CN217495446U - High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight - Google Patents
High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight Download PDFInfo
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- CN217495446U CN217495446U CN202221546388.1U CN202221546388U CN217495446U CN 217495446 U CN217495446 U CN 217495446U CN 202221546388 U CN202221546388 U CN 202221546388U CN 217495446 U CN217495446 U CN 217495446U
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Abstract
The utility model relates to the technical field of copper-clad aluminum substrates, and provides a high-pressure-resistant high-heat-conductivity copper-clad aluminum substrate for a LED television backlight source, which comprises an aluminum substrate and heat dissipation strips, wherein the bottom surface of the aluminum substrate is fixedly provided with a plurality of heat dissipation strips, and first positioning sleeves are arranged at four corners of the upper surface of the aluminum substrate; when the curing plate is arranged on the upper surface of the aluminum substrate, the first glue film is adhered to the aluminum substrate, and the positioning rod below the curing plate is embedded into the first positioning sleeve, so that the curing plate is not displaced when arranged above the aluminum substrate, and the contact area between the first glue film and the curing plate is increased through the protruding rod, so that the adhesion is more stable; and then the second adhesive film is adhered to the curing plate, the contact area of the first adhesive film and the curing plate is increased through the protruding rod, so that the adhesion is more stable, and the second positioning sleeve below the copper foil is sleeved on the positioning rod above the curing plate, so that the situation that the copper foil cannot shift when being installed on the curing plate is ensured.
Description
Technical Field
The utility model relates to a cover copper aluminium base board technical field, especially relate to a LED TV backlight covers copper aluminium base board with high-pressure resistant high heat conduction.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The high-end application is also designed to be a double-sided board, and the structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. At present, the aluminum-based circuit board of the LED backlight source for the television has the defects, defects and shortcomings that the circuit board can not resist high pressure and has high heat conductivity and cannot simultaneously resist high pressure and high heat conductivity due to the structural reason of the circuit board, and the high pressure resistance and the high heat conductivity are poor;
for example, in the prior art, the patent number is ZL201922311743.1, and the copper-clad aluminum substrate with high pressure resistance and high heat conductivity is used for the LED television backlight source; the high-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for the LED television backlight source has good high-voltage resistance and high heat conductivity, and good heat dissipation effect, and is convenient for people to use
But the research shows that;
when the high-pressure-resistant high-heat-conductivity copper-clad aluminum substrate for the LED television backlight is connected with a curing plate and a copper foil, the situation of displacement is easy to occur, and the use of the high-pressure-resistant high-heat-conductivity copper-clad aluminum substrate for the LED television backlight is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem existing in the above background art, and the LED TV backlight that proposes covers copper aluminium base board with high pressure resistant high heat conduction.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a high-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for an LED television backlight comprises an aluminum substrate, a heat dissipation strip, a first positioning sleeve, a first adhesive film, a curing plate, a second adhesive film, a copper foil and a second positioning sleeve;
the bottom surface of the aluminum substrate is fixedly provided with a plurality of heat dissipation strips, first positioning sleeves at four corners of the upper surface of the aluminum substrate, a first glue film positioned on the upper surface of the aluminum substrate, a curing plate positioned above the first glue film, a second glue film positioned above the curing plate, and a copper foil positioned above the second glue film, and the four corners of the bottom surface of the copper foil are fixedly provided with second positioning sleeves.
Preferably, the curing plate comprises a positioning rod and a protruding rod;
four corners on the upper and lower surface of the curing plate are all fixedly provided with positioning rods, and the center of the lower surface of the curing plate is all fixedly provided with a plurality of protruding rods.
Preferably, the length of the positioning rod below the curing plate is the same as that of the first positioning sleeve, and the positioning rod below the curing plate can be embedded into the central through hole of the first positioning sleeve.
Preferably, the length of the positioning rod above the curing plate is the same as that of the second positioning sleeve, and the positioning rod above the curing plate can be embedded into the central through hole of the first positioning sleeve.
Preferably, the first adhesive film and the second adhesive film are both compounded with nano-copper particles.
Preferably, the outer side surfaces of the protruding rods are fixedly provided with sleeve connecting pieces, and the sleeve connecting pieces are funnel-shaped.
Preferably, the side with the larger diameter of the sleeving piece faces the curing plate.
Has the advantages that:
1. when the curing plate is arranged on the upper surface of the aluminum substrate, the first glue film is adhered to the aluminum substrate, and the positioning rod below the curing plate is embedded into the first positioning sleeve, so that the curing plate is not displaced when arranged above the aluminum substrate, and the contact area between the first glue film and the curing plate is increased through the protruding rod, so that the adhesion is more stable; and then the second adhesive film is adhered to the curing plate, the contact area of the first adhesive film and the curing plate is increased through the protruding rod, so that the adhesion is more stable, and the second positioning sleeve below the copper foil is sleeved on the positioning rod above the curing plate, so that the situation that the copper foil cannot shift when being installed on the curing plate is ensured.
2. The outer side surface of the protruding rod is fixedly provided with the sleeve connecting piece, the contact area of the protruding rod and the first adhesive film or the second adhesive film is increased, the connection between the first adhesive film and the second adhesive film and the curing plate is more stable, the sleeve connecting piece is funnel-shaped, one side with a large diameter of the sleeve connecting piece faces the curing plate, the first adhesive film and the second adhesive film are located behind the sleeve connecting piece, the connection between the first adhesive film and the protruding rod and the second adhesive film is more tight, and the protruding rod is not easy to separate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic sectional view of the overall structure of the present invention;
FIG. 2 is a schematic view of the aluminum substrate of the present invention;
FIG. 3 is a schematic view of the copper foil of the present invention in a bottom view;
FIG. 4 is a schematic view of the whole structure of the curing plate of the present invention;
FIG. 5 is a schematic view of the overall structure of the protruding rod of the present invention;
fig. 6 is the vertical cutting structure of the protruding rod of the present invention.
Illustration of the drawings: 1. an aluminum substrate; 2. a heat dissipating strip; 3. a first positioning sleeve; 4. a first adhesive film; 5. curing the plate; 501. positioning a rod; 502. a projecting rod; 5021. sleeving a connecting sheet; 6. a second adhesive film; 7. copper foil; 8. a second locator sleeve.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
Referring to fig. 1-4, a high-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for an LED television backlight comprises an aluminum substrate 1, a heat dissipation strip 2, a first positioning sleeve 3, a first glue film 4, a curing plate 5, a second glue film 6, a copper foil 7 and a second positioning sleeve 8;
the bottom surface of the aluminum substrate 1 is fixedly provided with a plurality of heat dissipation strips 2, first positioning sleeves 3 at four corners of the upper surface of the aluminum substrate 1, a first glue film 4 positioned on the upper surface of the aluminum substrate 1, a curing plate 5 positioned above the first glue film 4, a second glue film 6 positioned above the curing plate 5, a copper foil 7 positioned above the second glue film 6, and second positioning sleeves 8 are fixedly arranged at four corners of the bottom surface of the copper foil 7.
Wherein, the curing plate 5 comprises a positioning rod 501 and a convex rod 502;
four corners of the upper and lower surfaces of the curing plate 5 are fixedly provided with positioning rods 501, and the center of the lower surface of the curing plate 5 is fixedly provided with a plurality of protruding rods 502.
The length of the positioning rod 501 below the curing plate 5 is the same as that of the first positioning sleeve 3, and the positioning rod 501 below the curing plate 5 can be embedded into the central through hole of the first positioning sleeve 3, so that when the curing plate 5 is fixed on the aluminum substrate 1, the situation of displacement does not occur.
The length of the positioning rod 501 above the curing plate 5 is the same as that of the second positioning sleeve 8, and the positioning rod 501 above the curing plate 5 can be embedded into the central through hole of the first positioning sleeve 3, so that the copper foil 7 cannot be displaced when being fixed on the curing plate 5.
Wherein, all compound the nanometer copper granule in first glued membrane 4 and the second glued membrane 6, improve the heat conduction effect of first glued membrane 4 and second glued membrane 6.
When the curing plate 5 is installed on the upper surface of the aluminum substrate 1, the first glue film 4 is adhered to the aluminum substrate 1, and then the positioning rod 501 below the curing plate 5 is embedded into the first positioning sleeve 3, so that the curing plate 5 is not displaced when installed above the aluminum substrate 1, and the contact area between the first glue film 4 and the curing plate 5 is increased through the protruding rod 502, so that the adhesion is more stable;
and then the second adhesive film 6 is adhered to the curing plate 5, the contact area between the first adhesive film 4 and the curing plate 5 is increased through the protruding rod 502, so that the adhesion is more stable, and the second positioning sleeve 8 below the copper foil 7 is sleeved on the positioning rod 501 above the curing plate 5, so that the situation that the copper foil 7 cannot shift when being installed on the curing plate 5 is ensured.
Example two:
referring to fig. 1 to 6, the difference from the first embodiment is;
wherein, the outside surface of protruding pole 502 all is fixed and is provided with cover connection piece 5021, and it is hourglass hopper-shaped to cup joint piece 5021, increases protruding pole 502 and first glued membrane 4 or the area of contact of second glued membrane 6 for first glued membrane 4 and second glued membrane 6 are connected with curing plate 5 more stably.
Wherein, cup joint the big one side of piece 5021 diameter and face curing plate 5, like the design just, behind first glued membrane 4 and second glued membrane 6 were in cup joint piece 5021 below, first glued membrane 4 and second glued membrane 6 and the protruding pole 502 between be connected inseparabler, be difficult for deviating from.
The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (7)
1. A high-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for an LED television backlight source is characterized in that; the heat dissipation structure comprises an aluminum substrate (1), a heat dissipation strip (2), a first positioning sleeve (3), a first glue film (4), a curing plate (5), a second glue film (6), a copper foil (7) and a second positioning sleeve (8);
the bottom surface of the aluminum substrate (1) is fixedly provided with a plurality of heat dissipation strips (2), first positioning sleeves (3) at four corners of the upper surface of the aluminum substrate (1), first glue films (4) positioned on the upper surface of the aluminum substrate (1), curing plates (5) positioned above the first glue films (4), second glue films (6) positioned above the curing plates (5), copper foils (7) positioned above the second glue films (6), and second positioning sleeves (8) are fixedly arranged at four corners of the bottom surface of the copper foils (7).
2. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 1, wherein: the curing plate (5) comprises a positioning rod (501) and a protruding rod (502);
four corners of the upper surface and the lower surface of the curing plate (5) are fixedly provided with positioning rods (501), and the center of the lower surface of the curing plate (5) is fixedly provided with a plurality of protruding rods (502).
3. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 2, wherein: the length of the positioning rod (501) positioned below the curing plate (5) is the same as that of the first positioning sleeve (3), and the positioning rod (501) positioned below the curing plate (5) can be embedded into the central through hole of the first positioning sleeve (3).
4. The high-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 2, wherein: the length of the positioning rod (501) above the curing plate (5) is the same as that of the second positioning sleeve (8), and the positioning rod (501) above the curing plate (5) can be embedded into the central through hole of the first positioning sleeve (3).
5. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 1, wherein: and the first adhesive film (4) and the second adhesive film (6) are compounded with nano-copper particles.
6. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 2, wherein: the outer side surfaces of the protruding rods (502) are fixedly provided with sleeve connecting pieces (5021), and the sleeve connecting pieces (5021) are funnel-shaped.
7. The high-voltage-resistant high-thermal-conductivity copper-clad aluminum substrate for the LED television backlight source as claimed in claim 6, wherein: the side of the sleeve connecting piece (5021) with the larger diameter faces the curing plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221546388.1U CN217495446U (en) | 2022-06-21 | 2022-06-21 | High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221546388.1U CN217495446U (en) | 2022-06-21 | 2022-06-21 | High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217495446U true CN217495446U (en) | 2022-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221546388.1U Active CN217495446U (en) | 2022-06-21 | 2022-06-21 | High-voltage-resistant high-heat-conductivity copper-clad aluminum substrate for LED television backlight |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217495446U (en) |
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2022
- 2022-06-21 CN CN202221546388.1U patent/CN217495446U/en active Active
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