CN211429212U - Rib type heat radiator with piezoelectric vibration flat plate - Google Patents

Abstract

The utility model discloses a carry on dull and stereotyped fin formula heat abstractor of piezoelectricity vibration. The heat dissipation device comprises a finned radiator, a vibrating flat plate, a piezoelectric stack and a jacket; the finned radiator is arranged on the surface of the electronic device to be radiated; the vibrating flat plate is arranged above the finned radiator; the piezoelectric stack is connected with the vibrating flat plate through a clamping sleeve and a fastening screw; the piezoelectric stack generates periodic telescopic deformation when alternating voltage is input, the deformation motion drives the vibration flat plate to transversely vibrate under the transmission action of the jacket, and air flowing through the fins of the radiator rotates under the influence of the transverse motion of the vibration flat plate to form a multi-longitudinal-vortex flow structure, so that the heat exchange between high-temperature gas near the surfaces of the fins and low-temperature fluid in the central area of a flow channel between the fins is enhanced, and the purpose of enhancing heat dissipation is finally realized. The utility model has the advantages of simple structure and reasonable design, it is convenient to maintain, has that the intensive radiating effect is good, the intensive radiating effect can be adjusted etc. in real time and is showing the advantage.

Description

Rib type heat radiator with piezoelectric vibration flat plate

Technical Field

The utility model relates to a conventional yardstick electronic equipment's forced air cooling field specifically relates to a carry on dull and stereotyped fin formula heat abstractor of piezoelectricity vibration.

Background

Electronic equipment can produce a large amount of heat energy when moving, if can not cool down the electronic component or the chip that generates heat in time, then can cause electronic system to damage or shorten life, consequently the inside of most electronic equipment can install the radiator usually to cool down the electronic component that generates heat.

At present, electronic equipment with conventional dimensions such as a notebook computer, a desktop computer and the like mostly adopts a finned radiator as a main radiating structure, and the finned radiator is attached to the surface of an electronic device and is matched with a forced air cooling mode for radiating. The method increases the heat dissipation surface area by means of a plurality of fins and improves the convection heat transfer coefficient by matching with forced air cooling so as to take away the heat generated when an electronic device works. The heat dissipation mode has the advantages of low cost, good reliability and the like.

However, in the above heat dissipation structure, since the flow state of air between the fins is mostly laminar flow or transitional flow in the conventional forced air cooling state, the fluid stratification phenomenon is obvious, the heat exchange strength between the cold and hot fluids is weak, and finally the actual heat dissipation effect is relatively general. Therefore, with the further increase of the power density of the electronic equipment, the conventional fin type heat dissipation structure is easy to cause the problem of overhigh temperature of the electronic equipment during heat dissipation, and finally influences the normal work and the service life of the electronic equipment.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a carry on dull and stereotyped rib formula heat abstractor of piezoelectricity vibration.

The specific technical scheme is as follows:

a rib type heat dissipation device carrying a piezoelectric vibration flat plate comprises a rib type heat radiator, a vibration flat plate, a piezoelectric stack and a jacket;

the finned radiator is arranged on the surface of the electronic device to be radiated;

the vibrating flat plate is arranged above the finned radiator;

the piezoelectric stack is connected with the vibrating flat plate through a clamping sleeve and a fastening screw;

the piezoelectric stack generates periodic telescopic deformation when alternating voltage is input, the deformation motion drives the vibration plate to transversely vibrate under the transmission action of the jacket, and air flowing through the fins of the radiator rotates under the influence of the transverse motion of the vibration plate to form a multi-longitudinal-vortex flow structure, so that the heat exchange between high-temperature gas near the surfaces of the fins and low-temperature fluid in the central area of a flow channel between the fins is enhanced, and the aim of enhancing heat dissipation is finally fulfilled.

The finned radiator is characterized in that 4 counter bores are arranged at four corners of the upper surface of the finned radiator, 4 balls are placed in the counter bores, the balls can roll in the counter bores, and the diameters of the balls are larger than the depths of the counter bores.

The vibrating plate is placed on the balls, the upper surface of the vibrating plate is provided with a boss structure, the clamping sleeve is installed on a boss of the vibrating plate through an opening square hole, the square hole and the boss surface are in clearance fit, and the clamping sleeve can slide up and down relative to the boss on the vibrating plate.

The jacket is provided with two cantilever structures,

one end of the piezoelectric stack, which is installed by matching with the jacket, is provided with a through hole, and the other end of the piezoelectric stack is fixedly supported on an external installation support.

The fastening screw penetrates through a through hole in the cantilever on one side of the jacket and a through hole in the piezoelectric stack and then is screwed into a threaded hole in the cantilever on the other side of the jacket to realize the connection of the piezoelectric stack and the vibrating plate.

The ratio of the height of the fins of the finned radiator to the distance between the fins is not more than 5.

The utility model has the advantages that:

the structure is simple, the design is reasonable, the maintenance is convenient, and the device has the remarkable advantages of good enhanced heat dissipation effect, real-time adjustment of the enhanced heat dissipation effect and the like.

Drawings

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Fig. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is an exploded view of the structure of the present invention;

fig. 3 is a top view of the overall structure of the present invention;

FIG. 4 is a schematic view of the cross section and the channel vortex generation of FIG. 3 according to the present invention;

description of reference numerals: 1. a finned heat sink; 2. vibrating the flat plate; 3. a piezoelectric stack; 4. a jacket; 5. fastening screws; 6. a counter bore; 7. a ball bearing; 8. a boss; 9. a cantilever.

Detailed Description

The technical content and the detailed description of the present invention will be described below with reference to the accompanying drawings, however, the attached drawings are only for illustrative purposes and are not intended to limit the protection scope of the present invention.

As shown in fig. 1, a finned heat sink device for mounting a piezoelectric vibrating plate includes a finned heat sink 1, a vibrating plate 2, a piezoelectric stack 3, a jacket 4, and fastening screws 5. The finned radiator 1 is arranged on the surface of an electronic device to be radiated. When the electronic device is in operation, the generated heat is transferred to the surfaces of the fins of the finned radiator 1 through heat conduction. The finned radiator 1 is arranged on the surface of a device to be radiated and comprises a plurality of fin structures, and flow channels among the fins are main places for convective heat transfer. The cooling air flow driven by an external fan or a pump flows into the finned radiator 1 from one side, so that the heat transfer process of the surfaces of the fins is changed from natural convection heat transfer to forced convection heat transfer.

As shown in fig. 2, four corners of the upper surface of the finned heat sink 1 are provided with counterbores 6, and balls 7 are placed in the counterbores 6. The ball 7 is free to roll within the counterbore 6 and the diameter of the ball 7 is greater than the depth of the counterbore 6. The vibration plate 2 is placed on the balls 7, and the vibration plate 2 can slide on the balls 7 under the action of external force. The upper surface of the vibrating plate 2 is provided with a boss structure, the jacket 4 is arranged on a boss 8 of the vibrating plate 2 through an opening square hole, the surface of the boss 8 is in clearance fit with the square hole, and the jacket 4 can slide up and down relative to the boss 8 of the vibrating plate 2.

As shown in fig. 2 and 3, the jacket 4 comprises two cantilevers 9, wherein a through hole is formed on one cantilever, and a threaded hole is formed on the other cantilever at a corresponding position.

As shown in fig. 2 and fig. 3, the piezoelectric stack 3 has a through hole at one end mounted in a fitting jacket, and the other end is fixedly supported on an external mounting bracket.

As shown in fig. 3, the fastening screw 5 passes through the through hole on the cantilever 9 on one side of the jacket 4 and the through hole on the piezoelectric stack 3, and then is screwed into the threaded hole on the cantilever on the other side of the jacket 4 to connect the piezoelectric stack 3 with the vibrating plate 2. After the connection is completed, the boss 8 is clamped, and the jacket 4 and the boss 8 cannot move relatively.

As shown in fig. 4, when an ac voltage is input, the piezoelectric stack 3 generates a periodic stretching deformation, and this deformation movement drives the vibrating plate 2 to vibrate transversely under the driving action of the jacket 4. Under the influence of the transverse motion of the vibrating plate 2, gas in the flow channels among the fins close to the vibrating plate 2 moves transversely along with the vibrating plate 2, when the motion direction of the vibrating plate 2 is switched, the pressure gradient direction is changed, the gas on the surface of the plate generates flow separation, and a longitudinal vortex flow structure with the rotation direction vertical to the main flow direction is formed. The longitudinal vortex structure brings low-temperature gas in the central area of the flow channel between the fins to the vicinity of the surfaces of the fins, and then takes high-temperature gas on the surfaces of the fins away, so that energy exchange between cold and hot fluid in the flow channel between the fins is enhanced, and the purpose of enhancing heat dissipation is finally realized.

As shown in fig. 4, in the rib radiator having the piezoelectric vibrating plate, in order to reduce the suppression effect of the wall surface constraint effect on the generation of the longitudinal vortex, the ratio of the height of the ribs to the pitch of the ribs of the rib radiator 1 should not exceed 5.

As shown in fig. 4, in the rib type heat dissipation device with a piezoelectric vibrating plate, the operating state of the piezoelectric stack 3 can be adjusted according to the actual heat dissipation requirement. Specifically, when the heat dissipation requirement of the electronic device is small, the alternating voltage input to the piezoelectric stack 3 can be turned off, so that the energy-saving effect is realized; when the heat dissipation requirement of the electronic equipment is high, alternating voltage can be input into the piezoelectric stack 6, so that the vibration plate generates transverse vibration, and the effect of enhancing heat dissipation is realized. The method is convenient to adjust and quick in response, and can be widely applied to heat dissipation occasions of electronic equipment with large fluctuation of heat productivity.

Claims (7)

1. A rib type heat dissipation device carrying a piezoelectric vibration flat plate is characterized by comprising a rib type heat radiator (1), a vibration flat plate (2), a piezoelectric stack (3) and a jacket (4);

the finned radiator (1) is arranged on the surface of an electronic device to be radiated;

the vibrating flat plate (2) is arranged above the finned radiator (1);

the piezoelectric stack (3) is connected with the vibrating flat plate (2) through a jacket (4) and a fastening screw (5);

the piezoelectric stack (3) generates periodic telescopic deformation when alternating voltage is input, the deformation motion drives the vibrating plate (2) to transversely vibrate under the transmission action of the jacket (4), and air flowing through the fins of the radiator rotates under the influence of the transverse motion of the vibrating plate (2) to form a multi-longitudinal-vortex flow structure, so that the heat exchange between high-temperature gas near the surfaces of the fins and low-temperature fluid in the central area of a flow channel between the fins is enhanced, and the aim of enhancing heat dissipation is finally fulfilled.

2. The heat dissipating device of claim 1, wherein: rib fin formula radiator (1) arranged 4 counter bores (6) on the four corners of upper surface, placed 4 ball (7) in counter bore (6), ball (7) can roll in counter bore (6) and the diameter of ball (7) is greater than the degree of depth of counter bore (6).

3. The heat dissipating device of claim 1, wherein: vibration flat board (2) place on ball (7), the upper surface is provided with boss (8) structure, press from both sides cover (4) and install on boss (8) of vibration flat board (2) through the opening square hole, square hole and boss (8) surface are clearance fit, press from both sides cover (4) and can slide from top to bottom for boss (8) on the vibration flat board (2).

4. The heat dissipating device of claim 1, wherein: the jacket (4) is provided with two cantilever (9) structures, a through hole is processed on one cantilever, and a threaded hole is processed on the corresponding position of the other cantilever.

5. The heat dissipating device of claim 1, wherein: one end of the piezoelectric stack (3) which is matched with the jacket for installation is provided with a through hole, and the other end of the piezoelectric stack is fixedly supported on an external installation support.

6. The heat dissipating device of claim 1, wherein: the fastening screw (5) penetrates through a through hole in a cantilever (9) on one side of the jacket (4) and a through hole in the piezoelectric stack (3), and then is screwed into a threaded hole in the cantilever (9) on the other side of the jacket (4) to realize the connection of the piezoelectric stack (3) and the vibrating plate (2).

7. The heat dissipating device according to claim 1, wherein the rib height to rib pitch ratio of the ribbed radiator (1) is not more than 5.

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