CN216161068U - Built-in radiator of notebook computer - Google Patents
Built-in radiator of notebook computer Download PDFInfo
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- CN216161068U CN216161068U CN202121702965.7U CN202121702965U CN216161068U CN 216161068 U CN216161068 U CN 216161068U CN 202121702965 U CN202121702965 U CN 202121702965U CN 216161068 U CN216161068 U CN 216161068U
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- plate body
- heat dissipation
- dissipation plate
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Abstract
The utility model discloses a built-in radiator of a notebook computer, which comprises a heat dissipation plate body, a support plate positioned below the heat dissipation plate body and a flat heat pipe arranged above the heat dissipation plate body, wherein a second sinking area and a third sinking area which are communicated with the first sinking area are respectively arranged on two sides of the middle section of the first sinking area on the heat dissipation plate body, a heat conduction silicone grease layer used for contacting with a main heating element is arranged on the sinking surface, a plurality of sinking grooves with through holes at the centers are arranged on the heat dissipation plate body positioned on the outer sides of the second sinking area and the third sinking area at intervals, a second position avoiding through hole is arranged on the support plate positioned below the sinking grooves, a downward bending part is arranged at the edge of one side of the heat dissipation plate body, and a 180-degree bending flanging part is arranged at the edge of the other side of the heat dissipation plate body. The utility model provides a good heat dissipation scheme for light and thin electronic equipment, improves the heat dissipation efficiency and stability, and can ensure the heat dissipation stability in the long-term use process.
Description
Technical Field
The utility model relates to a built-in radiator of a notebook computer, belonging to the field of electronic product radiation.
Background
As people pay more attention to quality and taste of life, the pursuit of science and technology is more perfect, and portable and trendy electronic devices such as notebook computers tend to be light, thin and exquisite.
The heat sink is an important heat sink module for computer products (especially notebook computers), because the temperature directly affects the operating performance, stability and service life of the CPU, and the structural design of the heat sink relatively changes with the design development trend of computer product form. However, the existing heat sink has low heat dissipation efficiency and is not stable enough, which affects the user experience.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a built-in radiator of a notebook computer, which improves the radiating efficiency and stability, enhances the structural strength of the radiator and ensures the radiating stability in the long-term use process.
In order to achieve the purpose, the utility model adopts the technical scheme that: a built-in radiator of a notebook computer comprises a radiating plate body, a supporting plate positioned below the radiating plate body and a flat heat pipe arranged above the radiating plate body, wherein the radiating plate body is provided with a first sinking zone matched with the flat heat pipe, the flat heat pipe is embedded into the first sinking zone and is connected with the upper surface of the first sinking zone, the two sides of the middle section of the first sinking zone on the radiating plate body are respectively provided with a second sinking zone and a third sinking zone which are communicated with the first sinking zone, so that the lower surfaces of the first sinking zone, the second sinking zone and the third sinking zone are connected to form a sinking surface lower than the lower surface of the radiating plate body, and the sinking surface is provided with a heat-conducting silicone grease layer used for contacting with a main heating element;
a plurality of sinking grooves with through holes in the centers are arranged on the heat dissipation plate body outside the second sinking area and the third sinking area at intervals, and second avoiding through holes are formed in the support plate below the sinking grooves;
the edge of one side of the heat dissipation plate body is provided with a downward bent part, and the edge of the other side of the heat dissipation plate body is provided with a 180-degree bent flanging part, so that the upper surface of the flanging part is in contact with the lower surface of the edge of the heat dissipation plate body.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the lower surface of the sinking groove and the upper surface of the supporting plate are arranged at intervals.
2. In the above scheme, the number of the sinking grooves is 3, and the sinking grooves are distributed on two sides of the flat heat pipe.
3. In the above scheme, the bending part integrally formed with the heat dissipation plate body is perpendicular to the heat dissipation plate body.
4. In the above scheme, the flanging part integrally formed with the heat dissipation plate body is arranged in parallel with the heat dissipation plate body.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:
1. the utility model relates to a built-in radiator of a notebook computer, wherein a first sinking zone matched with a flat heat pipe is arranged on a radiating plate body, the flat heat pipe is embedded in the first sinking zone and is connected with the upper surface of the first sinking zone, a second sinking zone and a third sinking zone which are communicated with the first sinking zone are respectively arranged at two sides of the middle section of the first sinking zone on the radiating plate body, so that the lower surfaces of the first sinking zone, the second sinking zone and the third sinking zone are connected to form a sinking surface which is lower than the lower surface of the radiating plate body, and a heat-conducting silicone grease layer which is used for contacting with a main heating element is arranged on the sinking surface; in addition, the bolt penetrates through the through hole in the sink groove, the main heat dissipation area on the heat dissipation plate main body is locked with the heat source, the heat dissipation efficiency of the main heating element is guaranteed, the sink groove is used as an elastic piece, reverse acting force is provided for the bolt, the sink surface is guaranteed to be tightly attached to the main heating element in the long-term use process, and the heat dissipation efficiency and stability are further improved.
2. According to the built-in radiator of the notebook computer, the edge of one side of the radiating plate body is provided with the downward bent part, and the edge of the other side of the radiating plate body is provided with the 180-degree bent flanging part, so that the upper surface of the flanging part is in contact with the lower surface of the edge of the radiating plate body, the structural strength of the radiator is enhanced while the overall thickness of the radiator is not increased, and the radiating stability in the long-term use process is ensured.
Drawings
FIG. 1 is a schematic view of an overall structure of a built-in radiator of a notebook computer according to the present invention;
FIG. 2 is a schematic partial exploded view of a built-in heat sink of a notebook computer according to the present invention;
FIG. 3 is an enlarged detail view of A of FIG. 1;
fig. 4 is an enlarged detail section at B in fig. 2.
In the above drawings: 1. a heat dissipation plate body; 2. a support plate; 3. a flat heat pipe; 41. a first sink zone; 42. a second sink zone; 43. a third sinking zone; 5. sinking the surface; 6. a thermally conductive silicone layer; 71. a first avoiding through hole; 72. a second avoiding through hole; 8. a thermally conductive gasket; 9. a through hole; 10. sinking the tank; 11. a bending part; 12. and (4) flanging.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a built-in radiator of a notebook computer comprises a radiating plate body 1, a supporting plate 2 positioned below the radiating plate body 1 and a flat heat pipe 3 arranged above the radiating plate body 1, wherein a first sinking area 41 matched with the flat heat pipe 3 is arranged on the radiating plate body 1, the flat heat pipe 3 is embedded into the first sinking area 41 and is connected with the upper surface of the first sinking area 41, a second sinking area 42 and a third sinking area 43 which are communicated with the first sinking area 41 are respectively arranged on two sides of the middle section of the first sinking area 41 on the radiating plate body 1, so that the lower surfaces of the first sinking area 41, the second sinking area 42 and the third sinking area 43 are connected to form a sinking surface 5 which is lower than the lower surface of the radiating plate body 1, and a heat-conducting silicone grease layer 6 used for being in contact with a main heating element is arranged on the sinking surface 5;
a plurality of sinking grooves 10 with through holes 9 in the center are arranged at intervals on the heat dissipation plate body 1 outside the second sinking area 42 and the third sinking area 43, and a second avoiding through hole 72 is arranged on the support plate 2 below the sinking grooves 10;
the edge of one side of the heat dissipation plate body 1 is provided with a downward bending part 11, the edge of the other side of the heat dissipation plate body 1 is provided with a flanging part 12 bent by 180 degrees, so that the upper surface of the flanging part 12 is in contact with the lower surface of the edge of the heat dissipation plate body 1.
A heat conducting gasket 8 for contacting with a small heating element is arranged on the lower surface of the heat radiating plate body 1;
the supporting plate 2 is provided with a first avoiding through hole 71 corresponding to the heat-conducting silicone layer 6 and the heat-conducting gasket 8;
the lower surface of the sink tank 10 and the upper surface of the support plate 2 are arranged at intervals;
the number of the sink grooves 10 is 3, and the sink grooves are distributed on two sides of the flat heat pipe 3.
Example 2: a built-in radiator of a notebook computer comprises a radiating plate body 1, a supporting plate 2 positioned below the radiating plate body 1 and a flat heat pipe 3 arranged above the radiating plate body 1, wherein a first sinking area 41 matched with the flat heat pipe 3 is arranged on the radiating plate body 1, the flat heat pipe 3 is embedded into the first sinking area 41 and is connected with the upper surface of the first sinking area 41, a second sinking area 42 and a third sinking area 43 which are communicated with the first sinking area 41 are respectively arranged on two sides of the middle section of the first sinking area 41 on the radiating plate body 1, so that the lower surfaces of the first sinking area 41, the second sinking area 42 and the third sinking area 43 are connected to form a sinking surface 5 which is lower than the lower surface of the radiating plate body 1, and a heat-conducting silicone grease layer 6 used for being in contact with a main heating element is arranged on the sinking surface 5;
a plurality of sinking grooves 10 with through holes 9 in the center are arranged at intervals on the heat dissipation plate body 1 outside the second sinking area 42 and the third sinking area 43, and a second avoiding through hole 72 is arranged on the support plate 2 below the sinking grooves 10;
the edge of one side of the heat dissipation plate body 1 is provided with a downward bending part 11, the edge of the other side of the heat dissipation plate body 1 is provided with a flanging part 12 bent by 180 degrees, so that the upper surface of the flanging part 12 is in contact with the lower surface of the edge of the heat dissipation plate body 1.
The lower surface of the sink tank 10 and the upper surface of the support plate 2 are arranged at intervals;
the number of the sinking grooves 10 is 3, and the sinking grooves are distributed on two sides of the flat heat pipe 3;
the bending part 11 and the flanging part 12 are respectively positioned at the edges of two long sides of the heat dissipation plate body 1;
the bending part 11 integrally formed with the heat dissipation plate body 1 is arranged perpendicular to the heat dissipation plate body 1;
the above-mentioned burring 12 integrally formed with the heat radiating plate body 1 is provided in parallel with the heat radiating plate body 1.
When the notebook computer is internally provided with the radiator, the radiating plate body is provided with a first sinking area matched with the flat heat pipe, the flat heat pipe is embedded into the first sinking area and is connected with the upper surface of the first sinking area, the two sides of the middle section of the first sinking area on the radiating plate body are respectively provided with a second sinking area and a third sinking area which are communicated with the first sinking area, so that the lower surfaces of the first sinking area, the second sinking area and the third sinking area are connected to form a sinking surface which is lower than the lower surface of the radiating plate body, and the sinking surface is provided with a heat-conducting silicone grease layer which is used for contacting with a main heating element; in addition, the bolt penetrates through the through hole in the sink groove to lock the main heat dissipation area on the heat dissipation plate main body and the heat source, so that the heat dissipation efficiency of the main heating element is ensured, the sink groove is used as an elastic piece to provide reverse acting force for the bolt, the sink surface is ensured to be tightly attached to the main heating element in the long-term use process, and the heat dissipation efficiency and stability are further improved;
in addition, the edge of one side of the heat dissipation plate body is provided with a downward bending part, and the edge of the other side of the heat dissipation plate body is provided with a 180-degree bending flanging part, so that the upper surface of the flanging part is in contact with the lower surface of the edge of the heat dissipation plate body, the overall thickness of the heat radiator is not increased, the structural strength of the heat radiator is enhanced, and the stability of heat dissipation in the long-term use process is ensured.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (5)
1. A built-in radiator of notebook computer which characterized in that: comprises a heat dissipation plate body (1), a support plate (2) positioned below the heat dissipation plate body (1) and a flat heat pipe (3) arranged above the heat dissipation plate body (1), the heat dissipation plate body (1) is provided with a first sinking area (41) matched with the flat heat pipe (3), the flat heat pipe (3) is embedded in the first sinking zone (41) and is connected with the upper surface of the first sinking zone (41), a second sinking area (42) and a third sinking area (43) which are communicated with the first sinking area (41) are respectively arranged on the two sides of the middle section of the first sinking area (41) on the heat dissipation plate body (1), the lower surfaces of the first sinking section (41), the second sinking section (42) and the third sinking section (43) are connected to be lower than the sinking surface (5) of the lower surface of the heat radiating plate body (1), the sinking surface (5) is provided with a heat-conducting silicone grease layer (6) which is used for contacting with the main heating element;
a plurality of sinking grooves (10) with through holes (9) in the centers are arranged on the heat dissipation plate body (1) at intervals outside the second sinking area (42) and the third sinking area (43), and second avoiding through holes (72) are arranged on the support plate (2) below the sinking grooves (10);
the edge of one side of the heat dissipation plate body (1) is provided with a downward bending part (11), the edge of the other side of the heat dissipation plate body (1) is provided with a flanging part (12) bent by 180 degrees, and the upper surface of the flanging part (12) is in contact with the lower surface of the edge of the heat dissipation plate body (1).
2. The built-in radiator of the notebook computer according to claim 1, wherein: the lower surface of the sinking groove (10) and the upper surface of the supporting plate (2) are arranged at intervals.
3. The built-in radiator of the notebook computer according to claim 1 or 2, characterized in that: the number of the sinking grooves (10) is 3, and the sinking grooves are distributed on two sides of the flat heat pipe (3).
4. The built-in radiator of the notebook computer according to claim 1, wherein: the bending part (11) which is integrally formed with the heat dissipation plate body (1) is perpendicular to the heat dissipation plate body (1).
5. The built-in radiator of the notebook computer according to claim 1 or 4, wherein: the flanging part (12) which is integrally formed with the heat dissipation plate body (1) is arranged in parallel with the heat dissipation plate body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121702965.7U CN216161068U (en) | 2021-07-26 | 2021-07-26 | Built-in radiator of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121702965.7U CN216161068U (en) | 2021-07-26 | 2021-07-26 | Built-in radiator of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216161068U true CN216161068U (en) | 2022-04-01 |
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ID=80836888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121702965.7U Active CN216161068U (en) | 2021-07-26 | 2021-07-26 | Built-in radiator of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216161068U (en) |
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2021
- 2021-07-26 CN CN202121702965.7U patent/CN216161068U/en active Active
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