CN215819251U

CN215819251U - Multilayer heat dissipation formula silica gel gasket

Info

Publication number: CN215819251U
Application number: CN202122125364.0U
Authority: CN
Inventors: 于昭玲
Original assignee: Qingdao Rijin Electroni Fitting Co ltd
Current assignee: Qingdao Rijin Electroni Fitting Co ltd
Priority date: 2021-09-04
Filing date: 2021-09-04
Publication date: 2022-02-11
Anticipated expiration: 2031-09-04

Abstract

The utility model relates to the technical field of radiating gaskets, in particular to a multilayer radiating silica gel gasket which comprises a silica gel sheet and an adhesive layer, wherein the top and the bottom of the silica gel sheet are respectively and fixedly connected with the adhesive layer and a spring, the outer side of the spring is provided with an adhesive radiating mechanism, the inner side of the silica gel sheet is provided with an insulating pressing mechanism, the adhesive radiating mechanism comprises the spring, the outer side of the spring is fixedly connected with an adhesive plate, the inner side of the adhesive plate is fixedly connected with an alloy block, and the inner part of the silica gel sheet is embedded and fixedly connected with a heat conducting patch, a heat conducting rod and a radiating hole pad.

Description

Multilayer heat dissipation formula silica gel gasket

Technical Field

The utility model relates to the technical field of radiating gaskets, in particular to a multilayer radiating silica gel gasket.

Background

Silica gel gasket is a class of product that market demand is more in the silica gel goods, there is certain tension, the pliability, good insulating nature, it is withstand voltage, high temperature resistant, the stable characteristic of low temperature resistant and chemical property, multilayer silica gel gasket generally uses on industrial machine, as bolster or the fastener of machine work, can play antiskid, take precautions against earthquakes, antistatic and high temperature resistant effect, better protection machine just reduces the loss, general silica gel gasket's laminating radiating effect is relatively poor, therefore, demand a multilayer heat dissipation formula silica gel gasket.

The problem that an interlayer heat dissipation mechanism is not arranged exists in a common multi-layer silica gel gasket, the silica gel gasket is not convenient to communicate and dissipate heat, the problem that a pressing shock absorption mechanism is not arranged exists in the common multi-layer silica gel gasket, the pressing shock absorption effect of the silica gel gasket is poor, and therefore the multi-layer heat dissipation type silica gel gasket is provided aiming at the problem.

Disclosure of Invention

The utility model aims to provide a multilayer heat dissipation type silica gel gasket to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a multilayer heat dissipation formula silica gel gasket, includes the silica gel piece and glues the layer, layer and spring are pasted to silica gel piece top and bottom fixedly connected with glue respectively, the spring outside is provided with laminating heat dissipation mechanism, silica gel piece inboard is provided with insulating pressing mechanism.

Preferably, laminating heat dissipation mechanism includes the spring, the spring outside fixedly connected with flitch, the inboard fixedly connected with alloy piece of flitch, inside gomphosis fixedly connected with heat conduction paster, heat conduction pole and the heat dissipation hole pad of silica gel piece.

Preferably, the insulating pressing mechanism comprises a silica gel sheet, a black cotton cushion layer is fixedly connected to the inner side of the silica gel sheet in an embedded mode, and a sponge interlayer is fixedly connected to the inner side of the black cotton cushion layer in an embedded mode.

Preferably, the left end and the right end of the heat conducting rod are respectively and fixedly communicated with a heat conducting patch and a heat radiating hole pad.

Preferably, a through groove is formed in the inner side of the silica gel sheet.

Preferably, the alloy block is in contact sliding connection with the heat conducting patch.

Preferably, the flitch is in embedded sliding connection with the inside of the silica gel sheet.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, through the arranged adhesive layer, the black cotton cushion layer, the pasting plate, the alloy block, the heat conduction paster, the heat conduction rod and the heat dissipation hole pad, before use, the adhesive layer is fixedly pasted with the adjacent electric appliance plate to be buffered and subjected to shock reduction, and under the flexible extrusion action of the spring and the pasting plate, the communicated heat conduction interlayer heat dissipation structure of the alloy block, the heat conduction paster, the heat conduction rod and the heat dissipation hole pad is completed, so that the problem that a common multilayer silica gel gasket is not provided with an interlayer heat dissipation mechanism is solved, and the practicability of the device is greatly improved.

2. According to the utility model, through the silica gel piece, the black cotton cushion layer, the sponge interlayer and the through groove, the interlayer damping effect on the multilayer silica gel gasket is improved through the black cotton cushion layer and the sponge interlayer which are embedded in the silica gel piece, and the insulation scattered holes in the interlayer area are pressed through the through groove and the silica gel piece, so that the problem that a pressing damping mechanism is not arranged on the common multilayer silica gel gasket is solved, and the stability and the reliability of the device are greatly improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of FIG. 1 at point A according to the present invention;

FIG. 3 is a schematic view of the structure at B of FIG. 1 according to the present invention.

In the figure: 1-silica gel sheet, 2-adhesive layer, 3-spring, 4-black cotton cushion layer, 5-sponge interlayer, 6-adhesive plate, 7-alloy block, 8-heat conducting patch, 9-heat conducting rod, 10-radiating hole pad and 11-through groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

the utility model provides a multilayer heat dissipation formula silica gel gasket, includes silica gel piece 1 and glues and

pastes layer

2, and 1 top of silica gel piece and bottom fixedly connected with respectively glue layer 2 and spring 3, and the spring 3 outside is provided with laminating heat dissipation mechanism, and 1 inboard of silica gel piece is provided with insulating pressing mechanism.

The attaching and radiating mechanism comprises a spring 3, an attaching plate 6 is fixedly connected to the outer side of the spring 3, an alloy block 7 is fixedly connected to the inner side of the attaching plate 6, and a heat-conducting attaching sheet 8, a heat-conducting rod 9 and a radiating hole pad 10 are fixedly connected to the inner portion of the silicon sheet 1 in an embedded mode; the insulation pressing mechanism comprises a silica gel sheet 1, a black cotton cushion layer 4 is fixedly connected to the inner side of the silica gel sheet 1 in an embedded mode, and a sponge interlayer 5 is fixedly connected to the inner portion of the black cotton cushion layer 4 in an embedded mode; the left end and the right end of the heat conducting rod 9 are respectively and fixedly communicated with a heat conducting patch 8 and a radiating hole pad 10; a through groove 11 is arranged on the inner side of the silica gel sheet 1; the alloy block 7 is in contact sliding connection with the heat conducting patch 8; the flitch 6 is embedded and slidably connected with the inside of the silica gel sheet 1; the heat-conducting sandwich type heat dissipation structure comprises an adhesive layer 2, a black cotton cushion layer 4, an adhesive plate 6, an alloy block 7, a heat-conducting patch 8, a heat-conducting rod 9 and a heat-dissipation hole pad 10, wherein before use, the adhesive layer 2 is adhered and fixed with an adjacent electric appliance plate to be buffered and subjected to shock reduction, and under the flexible extrusion action of a spring 3 and the adhesive plate 6, the heat-conducting sandwich type heat dissipation structure of the alloy block 7, the heat-conducting patch 8, the heat-conducting rod 9 and the heat-dissipation hole pad 10 is completed, so that the problem that a common multilayer silica gel gasket is not provided with a sandwich type heat dissipation mechanism is solved, and the practicability of the device is greatly improved; silica gel piece 1, black cotton bed course 4, sponge intermediate layer 5 and lead to groove 11, black cotton bed course 4 and sponge intermediate layer 5 that set up through the inside gomphosis of silica gel piece 1 improve the intermediate layer cushioning effect to multilayer silica gel gasket, accomplish the insulating scattered hole pressfitting to the intermediate layer region through leading to groove 11 and silica gel piece 1, solved general multilayer silica gel gasket and not set up the problem of pressfitting damper, greatly improved the stability and the reliability of device.

The working process is as follows: before the device is used, the adhesive layer 2 is attached and fixed to an adjacent electric appliance board to be buffered and subjected to shock reduction, under the flexible extrusion action of the spring 3 and the adhesive plate 6, a heat conduction interlayer heat dissipation structure of the alloy block 7, the heat conduction patch 8, the heat conduction rod 9 and the heat dissipation hole pad 10 is completed, the interlayer shock absorption effect on a plurality of layers of silica gel gaskets is improved through the black cotton cushion layer 4 and the sponge interlayer 5 which are embedded in the silica gel sheet 1, and the use process of the device is completed through the through groove 11 and the silica gel sheet 1 and through the pressing of the insulation scattered holes in the interlayer region.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a multilayer heat dissipation formula silica gel gasket, includes silica gel piece (1) and glues and paste layer (2), its characterized in that: the silicon sheet (1) top and bottom are fixedly connected with glue layer (2) and spring (3) respectively, the spring (3) outside is provided with laminating heat dissipation mechanism, silicon sheet (1) inboard is provided with insulating pressing mechanism.

2. The multi-layer heat dissipation type silica gel gasket of claim 1, wherein: laminating heat dissipation mechanism includes spring (3), spring (3) outside fixedly connected with flitch (6), inboard fixedly connected with alloy piece (7) of flitch (6), inside gomphosis fixedly connected with heat conduction paster (8), heat conduction pole (9) and radiating hole pad (10) of silicon chip (1).

3. The multi-layer heat dissipation type silica gel gasket of claim 1 or 2, wherein: the insulation pressing mechanism comprises a silica gel sheet (1), wherein a black cotton cushion layer (4) is fixedly connected with the inner side of the silica gel sheet (1) in an embedded mode, and a sponge interlayer (5) is fixedly connected with the inner side of the black cotton cushion layer (4) in an embedded mode.

4. The multi-layer heat dissipation type silica gel gasket of claim 2, wherein: the left end and the right end of the heat conducting rod (9) are respectively and fixedly communicated with a heat conducting patch (8) and a heat radiating hole pad (10).

5. The multi-layer heat dissipation type silica gel gasket of claim 1, wherein: the inner side of the silica gel sheet (1) is provided with a through groove (11).

6. The multi-layer heat dissipation type silica gel gasket of claim 2, wherein: the alloy block (7) is in contact sliding connection with the heat conducting patch (8).

7. The multi-layer heat dissipation type silica gel gasket of claim 2, wherein: the flitch (6) is in embedded sliding connection with the inside of the silica gel sheet (1).