CN210272328U

CN210272328U - Packaging structure of MOS pipe

Info

Publication number: CN210272328U
Application number: CN201921200769.2U
Authority: CN
Inventors: 薛会民
Original assignee: Shenzhen Sanhe Micro Technology Co Ltd
Current assignee: Shenzhen Sanhe Micro Technology Co Ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-04-07
Anticipated expiration: 2029-07-29

Abstract

The utility model discloses a packaging structure of MOS tube, which belongs to the field of MOS tube, comprising a packaging shell and a mounting shell, wherein, the two sides of the mounting shell are penetrated with a clamping groove, a first heat-conducting glue is penetrated under the inner part of the packaging shell, when in use, the first heat-conducting glue transfers the heat at the lower part in the packaging shell to a tin coating, the tin coating has stronger heat conductivity, the tin coating transfers the heat to a PCB, when a heat-radiating device in the device radiates the heat to the PCB, the heat at the lower part in the packaging shell is reduced, a second heat-conducting glue transfers the heat to a heat-conducting metal plate, as the heat-conducting lug at the top of the heat-conducting metal plate is communicated with the outside, the heat of the heat-conducting metal plate is reduced by the heat radiation of the outside air to the heat-conducting lug, and further the heat at the upper part in the packaging shell is reduced, the practicability is strong, and, the service life of the MOS tube is prolonged.

Description

Packaging structure of MOS pipe

Technical Field

The utility model relates to a MOS manages technical field, specifically is a packaging structure of MOS pipe.

Background

MOS pipe mostly is single and uses, but place need establish ties the use a bit, just so need establish ties the concatenation to MOS pipe, and current concatenation mode troublesome poeration, the structure is complicated, and the cost of spending is also more simultaneously, and the practicality is not strong, has brought a great deal of inconvenience for the user.

The prior art discloses a planar MOS packaging structure of high density current that application number is CN201821141210.2, including first MOS pipe body and second MOS pipe body, the equal fixedly connected with riser in both sides of first MOS pipe body, the equal fixedly connected with mounting panel in both sides of second MOS pipe body, the fixed slot has been seted up to one side of riser, the mounting groove has all been seted up to the top and the bottom of mounting panel one side, the equal fixedly connected with guide bar in top and the bottom of fixed slot inner wall one side, and the sliding surface of guide bar is connected with the slide bar, and the bottom of slide bar and the inner wall sliding connection of fixed slot, the top of slide bar runs through fixed slot and riser in proper order and extends to the top of riser, the utility model relates to an MOS technical field. This plane MOS packaging structure of high density current can realize making things convenient for the dismouting to the MOS pipe that needs the series connection to use, has established the basis for subsequent normal use of MOS pipe, has also brought a great deal of facility for the staff, has saved installation time.

However, the structure has complex process and high production difficulty, is not beneficial to large-scale production, and meanwhile, in the packaging structure, most of chips are wrapped in the packaging shell, so that the heat dissipation capacity is limited, and the stability of the operation of the chips is influenced

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging structure of MOS pipe to solve the complicated and not good problem of heat dissipation of technology that provides in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a packaging structure of an MOS tube comprises a packaging shell and a mounting shell, wherein clamping grooves are formed in two sides of the mounting shell in a penetrating mode, a first heat-conducting adhesive penetrates through the lower portion inside the packaging shell, a tin coating is arranged at the bottom of the packaging shell, the bottom of the first heat-conducting adhesive is connected with the tin coating, a base plate is arranged below the inside of the packaging shell, pins are arranged on the top of the base plate, one ends of the pins penetrate through one side inside the packaging shell, chips are arranged on the tops of the pins, a heat-conducting metal plate is fixed to the tops of the chips through a second heat-conducting adhesive, heat-conducting convex blocks extending to the tops of the packaging shell are fixed to the tops of the heat-conducting metal plate, a rectangular box is fixed to one side of the packaging shell and sleeved on the inner side of the mounting shell, two groups of fixing plates are fixed to the inside of the rectangular box, and clamping pieces are fixed to the outer sides of the two groups of fixing, and the clips extend to both sides of the rectangular box.

Preferably, the back of the mounting shell is fixed with a mounting plate, and a mounting hole penetrates through the top of the mounting plate.

Preferably, the clamping piece is matched with the clamping groove.

Preferably, the elastic pieces are arranged in a mirror image mode by taking the transverse middle shaft of the fixing plate as a center, and the elastic pieces are arc-shaped.

Preferably, one side of the top and one side of the bottom of the clamping piece are both in a slope shape.

Preferably, the heat conduction lugs are provided with a plurality of groups, and the plurality of groups are arranged at equal intervals.

Compared with the prior art, the beneficial effects of the utility model are that: the packaging structure of the MOS tube is provided with a mounting shell, an elastic sheet and a rectangular box, when the packaging structure is mounted, a worker firstly fixes the mounting shell on a PCB board through a mounting hole, when the MOS tube is mounted later, the worker inserts the rectangular box into the mounting shell, at the moment, after a clamping piece is extruded, the elastic sheet can be bent and deformed, the elastic sheet bends to enable a clamping piece to retract into the rectangular box, then the rectangular box is pushed into the mounting shell, after the rectangular box is pushed to a certain degree, under the composite capacity of the elastic sheet, the clamping piece is clamped into a clamping groove, so that the MOS tube body is fixed, the mounting of a plurality of MOS tube bodies can be more regular through the mounting shell, the complicated step that each MOS tube is fixed through a bolt is avoided, the mounting efficiency is greatly improved, and compared with the prior art, the manufacturing process is simple, the production difficulty is small, the packaging structure is suitable for large-scale production, and, this packaging structure still is provided with the heat conduction lug, first heat conduction glue, second heat conduction glue, tin coating and heat conduction metal sheet, when using, first heat conduction glue has transmitted the tin coating with the heat of encapsulation casing internal lower place, the tin coating has stronger heat conductivity, the tin coating transmits the heat for the PCB board, then reduced the heat of the inside below of encapsulation casing when heat abstractor in the equipment dispels the heat to the PCB board, second heat conduction glue transmits the heat for the heat conduction metal sheet, because the heat conduction lug and the external intercommunication at the top of heat conduction metal sheet, the heat that makes reduced the heat conduction metal sheet is dispelled the heat to the heat conduction lug to external air, and then reduced the heat of the inside top of encapsulation casing, therefore, the clothes hanger is strong in practicability, and the heat conduction metal sheet has increased the intensity of encapsulation casing, the life of MOS pipe has been prolonged.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the package housing of the present invention;

FIG. 3 is a schematic view of the structure of the mounting case of the present invention;

fig. 4 is a schematic view of the rectangular box structure of the present invention.

In the figure: 1. a package housing; 2. mounting a shell; 3. a rectangular box; 4. a card slot; 5. a fastener; 6. mounting a plate; 7. mounting holes; 8. a substrate; 9. a first thermally conductive adhesive; 10. plating a tin layer; 11. a pin; 12. a chip; 13. a second thermally conductive adhesive; 14. a heat conductive metal plate; 15. a fixing plate; 16. an elastic sheet; 17. a thermally conductive bump.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "disposed," "mounted," "connected," "fixed," "sleeved," and the like are to be construed broadly, e.g., as either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; the two elements may be connected directly or indirectly through an intermediate medium, and the two elements may be connected internally or in an interaction relationship, and a person skilled in the art can understand the specific meaning of the above terms in the present invention according to specific situations.

Referring to fig. 1-4, the present invention provides a technical solution: a packaging structure of a MOS tube comprises a packaging shell 1, a mounting shell 2, a rectangular box 3, a clamping groove 4, a clamping piece 5, a mounting plate 6, a mounting hole 7, a substrate 8, first heat-conducting glue 9, a tin coating 10, pins 11, a chip 12, second heat-conducting glue 13, a heat-conducting metal plate 14, a fixing plate 15, an elastic sheet 16 and a heat-conducting lug 17, wherein the clamping groove 4 penetrates through two sides of the mounting shell 2, the first heat-conducting glue 9 penetrates through the lower part inside the packaging shell 1, the tin coating 10 is arranged at the bottom of the packaging shell 1, the heat-conducting property is good, the ultrathin MOS tube is facilitated, the bottom of the first heat-conducting glue 9 is connected with the tin coating 10, the substrate 8 is arranged below the inside of the packaging shell 1, the pins 11 are arranged at the top of the substrate 8, one end of each pin 11 penetrates through one side inside the packaging shell 1, the chips 12 are arranged at the tops of the pins 11, the heat-conducting metal plate 14 is fixed at the tops of the, the top of heat conduction metal sheet 14 is fixed with the heat conduction lug 17 that extends to encapsulation casing 1 top, and one side of encapsulation casing 1 is fixed with rectangle case 3, and rectangle case 3 cup joints in the inboard of installing shell 2, and the inside of rectangle case 3 is fixed with two sets of fixed plates 15, and the outside of two sets of fixed plates 15 all is fixed with fastener 5 through flexure strip 16, and fastener 5 extends to the both sides of rectangle case 3.

Referring to fig. 1 and 3, a mounting plate 6 is fixed to the back of the mounting case 2, and a mounting hole 7 is formed through the top of the mounting plate 6, so that the mounting case 2 can be fixed conveniently.

Referring to fig. 1-4, the clip 5 is adapted to the slot 4 to function as a fixing MOS transistor, the elastic strip 16 is arranged in a mirror image with the horizontal central axis of the fixing plate 15 as the center, and the elastic strip 16 is arc-shaped, so that the elastic strip 16 is more easily deformed and restored.

Referring to fig. 1-4, one side of the top and one side of the bottom of the clip 5 are both sloped, so that the insertion and extraction of the mounting case 2 are more convenient, and the plurality of sets of heat-conducting bumps 17 are arranged at equal intervals, so as to increase the contact area with the outside air and improve the heat dissipation efficiency.

The working principle is as follows: firstly, a worker checks whether each part is intact or not, if the part is damaged, the part is replaced in time, then the mounting shell 2 is fixed on a PCB through the mounting hole 7 and a bolt, then the worker inserts the rectangular box 3 into the mounting shell 2, at the moment, after the clamping piece 5 is extruded, the elastic piece 16 can be bent and deformed, the elastic piece 16 bends to enable the clamping piece 5 to retract into the rectangular box 3, then the rectangular box 3 is pushed into the mounting shell 2, after the rectangular box is pushed to a certain degree, under the composite capacity of the elastic piece 16, the clamping piece 5 is clamped into the clamping groove 4, so that the MOS tubes are fixed, the mounting of the MOS tubes can be more regular through the mounting shell 2, when the mounting shell works, the first heat-conducting glue 9 transfers the heat below the inside of the packaging shell 1 to the tin-plated layer 10, the tin-plated layer 10 has stronger heat conductivity, the tin-plated layer 10 transfers the heat to the PCB, and when a heat dissipation device in the equipment dissipates the heat to the PCB, the heat below, second heat-conducting glue 13 gives heat conduction metal sheet 14 with heat transfer, because the heat conduction lug 17 and the external intercommunication at the top of heat conduction metal sheet 14, external air dispels the heat and then has reduced the heat of heat conduction metal sheet 14 to heat conduction lug 17, and then reduced the heat of the inside top of encapsulation casing 1, when dismantling the MOS pipe, the user inwards presses down fastener 5 with the finger, 16 emergence deformations of flexure strip, then the staff extracts the MOS pipe with the hand again and can change.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a packaging structure of MOS pipe, includes encapsulation casing (1) and installation shell (2), its characterized in that: the packaging structure comprises a mounting shell (2), wherein clamping grooves (4) penetrate through two sides of the mounting shell (2), a first heat-conducting glue (9) penetrates through the lower portion inside the packaging shell (1), a tin coating (10) is arranged at the bottom of the packaging shell (1), the bottom of the first heat-conducting glue (9) is connected with the tin coating (10), a substrate (8) is arranged below the inside of the packaging shell (1), pins (11) are arranged at the top of the substrate (8), one ends of the pins (11) penetrate through one side inside the packaging shell (1), chips (12) are arranged at the tops of the pins (11), a heat-conducting metal plate (14) is fixed at the tops of the chips (12) through a second heat-conducting glue (13), a heat-conducting lug (17) extending to the top of the packaging shell (1) is fixed at the top of the heat-conducting metal plate (14), a rectangular box (3) is fixed at one side of the packaging shell (1), and the rectangular box (3) is sleeved on the inner side of the mounting shell (2), two groups of fixing plates (15) are fixed inside the rectangular box (3), clamping pieces (5) are fixed on the outer sides of the two groups of fixing plates (15) through elastic pieces (16), and the clamping pieces (5) extend to the two sides of the rectangular box (3).

2. The package structure of a MOS transistor according to claim 1, wherein: the back of installation shell (2) is fixed mounting panel (6), mounting hole (7) have been run through at the top of mounting panel (6).

3. The package structure of a MOS transistor according to claim 1, wherein: the clamping piece (5) is matched with the clamping groove (4).

4. The package structure of a MOS transistor according to claim 1, wherein: the elastic pieces (16) are arranged in a mirror image mode by taking the transverse middle shaft of the fixing plate (15) as the center, and the elastic pieces (16) are arc-shaped.

5. The package structure of a MOS transistor according to claim 1, wherein: one side of the top and one side of the bottom of the clamping piece (5) are both in a slope shape.

6. The package structure of a MOS transistor according to claim 1, wherein: the heat conduction lugs (17) are provided with a plurality of groups, and the heat conduction lugs (17) are arranged in equal distance.