the printed lines, and the other end of the power sampling resistor R1 is connected with the wiring terminal N through the printed lines.
Optionally, the three-phase inverter bridge circuit further includes a plurality of ceramic dielectric capacitors;
one end of the ceramic dielectric capacitor is connected with the wiring terminal P through the printed line, and the other end of the ceramic dielectric capacitor is connected with the wiring terminal N through the printed line;
the ceramic dielectric capacitor is used for filtering noise generated at the moment when the power supply and the field effect tube are switched on and off.
Optionally, the single-layer aluminum substrate printed board includes a single-layer aluminum substrate, an insulating layer attached to the single-layer aluminum substrate, and a circuit layer attached to the insulating layer.
Optionally, the thickness of the single-layer aluminum substrate printed board is 2 mm; the insulating layer is made of HT-07006; the material of the circuit layer is copper, and the thickness of the circuit layer is 140 mu m.
Optionally, the binding post is composed of two cylinders, and the cross sections of the two cylinders are fixedly connected;
the cross-sectional areas of the two cylinders are different; the cylinder with the large cross section area is welded on the bonding pad, and the cylinder with the small cross section area is electrically connected with an external device.
Optionally, the total height of the binding post is 8.5 mm; the diameter of the cylinder with a large cross-sectional area is 2mm, and the height is 1 mm; the diameter of the cylinder with a small cross-sectional area is 0.8 mm.
Optionally, the circuit board is provided with a plurality of mounting holes.
Compared with the prior art, the three-phase inverter bridge aluminum substrate circuit board provided by the utility model is a single-layer aluminum substrate printed board. A plurality of welding pads, a plurality of printed lines and a plurality of binding posts are arranged on the surface of the single-layer aluminum substrate printed board. Each binding post is welded on the welding pad, each component included in the three-phase inverter bridge circuit is welded on the welding pad, and each component is connected with the binding post through a printed line. Compared with the existing mode of welding the three-phase inverter bridge circuit component on the epoxy glass cloth copper foil laminated board, due to the poor heat dissipation of the epoxy glass cloth copper foil laminated board, when the component, especially the power device, continuously passes a large current for a long time, the temperature of the power device rises too fast, and the problems that when the temperature rating is exceeded, the power device fails and the three-phase inverter bridge circuit stops working can be caused. In order to solve this problem, it is necessary to design and select a printed circuit board of an appropriate material. The components included in the three-phase inverter bridge circuit are all welded on the single-layer aluminum substrate printed board, and the single-layer aluminum substrate printed board has good heat dissipation, so that heat generated when a large current flows through the power device can be quickly dissipated in time, the temperature rise of the power device is greatly reduced, the temperature rise of the power device cannot exceed the rated value of the power device, and the three-phase inverter bridge circuit is still in a normal working state when the large current flows through the three-phase inverter bridge circuit.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:
fig. 1 is a layout diagram of a three-phase inverter bridge circuit on an aluminum substrate circuit board according to an embodiment of the present invention.
Fig. 2 is a connection relationship diagram of a three-phase inverter bridge circuit and a terminal column according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a terminal provided in an embodiment of the present invention.
Reference numerals:
1-single layer aluminum substrate printed board; 2-a binding post; 3-field effect transistor; 4-ceramic dielectric capacitance; 5-mounting holes.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example 1:
referring to fig. 1, an embodiment of the utility model is used to provide a three-phase inverter bridge aluminum substrate circuit board, which is a single-layer aluminum substrate printed board 1. The surface of the single-layer aluminum substrate printed board 1 is provided with a plurality of pads, a plurality of tracks and a plurality of terminals 2. The bonding pads are welding points used for welding pins of components on the circuit board, and the bonding pads are connected through printed lines on the top layer of the single-layer aluminum substrate printed board 1.
Each binding post 2 is welded on the welding pad, each component included in the three-phase inverter bridge circuit is welded on the welding pad, and each component is welded on the surface of the top layer of the single-layer aluminum substrate printed board 1 by welding on the welding pad. Each component is connected to the terminal 2 by a printed line.
In the embodiment, all components included in the three-phase inverter bridge circuit are welded on the single-layer aluminum substrate printed board 1, and the single-layer aluminum substrate printed board 1 can dissipate heat well, so that heat generated when a large current flows through the power device can be dissipated quickly and timely, the temperature rise of the power device is greatly reduced, the temperature rise of the power device cannot exceed the rated value of the power device, and the three-phase inverter bridge circuit is still in a normal working state when the large current flows through the three-phase inverter bridge circuit.
As shown in fig. 1, the plurality of terminals 2 are respectively denoted as a terminal P, a terminal N, a terminal AH, a terminal a, a terminal AL, a terminal BH, a terminal B, a terminal BL, a terminal CH, a terminal C, and a terminal CL.
The wiring terminal P is connected with the positive pole of the power supply, and the wiring terminal N is connected with the negative pole of the power supply, namely, the power supply flows into the three-phase inverter bridge circuit from the wiring terminal P and flows out of the three-phase inverter bridge circuit from the wiring terminal N. The terminal AH, the terminal AL, the terminal BH, the terminal BL, the terminal CH and the terminal CL are all used for receiving external control signals. And the wiring terminal A, the wiring terminal B and the wiring terminal C are connected with the motor coil.
As shown in fig. 2, the three-phase inverter bridge circuit of the present embodiment includes a power sampling resistor R1 and a plurality of field effect transistors 3. The field effect transistors 3 are respectively denoted as a field effect transistor Q1, a field effect transistor Q2, a field effect transistor Q3, a field effect transistor Q4, a field effect transistor Q5, and a field effect transistor Q6.
Specifically, pin 1 of the field-effect transistor Q1 is connected with the terminal AH through a printed wiring, pin 2 of the field-effect transistor Q1 is connected with the terminal P through a printed wiring, and pin 3 of the field-effect transistor Q1 is connected with the terminal a through a printed wiring.
One end of the power sampling resistor R1 is respectively connected with a pin 3 of the field-effect tube Q4, a pin 3 of the field-effect tube Q6 and a pin 3 of the field-effect tube Q2 through printed lines, and the other end of the power sampling resistor R1 is connected with the terminal N through the printed lines.
It should be noted that the type of the fet 3 is IPD068N10N3 of english-flying germany, and the package type is DPAK.
In this embodiment, the connection relationship between the fet 3 and the terminal 2 is set as follows: the pins 2 of the field effect transistors (Q1, Q3 and Q5) are connected with the terminals P through printed lines. Pin 1 of the field-effect tube Q1 is connected with the terminal AH through a printed line, pin 1 of the field-effect tube Q3 is connected with the terminal BH through a printed line, and pin 1 of the field-effect tube Q5 is connected with the terminal CH through a printed line. The pin 3 of the field-effect tube Q1, the terminal A and the pin 2 of the field-effect tube Q4 are connected through printed wires, the pin 3 of the field-effect tube Q3, the terminal B and the pin 2 of the field-effect tube Q6 are connected through printed wires, and the pin 3 of the field-effect tube Q5, the terminal C and the pin 2 of the field-effect tube Q2 are connected through printed wires. Pin 1 of the field-effect tube Q4 is connected with the terminal AL through a printed line, pin 1 of the field-effect tube Q6 is connected with the terminal BL through a printed line, and pin 1 of the field-effect tube Q2 is connected with the terminal CL through a printed line. One end of the power sampling resistor R1 is connected with a pin 3 of a field effect transistor (Q4, Q6 and Q2) through a printed line, and the other end is connected with a terminal N through a printed line. Through the connection relation, a power supply flows into the circuit from the terminal P and flows out of the circuit from the terminal N, the terminals (AH, BH, CH, AL, BL and CL) receive external control signals and are respectively sent into field effect transistors (Q1, Q3, Q5, Q4, Q6 and Q2), the on and off of 6 field effect transistors 3 are orderly controlled, the situation that each phase of bridge wall cannot be directly connected at the same time is ensured, meanwhile, the situation that the field effect transistors 3 are on both the upper bridge wall and the lower bridge wall at the same time is ensured, the current of the power supply flows into the field effect transistors 3 on the upper bridge wall, the phase current is output to the brushless direct current motor coil, and the current flows out of the brushless direct current motor coil, passes through the lower bridge wall which cannot be directly connected, and flows out of the negative end of the power supply after passing through the power sampling resistor R1, and the driving process of the motor is realized.
As an optional implementation manner, the three-phase inverter bridge circuit further includes a plurality of ceramic dielectric capacitors 4, which are respectively denoted as a ceramic dielectric capacitor C1, a ceramic dielectric capacitor C2, a ceramic dielectric capacitor C3, and a ceramic dielectric capacitor C4. One end of each ceramic dielectric capacitor 4 is connected with the wiring terminal P through a printed line, and the other end of each ceramic dielectric capacitor 4 is connected with the wiring terminal N through a printed line. The ceramic dielectric capacitor 4 is used for filtering noise generated at the moment when the power supply and the field effect tube 3 are switched on and off.
In the embodiment, all components included in the three-phase inverter bridge circuit are welded on the single-layer aluminum substrate printed board 1 with good heat dissipation performance, so that heat generated by the field-effect tubes (Q1, Q2, Q3, Q4, Q5 and Q6), the power sampling resistor R1 and the printed lines can be dissipated timely, and the temperatures of the field-effect tubes (Q1, Q2, Q3, Q4, Q5 and Q6), the power sampling resistor R1 and the printed lines are guaranteed to be within a safe range.
The single-layer aluminum substrate printed board 1 used in the present embodiment may have a three-layer structure with a thickness of 2 mm. The aluminum-based composite material comprises a single-layer aluminum base material, an insulating layer and a circuit layer, wherein the insulating layer is attached to the single-layer aluminum base material, and the circuit layer is attached to the insulating layer. The insulating layer is made of a heat-conducting insulating material, and the material selected specifically is HT-07006. The material of the circuit layer is copper, namely copper is coated on the insulating layer, and the thickness of the circuit layer is 140 mu m. By setting the structure and thickness of the single-layer aluminum substrate printed board 1, the heat dissipation performance of the single-layer aluminum substrate printed board 1 can be further improved.
Referring to fig. 3, the post 2 of the present embodiment can be made of pure copper material with good conductivity. The binding post 2 consists of two cylinders, the cross sections of which are fixedly connected. The two cylinders have different cross-sectional areas, the cylinder with the large cross-sectional area is welded on a bonding pad of the single-layer aluminum substrate printed board 1, and the cylinder with the small cross-sectional area is electrically connected with an external device. The external device comprises the power supply, a control device for generating an external control signal and a motor coil.
Wherein the total height of the terminal 2 is 8.5 mm. The diameter of the cylinder with a large cross-sectional area is 2mm, and the height is 1 mm. The diameter of the cylinder with a small cross-sectional area is 0.8 mm.
The current that this embodiment can make post 2 continuously pass through can reach 10A through setting up the shape and the size of post 2.
The circuit board is provided with a plurality of mounting holes 5, see fig. 1, which are provided with six mounting holes 5 in the circuit board for mounting the circuit board to other components.
In the embodiment, after the three-phase inverter bridge circuit component is welded by the aluminum substrate printed board, the aluminum substrate printed board has good heat dissipation, so that heat generated when a large current flows through the power device can be quickly dissipated in time, the temperature rise of the power device is greatly reduced, the temperature rise of the power device cannot exceed the rated value, and the three-phase inverter bridge circuit is still in a normal working state when the large current flows through the three-phase inverter bridge circuit.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A three-phase inverter bridge aluminum substrate circuit board is characterized in that the circuit board is a single-layer aluminum substrate printed board; the surface of the single-layer aluminum substrate printed board is provided with a plurality of bonding pads, a plurality of printed lines and a plurality of binding posts;
each binding post is welded on the bonding pad; each element included in the three-phase inverter bridge circuit is welded on the welding plate; each component is connected with the wiring terminal through the printed line.
2. The aluminum substrate circuit board for the three-phase inverter bridge according to claim 1, wherein the plurality of terminals are respectively marked as a terminal P, a terminal N, a terminal AH, a terminal A, a terminal AL, a terminal BH, a terminal B, a terminal BL, a terminal CH, a terminal C and a terminal CL;
the wiring terminal P is connected with the positive electrode of a power supply, and the wiring terminal N is connected with the negative electrode of the power supply; the terminal AH, the terminal AL, the terminal BH, the terminal BL, the terminal CH and the terminal CL are all used for receiving external control signals; the wiring terminal A, the wiring terminal B and the wiring terminal C are all connected with a motor coil.
3. The three-phase inverter bridge aluminum substrate circuit board of claim 2, wherein the three-phase inverter bridge circuit comprises a power sampling resistor R1 and a plurality of field effect transistors; the field effect transistors are respectively marked as a field effect transistor Q1, a field effect transistor Q2, a field effect transistor Q3, a field effect transistor Q4, a field effect transistor Q5 and a field effect transistor Q6;
pin 1 of the field-effect tube Q1 is connected with the terminal AH through the printed line, pin 2 of the field-effect tube Q1 is connected with the terminal P through the printed line, and pin 3 of the field-effect tube Q1 is connected with the terminal A through the printed line;
a pin 1 of the field-effect tube Q3 is connected with the binding post BH through the printed line, a pin 2 of the field-effect tube Q3 is connected with the binding post P through the printed line, and a pin 3 of the field-effect tube Q3 is connected with the binding post B through the printed line;
the pin 1 of the field-effect tube Q5 is connected with the terminal CH through the printed line, the pin 2 of the field-effect tube Q5 is connected with the terminal P through the printed line, and the pin 3 of the field-effect tube Q5 is connected with the terminal C through the printed line;
pin 1 of the field-effect tube Q4 is connected with the binding post AL through the printed line, and pin 2 of the field-effect tube Q4 is connected with the binding post A through the printed line;
pin 1 of the field-effect tube Q6 is connected with the wiring terminal BL through the printed line, and pin 2 of the field-effect tube Q6 is connected with the wiring terminal B through the printed line;
pin 1 of the field-effect tube Q2 is connected with the binding post CL through the printed line, and pin 2 of the field-effect tube Q2 is connected with the binding post C through the printed line;
one end of the power sampling resistor R1 is connected with the pin 3 of the field-effect tube Q4, the pin 3 of the field-effect tube Q6 and the pin 3 of the field-effect tube Q2 through the printed lines, and the other end of the power sampling resistor R1 is connected with the wiring terminal N through the printed lines.
4. The three-phase inverter bridge aluminum substrate circuit board of claim 3, wherein the three-phase inverter bridge circuit further comprises a plurality of ceramic dielectric capacitors;
one end of the ceramic dielectric capacitor is connected with the wiring terminal P through the printed line, and the other end of the ceramic dielectric capacitor is connected with the wiring terminal N through the printed line;
the ceramic dielectric capacitor is used for filtering noise generated at the moment when the power supply and the field effect tube are switched on and off.
5. The aluminum substrate circuit board for the three-phase inverter bridge of claim 1, wherein the single-layer aluminum substrate printed board comprises a single-layer aluminum substrate, an insulating layer attached to the single-layer aluminum substrate, and a circuit layer attached to the insulating layer.
6. The three-phase inverter bridge aluminum substrate circuit board of claim 5, wherein the single-layer aluminum substrate printed board has a thickness of 2 mm; the insulating layer is made of HT-07006; the material of the circuit layer is copper, and the thickness of the circuit layer is 140 mu m.
7. The aluminum substrate circuit board for the three-phase inverter bridge as claimed in claim 1, wherein the terminals are composed of two cylinders, and the cross sections of the two cylinders are fixedly connected;
the cross-sectional areas of the two cylinders are different; the cylinder with the large cross section area is welded on the bonding pad, and the cylinder with the small cross section area is electrically connected with an external device.
8. The aluminum substrate circuit board for the three-phase inverter bridge of claim 7, wherein the total height of the posts is 8.5 mm; the diameter of the cylinder with a large cross-sectional area is 2mm, and the height is 1 mm; the diameter of the cylinder with a small cross-sectional area is 0.8 mm.
9. The aluminum substrate circuit board for a three-phase inverter bridge as claimed in claim 1, wherein a plurality of mounting holes are formed on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121099788.8U CN215912272U (en) | 2021-05-21 | 2021-05-21 | Aluminum substrate circuit board of three-phase inverter bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121099788.8U CN215912272U (en) | 2021-05-21 | 2021-05-21 | Aluminum substrate circuit board of three-phase inverter bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215912272U true CN215912272U (en) | 2022-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121099788.8U Active CN215912272U (en) | 2021-05-21 | 2021-05-21 | Aluminum substrate circuit board of three-phase inverter bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215912272U (en) |
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2021
- 2021-05-21 CN CN202121099788.8U patent/CN215912272U/en active Active
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