CN219371035U - Novel semiconductor patch rectifier bridge diode for automobile - Google Patents

Abstract

The utility model belongs to the technical field of rectifier bridge diodes, and particularly relates to a novel semiconductor patch rectifier bridge diode for an automobile. According to the utility model, the cross heat-conducting plate is arranged, so that the protection adhesive layer can be restrained, the cracking condition of the protection adhesive layer is reduced, and meanwhile, the heat transmitted to the positive electrode lead and the negative electrode lead on the diode chip is conveniently transmitted to the heat-radiating plate, so that the semiconductor patch rectifier bridge diode is convenient to radiate, the adverse effect on the protection adhesive layer caused by overhigh internal heat is avoided, meanwhile, the bending parts are arranged on the first connecting sheet and the second connecting sheet, the function of a spring can be realized, the protection adhesive layer is matched for absorbing vibration, the vibration-absorbing and buffering functions can be realized, the welding position is further protected from being damaged, and the use of the semiconductor patch rectifier bridge diode is safer.

Description

Novel semiconductor patch rectifier bridge diode for automobile

Technical Field

The utility model relates to the technical field of rectifier bridge diodes, in particular to a novel semiconductor patch rectifier bridge diode for an automobile.

Background

Among electronic components, a diode is a device having two electrodes, which allows current to flow only in a single direction, and most of the use purpose thereof is rectification, and a rectifier bridge diode is a semiconductor device capable of converting alternating current into direct current, and currently, a rectifier bridge diode for an automobile engine is generally used by mounting the diode on a rectifier of an automobile generator when in use, and welding leads of the rectifier diode with a rectifier bracket.

The utility model of the prior art with publication No. CN203733806U provides an axial patch diode device, which greatly reduces the cracking between an epoxy packaging body and a copper lead wire and the risk of infirm welding of the diode chip and the copper lead wire caused in the subsequent use, but the epoxy packaging body in the technology plays a role of reducing the adverse effect of heat dissipation performance, so that the heat generated by the diode chip is inconvenient to dissipate, and meanwhile, the patch rectifier bridge diode has the condition of vibration to influence the welding strength when in use, a certain vibration can be generated when an automobile engine runs, because the lead wire of the patch rectifier bridge diode is shorter, the whole body is attached to a circuit board inside the rectifier, the vibration can occur along with the vibration of the circuit board, the vibration is easy to cause the influence of the welding strength between the lead wire and the diode chip to be damaged through the transmission of the adhesive packaging body and the lead wire, and even the diode chip can appear on the diode chip, so that the automobile chip is inconvenient to dissipate the heat, and the novel rectifier bridge diode chip is provided.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a novel semiconductor patch rectifier bridge diode for an automobile, and solves the problems that the rectifier bridge diode provided in the background art is poor in heat dissipation performance due to the influence of a glue sealing structure when in use and the welding position of the rectifier bridge diode is adversely affected by vibration.

(II) technical scheme

The utility model adopts the following technical scheme for realizing the purposes:

the utility model provides a novel semiconductor paster rectifier bridge diode for car, includes the diode chip, the two poles of the earth of diode chip are provided with anodal electrode and negative electrode respectively, the one end fixedly connected with anodal lead wire of anodal electrode, the one end fixedly connected with negative electrode lead wire of negative electrode, the one end of anodal lead wire is connected with anodal pin through connection piece one, the one end of negative electrode lead wire is connected with negative electrode pin through connection piece two, all the cover is equipped with cross heat-conducting plate on anodal lead wire and the negative electrode lead wire, the end fixedly connected with four heating panels of two cross heat-conducting plates, diode chip, anodal electrode, negative electrode and cross heat-conducting plate all encapsulate the inside at the protective adhesive layer, the surface of fixing at the protective adhesive layer is inlayed to the heating panel, the middle part of connection piece one and connection piece two all sets up to the cross-section and is U type bending portion, and bending portion's width is greater than the diameter of anodal lead wire and negative electrode lead wire.

Further, the anode electrode, the cathode electrode and the diode chip are welded through a welding flux layer.

Further, the positive electrode pin is arranged in parallel with the positive electrode lead, the negative electrode pin is arranged in parallel with the negative electrode lead, the positive electrode pin and the negative electrode pin are attached to the lower surface of the protective adhesive layer, and both ends of the positive electrode pin and the negative electrode pin extend to the outer side of the lower surface of the protective adhesive layer.

Further, a through hole is formed in the inner side wall of the cross heat conducting plate, and a heat conducting insulating gasket is fixed in the through hole.

Further, the protection glue layer is eight prismatic, the heating panel interval distributes in its four sides.

(III) beneficial effects

Compared with the prior art, the utility model provides the novel semiconductor patch rectifier bridge diode for the automobile, which has the following beneficial effects:

according to the utility model, the cross heat conducting plate is arranged, so that the protection adhesive layer can be restrained, the cracking condition of the protection adhesive layer is reduced, and meanwhile, the heat transmitted to the positive electrode lead and the negative electrode lead on the diode chip is conveniently transmitted to the heat radiating plate, so that the semiconductor patch rectifier bridge diode is convenient to radiate, the adverse effect on the protection adhesive layer caused by overhigh internal heat is avoided, meanwhile, the bending parts are arranged on the first connecting sheet and the second connecting sheet, the function of a spring can be realized, the vibration is absorbed by matching with the protection adhesive layer, the vibration absorbing and buffering functions can be realized, the welding position is further protected from being damaged, and the use of the semiconductor patch rectifier bridge diode is safer.

Drawings

FIG. 1 is a schematic elevational view of the present utility model;

FIG. 2 is a cross-sectional elevation view of the structure of the present utility model;

fig. 3 is a schematic side view of the present utility model.

In the figure: 1. a diode chip; 2. a positive electrode; 3. a negative electrode; 4. a flux layer; 5. a positive electrode lead; 6. a negative electrode lead; 7. a first connecting sheet; 8. a positive electrode pin; 9. a second connecting sheet; 10. a negative electrode pin; 11. a thermally conductive insulating gasket; 12. a cross-shaped heat conducting plate; 13. a heat dissipation plate; 14. and (5) protecting the adhesive layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

As shown in fig. 1, fig. 2 and fig. 3, the novel semiconductor patch rectifier bridge diode for the automobile provided by the embodiment of the utility model comprises a diode chip 1, wherein two poles of the diode chip 1 are respectively provided with an anode electrode 2 and a cathode electrode 3, one end of the anode electrode 2 is fixedly connected with an anode lead 5, one end of the cathode electrode 3 is fixedly connected with a cathode lead 6, one end of the anode lead 5 is connected with an anode pin 8 through a connecting sheet I7, one end of the cathode lead 6 is connected with a cathode pin 10 through a connecting sheet II 9, cross heat-conducting plates 12 are sleeved on the anode lead 5 and the cathode lead 6, the tail ends of the two cross heat-conducting plates 12 are fixedly connected with four heat dissipation plates 13, the diode chip 1, the anode electrode 2, the cathode electrode 3 and the cross heat-conducting plates 12 are packaged in a protective adhesive layer 14, the heat dissipation plates 13 are embedded and fixed on the outer surface of the protective adhesive layer 14, the middle parts of the connecting sheet I7 and the connecting sheet II are respectively provided with bending parts with U-shaped sections, and the width of the bending parts is larger than the diameters of the anode lead 5 and the cathode lead 6; in summary, the positive electrode of the diode chip 1 is connected with the positive electrode pin 8 through the positive electrode 2, the positive electrode lead 5 and the first connecting sheet 7, the negative electrode of the diode chip 1 is connected with the negative electrode pin 10 through the negative electrode 3, the negative electrode lead 6 and the second connecting sheet 9, the positive electrode pin 8 and the negative electrode pin 10 are arranged on the circuit board of the automobile engine rectifier, the diode chip 1, the positive electrode 2, the negative electrode 3, the positive electrode lead 5 and the negative electrode lead 6 can be protected and limited by arranging the protective adhesive layer 14, moisture and humidity are prevented from entering the diode chip 1, the heat emitted from the diode chip 1 can be transferred to the heat dissipation plate 13 through the cross heat conduction plate 12 due to the arrangement of the cross heat conduction plate 12 and the heat dissipation plate 13, the novel semiconductor patch rectifier bridge diode's for car heat dispersion is improved, avoid the inside excessive heat of accumulation of protection glue film 14 to lead to melting the condition that becomes soft, thereby avoid diode chip 1 and anodal electrode 2, the welding position of negative electrode 3 to appear not hard up, simultaneously, because the middle part of connection piece one 7 and connection piece two 9 all sets up to the portion of bending that the cross-section is U-shaped, and the width of bending is greater than the diameter of anodal lead 5 and negative electrode lead 6, the effect of spring can be played in the portion of bending, the damping performance of cooperation protection glue film 14 self, when the portion of bending vibrations, the bottom of protection glue film 14 and the upper surface of pin produce pressure, the damping performance of protection glue film 14 self material can be converted kinetic energy into the internal energy, thereby play the absorbing effect.

As shown in fig. 2, in some embodiments, the anode electrode 2 and the cathode electrode 3 are soldered with the diode chip 1 by a flux layer 4; by providing the flux layer 4, it is used for soldering between the positive electrode 2 and the negative electrode 3 and the diode chip 1.

As shown in fig. 1 and 2, in some embodiments, the positive electrode pin 8 is disposed parallel to the positive electrode lead 5, the negative electrode pin 10 is disposed parallel to the negative electrode lead 6, the positive electrode pin 8 and the negative electrode pin 10 are attached to the lower surface of the protective adhesive layer 14, and both ends thereof extend to the outside of the lower surface of the protective adhesive layer 14; this arrangement avoids rolling during rectifier bridge diode installation.

As shown in fig. 2, in some embodiments, the inner side wall of the cross heat conducting plate 12 is provided with a through hole, and a heat conducting insulating washer 11 is fixed in the through hole; by cooperating with a thermally conductive insulating gasket 11 for preventing leakage of the circuit.

As shown in fig. 3, in some embodiments, the protective adhesive layer 14 is an octagon, and the heat dissipation plates 13 are distributed on four sides thereof at intervals; by arranging the octagon protective adhesive layer 14 and the radiating plates 13 on the side surfaces of the octagon protective adhesive layer which are distributed at intervals, the radiating efficiency is improved.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (5)

1. The utility model provides a novel semiconductor paster rectifier bridge diode for car, includes diode chip (1), its characterized in that: the diode chip comprises a diode chip body, and is characterized in that two poles of the diode chip body (1) are respectively provided with an anode electrode (2) and a cathode electrode (3), one end of the anode electrode (2) is fixedly connected with an anode lead (5), one end of the anode lead (5) is connected with an anode pin (8) through a connecting sheet I (7), one end of the cathode lead (6) is connected with a cathode pin (10) through a connecting sheet II (9), cross heat conducting plates (12) are respectively sleeved on the anode lead (5) and the cathode lead (6), four radiating plates (13) are fixedly connected with the tail ends of the two cross heat conducting plates (12), the diode chip body (1), the anode electrode (2), the cathode electrode (3) and the cross heat conducting plates (12) are all packaged inside a protective adhesive layer (14), the radiating plates (13) are embedded and fixed on the outer surface of the protective adhesive layer (14), and the middle parts of the connecting sheet I (7) and the connecting sheet II (9) are respectively provided with a U-shaped bending part, and the diameters of the cross heat conducting plates (12) are larger than the cross heat conducting plates (6) of the anode lead (6).

2. The novel semiconductor chip rectifier bridge diode for an automobile according to claim 1, wherein: the anode electrode (2) and the cathode electrode (3) are welded with the diode chip (1) through the welding flux layer (4).

3. The novel semiconductor chip rectifier bridge diode for an automobile according to claim 1, wherein: the positive electrode pin (8) is arranged in parallel with the positive electrode lead (5), the negative electrode pin (10) is arranged in parallel with the negative electrode lead (6), the positive electrode pin (8) and the negative electrode pin (10) are attached to the lower surface of the protective adhesive layer (14), and both ends of the positive electrode pin and the negative electrode pin extend to the outer side of the lower surface of the protective adhesive layer (14).

4. The novel semiconductor chip rectifier bridge diode for an automobile according to claim 1, wherein: the inner side wall of the cross heat conducting plate (12) is provided with a through hole, and a heat conducting insulating gasket (11) is fixed in the through hole.

5. The novel semiconductor chip rectifier bridge diode for an automobile according to claim 1, wherein: the protection glue layer (14) is eight prismatic, and the radiating plates (13) are distributed on four sides of the protection glue layer at intervals.