CN219577690U - Multifunctional gasket - Google Patents
Multifunctional gasket Download PDFInfo
- Publication number
- CN219577690U CN219577690U CN202320416853.8U CN202320416853U CN219577690U CN 219577690 U CN219577690 U CN 219577690U CN 202320416853 U CN202320416853 U CN 202320416853U CN 219577690 U CN219577690 U CN 219577690U
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- layer
- thermal insulation
- metal sheet
- glued membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model discloses a multifunctional gasket which comprises an intermediate epoxy heat conduction insulating adhesive film layer, an upper metal sheet, a lower metal sheet, an upper heat conduction silica gel wave absorbing plate layer, a lower heat conduction silica gel wave absorbing plate layer, an upper epoxy heat conduction insulating adhesive film layer and a lower epoxy heat conduction insulating adhesive film layer, wherein the upper metal sheet and the lower metal sheet are respectively bonded with the upper end face and the lower end face of the intermediate epoxy heat conduction insulating adhesive film layer, the upper heat conduction silica gel wave absorbing plate layer is bonded with the upper end face of the upper metal sheet, the lower heat conduction silica gel wave absorbing plate layer is bonded with the lower end face of the lower metal sheet, the lower end face of the upper epoxy heat conduction insulating adhesive film layer is bonded with the upper end face of the upper heat conduction silica gel wave absorbing plate layer, and the upper end face of the lower epoxy heat conduction insulating adhesive film layer is bonded with the lower end face of the lower heat conduction silica gel wave absorbing plate layer. The advantages are that: the product has good cohesiveness, thermal conductivity, wave absorbing property and electromagnetic shielding property.
Description
Technical Field
The utility model relates to the field of gaskets, in particular to a multifunctional gasket.
Background
The conventional gasket is usually formed by combining an adhesive film with a copper foil or an aluminum foil, the performance of the gasket cannot meet the wave absorbing performance, and the original gasket has the wave absorbing function and has the problems of small adhesive force and poor electromagnetic shielding efficiency.
For example, chinese patent publication No. CN111031776a discloses a heat-conducting wave-absorbing pad, which is a multi-layer structure, and includes at least two heat-conducting wave-absorbing layers and at least one electrically-conducting flexible layer, and at least one electrically-conducting flexible layer is not located at the outermost side of the heat-conducting wave-absorbing pad. The heat-conducting wave-absorbing gasket is characterized in that the heat-conducting wave-absorbing gasket is provided with the heat-conducting wave-absorbing material, the heat-conducting wave-absorbing material is provided with the heat-conducting wave-absorbing plate, the heat-conducting wave-absorbing plate is provided with the heat-conducting wave-absorbing material, the heat-conducting wave-absorbing material is provided with the heat-conducting wave-absorbing material, and the heat-conducting wave-absorbing plate is provided with the heat-conducting wave-absorbing material.
In view of this, it is necessary to provide a multifunctional gasket.
Disclosure of Invention
The multifunctional gasket provided by the utility model effectively solves the problems that the existing gasket has good cohesiveness, wave absorbing property and electromagnetic shielding at the same time.
The technical scheme adopted by the utility model is as follows: the utility model provides a multifunctional gasket, includes the thermal insulation glued membrane layer of zhong epoxy, goes up sheetmetal, lower sheetmetal, goes up thermal insulation glued membrane layer, lower thermal insulation glued membrane layer, goes up epoxy thermal insulation glued membrane layer and lower epoxy thermal insulation glued membrane layer, go up sheetmetal and lower sheetmetal respectively with the up end and the lower terminal surface bonding of the thermal insulation glued membrane layer of zhong epoxy, go up thermal insulation glued membrane layer and the up end bonding of last sheetmetal, the lower terminal surface bonding of lower thermal insulation glued membrane layer and lower sheetmetal, the lower terminal surface bonding of the lower terminal surface of going up epoxy thermal insulation glued membrane layer and the up end bonding of last thermal insulation glued membrane layer, the up end of lower epoxy thermal insulation glued membrane layer and the lower terminal surface bonding of lower thermal insulation glued membrane layer.
Further is: the upper metal sheet is copper foil or aluminum foil, and the lower metal sheet is copper foil or aluminum foil.
Further is: the thickness ranges of the upper epoxy heat-conducting insulating film layer, the middle epoxy heat-conducting insulating film layer and the lower epoxy heat-conducting insulating film layer are all 50um-2mm.
Further is: the thickness of the upper metal sheet layer and the lower metal sheet layer is in the range of 10um-50um.
Further is: the thickness range of the upper heat conduction silica gel wave absorbing plate layer and the lower heat conduction silica gel wave absorbing plate layer is 0.5mm-3mm.
The utility model has the beneficial effects that: the product has good cohesiveness, thermal conductivity, wave absorbing property and electromagnetic shielding property.
Drawings
Fig. 1 is an overall schematic diagram of a multifunctional gasket according to an embodiment of the present utility model.
Marked in the figure as: 1. an epoxy heat conducting insulating film layer; 2. a metal sheet is arranged on the upper part; 3. a lower metal sheet; 4. a heat conduction silica gel wave absorbing plate layer is arranged on the upper surface of the substrate; 5. a lower heat conducting silica gel wave absorbing plate layer; 6. an epoxy heat-conducting insulating adhesive film layer is arranged on the upper surface of the substrate; 7. a lower epoxy heat-conducting insulating adhesive film layer;
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings.
As shown in fig. 1, the multifunctional gasket provided by the embodiment of the utility model comprises a middle epoxy heat conduction insulating adhesive film layer 1, an upper metal sheet 2, a lower metal sheet 3, an upper heat conduction silica gel wave absorbing sheet layer 4, a lower heat conduction silica gel wave absorbing sheet layer 5, an upper epoxy heat conduction insulating adhesive film layer 6 and a lower epoxy heat conduction insulating adhesive film layer 7, wherein the upper metal sheet 2 and the lower metal sheet 3 are respectively bonded with the upper end face and the lower end face of the middle epoxy heat conduction insulating adhesive film layer 1, the upper heat conduction silica gel wave absorbing sheet layer 4 is bonded with the upper end face of the upper metal sheet 2, the lower heat conduction silica gel wave absorbing sheet layer 5 is bonded with the lower end face of the lower metal sheet 3, the lower end face of the upper epoxy heat conduction insulating adhesive film layer 6 is bonded with the upper end face of the upper heat conduction silica gel wave absorbing sheet layer 4, and the upper end face of the lower epoxy heat conduction insulating adhesive film layer 7 is bonded with the lower end face of the lower heat conduction silica gel wave absorbing sheet layer 5.
The metal sheet is specifically copper or aluminum.
During actual use, the upper epoxy heat-conducting insulating adhesive film layer 6 is bonded with the heating component, and the lower epoxy heat-conducting insulating adhesive film layer 7 is bonded with the heat dissipation component, so that heat of the heating component sequentially passes through the upper epoxy heat-conducting insulating adhesive film layer 6, the upper heat-conducting silica gel wave absorbing plate layer 4, the upper metal sheet 2, the middle epoxy heat-conducting insulating adhesive film layer 1, the lower metal sheet 3, the lower heat-conducting silica gel wave absorbing plate layer 5, the lower epoxy heat-conducting insulating adhesive film layer 7 and the heat dissipation component. In addition, the upper heat conduction silica gel wave absorbing plate layer 4 and the lower heat conduction silica gel wave absorbing plate layer 5 have good heat conduction and wave absorbing performance, and the upper metal sheet 2 layer and the lower metal sheet 3 layer can play a good electromagnetic shielding effect.
In the design, the whole product has good cohesiveness, thermal conductivity, wave absorption and electromagnetic shielding property.
Specifically: the upper metal sheet 2 is copper foil or aluminum foil, and the lower metal sheet 3 is copper foil or aluminum foil.
In the design, the copper foil or the aluminum foil has good electromagnetic shielding effect, and can play a shielding role when applied to the utility model.
Specifically: the thickness ranges of the upper epoxy heat-conducting insulating adhesive film layer 6, the middle epoxy heat-conducting insulating adhesive film layer 1 and the lower epoxy heat-conducting insulating adhesive film layer 7 are all 50um-2mm.
In actual use, the upper metal sheet 2 layer and the lower metal sheet 3 layer are bonded by the epoxy heat-conducting insulating adhesive film layer 1, the upper epoxy heat-conducting insulating adhesive film layer 6 is bonded with a heating element, and the lower epoxy heat-conducting insulating adhesive film layer 7 is bonded with a heat dissipation element.
In the design, the thickness ranges of the upper epoxy heat conduction insulating film layer, the middle epoxy heat conduction insulating film layer and the lower epoxy heat conduction insulating film layer are all 50um-2mm, and the requirements of the thinning requirement and the adhesive force of the product can be met.
Specifically: the thickness range of the upper metal sheet 2 layer and the lower metal sheet 3 layer is 10um-50um.
In the design, the thickness range of the upper metal sheet 2 layer and the lower metal sheet 3 layer is 10um-50um, so that the support effect can be achieved, and the electromagnetic shielding effect can be ensured to be strong enough.
Specifically: the thickness range of the upper heat conduction silica gel wave absorbing plate layer 4 and the lower heat conduction silica gel wave absorbing plate layer 5 is 0.5mm-3mm.
In the design, the thickness ranges of the upper heat conduction silica gel wave absorbing plate layer 4 and the lower heat conduction silica gel wave absorbing plate layer 5 are 0.5mm-3mm, so that good bonding performance between the upper epoxy heat conduction insulating adhesive film layer 6 and the upper metal sheet 2 and between the lower epoxy heat conduction insulating adhesive film layer 7 and the lower metal sheet 3 can be ensured, and good wave absorbing performance can be ensured.
It should be understood that the foregoing description is only illustrative of the present utility model and is not intended to limit the utility model to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.
Claims (5)
1. A multifunctional gasket, characterized in that: including well thermal insulation glued membrane layer (1), last sheetmetal (2), lower sheetmetal (3), go up thermal insulation glued membrane layer (4), lower thermal insulation glued membrane layer (5), go up thermal insulation glued membrane layer (6) and lower epoxy thermal insulation glued membrane layer (7), go up sheetmetal (2) and lower sheetmetal (3) respectively with the up end and the lower terminal surface bonding of well thermal insulation glued membrane layer (1), go up thermal insulation glued membrane layer (4) and the up end bonding of last sheetmetal (2), lower thermal insulation glued membrane layer (5) bond with the lower terminal surface of lower sheetmetal (3), the lower terminal surface of going up thermal insulation glued membrane layer (6) bonds with the up end of last thermal insulation glued membrane layer (4), the up end of lower thermal insulation glued membrane layer (7) bonds with the lower terminal surface of lower thermal insulation glued membrane layer (5).
2. The multi-purpose gasket of claim 1, wherein: the upper metal sheet (2) is copper foil or aluminum foil, and the lower metal sheet (3) is copper foil or aluminum foil.
3. The multi-purpose gasket of claim 1, wherein: the thickness ranges of the upper epoxy heat-conducting insulating adhesive film layer (6), the middle epoxy heat-conducting insulating adhesive film layer (1) and the lower epoxy heat-conducting insulating adhesive film layer (7) are all 50um-2mm.
4. The multi-purpose gasket of claim 1, wherein: the thickness of the upper metal sheet (2) and the lower metal sheet (3) are both in the range of 10um-50um.
5. The multi-purpose gasket of claim 1, wherein: the thickness range of the upper heat conduction silica gel wave absorbing plate layer (4) and the lower heat conduction silica gel wave absorbing plate layer (5) is 0.5mm-3mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320416853.8U CN219577690U (en) | 2023-03-07 | 2023-03-07 | Multifunctional gasket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320416853.8U CN219577690U (en) | 2023-03-07 | 2023-03-07 | Multifunctional gasket |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219577690U true CN219577690U (en) | 2023-08-22 |
Family
ID=87655940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202320416853.8U Active CN219577690U (en) | 2023-03-07 | 2023-03-07 | Multifunctional gasket |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219577690U (en) |
-
2023
- 2023-03-07 CN CN202320416853.8U patent/CN219577690U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN205082059U (en) | heat dissipation circuit board | |
WO2014117541A1 (en) | Photovoltaic component module for building | |
CN219577690U (en) | Multifunctional gasket | |
CN210607231U (en) | Novel composite heat dissipation material | |
CN207336999U (en) | A kind of liquid crystal display die set | |
CN215819251U (en) | Multilayer heat dissipation formula silica gel gasket | |
CN212211739U (en) | Edge-covered graphite heat-conducting foam gasket | |
CN211467710U (en) | High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight | |
CN210406048U (en) | Composite heat conduction structure with efficient laminating effect | |
CN220390535U (en) | High-performance glass fiber cloth prepreg composite material | |
CN211896756U (en) | Heat-conducting glue film for thermal-shock-resistant aluminum substrate | |
CN220390523U (en) | Wrapped type buffer foam capable of welding, conducting and radiating | |
CN210868320U (en) | Aluminum substrate with copper-aluminum composite conductive layer | |
CN216532347U (en) | Multilayer high strength heat conduction silica gel piece | |
CN219165040U (en) | Multilayer composite heat-conducting silica gel sheet | |
CN214774479U (en) | High heat-resistant copper-clad plate | |
CN210610139U (en) | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material | |
CN213152455U (en) | Double-layer laminating type heat dissipation copper-clad plate | |
CN220674213U (en) | Self-adhesive insulating heat dissipation graphite sheet for mobile phone motherboard | |
CN217470639U (en) | Composite heat conducting gasket | |
CN208490029U (en) | Flexible circuit board with radiating structure | |
CN217495446U (en) | High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight | |
CN219628059U (en) | Power converter cover | |
CN217789984U (en) | High-voltage-resistant aluminum-based copper-clad plate | |
CN216291588U (en) | Mobile phone motherboard with graphite flake heat conduction structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |