CN219279785U

CN219279785U - High-adhesion heat-conducting gel

Info

Publication number: CN219279785U
Application number: CN202320372314.9U
Authority: CN
Inventors: 邢丹; 陈苗苗
Original assignee: Shenzhen Xingyang Automotive Electronics Co ltd
Current assignee: Shenzhen Xingyang Automotive Electronics Co ltd
Priority date: 2023-03-03
Filing date: 2023-03-03
Publication date: 2023-06-30
Anticipated expiration: 2033-03-03

Abstract

The application relates to the technical field of gel, and disclose a high adhesive force heat conduction gel, which comprises a colloid, the colloid includes heat conduction gel layer, lower heat conduction gel layer and two powerful viscose layers, it sets up to go up the top that the heat conduction gel layer is located down heat conduction gel layer, two powerful viscose layers are located the opposite one end setting of heat conduction gel layer and lower heat conduction gel layer respectively, two a set of through-hole has all been seted up to powerful viscose layer's terminal surface, go up the opposite one end of heat conduction gel layer and lower heat conduction gel layer all to be equipped with a set of heat conduction gel contact layer, and two sets of heat conduction gel contact layer all stagger each other with a set of through-hole of homonymy and set up, two sets of the terminal surface of the opposite one side of heat conduction gel contact layer has all embedded the aluminium film. The heat conducting gel adhesive force can be effectively improved, the adhesive surface is good in heat conducting performance, low in thermal resistance and high in heat radiating efficiency.

Description

High-adhesion heat-conducting gel

Technical Field

The application relates to the technical field of gels, in particular to a high-adhesion heat-conducting gel.

Background

The heat conducting gel sheet is a sheet pressed by high plastic materials, and can be made into different shapes according to actual requirements, and the heat conducting gel sheet is soft and easy to deform, so that the heat conducting gel sheet can be tightly attached between a heat source and a heat radiating element under the condition of applying pressure, thereby greatly reducing interface contact thermal resistance, enhancing heat conduction between the heat source and the heat radiating element and improving heat conduction performance.

In the process of realizing the application, the inventor finds that at least the following problems exist in the technology, namely, the heat conducting gel sheet is commonly used for mounting electronic components, is used for fixing the electronic components and has good heat dissipation performance, but the adhesive force of the heat conducting gel sheet is not strong, so that the stability of the electronic components after being mounted is poor, and the heat resistance of the heat conducting gel is increased by adding the strong adhesive, so that the high-adhesive-force heat conducting gel is provided.

Disclosure of Invention

The purpose of this application is in order to solve among the prior art the bonding force of heat conduction gel piece itself not strong, leads to the stability after the electronic components installation not good, and can influence the problem that the thermal resistance of heat conduction gel increases through increasing powerful glue again, and a high adhesive force heat conduction gel that proposes.

In order to achieve the above purpose, the present application adopts the following technical scheme:

the utility model provides a high adhesive force heat conduction gel, includes the colloid, the colloid includes heat conduction gel layer, lower heat conduction gel layer and two powerful viscose layers, it sets up to go up the top that the heat conduction gel layer is located down heat conduction gel layer, two powerful viscose layers are located the opposite one end setting of heat conduction gel layer and lower heat conduction gel layer respectively, two a set of through-hole has all been seted up to powerful viscose layer's terminal surface, go up the opposite one end of heat conduction gel layer and lower heat conduction gel layer all to be equipped with a set of heat conduction gel contact layer, and two sets of heat conduction gel contact layer all stagger each other with a set of through-hole of homonymy and set up, two sets of the terminal surface of the opposite one side of heat conduction gel contact layer has all been embedded with the aluminium film.

By adopting the technical scheme, the high viscosity of the two groups of strong adhesive layers can improve the mounting stability of electronic components, the adhesive force is strong, and the heat conduction performance of the strong adhesive layers can be improved by matching a plurality of heat conduction gel contact layers with a plurality of aluminum films, so that the heat resistance is reduced, the use effect is good, no excessive additives are generated, and the electronic components have certain environmental protection performance.

Preferably, a boron nitride layer is fixedly arranged between the upper heat-conducting gel layer and the lower heat-conducting gel layer.

By adopting the technical scheme, the high thermal conductivity of the boron nitride layer can be utilized, and the overall heat conduction and radiation effect of the colloid is further improved.

Preferably, the end surfaces of the two strong adhesive layers are flush with the end surface of the same-side heat conducting gel contact layer.

By adopting the technical scheme, the end surfaces of the strong adhesive layer and the heat conduction gel contact layer are flush, so that the effective high-stability adhesive fixation is realized.

Preferably, the thickness of each strong adhesive layer is set in the range of 0.2mm to 0.4 mm.

By adopting the technical scheme, the enough high adhesive force is ensured to be provided, and the installation is stable.

Preferably, the thicknesses of the upper heat-conducting gel layer and the lower heat-conducting gel layer are all in the range of 0.4mm to 0.6 mm.

By adopting the technical scheme, the heat conduction and heat dissipation efficiency of the colloid after being integrally bonded is ensured.

Preferably, the thickness of the boron nitride layer is set in a range of 0.1mm to 0.3 mm.

By adopting the technical scheme, the utilization of high thermal conductivity of the boron nitride layer is ensured.

Compared with the prior art, the application provides a high-adhesion heat conduction gel, which has the following beneficial effects:

1. this high adhesive force heat conduction gel, through the mutual cooperation of the strong viscose layer of last heat conduction gel layer that is equipped with, lower heat conduction gel layer, two sets of powerful viscose layers, a plurality of outer heat conduction gel layers and a plurality of heat conduction aluminium granule, through the high viscidity of two sets of powerful viscose layers, can improve the installation stability of electronic components, the adhesive force is strong, and through the inside heat conduction aluminium granule of a plurality of outer heat conduction gel layers cooperation, can improve the heat conductivility of powerful viscose layer department, reduce thermal resistance, excellent in use effect, and do not have unnecessary additives, possess certain environmental protection performance.

2. This high adhesive force heat conduction gel through the boron nitride layer that is equipped with, can utilize the high thermal conductivity on boron nitride layer, further improves the whole heat conduction radiating effect of colloid, through the outer fringe setting that the outer fringe of last heat conduction gel layer and lower heat conduction gel layer all surpassed two powerful viscose layers, can increase the contact area of colloid heat conduction part and external to can further improve radiating efficiency.

The device does not involve the part and is the same with or can adopt prior art to realize, and this application can effectively improve the whole adhesive force of heat conduction gel, and is equipped with better heat conductivility at the bonding face, low thermal resistance, and radiating efficiency is high simultaneously.

Drawings

Fig. 1 is a schematic structural diagram of a high-adhesion thermal conductive gel according to the present application;

fig. 2 is a schematic view of the internal structure of the strong adhesive layer in fig. 1.

In the figure: 1. a colloid; 2. an upper thermally conductive gel layer; 3. a lower thermally conductive gel layer; 4. a strong adhesive layer; 5. an outer thermally conductive gel layer; 6. thermally conductive aluminum particles; 7. and a boron nitride layer.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

Referring to fig. 1-2, a high-adhesion heat-conducting gel comprises a gel 1, wherein the gel 1 comprises an upper heat-conducting gel layer 2, a lower heat-conducting gel layer 3 and two strong adhesive layers 4, the upper heat-conducting gel layer 2 is arranged above the lower heat-conducting gel layer 3, the two strong adhesive layers 4 are respectively arranged at opposite ends of the upper heat-conducting gel layer 2 and the lower heat-conducting gel layer 3, a group of through holes are formed in the end faces of the two strong adhesive layers 4, a group of heat-conducting gel contact layers 5 are respectively arranged at opposite ends of the upper heat-conducting gel layer 2 and the lower heat-conducting gel layer 3, the two groups of heat-conducting gel contact layers 5 are mutually staggered with a group of through holes at the same side, and aluminum films 6 are respectively embedded in the end faces of opposite sides of the two groups of heat-conducting gel contact layers 5.

The boron nitride layer 7 is fixedly arranged between the upper heat-conducting gel layer 2 and the lower heat-conducting gel layer 3, so that the high heat conductivity of the boron nitride layer 7 can be utilized, and the overall heat-conducting and heat-radiating effect of the colloid 1 is further improved.

The end surfaces of the two strong adhesive layers 4 are flush with the end surface of the heat conducting gel contact layer 5 at the same side, so that the end surfaces of the strong adhesive layers 4 and the heat conducting gel contact layer 5 are kept flush, and stable adhesion and fixation are ensured.

The thickness of each strong adhesive layer 4 is set in the range of 0.2mm to 0.4mm, ensuring that a sufficiently high adhesive force is provided and the installation is stable.

The thickness of the upper heat-conducting gel layer 2 and the lower heat-conducting gel layer 3 is in the range of 0.4mm to 0.6mm, so that the heat-conducting and heat-dissipating efficiency of the colloid 1 after the whole adhesion is ensured.

The thickness of the boron nitride layer 7 is set in the range of 0.1mm to 0.3mm, ensuring the utilization of the high thermal conductivity of the boron nitride layer 7.

In this application, during the use, bond through the powerful viscose layer 4 of both sides and the installation face of electronic components and equipment casing, can improve the installation stability of electronic components, the adhesive force is strong, and through the heat conduction gel contact layer 5 that sets up between the through-hole of two powerful viscose layer 4 terminal surfaces and cooperate a plurality of aluminium film 6, can increase the heat conduction heat transfer performance of colloid 1 bonding face department to can derive the heat fast through last heat conduction gel layer 2 and lower heat conduction gel layer 3, ensure the holistic heat conduction heat dispersion of colloid 1.

The foregoing is only a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, within the scope of the present application, should apply to the present application, and all equivalents and modifications as fall within the scope of the present application.

Claims

1. The utility model provides a high adhesive force heat conduction gel, includes colloid (1), its characterized in that, colloid (1) include heat conduction gel layer (2), lower heat conduction gel layer (3) and two powerful viscose layers (4), go up the top setting that heat conduction gel layer (2) are located lower heat conduction gel layer (3), two powerful viscose layers (4) are located the opposite one end setting of heat conduction gel layer (2) and lower heat conduction gel layer (3) respectively, two a set of through-hole has all been seted up to the terminal surface of powerful viscose layers (4), the opposite one end of heat conduction gel layer (2) and lower heat conduction gel layer (3) all is equipped with a set of heat conduction gel contact layer (5), and two sets of heat conduction gel contact layer (5) all are the setting of staggering each other with a set of through-hole of homonymy, two sets of the terminal surface of heat conduction gel contact layer (5) opposite one side all imbeds aluminium film (6).

2. A high adhesion thermally conductive gel according to claim 1, characterized in that a boron nitride layer (7) is fixedly arranged between the upper thermally conductive gel layer (2) and the lower thermally conductive gel layer (3).

3. A high adhesion thermally conductive gel as claimed in claim 1, wherein the end faces of both strong adhesive layers (4) are flush with the end face of the thermally conductive gel contact layer (5) on the same side.

4. A high adhesion thermally conductive gel as claimed in claim 1, wherein the thickness of each strong adhesive layer (4) is set in the range of 0.2mm to 0.4 mm.

5. A high adhesion thermally conductive gel according to claim 1, characterized in that the thickness of the upper thermally conductive gel layer (2) and the lower thermally conductive gel layer (3) are both arranged in the range of 0.4mm to 0.6 mm.

6. A high adhesion thermally conductive gel according to claim 2, characterized in that the thickness of the boron nitride layer (7) is arranged in the range of 0.1mm to 0.3 mm.