CN211479068U - Computer big data server heat abstractor - Google Patents
Computer big data server heat abstractor Download PDFInfo
- Publication number
- CN211479068U CN211479068U CN202020668575.1U CN202020668575U CN211479068U CN 211479068 U CN211479068 U CN 211479068U CN 202020668575 U CN202020668575 U CN 202020668575U CN 211479068 U CN211479068 U CN 211479068U
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- outer cover
- base
- heat
- fixedly connected
- big data
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Abstract
The utility model provides a computer big data server heat abstractor, which belongs to the technical field of radiators and aims at the defect of poor heat dissipation effect of radiators in the prior art, and comprises a base and an outer cover, wherein the lower end of the base is provided with supporting legs, the base is provided with an air inlet hole, the upper end of the base is fixedly connected with a limiting ring, the opening of the outer cover is arranged downwards, and a limiting block is embedded into the opening of the outer cover, the upper end of the outer cover is provided with an air outlet hole, and a fan is arranged right above the; the heat conducting plate is fixedly connected with one side of the radiating fin, and the heat conducting plate is fixedly connected with the outer cover through screws; the radiating fins are provided with through holes, and cooling pipelines penetrating through the through holes in all the radiating fins are arranged between the radiating fins on the two sides of the outer cover. The utility model discloses have good heat dispersion, can dismantle the fin and wash the fin simultaneously.
Description
Technical Field
The utility model belongs to the technical field of the radiator, concretely relates to big data server heat abstractor of computer.
Background
Computers are an indispensable tool in modern society. The high-speed computing capability of the computer greatly accelerates the data processing speed. The existing society is a society with high-speed development, developed science and technology and information circulation, people communicate with each other more and more closely, the life is more and more convenient, and big data is a product of the high-tech era. The most core value of big data is to store and analyze massive data. The combined cost of the three aspects of "cheap, fast, optimized" of big data is optimal compared to other existing technologies. The big data technology is a new revolutionary information technology taking data as essence, and can drive innovation of ideas, modes, technologies and application practices in the data mining process. When the server is used for large data processing, a large amount of data is required to be processed in a centralized manner, which generates a large amount of heat, and is easy to generate accidents such as heat accumulation failure and server burnout. The radiator in the prior art has poor radiating effect and is difficult to meet the use requirement.
Disclosure of Invention
The utility model discloses to the relatively poor drawback of radiator radiating effect among the prior art, provide a big data server heat abstractor of computer, this heat abstractor has good radiating effect.
The invention aims to be realized by the following technical scheme: a heat dissipation device for a computer big data server comprises a base and an outer cover with an opening, wherein the lower end of the base is fixedly connected with supporting legs which are used for supporting the base and enabling an interval to be formed between the lower end face of the base and the ground; the base is provided with a clamping piece detachably connected with the outer cover; a plurality of vertically arranged through grooves are formed in the left side and the right side of the outer cover, radiating fins protruding outwards relative to the outer side face of the outer cover are embedded in the through grooves, a heat conducting plate located in the inner cavity of the outer cover is fixedly connected to one side of each radiating fin, and the heat conducting plate is fixedly connected with the outer cover through screws; the cooling fins are provided with through holes, cooling pipelines penetrating through the through holes on all the cooling fins are arranged between the cooling fins on the two sides of the outer cover, and two ends of each cooling pipeline are fixedly connected with a pipeline connector; the base both sides still are equipped with the mounting panel that is located the fin below, are equipped with a plurality of fans that set up on the mounting panel.
In the above scheme, fan work can be taken the air of dustcoat inner chamber out from the exhaust vent, the fresh air of external cold air can follow the fresh air inlet of base lower extreme and get into the dustcoat inner chamber, can take away the heat in the dustcoat, and accord with the ascending keeping away from of hot-air, the radiating effect is better, the heat-conducting plate that sets up simultaneously can absorb the heat in the dustcoat, and give off the external world through the fin, the external water pump of cooling pipe accessible pipe connection head that sets up, the realization is to the water-cooling of fin, promote heat dispersion, and simultaneously, through the fan that sets up, can follow the fin lower extreme and blow to the fin, further promote heat. After the radiating fin is used for a long time, the surface of the radiating fin is covered with dust to cause the heat radiating performance of the radiating fin to be reduced, the outer cover can be separated from the base, the cooling pipeline is drawn out from the through hole, the screw on the heat conducting plate is detached, the radiating fin can be cleaned, and the heat radiating performance is improved.
Preferably, the joint spare is including fixing the base side and the convex elastic plate that makes progress, elastic plate medial surface upper end fixedly connected with latch, the dustcoat lateral surface be equipped with latch complex draw-in groove. The outer cover can be fixed, so that the outer cover is stable when being installed on the base.
Preferably, heat conduction rings coaxially arranged with the through holes are arranged on two sides of the radiating fins, and the heat conduction rings are sleeved on the cooling pipeline and attached to the corresponding radiating fins. The heat conduction performance between the radiating fins and the cooling pipeline can be improved by the arrangement of the heat conduction rings, and further the heat radiation performance of the radiating fins can be improved.
Preferably, two heat conduction rings located at two ends of the same through hole are matched for use, a first connecting ring is fixedly connected to one heat conduction ring, a second connecting ring is fixedly connected to the other heat conduction ring, the first connecting ring is embedded into the second connecting ring, and anti-skid grains are arranged on the outer side face of the first connecting ring and the inner side face of the second connecting ring. The first connecting ring and the second connecting ring are matched for use, and the two heat conducting rings can be connected and installed.
Preferably, the base is provided with a mounting seat. The computer server is mounted on the mounting base.
Preferably, the outer side surface of the outer cover, which is not provided with the radiating fins, is provided with radiating holes. The heat dissipation holes can further improve the heat dissipation performance of the outer cover.
Compared with the prior art, the utility model discloses following beneficial effect has: the utility model discloses have good heat dispersion, can dismantle the fin and wash the fin simultaneously.
Drawings
FIG. 1 is a perspective view of the present invention;
fig. 2 is a top view of the present invention;
FIG. 3 is a cross-sectional view taken at A-A of FIG. 2;
FIG. 4 is a schematic structural view of the base, the housing, and the clip;
FIG. 5 is a schematic view of a connection structure of two heat conduction rings;
the labels in the figure are: 1. the base, 2, dustcoat, 3, supporting legs, 4, fresh air inlet, 5, spacing ring, 6, the exhaust vent, 7, the fan, 8, joint spare, 9, the elastic plate, 10, the latch, 11, the draw-in groove, 12, logical groove, 13, the fin, 14, the heat-conducting plate, 15, the through-hole, 16, the cooling duct, 17, the pipe connection head, 18, the heat-conducting ring, 19, first go-between, 20, the second go-between, 21, the mounting panel, 22, the fan, 23, the mount pad, 24, the louvre.
Detailed Description
The invention will be further described with reference to the embodiments shown in the drawings to which:
example 1
As shown in fig. 1-5, a heat dissipation device for a computer big data server comprises a base 1 and an outer cover 2 provided with an opening, wherein the lower end of the base 1 is fixedly connected with a supporting leg 3 for supporting the base 1 and enabling a space to be formed between the lower end surface of the base 1 and the ground, the base 1 is provided with an air inlet 4 penetrating through the upper end and the lower end of the base 1, the upper end of the base 1 is fixedly connected with a limiting ring 5 in a square ring structure, the opening of the outer cover 2 is arranged downwards, the limiting block is embedded into the opening of the outer cover 2, the lower end of the outer cover 2 is attached to the upper end surface of the base 1, the upper end of the outer cover 2 is provided with an air outlet 6 communicated with an inner cavity of; the base 1 is provided with a clamping piece 8 which is detachably connected with the outer cover 2; joint 8 is including fixing in base 1 side and the convex elastic plate 9 that makes progress, and elastic plate 9 medial surface upper end fixedly connected with latch 10, 2 lateral surfaces of dustcoat are equipped with latch 10 complex draw-in groove 11. A plurality of through grooves 12 which are vertically arranged are formed in the left side and the right side of the outer cover 2, radiating fins 13 which protrude outwards relative to the outer side face of the outer cover 2 are embedded in the through grooves 12, a heat conducting plate 14 which is positioned in an inner cavity of the outer cover 2 is fixedly connected to one side of each radiating fin 13, and the heat conducting plate 14 is fixedly connected with the outer cover 2 through screws; the radiating fins 13 are provided with through holes 15, cooling pipelines 16 penetrating through the through holes 15 on all the radiating fins 13 are arranged between the radiating fins 13 on the two sides of the outer cover 2, and two ends of each cooling pipeline 16 are fixedly connected with a pipeline connector 17; heat conduction rings 18 which are coaxial with the through holes 15 are arranged on two sides of the radiating fins 13, and the heat conduction rings 18 are sleeved on the cooling pipeline 16 and are attached to the corresponding radiating fins 13. The two heat conduction rings 18 located at two ends of the same through hole 15 are used in a matched mode, a first connection ring 19 is fixedly connected to one heat conduction ring 18, a second connection ring 20 is fixedly connected to the other heat conduction ring 18, the first connection ring 19 is embedded into the second connection ring 20, the second connection ring 20 is sleeved in the through hole 15, and anti-skidding lines are arranged on the outer side face of the first connection ring 19 and the inner side face of the second connection ring 20.
The base 1 both sides still are fixed to be equipped with the mounting panel 21 that is located the fin 13 below, are equipped with three fan 22 that set up on the mounting panel 21. The two heat conduction rings 18 located at two ends of the same through hole 15 are used in a matching manner, wherein a first connection ring 19 is fixedly connected to one heat conduction ring 18, a second connection ring 20 is fixedly connected to the other heat conduction ring 18, the first connection ring 19 is embedded into the second connection ring 20, and anti-skid grains are arranged on the outer side surface of the first connection ring 19 and the inner side surface of the second connection ring 20.
The base 1 is provided with a mounting seat 23, and the calculator server can be mounted on the mounting seat 23. The outer side surface of the outer cover 2, which is not provided with the radiating fins 13, is provided with radiating holes 24.
The utility model discloses during the in-service use, the water pump can be connected to the pipe connection head 17 of 16 one ends of cooling tube, the pipe connection head 17 joint drain pipe of the other end, and place water pump and drain pipe in same pond, can realize the circulating water cooling to fin 13, for the ease of dismantling fin 13, divide into the water pipe of multistage spiro union of each other with cooling tube 16, only need progressively dismantle the multistage water pipe, just can demolish cooling tube 16, can dismantle fin 13, heat-conducting plate 14 after that, clear up.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The heat dissipation device for the computer big data server is characterized by comprising a base (1) and an outer cover (2) with an opening, wherein the lower end of the base (1) is fixedly connected with a supporting leg (3) which is used for supporting the base (1) and enables the lower end face of the base (1) and the ground to form an interval, the base (1) is provided with an air inlet hole (4) which penetrates through the upper end and the lower end of the base (1), the upper end of the base (1) is fixedly connected with a limiting ring (5) with a square annular structure, the opening of the outer cover (2) is arranged downwards, a limiting block is embedded into the opening of the outer cover (2), the lower end of the outer cover (2) is attached to the upper end face of the base (1), the upper end of the outer cover (2) is provided with an air outlet hole (6) communicated with the inner cavity of the outer cover (2), and the upper; the base (1) is provided with a clamping piece (8) detachably connected with the outer cover (2); a plurality of through grooves (12) which are vertically arranged are formed in the left side and the right side of the outer cover (2), radiating fins (13) which protrude outwards relative to the outer side surface of the outer cover (2) are embedded into the through grooves (12), a heat conducting plate (14) which is positioned in an inner cavity of the outer cover (2) is fixedly connected to one side of each radiating fin (13), and the heat conducting plate (14) is fixedly connected with the outer cover (2) through screws; through holes (15) are formed in the radiating fins (13), cooling pipelines (16) penetrating through the through holes (15) in all the radiating fins (13) are arranged between the radiating fins (13) on the two sides of the outer cover (2), and two ends of each cooling pipeline (16) are fixedly connected with a pipeline connector (17); the base (1) both sides still are equipped with mounting panel (21) that are located fin (13) below, are equipped with a plurality of fans (22) that set up upwards on mounting panel (21).
2. The heat dissipation device for the computer big data server according to claim 1, wherein the clip member (8) comprises an elastic plate (9) fixed on a side surface of the base (1) and protruding upwards, a clip tooth (10) is fixedly connected to an upper end of an inner side surface of the elastic plate (9), and a slot (11) matched with the clip tooth (10) is arranged on an outer side surface of the outer cover (2).
3. The heat sink for big data server of computer according to claim 1, wherein the heat sink (13) has heat-conducting rings (18) disposed on two sides thereof and coaxial with the through holes (15), and the heat-conducting rings (18) are sleeved on the cooling pipe (16) and attached to the corresponding heat sink (13).
4. The heat sink for big data server of computer according to claim 3, wherein two heat-conducting rings (18) located at two ends of the same through hole (15) are used together, wherein a first connecting ring (19) is fixedly connected to one heat-conducting ring (18), a second connecting ring (20) is fixedly connected to the other heat-conducting ring (18), the first connecting ring (19) is embedded in the second connecting ring (20), and the outer side of the first connecting ring (19) and the inner side of the second connecting ring (20) are both provided with anti-slip threads.
5. The heat sink for big data server of computer according to claim 1, wherein the base (1) is provided with a mounting seat (23).
6. The heat sink for big data server of computer according to claim 1, wherein the heat sink holes (24) are disposed on the outer side of the housing (2) without the heat sink fins (13).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020668575.1U CN211479068U (en) | 2020-04-27 | 2020-04-27 | Computer big data server heat abstractor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020668575.1U CN211479068U (en) | 2020-04-27 | 2020-04-27 | Computer big data server heat abstractor |
Publications (1)
Publication Number | Publication Date |
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CN211479068U true CN211479068U (en) | 2020-09-11 |
Family
ID=72380415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202020668575.1U Expired - Fee Related CN211479068U (en) | 2020-04-27 | 2020-04-27 | Computer big data server heat abstractor |
Country Status (1)
Country | Link |
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CN (1) | CN211479068U (en) |
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2020
- 2020-04-27 CN CN202020668575.1U patent/CN211479068U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200911 Termination date: 20210427 |