CN218633721U - Three-phase inversion power module - Google Patents

Abstract

The utility model provides a three-phase contravariant power module. The three-phase inversion power module comprises a frame; the bus capacitor is arranged in the frame; the power substrate assemblies are arranged in the frame in parallel, the input end of each power substrate assembly is connected with the direct current bus, and the output end of each power substrate assembly is connected with the input end of the motor; a positive power terminal to which at least a part of the lead-out terminals of the bus capacitor are connected; the negative power terminal is connected with at least one other leading-out terminal of the bus capacitor; each power substrate assembly includes: the lead terminal of the bus capacitor is arranged on the substrate and is electrically connected with the substrate; the inverter circuit is provided with at least two semiconductor switches; and the at least two filtering units are arranged in one-to-one correspondence with the at least two semiconductor switches, and each filtering unit is arranged in parallel with the corresponding semiconductor switch. The utility model provides a power module's the great problem of volume among the prior art.

Description

Three-phase inversion power module

Technical Field

The utility model relates to a power semiconductor module encapsulation technical field particularly, relates to a three-phase contravariant power module.

Background

At present, the packaging technology of semiconductor (IGBT/MOSFET and the like) power modules is mainly used for solving the problems of heat dissipation, current bearing, reliable connection, power density improvement, reliability improvement and the like of the semiconductor power modules, only a semiconductor switch is arranged in the power module packaging technology in the prior art, and a motor controller applying the semiconductor power modules needs a large amount of connecting copper bars and bolt structures, so that the whole volume is large, the stray inductance parameters are large, the operation reliability of the semiconductor power modules is influenced, and the volume and the weight of a system are influenced.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a three-phase inverter power module to solve the problems of complex connection and large overall size of the power module in the prior art.

In order to achieve the above object, the present invention provides a three-phase inverter power module, which includes a frame; the bus capacitor is arranged in the frame; the power substrate assemblies are arranged in the frame in parallel, the input end of each power substrate assembly is connected with the direct current bus, and the output end of each power substrate assembly is connected with the input end of the motor; a positive power terminal to which at least a part of the lead-out terminals of the bus capacitor are connected; the negative power terminal is connected with at least one other leading-out terminal of the bus capacitor; wherein, each power base plate assembly includes: the lead terminal of the bus capacitor is arranged on the substrate and is electrically connected with the substrate; the inverter circuit is provided with at least two semiconductor switches; and the at least two filtering units are arranged in one-to-one correspondence with the at least two semiconductor switches, and each filtering unit is arranged in parallel with the corresponding semiconductor switch.

Further, each power substrate assembly further comprises: and the current sensor is arranged on the output end of the power substrate assembly and used for detecting the current value of the output end.

Further, each power substrate assembly further comprises: and the passive discharge unit is connected in parallel with the bus capacitor.

Furthermore, all the power substrate assemblies are positioned on the same side of the bus capacitor.

Further, the three-phase inversion power module still includes: and each power substrate assembly and each bus capacitor are in contact with the radiator so as to radiate the heat of each power substrate assembly and each bus capacitor through the radiator.

Further, the heat sink includes: two opposite mounting plates; the first cooling parts are arranged on one mounting plate, and are arranged at intervals along a preset direction; the second cooling parts are arranged on the other mounting plate, and the second cooling parts are multiple and are arranged at intervals along the preset direction; at least one second cooling part is arranged between every two adjacent first cooling parts, and at least one first cooling part is arranged between every two adjacent second cooling parts.

Further, the first cooling part is rod-shaped or needle-shaped, and the cross section of the first cooling part is circular, oval or polygonal; and/or the second cooling part is rod-shaped or needle-shaped, and the cross section of the second cooling part is circular, oval or polygonal.

Furthermore, the two mounting plates comprise a first mounting plate and a second mounting plate, and the first cooling part is arranged on the first mounting plate and is of an integrated structure with the first mounting plate; and/or the second cooling part is arranged on the second mounting plate and is in an integrated structure with the second mounting plate.

Further, the three-phase inversion power module further comprises: the frame covers the bus capacitor, the all-power substrate assembly and the radiator, and glue filling spaces are formed among the frame, the bus capacitor, the all-power substrate assembly and the radiator; wherein, the frame has the through-hole that supplies positive power terminal and negative power terminal to wear out.

Furthermore, the substrate is a double-sided copper-clad insulating heat-conducting substrate.

Use the technical scheme of the utility model, all set up bus-bar capacitance and a plurality of power base plate assemblies in the frame, and each power base plate assembly includes base plate, inverter circuit and two at least filter unit, bus-bar capacitance's lead terminal setting on the base plate and be connected with the base plate electricity, inverter circuit is last to be provided with two at least semiconductor switches, two at least filter unit and two at least semiconductor switch one-to-one ground set up, each filter unit sets up rather than corresponding semiconductor switch in parallel. Therefore, the bus capacitor and the power substrate assemblies are all packaged in the frame, so that on one hand, the integration level of the power unit is improved, the problem that the power unit in the prior art needs various copper bars to be connected with bolts to cause larger integral volume is solved, and the miniaturization design of the motor controller is realized; on the other hand, clutter in the power loop is effectively absorbed through each filtering unit, and safe and reliable operation of a power device is guaranteed.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 shows a schematic view of the internal electrical connections of an embodiment of a three-phase inverter power module according to the present invention;

fig. 2 shows a schematic diagram of the internal overall arrangement of the three-phase inverter power module in fig. 1;

fig. 3 shows a top view of the three-phase inverter power module of fig. 2;

fig. 4 shows an assembly schematic of a heat sink of the three-phase inverter power module of fig. 1;

FIG. 5 shows a side view of the heat sink of FIG. 4;

fig. 6 shows a bottom view of the first mounting plate of the heat sink of fig. 4 assembled with the first cooling portion.

Wherein the figures include the following reference numerals:

10. a bus capacitor; 20. a power substrate assembly; 21. a substrate; 22. a semiconductor switch; 221. an upper bridge arm power switch device chip; 222. a lower bridge arm power switch device chip; 23. a filtering unit; 231. an upper bridge arm filtering absorption unit; 232. a lower bridge arm filtering absorption unit; 24. a current sensor; 25. a passive discharge unit; 26. a copper sheet circuit; 27. binding the wires; 30. A positive power terminal; 31. a first positive power terminal; 32. a second positive power terminal; 33. a third positive power terminal; 40. a negative power terminal; 41. a first negative power terminal; 42. a second negative power terminal; 43. a third negative power terminal; 50. a heat sink; 51. mounting a plate; 511. a first mounting plate; 512. a second mounting plate; 52. a first cooling section; 53. a second cooling section; 60. A frame; 71. a first output terminal; 72. a second output terminal; 73. and a third output terminal.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

It is to be noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

In the present application, where the contrary is not intended, the use of directional terms such as "upper" and "lower" is generally with respect to the orientation shown in the drawings, or to the vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "left and right" are generally to the left and right as shown in the drawings; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself, but the above directional terms are not intended to limit the present invention.

In order to solve the problem that the whole volume of a power module is large in the prior art, the application provides a three-phase inversion power module.

As shown in fig. 1 to 6, the three-phase inverter power module includes a frame 60, a bus capacitor 10, a plurality of power substrate assemblies 20 arranged in parallel with each other, a positive power terminal 30, and a negative power terminal 40. Wherein the bus capacitor 10 is arranged within the frame 60. A plurality of power substrate assemblies 20 arranged in parallel with each other are disposed in the frame 60, an input end of each power substrate assembly 20 is connected to a dc bus, and an output end of each power substrate assembly 20 is connected to an input end of a motor. The positive power terminal 30 is connected to at least a part of the lead terminals of the bus capacitor 10, and the negative power terminal 40 is connected to at least another part of the lead terminals of the bus capacitor 10. Each power substrate assembly 20 includes a substrate 21, an inverter circuit, and at least two filter units 23. The lead terminal of bus capacitor 10 is disposed on substrate 21 and electrically connected to substrate 21. At least two semiconductor switches 22 are provided on the inverter circuit. At least two filter units 23 are provided in one-to-one correspondence with at least two semiconductor switches 22, and each filter unit 23 is provided in parallel with its corresponding semiconductor switch 22.

By applying the technical solution of the present embodiment, the bus capacitor 10 and the plurality of power substrate assemblies 20 are all disposed in the frame 60, and each power substrate assembly 20 includes a substrate 21, an inverter circuit and at least two filter units 23, the lead terminal of the bus capacitor 10 is disposed on the substrate 21 and electrically connected to the substrate 21, the inverter circuit is disposed with at least two semiconductor switches 22, the at least two filter units 23 and the at least two semiconductor switches 22 are disposed in a one-to-one correspondence manner, and each filter unit 23 is disposed in parallel with its corresponding semiconductor switch 22. In this way, the bus capacitor 10 and the plurality of power substrate assemblies 20 are all packaged in the frame 60, so that on one hand, the integration level of the three-phase inverter power module is improved, the problem that the power unit needs copper bars and bolts to be connected to cause larger overall size in the prior art is solved, and the miniaturization design of the motor controller is realized; on the other hand, clutter in the power loop is effectively absorbed through each filtering unit 23, and safe and reliable operation of a power device is guaranteed.

In the present embodiment, the substrate 21 is a copper-clad substrate.

In the present embodiment, there are three power substrate assemblies 20, so that the three-phase inverter power module has a three-phase topology.

In the present embodiment, there are three positive power terminals 30, and the three positive power terminals 30 include a first positive power terminal 31, a second positive power terminal 32, and a third positive power terminal 33.

In the present embodiment, there are three negative power terminals 40, and the three negative power terminals 40 include a first negative power terminal 41, a second negative power terminal 42, and a third negative power terminal 43.

In this embodiment, each filtering unit 23 plays a role in filtering, so as to solve the problem of voltage and current impact caused by the rapid switching of the semiconductor switch 22, especially for SiC devices, thereby improving the reliability and safety of the system.

In the present embodiment, each power substrate assembly 20 includes two semiconductor switches 22 and two filtering units 23, and all power substrate assemblies 20 include six semiconductor switches 22 and six filtering units 23, where the six semiconductor switches 22 are Q1, Q2, Q3, Q4, Q5, and Q6, respectively, and the six filtering units 23 are C1, C2, C3, C4, C5, and C6, respectively.

Alternatively, the filtering unit 23 is a combination of a single capacitor, a capacitor and a resistor in series, and a capacitor and a resistor and a diode.

In this embodiment, the multiple capacitor cores of the bus capacitor 10 are connected by laminated copper bars, and the connection is completely by copper bonding, and the copper bars on the lower surface of the bus capacitor 10 are disposed on the heat sink 50, so as to improve the heat dissipation capability of the capacitor.

As shown in fig. 2, each power substrate assembly 20 also includes a current sensor 24. The current sensor 24 is disposed on the output end of the power substrate assembly 20 for detecting the current value of the output end. Like this, current sensor 24's above-mentioned setting not only can detect the current value of output, also encapsulates current sensor 24 in three-phase contravariant power module, and then has solved traditional current detection circuit and has taken up bulky, arrange difficult problem.

In the present embodiment, the number of the output terminals of the power substrate assembly 20 is three, and the power substrate assembly includes a first output terminal 71, a second output terminal 72 and a third output terminal 73. The three current sensors 24 are respectively I1, I2 and I3, and the three current sensors 24 are respectively disposed on the first output terminal 71, the second output terminal 72 and the third output terminal 73 to detect the three-phase output current in real time, thereby improving the reliability of the three-phase inverter power module and the system.

As shown in fig. 2, each power substrate assembly 20 further includes a passive discharge unit 25. The passive discharge unit 25 is connected in parallel with the bus capacitor 10. In this way, the passive discharge unit 25 is packaged in the frame 60, so that the problems of large size and difficult arrangement of the traditional circuit are solved, and the miniaturization design of the motor controller is realized.

In the present embodiment, each power substrate assembly 20 includes one passive discharge unit 25, and all power substrate assemblies 20 include three passive discharge units 25, where the three passive discharge units 25 are R1, R2, and R3, respectively. In this way, the discharge circuit is divided into three parts by the three passive discharge units 25 and packaged in a three-phase inverter power module in a small volume.

Alternatively, the passive discharge unit 25 is a discharge resistor.

Specifically, the three-phase inverter power module is additionally provided with a filter circuit (a circuit where the filter unit 23 is located), a three-phase current detection circuit (a circuit where the current sensor 24 is located), a discharge circuit (a circuit where the passive discharge unit 25 is located) and a bus capacitor C (a bus capacitor 10) on the basis of the traditional circuit topology, the bus capacitor 10 is packaged in the three-phase inverter power module before being placed in the three-phase inverter power module, and finally the three-phase inverter power module is integrally packaged, so that the integration level and the heat dissipation capacity of the three-phase inverter power module are improved, and the size of the motor controller is further reduced. Meanwhile, a plurality of functional circuits are integrated in the three-phase inversion power module, and power devices are reasonably arranged and wired by analyzing the functions of the circuits and the relation among the devices, so that stray inductance is reduced, power density is improved, and power grade expansion is facilitated.

In this embodiment, the filter absorption unit (the filter unit 23) is integrated inside the three-phase inverter power module, and the filter absorption unit (the filter unit 23) is disposed around the power semiconductor device chip (the semiconductor switch 22), so that noise in the power circuit can be effectively absorbed, the safe and reliable switching operation of the power device is ensured, and the system EMC performance (Electromagnetic Compatibility) is improved. The internal integrated discharge circuit (the circuit where the passive discharge unit 25 is located) of the three-phase inverter power module is arranged on the periphery of the bus capacitor 10, so that residual voltage in the bus capacitor 10 can be discharged conveniently, the fact that the capacitor does not have high voltage residue after the whole vehicle is flamed out for a certain time is guaranteed, and the integrated arrangement mode is easy to install, small in size and good in heat dissipation. Three-phase contravariant power module's inside integrated current sensor 24, current sensor 24 arranges on the three-phase output copper bar, and real-time detection phase current and small effectively dispel the heat simultaneously, saves space, easily installs than traditional hall current sensor.

In the present embodiment, all the power substrate assemblies 20 are located on the same side of the bus capacitor 10. Therefore, the structural layout in the three-phase inverter power module is more reasonable and compact by the arrangement, and the space utilization rate of the frame 60 is improved.

As shown in fig. 2 to 6, the three-phase inverter power module further includes a heat sink 50. Each power substrate assembly 20 and the bus capacitor 10 are in contact with the heat sink 50, so that each power substrate assembly 20 and the bus capacitor 10 are dissipated heat through the heat sink 50. In this way, each power substrate assembly 20 and the bus capacitor 10 share one heat sink 50, so as to cool each power substrate assembly 20 and the bus capacitor 10 through the heat sink 50, thereby avoiding the normal operation of the three-phase inverter power module from being influenced by the overhigh temperature of each power substrate assembly 20 and the bus capacitor 10, and improving the high temperature resistance and the heat dissipation capacity of the three-phase inverter power module.

Specifically, the lower surface of each power substrate assembly 20 is soldered to the upper surface of the heat sink 50, and the lower surface of the bus capacitor 10 is soldered to the upper surface of the heat sink 50.

As shown in fig. 4 to 6, the heat sink 50 includes two mounting plates 51, a first cooling portion 52, and a second cooling portion 53, which are provided to face each other. The first cooling portion 52 is provided on one mounting plate 51, the first cooling portion 52 is plural, and the plural first cooling portions 52 are provided at intervals in a predetermined direction. The second cooling portion 53 is provided on the other mounting plate 51, the second cooling portion 53 is plural, and the plural second cooling portions 53 are provided at intervals in a predetermined direction. At least one second cooling portion 53 is disposed between every two adjacent first cooling portions 52, and at least one first cooling portion 52 is disposed between every two adjacent second cooling portions 53. In this way, each second cooling portion 53 is interposed between two adjacent first cooling portions 52, and each first cooling portion 52 is interposed between two adjacent second cooling portions 53, so as to form a cooling cavity and achieve a heat dissipation function.

In the present embodiment, the first cooling part 52 is a pin needle, and the second cooling part 53 is a pin needle. The first cooling portion 52 is provided on the surface of each mounting plate 51 facing each other.

In the present embodiment, the plurality of first cooling portions 52 are disposed in an elliptical array on the mounting plate 51, the plurality of second cooling portions 53 are disposed in an elliptical array on the mounting plate 51, and the plurality of first cooling portions 52 and the plurality of second cooling portions 53 are staggered, so as to improve the heat dissipation capability of the heat sink 50.

It should be noted that the arrangement direction of the plurality of first cooling portions 52 on the mounting plate 51 is not limited to this, and may be adjusted according to the working condition and the use requirement. Alternatively, the plurality of first cooling portions 52 are arranged in a rectangular array or in a circular array on the mounting plate 51.

It should be noted that the arrangement direction of the plurality of second cooling portions 53 on the mounting plate 51 is not limited to this, and may be adjusted according to the working condition and the use requirement. Alternatively, the plurality of second cooling portions 53 are arranged in a rectangular array or in a circular array on the mounting plate 51.

Alternatively, the first cooling part 52 has a rod shape or a needle shape, and the cross section of the first cooling part 52 is a circle, an ellipse, or a polygon; and/or the second cooling part 53 is rod-shaped or needle-shaped, and the cross section of the second cooling part 53 is circular, or elliptical, or polygonal. Like this, above-mentioned setting makes the shape of first cooling portion 52 and/or second cooling portion 53 select more variety to satisfy different user demand and operating mode, also promoted staff's processing flexibility.

In this embodiment, the first cooling portion 52 is needle-shaped, and the cross section of the first cooling portion 52 is circular, so that the structure of the first cooling portion 52 is simpler, the processing and the implementation are easy, and the processing cost and the processing difficulty of the first cooling portion 52 are reduced.

In this embodiment, the second cooling portion 53 is needle-shaped, and the cross section of the second cooling portion 53 is circular, so that the structure of the second cooling portion 53 is simpler, the processing and the implementation are easy, and the processing cost and the processing difficulty of the second cooling portion 53 are reduced.

Alternatively, the two mounting plates 51 include a first mounting plate 511 and a second mounting plate 512, and the first cooling portion 52 is disposed on the first mounting plate 511 and is formed integrally with the first mounting plate 511; and/or the second cooling part 53 is arranged on the second mounting plate 512 and is of an integrated structure with the second mounting plate 512. Thus, the above arrangement not only improves the connection strength between the first cooling portion 52 and the first mounting plate 511, but also between the second cooling portion 53 and the second mounting plate 512, and also reduces the processing cost of the heat sink 50.

In the present embodiment, the first cooling portion 52 is disposed on the first mounting plate 511 and is integrally formed with the first mounting plate 511, and the second cooling portion 53 is disposed on the second mounting plate 512 and is integrally formed with the second mounting plate 512, so that the heat sink 50 can be more easily and conveniently processed, and the processing difficulty and the processing cost can be reduced. Meanwhile, the arrangement improves the overall structural strength of the radiator 50, and prolongs the service life of the radiator 50.

As shown in fig. 2 and 3, the frame 60 covers the bus capacitor 10, the total power substrate assembly 20, and the heat sink 50, and a glue filling space is formed between the frame 60 and the bus capacitor 10, the total power substrate assembly 20, and the heat sink 50. The frame 60 has a through hole for the positive power terminal 30 and the negative power terminal 40 to pass through. Therefore, the potting adhesive is poured into the potting adhesive space to integrally encapsulate and form the frame 60, the bus capacitor 10, the all-power substrate assembly 20 and the radiator 50, and the process is simple and the integration level is high.

Optionally, the substrate 21 is a double-sided copper-clad insulating and heat-conducting substrate.

In this embodiment, the double-sided copper-clad insulating and heat-conducting substrate has a ceramic layer in the middle, and two copper layers on the upper and lower sides, the upper copper layer being provided with a circuit for connecting power devices, the lower copper layer being used for soldering the heat sink 50, and the ceramic layer being used for insulation.

In the present embodiment, the internal power terminals of the bus capacitor 10 are soldered on the substrate 21 of each power substrate assembly 20 by laminated copper bars, the external power terminals of the bus capacitor 10 are led out by the first positive power terminal 31, the second positive power terminal 32, the third positive power terminal 33, the first negative power terminal 41, the second negative power terminal 42, and the third negative power terminal 43, the lower surface of the bus capacitor 10 is soldered on the upper surface of the heat sink 50, and shares the same heat sink 50 with each power substrate assembly 20, and this arrangement of strong heat dissipation can effectively reduce the volume of the capacitor. The frame 60 is arranged on the radiator 50, and the radiator and the frame form a potting cavity together, and finally, integral potting molding is realized.

In the present embodiment, the two semiconductor switches 22 of each power board assembly 20 are an upper arm power switch device chip 221 and a lower arm power switch device chip 222, respectively, and the two filter units 23 of each power board assembly 20 are an upper arm filter absorption unit 231 and a lower arm filter absorption unit 232, respectively. Each power substrate assembly 20 further includes a copper circuit 26 and a binding wire 27. The upper bridge arm power switch device chip 221 and the lower bridge arm power switch device chip 222 are both welded on a double-sided copper-clad insulating heat-conducting substrate, the lower surface of the double-sided copper-clad insulating heat-conducting substrate is welded on the upper surface of the radiator 50, and the upper bridge arm power switch device chip 221 and the lower bridge arm power switch device chip 222 can be formed by connecting a plurality of semiconductor chips in parallel according to the output requirement of the system power performance. The power terminals of the upper bridge arm power switch device chip 221 and the lower bridge arm power switch device chip 222 are connected with the power terminal of the bus capacitor 10 through laminated copper bars, and the signal terminals of the upper bridge arm power switch device chip 221 and the lower bridge arm power switch device chip 222 are led out through welding auxiliary connecting line terminals and connected with a driving unit outside the three-phase inversion power module. The upper bridge arm filter absorption unit 231 and the lower bridge arm filter absorption unit 232 are arranged around the upper bridge arm power switch device chip 221 and the lower bridge arm power switch device chip 222, the closer the upper bridge arm filter absorption unit and the lower bridge arm filter absorption unit, the better the effect is, clutter in a power loop can be effectively absorbed, the safe and reliable switching action of a power device is guaranteed, and the EMC performance of the system is improved. The passive discharge unit 25 is arranged on the periphery of the bus capacitor 10 so as to discharge residual voltage in the bus capacitor 10, and no high voltage residue exists in the bus capacitor 10 after the whole vehicle is flamed out for a certain time. The current sensor 24 is arranged on the first output terminal 71, the second output terminal 72 and the third output terminal 73, detects phase current in real time, is small in size, effectively dissipates heat, saves space compared with the traditional Hall current sensor, and is easy to install. The internal signals are connected by the solder bonding wires 27. Therefore, the three-phase inversion power module has the characteristics of small-size packaging, high-temperature-resistant packaging, high-reliability packaging and the like.

From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:

the bus capacitor and the power substrate assemblies are arranged in the frame, each power substrate assembly comprises a substrate, an inverter circuit and at least two filter units, lead terminals of the bus capacitor are arranged on the substrates and are electrically connected with the substrates, at least two semiconductor switches are arranged on the inverter circuit, the at least two filter units and the at least two semiconductor switches are arranged in a one-to-one correspondence mode, and each filter unit is arranged in parallel with the corresponding semiconductor switch. Therefore, the bus capacitor and the power substrate assemblies are all packaged in the frame, on one hand, the integration level of the three-phase inversion power module is improved, the problem that the overall size of the system is large due to the fact that the three-phase inversion power module is connected by an external connecting copper bar and a bolt in the prior art is solved, and the miniaturization design of the motor controller is achieved; on the other hand, clutter in the power loop is effectively absorbed through each filtering unit, and safe and reliable operation of a power device is guaranteed.

It is obvious that the above described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A three-phase inverter power module, comprising:

a frame (60);

a bus capacitor (10) disposed within the frame (60);

the power substrate assemblies (20) are arranged in parallel in the frame (60), the input end of each power substrate assembly (20) is connected with a direct current bus, and the output end of each power substrate assembly (20) is connected with the input end of a motor;

a positive power terminal (30), at least a part of the outgoing terminals of the bus capacitor (10) being connected to the positive power terminal (30);

a negative power terminal (40) to which at least another part of the outgoing terminals of the bus capacitors (10) is connected;

wherein each of the power substrate assemblies (20) comprises:

a substrate (21), wherein a lead terminal of the bus capacitor (10) is disposed on the substrate (21) and electrically connected to the substrate (21);

the inverter circuit is provided with at least two semiconductor switches (22);

at least two filter units (23) provided in one-to-one correspondence with the at least two semiconductor switches (22), each of the filter units (23) being provided in parallel with the corresponding semiconductor switch (22).

2. The three-phase inverter power module of claim 1, wherein each of the power substrate assemblies (20) further comprises:

a current sensor (24), the current sensor (24) being disposed on an output of the power substrate assembly (20) for detecting a current value of the output.

3. The three-phase inverter power module of claim 1, wherein each of the power substrate assemblies (20) further comprises:

and the passive discharge unit (25) is arranged in parallel with the bus capacitor (10).

4. The three-phase inverter power module of claim 1, wherein all of the power substrate assemblies (20) are located on the same side of the bus capacitor (10).

5. The three-phase inverter power module of claim 1, further comprising:

a heat sink (50), wherein each power substrate assembly (20) and the bus capacitor (10) are in contact with the heat sink (50) so as to dissipate heat of each power substrate assembly (20) and the bus capacitor (10) through the heat sink (50).

6. The three-phase inverter power module according to claim 5, wherein the heat sink (50) includes:

two mounting plates (51) arranged oppositely;

a plurality of first cooling parts (52) arranged on one mounting plate (51), wherein the plurality of first cooling parts (52) are arranged at intervals along a preset direction;

a plurality of second cooling portions (53) provided on the other mounting plate (51), the plurality of second cooling portions (53) being provided at intervals in the predetermined direction;

wherein at least one second cooling part (53) is arranged between every two adjacent first cooling parts (52), and at least one first cooling part (52) is arranged between every two adjacent second cooling parts (53).

7. The three-phase inverter power module according to claim 6, wherein the first cooling part (52) has a rod shape or a needle shape, and the cross section of the first cooling part (52) is a circular shape, an oval shape, or a polygonal shape; and/or the second cooling part (53) is rod-shaped or needle-shaped, and the cross section of the second cooling part (53) is circular, oval or polygonal.

8. The three-phase inverter power module according to claim 6, wherein the two mounting plates (51) include a first mounting plate (511) and a second mounting plate (512), and the first cooling portion (52) is provided on the first mounting plate (511) and is of an integral structure with the first mounting plate (511); and/or the second cooling part (53) is arranged on the second mounting plate (512) and is of an integrated structure with the second mounting plate (512).

9. The three-phase inverter power module according to claim 5, wherein the frame (60) covers the bus capacitor (10), all of the power substrate assemblies (20) and the heat sink (50), and a glue filling space is formed between the frame (60) and the bus capacitor (10), all of the power substrate assemblies (20) and the heat sink (50); wherein the frame (60) has a through hole for the positive power terminal (30) and the negative power terminal (40) to pass through.

10. The three-phase inverter power module according to claim 1, wherein the substrate (21) is a double-sided copper-clad insulating and heat-conducting substrate.

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