CN214101904U - Corrosion-resistant circuit board structure - Google Patents
Corrosion-resistant circuit board structure Download PDFInfo
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- CN214101904U CN214101904U CN202120189030.7U CN202120189030U CN214101904U CN 214101904 U CN214101904 U CN 214101904U CN 202120189030 U CN202120189030 U CN 202120189030U CN 214101904 U CN214101904 U CN 214101904U
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- circuit board
- bottom plate
- corrosion
- board body
- semiconductor refrigeration
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Abstract
The utility model discloses a corrosion-resistant circuit board structure, which comprises a bottom plate, a cover body, a circuit board body, a corrosion-resistant layer and a semiconductor refrigeration sheet, wherein the heat dissipation holes are arranged at the central position of the bottom plate, one side of the upper end of the bottom plate is provided with a connecting seat, one side of the cover body is rotationally connected on the connecting seat, the cover body is used for covering the bottom plate, the circuit board body is arranged above the bottom plate and is connected with the bottom plate through a plurality of fixing columns, the lower end of the circuit board body and the upper end of the bottom plate are provided with gaps, the corrosion-resistant layer is arranged at the upper side of the circuit board body, the semiconductor refrigeration sheet is arranged at the lower side of the circuit board body, the refrigeration surface of the semiconductor refrigeration sheet is connected with the circuit board body, the heating surface of the semiconductor refrigeration sheet faces the heat dissipation holes, the utility model not only effectively prevents liquid or corrosion-resistant substances from directly contacting the circuit board body, the corrosion resistance is strong, but also can cool the circuit board body through the semiconductor refrigeration sheet, the heat dissipation efficiency is high.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a corrosion-resistant circuit board structure.
Background
The circuit board makes the circuit miniaturized, visualized, play an important role to fixed circuit's batch production and optimization electrical apparatus overall arrangement, and the circuit board divides into single-sided board, double-sided board, and three big classifications of multilayer circuit board according to the number of layers. In the process of using the circuit board, in order to ensure that the circuit board has better corrosion resistance, a corrosion-resistant paint layer is usually coated on the surface of the circuit board to protect the circuit board, but such a circuit board has the following defects in the use process:
(1) the circuit board is protected only by the corrosion-resistant paint layer, and the corrosion-resistant effect is poor.
(2) The heat dissipation efficiency of the circuit board can be affected, which easily causes the heat on the surface of the circuit board to be too high, and affects the normal work of the circuit board.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of prior art, the utility model aims to provide a corrosion-resistant circuit board structure not only prevents effectively that liquid or corrosion-resistant material direct contact circuit board body, and corrosion resisting ability is strong, and accessible semiconductor refrigeration piece cools down the heat dissipation efficiency height to the circuit board body moreover.
The purpose of the utility model is realized by adopting the following technical scheme:
a corrosion-resistant circuit board structure comprises a bottom plate, a cover body, a circuit board body, a corrosion-resistant layer and a semiconductor refrigeration sheet, wherein a heat dissipation hole is formed in the center of the bottom plate;
the circuit board body is arranged above the bottom plate and is connected with the bottom plate through a plurality of fixing columns, and a gap is reserved between the lower end of the circuit board body and the upper end of the bottom plate;
the corrosion-resistant layer is arranged on the upper side of the circuit board body;
the semiconductor refrigeration piece is arranged on the lower side of the circuit board body, the refrigeration surface of the semiconductor refrigeration piece is connected with the circuit board body, and the heating surface of the semiconductor refrigeration piece faces the heat dissipation holes.
Preferably, supporting legs are arranged at four corners of the lower end face of the bottom plate.
Preferably, a waterproof layer is arranged on the upper side of the corrosion-resistant layer.
Preferably, a heat conduction layer is arranged between the circuit board body and the semiconductor refrigeration sheet.
Preferably, the heating surface of the semiconductor refrigerating sheet is uniformly provided with radiating scales.
Preferably, one side of the cover body, which is far away from the connecting seat, is provided with a supporting part, and when the cover body is closed, a gap is reserved between the lower end of the cover body and the upper end of the bottom plate.
Compared with the prior art, the beneficial effects of the utility model reside in that:
(1) be provided with lid and corrosion-resistant layer, close on the bottom plate through the lid, can prevent effectively that liquid or corrosion-resistant material direct contact circuit board body, the corrosion-resistant layer of cooperation circuit board body upside improves corrosion-resistant ability greatly.
(2) Be provided with the semiconductor refrigeration piece, cool down to the circuit board body through the semiconductor refrigeration piece to dispel the heat through the radiating hole to the semiconductor refrigeration piece, improve the radiating efficiency of circuit board.
The utility model discloses not only prevent effectively that liquid or corrosion resisting substance direct contact circuit board body, corrosion resisting capability is strong, and accessible semiconductor refrigeration piece cools down the circuit board body moreover, and the radiating efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a cross-sectional view of an embodiment of the present invention.
In the figure: 1. a base plate; 11. a connecting seat; 12. heat dissipation holes; 13. supporting legs; 2. a cover body; 21. a support portion; 3. a circuit board body; 4. fixing a column; 5. a corrosion-resistant layer; 6. a waterproof layer; 7. a heat conductive layer; 8. a semiconductor refrigeration sheet; 81. heat dissipation scales.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.
As shown in fig. 1-2, a corrosion-resistant circuit board structure comprises a bottom plate 1, a cover body 2, a circuit board body 3, a corrosion-resistant layer 5 and a semiconductor refrigeration sheet 8, wherein a heat dissipation hole 12 is formed in the center of the bottom plate 1, the heat dissipation hole 12 penetrates through the bottom plate 1, a connecting seat 11 is arranged on one side of the upper end of the bottom plate 1, one side of the cover body 2 is rotatably connected to the connecting seat 11 through a pivot, and the cover body 2 is used for covering the bottom plate 1.
The circuit board body 3 sets up in bottom plate 1 top, and links to each other with bottom plate 1 through a plurality of fixed columns 4, and fixed column 4 runs through circuit board body 3 and 4 lower extremes of fixed column and bottom plate 1 upper end fixed linking to each other, and the clearance is left with 1 upper end of bottom plate to 3 lower extremes of circuit board body, and the quantity of fixed column 4 is 4 in this embodiment, sets up the position that is close to four edges at circuit board body 3 respectively for circuit board body 3 links to each other with bottom plate 1 is firm.
The corrosion-resistant layer 5 is bonded and arranged on the upper side of the circuit board body 3, so that the circuit board body 3 is prevented from being corroded and damaged, and in the embodiment, the corrosion-resistant layer 5 is made of phenolic resin.
As a preferred embodiment, supporting legs 13 are arranged at four corners of the lower end surface of the bottom plate 1, and the supporting legs 13 increase the height of the bottom plate 1, thereby ensuring the heat dissipation effect of the heat dissipation holes 12.
As a preferred embodiment, the waterproof layer 6 is adhered to the upper side of the corrosion-resistant layer 5, the waterproof layer 6 is made of rubber, and the waterproof layer 6 can isolate external moisture, so that the circuit board body 3 is prevented from being affected with damp and short-circuited, and the safety of the circuit board body 3 is protected.
As preferred embodiment, be provided with heat-conducting layer 7 between circuit board body 3 and the semiconductor refrigeration piece 8, heat-conducting layer 7 adopts graphite preparation to form, evenly transmits the temperature of the 8 refrigeration faces of semiconductor refrigeration piece to circuit board body 3 lower extreme through heat-conducting layer 7, carries out rapid cooling to circuit board body 3 through semiconductor refrigeration piece 8, guarantees circuit board body 3's normal work.
As the preferred embodiment, evenly be provided with heat dissipation scale 81 on the face of heating of semiconductor refrigeration piece 8, heat dissipation scale 81 parallel arrangement each other and one end and the face of heating of semiconductor refrigeration piece 8 bond and link to each other, improve the radiating efficiency of the face of heating of semiconductor refrigeration piece 8 through a plurality of heat dissipation scale 81, promote the refrigeration effect of the face of cooling of semiconductor refrigeration piece 8 to improve the radiating efficiency of circuit board body 3.
As a preferred embodiment, a supporting portion 21 is disposed on one side of the cover body 2 away from the connecting seat 11, the supporting portion 21 is fixedly disposed at the lower end of the cover body 2, when the cover body 2 is closed, the supporting portion 21 is connected to the bottom plate 1, so that a gap is left between the lower end of the cover body 2 and the upper end of the bottom plate 1, and the heat dissipation effect of the heating surface of the circuit board body 3 and the semiconductor cooling fins 8 is improved while the shielding and protecting effect of the cover body 2 is ensured.
The utility model discloses a working process:
when the anti-corrosion cover is used, the cover body 2 is covered on the bottom plate 1 along the connecting seat 11 in a rotating mode, the circuit board body 3 is wrapped by the cover body 2 at the moment, liquid or anti-corrosion substances can be effectively prevented from directly contacting the circuit board body 3, and the anti-corrosion cover is matched with the anti-corrosion layer 5 on the upper side of the circuit board body 3, so that the anti-corrosion capability is greatly improved; in the working process, the circuit board body 3 is cooled through the semiconductor refrigerating sheet 8, and the semiconductor refrigerating sheet 8 is radiated through the radiating holes 12, so that the radiating efficiency of the circuit board is improved.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.
Claims (6)
1. A corrosion-resistant circuit board structure, characterized in that: the refrigerator comprises a bottom plate, a cover body, a circuit board body, an anti-corrosion layer and a semiconductor refrigeration sheet, wherein a heat dissipation hole is formed in the center of the bottom plate, a connecting seat is arranged on one side of the upper end of the bottom plate, one side of the cover body is rotatably connected to the connecting seat, and the cover body is used for covering the bottom plate;
the circuit board body is arranged above the bottom plate and is connected with the bottom plate through a plurality of fixing columns, and a gap is reserved between the lower end of the circuit board body and the upper end of the bottom plate;
the corrosion-resistant layer is arranged on the upper side of the circuit board body;
the semiconductor refrigeration piece is arranged on the lower side of the circuit board body, the refrigeration surface of the semiconductor refrigeration piece is connected with the circuit board body, and the heating surface of the semiconductor refrigeration piece faces the heat dissipation holes.
2. A corrosion resistant circuit board structure according to claim 1, wherein: supporting legs are arranged at four corners of the lower end face of the bottom plate.
3. A corrosion resistant circuit board structure according to claim 1, wherein: and a waterproof layer is arranged on the upper side of the corrosion-resistant layer.
4. A corrosion resistant circuit board structure according to claim 1, wherein: and a heat conduction layer is arranged between the circuit board body and the semiconductor refrigeration sheet.
5. A corrosion resistant circuit board structure according to claim 1, wherein: and heat dissipation scales are uniformly arranged on the heating surface of the semiconductor refrigerating sheet.
6. A corrosion resistant circuit board structure according to claim 1, wherein: and a supporting part is arranged on one side of the cover body, which is far away from the connecting seat, and when the cover body is closed, a gap is reserved between the lower end of the cover body and the upper end of the bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120189030.7U CN214101904U (en) | 2021-01-22 | 2021-01-22 | Corrosion-resistant circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120189030.7U CN214101904U (en) | 2021-01-22 | 2021-01-22 | Corrosion-resistant circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214101904U true CN214101904U (en) | 2021-08-31 |
Family
ID=77439511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120189030.7U Active CN214101904U (en) | 2021-01-22 | 2021-01-22 | Corrosion-resistant circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214101904U (en) |
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2021
- 2021-01-22 CN CN202120189030.7U patent/CN214101904U/en active Active
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