CN208490029U

CN208490029U - Flexible circuit board with radiating structure

Info

Publication number: CN208490029U
Application number: CN201821195446.4U
Authority: CN
Inventors: 廖云军
Original assignee: Shenzhen Pinbao Electronics Co Ltd
Current assignee: Shenzhen Pinbao Electronics Co Ltd
Priority date: 2018-07-26
Filing date: 2018-07-26
Publication date: 2019-02-12
Anticipated expiration: 2028-07-26

Abstract

The utility model discloses a kind of flexible circuit board with radiating structure, including aluminum substrate, wiring board is socketed on the inside of aluminum substrate, wiring board, the bottom of aluminum substrate is provided with one layer of heat dissipating layer, wiring board includes pad and the copper foil thin layer that is covered at the top of pad, groove is equipped between the top surface of pad and the inner wall of aluminum substrate, the fastening of copper foil thin layer is pressed together in groove, several triangle conductive structures contacted with the bottom of pad are convexly equipped on heat dissipating layer, several triangle conductive structure parallel intervals distribution, adhesive layer is equipped between adjacent two triangles conductive structure, the bottom of pad is fixedly connected by adhesive layer with the top surface of heat dissipating layer, the bottom of heat dissipating layer is honeycomb clathrum, honeycomb clathrum is arranged by several regular hexagonal cells.The heat dissipation effect of the utility model is fairly good, with good flexibility, improves service life, and binding force is strong between layers, the copper foil layer on surface can more thinning, route precision is high.

Description

Flexible circuit board with radiating structure

Technical field

The utility model relates to wiring board technology field, in particular to a kind of flexible circuitry with radiating structure Plate.

Background technique

Flexible circuit board is commonly used in the closed space such as mobile phone, tablet computer, is especially applied in notebook or is turned over When in lid mobile phone, regular overturning, bending are needed, therefore very high to the intensity and flexibility requirements of flexible circuit board.It is existing Flexible circuit board is easy to fracture because repeatedly bending.Also, in the closed space such as mobile phone, tablet computer to cooling requirements compared with Height is easy to cause electronic product fever serious, influences service life once heat dissipation is bad.

Summary of the invention

The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of flexibility with radiating structure Wiring board, excellent in heat dissipation effect, with good flexibility.

The technical solution of the utility model is as follows: a kind of flexible circuit board with radiating structure, including aluminum substrate, Be socketed with wiring board on the inside of the aluminum substrate, the wiring board, aluminum substrate bottom be provided with one layer of heat dissipating layer, the route Plate includes pad and the copper foil thin layer that is covered at the top of the pad, between the top surface of the pad and the inner wall of the aluminum substrate Equipped with groove, the copper foil thin layer fastening pressing in the groove, is convexly equipped with several and the pad on the heat dissipating layer Bottom contact triangle conductive structure, the distribution of described several triangle conductive structure parallel intervals, the adjacent thermally conductive knot of two triangles Adhesive layer is equipped between structure, the bottom of the pad is fixedly connected by the adhesive layer with the top surface of heat dissipating layer, the heat dissipation The bottom of layer is honeycomb clathrum, and the honeycomb clathrum is arranged by several regular hexagonal cells.

Further, the corner angle of the triangle conductive structure is 60 degree ~ 120 degree.

Further, the corner angle of the triangle conductive structure is 90 degree.

Further, the side length of the regular hexagonal cell is 0.4mm, and the width of grid lines is 0.1mm.

Further, the quadrangle of the aluminum substrate offers the route mounting hole for penetrating aluminum substrate and heat dissipating layer.

Compared with the existing technology, it the utility model has the beneficial effects that: by several triangle conductive structures, can incite somebody to action Heat is rapidly spread to heat dissipating layer from line layer bottom, and the honeycomb clathrum that heat dissipating layer bottom is equipped with can not only improve scattered Hot property, moreover it is possible to further enhance the flexibility of flexible circuit board entirety, and also can effectively prevent flexible circuit board width and length The deformation in direction is spent, shape is also beautiful,

And the surrounding of wiring board can be radiated by aluminum substrate, aluminum substrate has good heat sinking function.In addition, layer with Binding force is strong between layer, and the copper foil layer on surface can accomplish more thinning, so that the route precision of production is higher.

Detailed description of the invention

Fig. 1 is a kind of structural schematic diagram of the flexible circuit board with radiating structure of the utility model；

Fig. 2 is the structural schematic diagram of honeycomb clathrum described in the utility model.

Specific embodiment

Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.

Refering to Figure 1, the utility model provides a kind of flexible circuit board with radiating structure, including aluminium base Plate 1, the inside of aluminum substrate 1 are socketed with wiring board 2, wiring board 2, aluminum substrate 1 bottom be provided with one layer of heat dissipating layer 3, wiring board 2 Including pad 21 and the copper foil thin layer 22 being covered at the top of pad 21, it is equipped between the top surface of pad 21 and the inner wall of aluminum substrate 1 Groove, the fastening of copper foil thin layer 22 is pressed together in groove, so that the copper foil layer on surface can accomplish more thinning, it is identical in manufacturing process Under the conditions of, copper thickness is thinner, and the route precision of production is higher, but copper foil is thinner, and copper foil is just easy to de- with bond pad surface It opens, needs stronger binding force, by the way that the fastening of copper foil thin layer 22 to be pressed together in the groove on top, binding force meets the present embodiment Demand, therefore that surface copper foil can be made to accomplish is thinner, so that the route precision of production is higher.

Further, several triangle conductive structures 4 contacted with the bottom of pad 21 are convexly equipped on heat dissipating layer 3, if should Dry 4 parallel interval distribution of triangle conductive structure can be by heat from 2 bottom of line layer by several triangle conductive structures 4 It is rapidly spread to heat dissipating layer, the triangle of triangle conductive structure 4 can effectively increase heat-conducting area, the present embodiment, the triangle The corner angle of conductive structure 4 is 60 degree ~ 120 degree, it is preferred that the corner angle of triangle conductive structure 4 is 90 degree, heat-conducting effect Most preferably.And the surrounding of wiring board 2 can be radiated by aluminum substrate 1, aluminum substrate 1 has good heat sinking function.

Adhesive layer 5 is equipped between adjacent two triangles conductive structure 4, the bottom of pad 21 passes through adhesive layer 5 and heat dissipating layer 3 Top surface is fixedly connected, and ensure that the binding force between pad 21 and heat dissipating layer 3.

Further, as shown in Fig. 2, the bottom of heat dissipating layer 3 is honeycomb clathrum 31, honeycomb clathrum is by several Regular hexagonal cell 311 is arranged.The honeycomb clathrum 31, can not only improve heat dissipation performance, moreover it is possible to further enhance soft The flexibility of property wiring board entirety, and also can effectively prevent the deformation of flexible circuit board width and length direction, shape is also beautiful. The present embodiment, the side length of the regular hexagonal cell 311 are 0.4mm, and the width of grid lines is 0.1mm.

Further, the quadrangle of aluminum substrate 1 offers the route mounting hole 6 for penetrating aluminum substrate 1 and heat dissipating layer 3.

In conclusion the heat dissipation effect of the utility model is fairly good, with good flexibility, flexible circuitry is improved The whole buckle resistance energy of plate prevents from repeatedly bending wiring board fracture, improves service life, and binding force between layers By force, the copper foil layer on surface can more thinning, route precision is high.

The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle Within the scope of shield.

Claims

1. a kind of flexible circuit board with radiating structure, it is characterised in that: including aluminum substrate, the inside of the aluminum substrate Be socketed with wiring board, the wiring board, aluminum substrate bottom be provided with one layer of heat dissipating layer, the wiring board includes pad and covering Copper foil thin layer at the top of the pad is equipped with groove, the copper between the top surface of the pad and the inner wall of the aluminum substrate Foil thin layer fastening pressing in the groove, is convexly equipped with several triangles contacted with the bottom of the pad on the heat dissipating layer Conductive structure, several described triangle conductive structure parallel intervals are distributed, and adhesive layer is equipped between adjacent two triangles conductive structure, The bottom of the pad is fixedly connected by the adhesive layer with the top surface of heat dissipating layer, and the bottom of the heat dissipating layer is honeycomb net Compartment, the honeycomb clathrum are arranged by several regular hexagonal cells.

2. the flexible circuit board according to claim 1 with radiating structure, it is characterised in that: the triangle is thermally conductive The corner angle of structure is 60 degree ~ 120 degree.

3. the flexible circuit board according to claim 2 with radiating structure, it is characterised in that: the triangle is thermally conductive The corner angle of structure is 90 degree.

4. the flexible circuit board according to claim 1 with radiating structure, it is characterised in that: the regular hexagon The side length of grid is 0.4mm, and the width of grid lines is 0.1mm.

5. the flexible circuit board according to claim 1 with radiating structure, it is characterised in that: the aluminum substrate Quadrangle offers the route mounting hole for penetrating aluminum substrate and heat dissipating layer.