CN220709637U

CN220709637U - Bidirectional heat dissipation CPU radiator

Info

Publication number: CN220709637U
Application number: CN202322453558.2U
Authority: CN
Inventors: 谈凤志; 陈嘉宏
Original assignee: Yung Teng Electronic Products Co ltd
Current assignee: Yung Teng Electronic Products Co ltd
Priority date: 2023-09-08
Filing date: 2023-09-08
Publication date: 2024-04-02
Anticipated expiration: 2033-09-08

Abstract

The utility model discloses a bidirectional heat dissipation CPU radiator, which comprises a heat dissipation mechanism, mounting mechanisms, a dust cover and a heat dissipation fan, wherein the mounting mechanisms are assembled on two sides below the heat dissipation mechanism and used for supporting the heat dissipation mechanism; the lower fins and the upper fins of the utility model utilize the heat pipe group and the heat radiation fan to simultaneously perform heat radiation operation, and the heat radiation fan can simultaneously perform air supply and heat radiation on the lower fins and the upper fins, thereby meeting the higher and higher heat radiation requirements, and having the advantages of simple structure and good heat radiation effect.

Description

Bidirectional heat dissipation CPU radiator

Technical Field

The utility model particularly relates to a bidirectional heat dissipation CPU radiator.

Background

With the progress of semiconductor technology, the operation speed of a computer cpu has been greatly increased in recent years, and the higher the heat quantity on the surface of a chip, in order to reduce the working temperature of a heat generating electronic component and keep the heat generating electronic component operating effectively, heat dissipating devices such as a heat dissipating fin and a fan are generally arranged, however, the air flow of the fan blowing through the heat dissipating fin in the conventional heat dissipating device is limited, and it is difficult to meet the higher heat dissipating requirement.

Disclosure of Invention

In view of the above, the present utility model aims to provide a bidirectional heat dissipation CPU radiator with simple structure and good heat dissipation effect.

In order to solve the problems, the utility model adopts the following technology and method:

the bidirectional heat dissipation CPU radiator comprises a heat dissipation mechanism, mounting mechanisms which are assembled on two sides below the heat dissipation mechanism and used for supporting the heat dissipation mechanism, and a dust cover which is assembled above the heat dissipation mechanism, wherein the heat dissipation mechanism comprises a bottom steel plate, a heat pipe group which is assembled on the bottom steel plate, lower fins which are stacked above the bottom steel plate, upper fins which are stacked above the lower fins and are hollowed in the middle part, and a heat dissipation fan which is assembled at the hollowed part of the upper fins.

Preferably, the lower surface of the bottom steel plate is provided with three lower heat pipe mounting grooves parallel to the shorter side of the bottom steel plate; two upper heat pipe mounting grooves parallel to the longer side of the bottom steel plate are formed in the upper surface of the bottom steel plate.

Preferably, the heat pipe group is composed of five heat pipes.

Preferably, the mounting mechanism comprises a bracket which is abutted against one side of the lower surface of the bottom steel plate, a screw which penetrates through the bracket and enables the bracket to be fixedly mounted with the bottom steel plate, a stud which is assembled at two ends of the bracket, a spring which is sleeved on the stud, an O-shaped ring which is sleeved on the stud and is used as a gasket between the spring and the bracket, and a semicircular ring which is positioned below the bracket and is used for buckling the stud.

Further, the lower end of the stud is provided with an annular groove.

Preferably, the dust cover is hollowed.

The lower fins and the upper fins of the utility model utilize the heat pipe group and the heat radiation fan to simultaneously perform heat radiation operation, and the heat radiation fan can simultaneously perform air supply and heat radiation on the lower fins and the upper fins, thereby meeting the higher and higher heat radiation requirements, and having the advantages of simple structure and good heat radiation effect.

Drawings

FIG. 1 is a schematic diagram of a bi-directional heat dissipating CPU heat sink according to the present utility model;

FIG. 2 is a second structural view of a bi-directional heat dissipating CPU heat sink according to the present utility model;

FIG. 3 is a perspective view of a vertical CPU heat sink of the present utility model from the bottom side;

FIG. 4 is an exploded view of FIG. 3;

FIG. 5 is a structural view of the middle sole plate of FIG. 4;

fig. 6 is a structural view of the bolt of fig. 4.

Detailed Description

The following detailed description of the utility model is provided in connection with the accompanying drawings to facilitate understanding and grasping of the technical scheme of the utility model.

In this embodiment, it should be understood that the directions or positional relationships indicated by the terms "middle", "upper", "lower", "top", "right", "left", "upper", "back", "middle", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present utility model, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model.

In this embodiment, if not specifically described, the members may be connected or fixed by bolts, pins, or the like, which are commonly used in the prior art, and therefore, the details thereof will not be described in this embodiment.

A bidirectional heat dissipation CPU radiator, as shown in fig. 1-4, comprises a heat dissipation mechanism 1, a mounting mechanism 2 for supporting the heat dissipation mechanism 1, which is assembled on both sides below the heat dissipation mechanism 1, and a dust cover 3, which is assembled above the heat dissipation mechanism 1. The heat radiation mechanism 1 comprises a bottom steel plate 11, a heat pipe group 12 assembled on the bottom steel plate 11, a lower fin 13 stacked above the bottom steel plate 11, an upper fin 14 stacked above the lower fin 13 and provided with a hollowed-out middle part, and a heat radiation fan 15 assembled at the hollowed-out part of the upper fin 14. Three lower heat pipe mounting grooves 111 parallel to the shorter side of the bottom steel plate 11 are formed in the lower surface of the bottom steel plate 11; the mounting mechanism 2 includes a bracket 21 abutting against one side of the lower surface of the bottom steel plate 11, screws 22 penetrating the bracket 21 and fixedly mounting the bracket 21 and the bottom steel plate 11, studs 23 fitted at both ends of the bracket 21, springs 24 fitted over the studs 23, O-rings 25 fitted over the studs 23 as spacers between the springs 24 and the bracket 21, and semicircular rings 26 located below the bracket 21 and used for fastening the studs 23. The dust cover 3 is hollow, so that the cooling fan 15 can conveniently run, and ventilation and heat dissipation are facilitated.

As shown in fig. 5, and in combination with fig. 4, the upper surface of the bottom steel plate 11 is provided with two upper heat pipe installation grooves 112 parallel to the longer sides of the bottom steel plate 11. The heat pipe group 12 is composed of five heat pipes; specifically, three heat pipes are mounted in cooperation with three lower heat pipe mounting grooves 111 on the lower surface of the bottom steel plate 11, the upper ends of the three heat pipes are inserted into the upper fins 14, one ends of the other two heat pipes are inserted into the lower fins 13, and the other ends of the other two heat pipes are mounted in cooperation with two upper heat pipe mounting grooves 112 on the upper surface of the bottom steel plate 11.

As shown in fig. 6, and referring to fig. 4, an annular groove 231 is provided at the lower end of the stud 23, specifically, a semicircular ring 26 can be embedded therein, and after the stud 23 passes through the bracket 21, the stud 23 is locked into the annular groove 231 by the semicircular ring 26, so that the limiting spring 24 ejects the stud 23.

The foregoing is merely illustrative of the present utility model, and the scope of the utility model is not limited thereto, but is intended to cover any variations or alternatives not suggested by the applicant's knowledge, and accordingly, the scope of the utility model is to be determined by the appended claims.

Claims

1. The utility model provides a two-way heat dissipation CPU radiator, includes heat dissipation mechanism, assembles in heat dissipation mechanism below both sides, is used for supporting heat dissipation mechanism's installation mechanism to and assemble the dust cover in heat dissipation mechanism top, its characterized in that: the heat radiation mechanism comprises a bottom steel plate, a heat pipe group assembled on the bottom steel plate, a lower fin stacked above the bottom steel plate, an upper fin stacked above the lower fin, the middle part of which is provided with a hollow, and a heat radiation fan assembled at the hollow part of the upper fin.

2. The bi-directional heat dissipating CPU heat sink of claim 1 wherein: three lower heat pipe mounting grooves parallel to the shorter side of the bottom steel plate are formed in the lower surface of the bottom steel plate; two upper heat pipe mounting grooves parallel to the longer side of the bottom steel plate are formed in the upper surface of the bottom steel plate.

3. The bi-directional heat dissipating CPU heat sink of claim 1 wherein: the heat pipe group consists of five heat pipes.

4. The bi-directional heat dissipating CPU heat sink of claim 1 wherein: the mounting mechanism comprises a bracket which is abutted against one side of the lower surface of the bottom steel plate, screws which penetrate through the bracket and enable the bracket to be fixedly mounted with the bottom steel plate, studs which are assembled at two ends of the bracket, springs which are sleeved on the studs, O-shaped rings which are sleeved on the studs and serve as gaskets between the springs and the bracket, and semicircular rings which are positioned below the bracket and used for buckling the studs.

5. The bi-directional heat dissipating CPU heat sink of claim 4, wherein: the lower end of the stud is provided with an annular groove.

6. The bi-directional heat dissipating CPU heat sink of claim 1 wherein: the dust cover is hollow.