CN220509388U

CN220509388U - CPU radiator

Info

Publication number: CN220509388U
Application number: CN202321806650.6U
Authority: CN
Inventors: 曹蓉蓉; 彭斌
Original assignee: Shenzhen Chuang Ruixin Technology Co ltd
Current assignee: Shenzhen Chuang Ruixin Technology Co ltd
Priority date: 2023-07-11
Filing date: 2023-07-11
Publication date: 2024-02-20
Anticipated expiration: 2033-07-11

Abstract

The utility model discloses a CPU radiator, which comprises a mounting plate, wherein an air duct is embedded in the upper surface of the mounting plate, a dish-shaped fan is fixedly arranged on the inner wall of the air duct, a heat conducting plate is fixedly arranged on the lower surface of the mounting plate, the lower surface of the heat conducting plate is contacted with the end surface of an external CPU, and the air inlet end at the bottom of the air duct extends to the upper surface of the heat conducting plate. According to the CPU radiator, under the action of the elastic force of the buffer spring, the upper end face of the main heat conducting plate is abutted against the upper end face of the CPU, heat generated by the operation of the CPU is transferred to the main heat conducting plate, then under the driving action of the butterfly fan, the heat is emitted to the outside by air, the purpose of heat dissipation is achieved, in the using process, the heat emission of the surface of the CPU can be improved by utilizing the side face contact of the auxiliary heat conducting plate and the CPU, and the heat of the surface of the auxiliary heat conducting plate is emitted to the outside under the conveying action of the butterfly fan.

Description

CPU radiator

Technical Field

The utility model relates to the technical field of computer accessories, in particular to a CPU radiator.

Background

The CPU is an important part of the computer, with the continuous update of the CPU, the performance requirement of the CPU is continuously improved, the heat consumption of the CPU becomes an important research topic, and the heat dissipation of the CPU becomes a non-negligible important problem. If the heat of the CPU cannot be timely emitted from the surface of the CPU, the running performance of the CPU is directly affected, and if the heat in the CPU is too high, the CPU is seriously damaged, so that the running stability of the CPU is seriously affected. The heat dissipation of the CPU is also particularly important, and the higher the requirement for the CPU heat sink is.

Through searching, the prior patent (publication number: CN 214896514U) discloses a CPU radiator, which comprises a bottom plate, radiating fins, a heat conducting element, a radiating fan and a plurality of U-shaped heat pipes, wherein the radiating fins are fixed on the bottom plate, the radiating fan is arranged on one side of the radiating fins, the heat conducting element and the plurality of U-shaped heat pipes are all arranged at the bottom of the bottom plate, and one side pipe of each U-shaped heat pipe is connected with the heat conducting element. Through the arrangement, one side pipe of each U-shaped heat pipe can be contacted with a heat source through the heat conducting element, heat is timely conducted to the whole bottom plate, and the layout design of the plurality of U-shaped heat pipes is excellent, so that the heat-dissipating device has the advantage of good heat-dissipating performance. However, the inventors have found that the prior art has the following problems in the implementation of the present utility model: when the heat conducting element is used for conducting heat by contacting with the CPU, the heat conducting element is only used for contacting with the upper end face of the CPU, the effect of conducting heat to the side face of the CPU is lacking, the heat on the surface of the CPU is difficult to quickly transfer to the heat conducting element, so that the heat dissipation efficiency of the radiator is poor, and the use requirement is difficult to meet.

Therefore, a CPU heat sink is proposed against the above-described problems.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks of the prior art, an embodiment of the present utility model provides a CPU heat sink to solve the above-mentioned problems of the related art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the CPU radiator comprises a mounting plate, wherein an air duct is embedded in the upper surface of the mounting plate, a dish-shaped fan is fixedly arranged on the inner wall of the air duct, a main heat-conducting plate is fixedly arranged on the lower surface of the mounting plate, the lower surface of the main heat-conducting plate is in contact with the end face of an external CPU, an air inlet end at the bottom of the air duct extends to the upper surface of the main heat-conducting plate, an air inlet hole communicated with the air inlet end of the air duct is formed in the surface of the main heat-conducting plate, and a side heat-absorbing component is arranged on the surface of the main heat-conducting plate;

the side heat absorption assembly comprises a T-shaped sliding groove formed in the surface of the main heat conduction plate, the inner wall of the T-shaped sliding groove is horizontally and slidably connected with a T-shaped sliding block, the bottom end of the T-shaped sliding block is provided with a telescopic groove, the inner wall of the telescopic groove is vertically and slidably connected with an auxiliary heat conduction plate, one side, far away from the central shaft of the main heat conduction plate, of the auxiliary heat conduction plate is fixedly provided with an air pipe, one end of the air pipe is in an opening shape, the other end of the air pipe is fixedly connected with a spring hose, and the other end of the spring hose is communicated with the air inlet end of the air guide pipe.

Preferably, the surface of the mounting plate is provided with four mounting screws in rectangular arrays at four corners of the mounting plate.

Preferably, the surface of the mounting screw rod is sleeved with a buffer spring.

Preferably, the number of the T-shaped sliding grooves is four, the four T-shaped sliding grooves are in a cross shape and are formed in the lower surface of the main heat conducting plate, and the inner wall of each T-shaped sliding groove is provided with a first abutting spring for driving the T-shaped sliding block to move towards the central shaft of the main heat conducting plate.

Preferably, the T-shaped sliding block is provided with a second abutting spring in the telescopic groove for driving the auxiliary heat conducting plate to move downwards.

Preferably, a plurality of heat dissipation rods are arranged on the upper surface of the heat conduction plate corresponding to the air inlet end of the air guide pipe.

The utility model has the technical effects and advantages that:

compared with the prior art, the CPU radiator is characterized in that the mounting plate is fixed inside the computer through the mounting screw, the upper end face of the main heat conducting plate and the upper end face of the CPU are abutted against each other under the action of the elasticity of the buffer spring, heat generated by the operation of the CPU is transferred to the main heat conducting plate, then the heat is emitted to the outside under the driving action of the butterfly fan, the purpose of heat radiation is achieved, in the using process, the heat emission of the surface of the CPU can be improved by utilizing the contact of the auxiliary heat conducting plate and the side face of the CPU, and the heat of the surface of the auxiliary heat conducting plate is emitted to the outside under the conveying action of the butterfly fan.

Compared with the prior art, the CPU radiator can slide along the T-shaped sliding groove through the T-shaped sliding block, can enable the side face of the auxiliary heat-conducting plate and the side face of the CPU to be abutted tightly under the action of the elastic force of the first abutting spring, can slide along the telescopic groove through the auxiliary heat-conducting plate, can drive the auxiliary heat-conducting plate to move downwards under the action of the elastic force of the second abutting spring, and can be used for guaranteeing that the radiator can be suitable for heat dissipation of CPUs with different sizes.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is a schematic view of a perspective two-dimensional structure of the present utility model.

Fig. 3 is a schematic view of the front cross-section structure of the present utility model.

Fig. 4 is an enlarged schematic view of the structure of fig. 3 at a.

The reference numerals are: 1. a mounting plate; 2. an air duct; 3. a dish-shaped fan; 4. a heat conducting plate; 5. an air inlet hole; 6. a T-shaped slider; 7. an auxiliary heat-conducting plate; 8. an air duct; 9. a spring hose; 10. installing a screw; 11. a buffer spring; 12. a first abutment spring; 13. a second abutment spring; 14. a heat dissipation rod.

Description of the embodiments

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The CPU radiator as shown in figures 1-4 comprises a mounting plate 1, wherein four mounting screws 10 are arranged on four corners of the mounting plate 1, and the surfaces of the mounting plate 1 are in rectangular arrays.

The surface of the mounting screw 10 is sleeved with a buffer spring 11.

The upper surface of mounting panel 1 inlays and is equipped with air duct 2, and air duct 2's inner wall fixed mounting has dish fan 3, and the lower surface fixed mounting of mounting panel 1 has leading hot plate 4, and the lower surface of leading hot plate 4 contacts with the terminal surface of outside CPU, and the inlet port of air duct 2 bottom extends to leading hot plate 4's upper surface, and leading hot plate 4's surface has seted up the inlet port 5 that is linked together with air duct 2 inlet port.

According to the CPU radiator, the mounting plate 1 is fixed inside a computer through the mounting screw 10, the upper end face of the CPU is abutted against the main heat plate 4 under the action of the elastic force of the buffer spring 11, heat generated by the operation of the CPU is transferred to the main heat plate 4, and then the heat is emitted to the outside through air under the driving action of the butterfly fan 3, so that the purpose of heat dissipation of the CPU is achieved.

The surface of the main heat-conducting plate 4 is provided with lateral heat-absorbing components.

The side heat absorption assembly comprises T-shaped sliding grooves formed in the surface of the main heat conduction plate 4, the inner walls of the T-shaped sliding grooves are horizontally and slidably connected with T-shaped sliding blocks 6, the number of the T-shaped sliding grooves is four, the four T-shaped sliding grooves are formed in a cross shape and formed in the lower surface of the main heat conduction plate 4, and the inner walls of the T-shaped sliding grooves are provided with first abutting springs 12 for driving the T-shaped sliding blocks 6 to move towards the central shaft position of the main heat conduction plate 4.

The bottom of T type slider 6 has seted up the expansion tank, and the vertical sliding connection of inner wall in expansion tank has supplementary heat-conducting plate 7, and T type slider 6 is provided with the second in the inside of expansion tank and supports tight spring 13 of supplementary heat-conducting plate 7 downwardly moving.

One side of the auxiliary heat-conducting plate 7 far away from the central shaft of the main heat-conducting plate 4 is fixedly provided with an air pipe 8, one end of the air pipe 8 is in an opening shape, the other end of the air pipe 8 is fixedly connected with a spring hose 9, and the other end of the spring hose 9 is communicated with the air inlet end of the air duct 2.

Further, the auxiliary heat conducting plate 7 is in contact with the side surface of the CPU, so that heat dissipation of the surface of the CPU can be improved, and the heat of the surface of the auxiliary heat conducting plate 7 is dissipated to the outside under the conveying action of the dish-shaped fan 3.

And in the use, can slide along T type spout through T type slider 6 to under the elasticity effect of first tight spring 12 that supports, can make supplementary heat-conducting plate 7 support tightly with the side of CPU, can slide along the expansion groove through supplementary heat-conducting plate 7, and under the elasticity effect of second tight spring 13 that supports, can drive supplementary heat-conducting plate 7 and move down, ensure that this radiator can be applicable to the use when the heat dissipation of the not CPU of equidimension.

The upper surface of the heat conducting plate is provided with a plurality of heat dissipation rods 14 corresponding to the air inlet end of the air duct 2.

By providing the heat radiation rod 14, the heat exchange efficiency between the heat conduction plate 4 and the air can be improved, thereby further improving the heat radiation effect of the radiator.

The working process of the utility model is as follows:

firstly, when the CPU radiator is installed, the installation plate 1 is fixed inside a computer through the installation screw rod 10, the main heat conducting plate 4 is abutted against the upper end face of the CPU under the action of the elasticity of the buffer spring 11, the auxiliary heat conducting plate 7 is driven to be abutted against the side face of the CPU under the action of the elasticity of the first abutting spring 12 and the second abutting spring 13, heat generated by the operation of the CPU is respectively transferred to the main heat conducting plate 4 and the auxiliary heat conducting plate 7, and the heat is emitted to the outside along with the air flow under the action of the driving of the butterfly fan 3, so that the heat dissipation purpose is realized.

This is the working principle of the CPU radiator.

The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;

secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;

finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.

Claims

1. A CPU radiator comprising a mounting plate (1), characterized in that: the air inlet end at the bottom of the air duct (2) extends to the upper surface of the main heat conducting plate (4), an air inlet hole (5) communicated with the air inlet end of the air duct (2) is formed in the surface of the main heat conducting plate (4), and a side heat absorbing component is arranged on the surface of the main heat conducting plate (4);

the side heat absorption assembly comprises a T-shaped chute arranged on the surface of a main heat conduction plate (4), wherein the inner wall of the T-shaped chute is horizontally and slidably connected with a T-shaped sliding block (6), a telescopic groove is arranged at the bottom end of the T-shaped sliding block (6), an auxiliary heat conduction plate (7) is vertically and slidably connected with the inner wall of the telescopic groove, an air pipe (8) is fixedly arranged on one side, far away from the central shaft of the main heat conduction plate (4), of the auxiliary heat conduction plate (7), one end of the air pipe (8) is in an opening shape, a spring hose (9) is fixedly connected with the other end of the air pipe (8), and the other end of the spring hose (9) is communicated with the air inlet end of the air guide pipe (2).

2. A CPU heat sink as claimed in claim 1, wherein: four mounting screws (10) are arranged at four corners of the mounting plate (1) in a rectangular array on the surface of the mounting plate (1).

3. A CPU heat sink as claimed in claim 2, wherein: the surface of the mounting screw rod (10) is sleeved with a buffer spring (11).

4. A CPU heat sink as claimed in claim 1, wherein: the number of the T-shaped sliding grooves is four, the four T-shaped sliding grooves are in a cross shape and are formed in the lower surface of the main heat conducting plate (4), and a first abutting spring (12) for driving the T-shaped sliding block (6) to move towards the central shaft of the main heat conducting plate (4) is arranged on the inner wall of the T-shaped sliding groove.

5. A CPU heat sink as claimed in claim 1, wherein: the T-shaped sliding block (6) is provided with a second abutting spring (13) in the telescopic groove for driving the auxiliary heat conducting plate (7) to move downwards.

6. A CPU heat sink as claimed in claim 1, wherein: the upper surface of the main heat conducting plate is provided with a plurality of heat dissipation rods (14) corresponding to the air inlet end of the air guide pipe (2).